On the problems of measuring transient temperature in cryogenic fluids
Cryogenic sensor errors in measuring transient temperature in cryogenic fluids
Flynn, T. M.↗
SEARCH · Engineering Papers
Results for “temperature sensor”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Reusable Cryogenic Tank VHM Using Fiber Optic Distributed Sensing Technology
The reusable oxygen and hydrogen tanks are key systems for both the X-33 (sub-scale, sub-orbital technology demonstrator) and the commercial Reusable Launch Vehicle (RLV). The backbone of the X-33 Reusable Cryogenic Tank Vehicle Health Management (VHM) system lies in the optical network of distributed strain temperature and hydrogen sensors. This network of fiber sensors will create a global strain and temperature map for monitoring the health of the tank structure, cryogenic insulation, and Thermal Protection System. Lockheed Martin (Sanders and LMMSS) and NASA Langley have developed this sensor technology for the X-33 and have addressed several technical issues such as fiber bonding and laser performance in this harsh environment.
Bodan-Sanders, Patricia↗
Electronic Thermometer Readings
NASA Stennis' adaptive predictive algorithm for electronic thermometers uses sample readings during the initial rise in temperature and applies an algorithm that accurately and rapidly predicts the steady state temperature. The final steady state temperature of an object can be calculated based on the second-order logarithm of the temperature signals acquired by the sensor and predetermined variables from the sensor characteristics. These variables are calculated during tests of the sensor. Once the variables are determined, relatively little data acquisition and data processing time by the algorithm is required to provide a near-accurate approximation of the final temperature. This reduces the delay in the steady state response time of a temperature sensor. This advanced algorithm can be implemented in existing software or hardware with an erasable programmable read-only memory (EPROM). The capability for easy integration eliminates the expense of developing a whole new system that offers the benefits provided by NASA Stennis' technology.
Source record↗
Flow separation detector
An arrangement for sensing the fluid separation along a surface which employs a thermally insulating element having a continuous surface blending into and forming a part of the fluid flow surface is described. A sudden decrease in the temperature of the downstream sensor conductor and concomitant increase in the temperature of the upstream sensor conductor is an indication of the separation. When the temperatures are returned to the state achieved during normal flow, the indicator thereby indicates the normal, attached fluid flow. The conductors may be, for example, wires or thin films, and should be within the viscous sub-layer of the expected fluid flow. A single heater and several pairs of sensors and corresponding sensor conductors may be used to detect not only the fluid flow and the separation, but the direction of the fluid flow, over the fluid flow surface.
Mateer, G. C.↗
Wireless Temperature-Monitoring System
A relatively inexpensive instrumentation system that includes units that are connected to thermocouples and that are parts of a radio-communication network has been developed to enable monitoring of temperatures at multiple locations. Because there is no need to string wires or cables for communication, the system is well suited for monitoring temperatures at remote locations and for applications in which frequent changes of monitored or monitoring locations are needed. The system can also be adapted to monitoring of slowly varying physical quantities, other than temperature, that can be transduced by solid-state electronic sensors. electronic sensors. The system comprises any number of transmitting units and a single receiving unit. Each transmitting unit includes connections for as many as four external thermocouples, a signal-conditioning module, a control module, and a radio-communication module. The signal-conditioning module acts as an interface between the thermocouples and the rest of the transmitting unit and includes a built-in solid ambient temperature sensor that is in addition to the external thermocouples. The control module is a system-on-chip embedded processor that includes analog-to-digital converters, serial and parallel data ports, and an interface for local connection to an analog meter that is used during installation to verify correct operation. The radio-communication module contains a commercial spread-spectrum transceiver that operates in the 900-MHz industrial, scientific, and medical (ISM) frequency band. This transceiver transmits data to the receiving unit at a rate of 19,200 baud. The receiving unit includes a transceiver like that of a transmitting unit, plus a control module that contains a system-on-chip processor that includes serial data port for output to a computer that runs monitoring and/or control software, a parallel data port for output to a printer, and a seven-segment light-emitting-diode display. Each transmitting unit is battery-powered and can operate for at least seven days continuously while reporting temperatures every half hour. The receiving unit is powered by a wall-mounted transformer source. The receiving unit responds to each transmitting unit and reports the readings of each of the four thermocouples and of the ambient-temperature sensor of the transmitting unit. The end-to-end accuracy of the system is plus or minus 0.2 C over the temperature range from 0 to 100 C. The radio-communication range between the receiving and transmitting units is approximately equal to 0.5 mile (approximately equal to 0.8 km).
Solano, Wanda↗
A High Frequency (HF) Inductive Power Transfer Circuit for High Temperature Applications Using SiC Schottky Diodes
Wireless sensors placed in high temperature environments, such as aircraft engines, are desirable to reduce the mass and complexity of routing wires. While communication with the sensors is straight forward, providing power wirelessly is still a challenge. This paper introduces an inductive wireless power transfer circuit incorporating SiC Schottky diodes and its operation from room temperature (25 C) to 500 C.
Diode↗
Hydrogen Sensors Demonstrated on the Shuttle
Microelectromechanical-systems- (MEMS-) based hydrogen sensor technology developed by the NASA Glenn Research Center at Lewis Field and Case Western Reserve University was demonstrated on shuttle missions STS-95 (Senator Glenn s mission) and STS-96. These smart sensors, commercialized by Makel Engineering Inc., were part of an "Integrated Vehicle Health Monitoring HEDS Technology Demonstration" series conducted at the NASA Kennedy Space Center. The experiments were designed to demonstrate the effect of technological upgrades on shuttle performance. The hydrogen sensors were micro-fabricated for minimal size, weight, and power consumption. A temperature detector and heater were included on the sensor for temperature control. Two palladium chrome (PdCr) hydrogen detection devices were included in each sensor package: a Schottky diode for low concentrations and a resistor for high concentrations. These sensor designs allow operation in inert environments. "Smart" electronics developed by Makel Engineering were integrated with the sensors to control the sensor temperature and process the output of the various sensors. This complete hydrogen detection system (two sensors on a chip with smart electronics) flew on STS-95 (launched October 1998) and STS-96 (launched May 1999). It was installed in the aft compartment of the shuttle and used to monitor the hydrogen concentration in that region. Up to this time, a mass spectrometer had monitored the hydrogen concentration in the aft compartment before launch, and "grab" bottles had been used after launch. The inside of these bottles is at vacuum. During flight, the grab bottles are pyrotechnically opened for a brief period, and the gas in the aft compartment is captured in the bottle. Several of these bottles are opened at different times during takeoff, and their contents are used to determine the time profile of the gases in the aft chamber. However, this information is not available until after the flight. On the launch pad, results from the new sensor technology paralleled the responses of the mass spectrometer with, in some cases, a quicker response time. In flight, data from the new sensors agreed with those derived from analyzing the contents of the grab bottles. Moreover, this microsensor can monitor the aft compartment continuously and, in principle, could monitor the health of the vehicle in real time during flight.
Hunter, Gary W.↗
Developing Multilayer Thin Film Strain Sensors With High Thermal Stability
A multilayer thin film strain sensor for large temperature range use is under development using a reactively-sputtered process. The sensor is capable of being fabricated in fine line widths utilizing the sacrificial-layer lift-off process that is used for micro-fabricated noble-metal sensors. Tantalum nitride films were optimized using reactive sputtering with an unbalanced magnetron source. A first approximation model of multilayer resistance and temperature coefficient of resistance was used to set the film thicknesses in the multilayer film sensor. Two multifunctional sensors were fabricated using multilayered films of tantalum nitride and palladium chromium, and tested for low temperature resistivity, TCR and strain response. The low temperature coefficient of resistance of the films will result in improved stability in thin film sensors for low to high temperature use.
Wrbanek, John D.↗
Thin Film Physical Sensor Instrumentation Research and Development at NASA Glenn Research Center
A range of thin film sensor technology has been demonstrated enabling measurement of multiple parameters either individually or in sensor arrays including temperature, strain, heat flux, and flow. Multiple techniques exist for refractory thin film fabrication, fabrication and integration on complex surfaces and multilayered thin film insulation. Leveraging expertise in thin films and high temperature materials, investigations for the applications of thin film ceramic sensors has begun. The current challenges of instrumentation technology are to further develop systems packaging and component testing of specialized sensors, further develop instrumentation techniques on complex surfaces, improve sensor durability, and to address needs for extreme temperature applications. The technology research and development ongoing at NASA Glenn for applications to future launch vehicles, space vehicles, and ground systems is outlined.
Wrbanek, John D.↗
Array Of Sensors Measures Broadband Radiation
Multiple broadband radiation sensors aimed at various portions of total field of view. All sensors mounted in supporting frame, serving as common heat sink and temperature reference. Each sensor includes heater winding and differential-temperature-sensing bridge circuit. Power in heater winding adjusted repeatedly in effort to balance bridge circuit. Intended to be used aboard satellite in orbit around Earth to measure total radiation emitted, at various viewing angles, by mosaic of "footprint" areas (each defined by its viewing angle) on surface of Earth. Modified versions of array useful for angle-resolved measurements of broadband radiation in laboratory and field settings on Earth.
Hoffman, James W.↗
Novel Thin Film Sensor Technology for Turbine Engine Hot Section Components
Degradation and damage that develops over time in hot section components can lead to catastrophic failure of the turbine section of aircraft engines. A range of thin film sensor technology has been demonstrated enabling on-component measurement of multiple parameters either individually or in sensor arrays including temperature, strain, heat flux, and flow. Conductive ceramics are beginning to be investigated as new materials for use as thin film sensors in the hot section, leveraging expertise in thin films and high temperature materials. The current challenges are to develop new sensor and insulation materials capable of withstanding the extreme hot section environment, and to develop techniques for applying sensors onto complex high temperature structures for aging studies of hot propulsion materials. The technology research and development ongoing at NASA Glenn Research Center for applications to future aircraft, launch vehicles, space vehicles, and ground systems is outlined.
Wrbanek, John D.↗
Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology
This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.
dielectric properties↗
Low TCR nanocomposite strain gages
A high temperature thin film strain gage sensor capable of functioning at temperatures above 1400.degree. C. The sensor contains a substrate, a nanocomposite film comprised of an indium tin oxide alloy, zinc oxide doped with alumina or other oxide semiconductor and a refractory metal selected from the group consisting of Pt, Pd, Rh, Ni, W, Ir, NiCrAlY and NiCoCrAlY deposited onto the substrate to form an active strain element. The strain element being responsive to an applied force.
Gregory, Otto J.↗
Advanced Ground Systems Maintenance Intelligent Devices/Smart Sensors Project
This project provides development and qualification of Smart Sensors capable of self-diagnosis and assessment of their capability/readiness to support operations. These sensors will provide pressure and temperature measurements for use in ground systems.
Temperature↗
High Temperature Dynamic Pressure Measurements Using Silicon Carbide Pressure Sensors
Un-cooled, MEMS-based silicon carbide (SiC) static pressure sensors were used for the first time to measure pressure perturbations at temperatures as high as 600 C during laboratory characterization, and subsequently evaluated in a combustor rig operated under various engine conditions to extract the frequencies that are associated with thermoacoustic instabilities. One SiC sensor was placed directly in the flow stream of the combustor rig while a benchmark commercial water-cooled piezoceramic dynamic pressure transducer was co-located axially but kept some distance away from the hot flow stream. In the combustor rig test, the SiC sensor detected thermoacoustic instabilities across a range of engine operating conditions, amplitude magnitude as low as 0.5 psi at 585 C, in good agreement with the benchmark piezoceramic sensor. The SiC sensor experienced low signal to noise ratio at higher temperature, primarily due to the fact that it was a static sensor with low sensitivity.
Pressure Sensors↗
Evolvable Cryogenics (ECRYO) Pressure Transducer Calibration Test
This paper provides a summary of the findings of recent activities conducted by Marshall Space Flight Center's (MSFC) In-Space Propulsion Branch and MSFC's Metrology and Calibration Lab to assess the performance of current "state of the art" pressure transducers for use in long duration storage and transfer of cryogenic propellants. A brief historical narrative in this paper describes the Evolvable Cryogenics program and the relevance of these activities to the program. This paper also provides a review of three separate test activities performed throughout this effort, including: (1) the calibration of several pressure transducer designs in a liquid nitrogen cryogenic environmental chamber, (2) the calibration of a pressure transducer in a liquid helium Dewar, and (3) the calibration of several pressure transducers at temperatures ranging from 20 to 70 degrees Kelvin (K) using a "cryostat" environmental chamber. These three separate test activities allowed for study of the sensors along a temperature range from 4 to 300 K. The combined data shows that both the slope and intercept of the sensor's calibration curve vary as a function of temperature. This homogeneous function is contrary to the linearly decreasing relationship assumed at the start of this investigation. Consequently, the data demonstrates the need for lookup tables to change the slope and intercept used by any data acquisition system. This ultimately would allow for more accurate pressure measurements at the desired temperature range. This paper concludes with a review of a request for information (RFI) survey conducted amongst different suppliers to determine the availability of current "state of the art" flight-qualified pressure transducers. The survey identifies requirements that are most difficult for the suppliers to meet, most notably the capability to validate the sensor's performance at temperatures below 70 K.
Diaz, Carlos E., Jr.↗
Sensor Development for Active Flow Control
Presented are the developmental efforts for MEMS sensors for a closed-loop active flow control in a low-speed wind tunnel evaluation. The MEMS sensors are designed in-house and fabricated out of house, and the shear sensors are a thermal type that are collocated with temperature and pressure sensors on a flexible polyimide sheet, which conforms to surfaces of a simple curvature. A total of 6 sensors are located within a 1.5 by 3 mm area as a cluster with each sensor being 300 pm square. The thickness of this sensor cluster is 75 pm. Outputs from the shear sensors have been compared with respect to those of the Preston tube for evaluation of the sensors on a flat plate. Pressure sensors are the absolute type and have recorded pressure measurements within 0.05 percent of the tunnel ESP pressure sensor readings. The sensors and signal conditioning electronics have been tested on both a flat plate and a ramp in Langley s 15-Inch Low-Turbulence Tunnel. The system configuration and control PC is configured with LabView, where calibration constants are stored for desired compensation and correction. The preliminary test results are presented within.
Kahng, Seun K.↗
Development of an Extreme High Temperature n-type Ohmic Contact to Silicon Carbide
We report on the initial demonstration of a tungsten-nickel (75:25 at. %) ohmic contact to silicon carbide (SiC) that performed for up to fifteen hours of heat treatment in argon at 1000 C. The transfer length method (TLM) test structure was used to evaluate the contacts. Samples showed consistent ohmic behavior with specific contact resistance values averaging 5 x 10-4 -cm2. The development of this contact metallization should allow silicon carbide devices to operate more reliably at the present maximum operating temperature of 600 C while potentially extending operations to 1000 C. Introduction Silicon Carbide (SiC) is widely recognized as one of the materials of choice for high temperature, harsh environment sensors and electronics due to its ability to survive and continue normal operation in such environments [1]. Sensors and electronics in SiC have been developed that are capable of operating at temperatures of 600 oC. However operating these devices at the upper reliability temperature threshold increases the potential for early degradation. Therefore, it is important to raise the reliability temperature ceiling higher, which would assure increased device reliability when operated at nominal temperature. There are also instances that require devices to operate and survive for prolonged periods of time above 600 oC [2, 3]. This is specifically needed in the area of hypersonic flight where robust sensors are needed to monitor vehicle performance at temperature greater than 1000 C, as well as for use in the thermomechanical characterization of high temperature materials (e.g. ceramic matrix composites). While SiC alone can withstand these temperatures, a major challenge is to develop reliable electrical contacts to the device itself in order to facilitate signal extraction
Evans, Laura J.↗