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At least 649 records · Page 36

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DOE OSTI2023

A high-resolution clock phase shifter circuitry for ALTIROC

Abstract A high-resolution clock phase shifter is implemented to adjust the phase of multiple clocks at 40 MHz, 80 MHz, or 640 MHz in the ALTIROC chip. The phase shifter has a coarse-phase shifter and a fine-phase shifter to achieve a step size of 97.7 ps and an adjustable range of 25 ns. The fine delay unit is based on a Delay Locked Loop (DLL) operating at 640 MHz. The phase shifter is fabricated in a 130 nm CMOS process. The area of the phase shifter is 725 µm × 248 µm. The Differential Non-Linearity (DNL) and the Integral Non-Linearity (INL) are ±0.6 LSB and ±0.75 LSB, respectively. The jitter from −25 °C to 20 °C is less than 15.5 ps (RMS), including the contributions from the FPGA clock source and the PLL. The power consumption is 11.2 mW.

Instruments & Instrumentation↗

DOE OSTI2023

First test results of the trans-impedance amplifier stage of the ultra-fast HPSoC ASIC

Abstract We present the first results from the HPSoC ASIC designed for readout of Ultra-fast Silicon Detectors. The 4-channel ASIC manufactured in 65 nm CMOS by TSMC has been optimized for 50 μm thick AC-LGAD. The evaluation of the analog front end with β-particles impinging on 3 × 3 AC-LGAD arrays (500 μm pitch, 200 × 200 μm 2 metal) confirms a fast output rise time of 600 ps and good timing performance with a jitter of 45 ps. Further calibration experiments and TCT laser studies indicate some gain limitations that are being investigated and are driving the design of the second-generation pre-amplification stages to reach a jitter of 15 ps.

Instruments & Instrumentation↗

DOE OSTI2023

The COLUTA ADC ASIC and the ATLAS HL-LHC Liquid Argon Front-End Readout

Abstract The upgraded High-Luminosity Large Hadron Collider (HL-LHC) requires a new radiation tolerant ATLAS Liquid Argon (LAr) Calorimeter readout operating at 40 MHz with 16-bit dynamic range. The Front-End Board 2 (FEB2) will provide the front-end readout for the calorimeter, and will interface a series of custom ASICs due to radiation tolerance requirements of the HL-LHC. The COLUTA is a 65 nm CMOS custom 8-channel 15-bit 40 MSPS ADC ASIC developed for this application. This contribution will present performance results of the final prototype of the COLUTA, surpassing specifications at >11.5 ENOB for relevant frequencies, as well as non-linearity and radiation requirements. Preliminary integration results of the front-end readout components will also be described by means of the FEB2 Pre-Prototype, the “Slice Testboard”.

Instruments & Instrumentation↗

DOE OSTI2022

A Low-Power 1 Gb/s Line Driver with Configurable Pre-Emphasis for Lossy Transmission Lines

A line driver with configurable pre-emphasis is implemented in a 65 nm CMOS process. The driver utilizes a three-tap feed-forward equalization (FFE) architecture. The relative delays between the taps are selectable in increments of 1/16th of the unit interval (UI) via an 8-stage delay-locked loop (DLL) and digital interpolator. It is also possible to control the output amplitude and source impedance for each tap via a programmable array of eight source-series terminated (SST) drivers. The entire design consumes 9 mW from a 1.2 V supply at 1 Gb/s.

47 OTHER INSTRUMENTATION↗

DOE OSTI2024

The SparkPix-S ASIC for the sparsified readout of 1 MHz frame-rate X-ray cameras at LCLS-II: pixel design and simulation results

Exploiting the “sparse” nature of the information in XPCS (X-ray Photon Correlation Spectroscopy) and XSVS (Speckle Visibility Spectroscopy) experiments, we present the SparkPix-S, a 3-sides buttable Application Specific Integrated Circuit (ASIC) based on a sparsified readout strategy for large-format hybrid detectors. The SparkPix-S architecture, based on the successful ePix family, will be composed as follows: a front-end 2-D matrix of 384×352 square pixels with 50 µm pitch is arranged to match the dimensions of a PIN Si-sensor matrix; charge readout, signal shaping and amplitude discrimination is performed at pixel-level, by means of a low-power (<18 µW) analog processor, which, in case of an event, negotiates access to an analog bus placed every other column; on the chip periphery (balcony), the information on each bus is digitized by an array of successive approximation analog-to-digital converters (SAR-ADCs) running at 10 Msps; on the digital back-end the global logic will generate the output data stream using low-voltage differential signalling (LVDS). A first prototype of the SparkPix-S, with a reduced matrix size of 96×96 pixels, is currently under production on a 130 nm CMOS technology. Simulated performance results show an equivalent noise charge <60 el. r.m.s. at 1 MHz repetition rate, with a maximum input energy of 60 keV and capability to discriminate charge signals with equivalent energy as low as 900 eV.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2024

First test results of the HGCAL concentrator ASICs: ECON-T and ECON-D

With over 6 million channels, the High Granularity Calorimeter for the CMS HL-LHC upgrade presents a unique data transmission challenge. The ECON ASICs provide a critical stage of on-detector data compression and selection for the trigger path (ECON-T) and data acquisition path (ECON-D) of the HGCAL. The ASICs, fabricated in 65 nm CMOS, are radiation tolerant up to 200 Mrad and require low power consumption: < 2.5 mW/sensor-channel per chip. Here, we report on the first functionality and radiation tests for the ECON-D-P1 full-functionality prototype. We present a comparison of single event effect (SEE) cross sections measured for different methods of triple modular redundancy using test results from the ECON-T-P1 full-functionality prototype.

47 OTHER INSTRUMENTATION↗

DOE OSTI2025

GRAPH — an readout ASIC for large MCP based detectors

We present a programmable 16 channel, mixed signal, low power readout ASIC, having the project historically named Gigasample Recorder of Analog waveforms from a PHotodetector (GRAPH). It is designed to read large aperture single photon imaging detectors using micro channel plates for charge multiplication, and measuring the detector's response on crossed strips anodes to extrapolate the incoming photon position. Each channel consists of a fast, low power and low noise charge sensitive amplifier, which provides a myriad of coarse and fine programmable options for gain and shaping settings. Further, the amplified signal is recorded using, to our knowledge novel, the Hybrid Universal sampLing Architecture (HULA) ADC. A kind of mixed signal double buffer memory, that enables concurrent waveform recording, and selected event digitized data extraction. The sampling frequency is freely adjustable between few kHz up to 125 MHz, while the chip's internal digital memory holds a history 2048 samples for each channel, with a digital headroom of 12 bits. An optimized region of interest sample-read algorithm allows to extract the information just around the event pulse peak, while selecting the next event, thus substantially reducing the operational dead time. The chip is designed in 130 nm TSMC CMOS technology, and its power consumption is around 47 mW per channel.

47 OTHER INSTRUMENTATION↗

DOE OSTI2025

An integer- N frequency synthesizer for flexible on-chip clock generation

A low-power integer-N frequency synthesizer for flexible on-chip clock generation has been designed in a 65 nm CMOS process. The circuit can be programmed to generate two independent low-jitter clocks between 30 MHz and 3 GHz that are locked to a 10–50 MHz reference input. The design uses a phase-locked loop (PLL) with a dual-tuned LC voltage-controlled oscillator (VCO), programmable feedback divider, and dual output dividers. The total power consumption from 1.2 V and 0.8 V supplies is 4.0 mW. In conclusion, experimental results confirm the functionality of the proposed synthesizer over a wide range of output frequencies.

47 OTHER INSTRUMENTATION↗

DOE OSTI2025

Lifetime study of the ColdADC for the Deep Underground Neutrino Experiment

ColdADC is a custom ASIC digitizer implemented in 65 nm CMOS technology using specialized techniques for long-term reliability in cryogenic environments. ColdADC was developed for use in the DUNE Far Detector complex, which will consist of four liquid argon time projection chambers. Each contains 17 kilotons liquid argon as the target material in order to measure neutrino oscillations. Approximately 40,000 ColdADC ASICs will be installed for DUNE in the first two large detectors and will be operated at cryogenic temperatures during the experiment without replacement. The lifetime of the ColdADC is a critical parameter affecting the data quality and physics sensitivity of the experiment. A measurement of the lifetime of the ColdADC was carried out, and the results shown in this paper assure orders of magnitude longer lifetime of the ColdADC than the planned operation time of the detectors.

Front-end electronics for detector readout↗

DOE OSTI2026

Low power on-chip data transmission for wafer-scale monolithic active pixel sensors

Here, this paper details the implementation of the digital pulse shaping subsystem within the Backbone Transmission Line Encoding (BTLE) driver, a low-power, long-distance on-chip data transmission solution designed in a 65 nm CMOS process. Digital pulse shaping is critical for minimizing inter-symbol interference (ISI) caused by bandwidth limitations of on-chip interconnects, especially in wafer-scale monolithic active pixel sensors (MAPS). A duobinary encoder coupled with a parallelized polyphase finite impulse response (FIR) filter is used for efficient shaping of the transmitted signal spectrum. This reconfigurable architecture achieves reliable 160 Mb/s data transfer over a 10 cm on-chip link, as validated by simulations demonstrating low power consumption (FoM 37.3 fJ/bit/mm of transmission line length) and effective ISI mitigation.

47 OTHER INSTRUMENTATION↗

DOE OSTI2024

Smart pixel sensors: towards on-sensor filtering of pixel clusters with deep learning

Highly granular pixel detectors allow for increasingly precise measurements of charged particle tracks. Next-generation detectors require that pixel sizes will be further reduced, leading to unprecedented data rates exceeding those foreseen at the High- Luminosity Large Hadron Collider. Signal processing that handles data incoming at a rate of $\mathcal{O}$(40 MHz) and intelligently reduces the data within the pixelated region of the detector at rate will enhance physics performance at high luminosity and enable physics analyses that are not currently possible. Using the shape of charge clusters deposited in an array of small pixels, the physical properties of the traversing particle can be extracted with locally customized neural networks. In this first demonstration, we present a neural network that can be embedded into the on-sensor readout and filter out hits from low momentum tracks, reducing the detector's data volume by 57.1%–75.7%. The network is designed and simulated as a custom readout integrated circuit with 28 nm CMOS technology and is expected to operate at less than 300 μW with an area of less than 0.2 mm 2 . The temporal development of charge clusters is investigated to demonstrate possible future performance gains, and there is also a discussion of future algorithmic and technological improvements that could enhance efficiency, data reduction, and power per area.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2021

High-energy micrometre-scale pixel direct conversion X-ray detector

The objective of this work was to fabricate and characterize a new X-ray imaging detector with micrometre-scale pixel dimensions (7.8 µm) and high detection efficiency for hard X-ray energies above 20 keV. A key technology component consists of a monolithic hybrid detector built by direct deposition of an amorphous selenium film on a custom designed CMOS readout integrated circuit. Characterization was carried out at the synchrotron beamline 1-BM-B at the Advanced Photon Source of Argonne National Laboratory. The direct conversion detector demonstrated micrometre-scale spatial resolution with a 63 keV modulation transfer function of 10% at Nyquist frequency. In addition, spatial resolving power down to 8 µm was determined by imaging a transmission bar target at 21 keV. X-ray signal linearity, responsivity and lag were also characterized in the same energy range. Finally, phase contrast edge enhancement was observed in a phase object placed in the beam path. This amorphous selenium/CMOS detector technology can address gaps in commercially available X-ray detectors which limit their usefulness for existing synchrotron applications at energies greater than 50 keV; for example, phase contrast tomography and high-resolution imaging of nanoscale lattice distortions in bulk crystalline materials using Bragg coherent diffraction imaging. Here, the technology will also facilitate the creation of novel synchrotron imaging applications for X-ray energies at or above 20 keV.

36 MATERIALS SCIENCE↗

DOE OSTI2026

Evaluation of an event-driven 3FI ASIC for spectroscopic X-ray detection with synchrotron radiation

The novel design and evaluation on the NSLS-II beamline of the 3FI application-specific integrated circuit (ASIC) bump-bonded to a simple, planar, 2D segmented silicon sensor are presented. The ASIC was developed for full-field fluorescence spectral X-ray imaging (3FI). It is a small-scale prototype that features a square array of 32 × 32 pixels, and the size of the pixels is 100 µm × 100 µm. The ASIC was implemented in a 65 nm CMOS integrated circuit fabrication process. Each pixel incorporates a charge-sensitive amplifier, a shaping filter, a discriminator, a peak detector and a sample-and-hold circuit, allowing detection of events and storage of signal amplitudes. The system operates in a frameless event-driven readout mode, outputting analog values for threshold-triggered events, allowing high-speed multi-element X-ray fluorescence data acquisition. The 3FI ASIC achieves per-channel spectrometric performance at a power consumption of only 200 µW per pixel, with nearly all dissipation confined to the analog front-end. An energy resolution is measured at the level of 308 eV full width at half-maximum (FWHM) at 8.04 keV (Cu Kα), and 138 eV FWHM at 3.69 keV (Ca Kα). This per-pixel capability makes the prototype suitable for in situ trace element microanalysis in biological and environmental studies. Moreover, the frameless architecture of the detector is designed to address limitations of conventional X-ray fluorescence microscopy, which typically requires mechanical scanning, by enabling continuous high-throughput data acquisition in future full-field implementations.

47 OTHER INSTRUMENTATION↗

DOE OSTI2021

An 802pW 93% Peak Efficiency Buck Converter with 5.5×10 6 Dynamic Range Featuring Fast DVFS and Asynchronous Load-Transient Control

Here this paper presents a buck converter with sub-nW quiescent power, high efficiency, and a wide dynamic range for ultra-low-power (ULP) IoT SoCs. To optimize the SoC power consumption, the buck converter supports fast dynamic voltage and frequency scaling (DVFS) and enables fast load-transient response (FLTR) through asynchronous control. In addition, the buck converter is fully self-contained with all features integrated on chip including a proposed adaptive deadtime controller. Fabricated in 65nm CMOS, measurement results show the buck converter has an 802pW quiescent power at 1.5V input voltage and a 93% peak efficiency. The measured dynamic range is from 0.5nW to 2.75mW, which is over 6 orders of magnitude. The measured voltage droop is 54mV for a 45nA-to-1mA load current step thanks to the asynchronous load-transient detector. The buck converter achieves the highest efficiency and widest dynamic range among all the state-of-the-art sub-nW switching voltage regulators, which makes it well suited for power management in ULP SoCs.

42 ENGINEERING↗

DOE OSTI2024

First Demonstration of Vertical 2T-nC FeRAM Hybrid Cell and its Scalability for High-Density 3D Ferroelectric Capacitor Memory

In this article, we perform a comprehensive experimental and modeling study into the scaling of vertical 2T-nC ferroelectric random-access memory (FeRAM) hybrid cell to demonstrate a high performance and high-density 3D capacitor memory. We demonstrate: i) first time successful integration of the vertical 2T-3C FeRAM cell by stacking the vertical metal-ferroelectricmetal (MFM) stack on top of Si CMOS transistors; ii) successful experimental operation of the memory cell, including the quasi-nondestructive read out (QNRO) of the polarization without write back after 106 read cycles; iii) the write bit line (WBL) heavily screens the coupling between neighboring strings, making it a minor concern; V ) aggressive stacking of the WBLs, i.e., number of MFMs in a string, could facilitate the self-boosting during write operation due to ferroelectric linear capacitance (CFE), which allows self-boosted inhibition for Vw/2 scheme and worsens the Vw/3 scheme as disturb increases to intolerable 2Vw/3; v) aggressive horizontal scaling significantly increases the read disturb to cells on neighboring planes due to capacitance between two WBLs (Cz).

42 ENGINEERING↗

DOE OSTI2023

Foundry-fabricated silicon source of broadband polarization entanglement

We present a CMOS-fabricated photonic integrated circuit tailored to the generation of ultrabroadband polarization-entangled photons. This fully on-chip source leverages a novel design combining polarization splitter-rotators and a bidirectionally pumped microring resonator to produce high-fidelity polarization Bell states over 115 frequency-bin pairs spaced 38.4 GHz apart.

Miloshevsky, Alex↗

DOE OSTI2020

An 85 nW IoT Node-Controlling SoC for MELs Power-Mode Management and Phantom Energy Reduction

This paper presents an ultra-low power (ULP) node-controlling system-on-chip (SoC) used for power-mode management and phantom energy reduction of miscellaneous electric loads (MELs). The SoC is powered from a single 2.5 V voltage supply enabled by the integrated power management unit (PMU) and can control up to 16 MELs due to the on-chip 16-channel correlator and the 32b RISC-V microprocessor. To further reduce the system power consumption, two clock domains have been adopted for the correlator and the processor separately. Fabricated in 65-nm CMOS, the measured minimum power consumption of the proposed SoC is only 85 nW at 0.45 V voltage supply and 1 kHz clock frequency. The measured maximum operating frequency can go up to 148 kHz with a 0.55 V supply. An application experiment successfully demonstrates that the SoC controls the power modes of MELs from wake-up to cut-off to save the average power and phantom energy.

power-mode management, phantom energy, phantom pow↗

DOE OSTI2022

A 194nW Energy-Performance-Aware loT SoC Employing a 5.2nW 92.6% Peak Efficiency Power Management Unit for System Performance Scaling, Fast DVFS and Energy Minimization

A self-powered IoT system-on-chip (SoC) reduces power to sub-μw and employs multiple power-management techniques to trade-off ultra-low power (ULP), higher performance, smaller energy harvester footprint, and longer operating lifetime. Minimum Energy Point Tracking (MEPT) [1]–[4] keeps an SoC operating at the minimum energy point (MEP) to enhance system lifetime. Previous sample-and-hold MEPT schemes need frequent voltage comparisons and a high-frequency clock that increases power [2]. Current-ratio-based MEPT relies on specialized CMOS technology for body-bias tuning [3]. A switched-capacitor-based MEPT can achieve energy minimization at a targeted performance [4], but it uses a 30MHz clock witμW power consumption and low power efficiency. For ULP IoT applications, SoCs need to have ultra-low quiescent power, high efficiency for energy delivery, performance scaling based on available energy, and energy minimization to increase system lifetime. In this work, we propose an ULP IoT SoC with a triple-mode power management unit (PMU) that integrates energy-performance scaling, event-driven fast DVFS, and MEPT features to improve the system energy efficiency, as shown in Fig. 13.8.1. This work achieves a minimum 194nW power consumption for the SoC and 5.2nW quiescent power for the PMU with a 92.6% peak efficiency and >10 4 dynamic range. The timing waveform in Fig. 13.8.1 (bottom), demonstrates the transition of the three modes including energy aware (EA), performance aware (PA), and MEPT based on event priority and input voltage level which reflects the energy availability. As such, the system energy consumption and performance could be well-balanced based on both the input and output conditions.

self-powered IoT system-on-chip (SoC)↗