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NASA NTRS2005

Operation's Concept for Array-Based Deep Space Network

The Array-based Deep Space Network (DSNArray) will be a part of more than 10(exp 3) times increase in the downlink/telemetry capability of the Deep space Network (DSN). The key function of the DSN-Array is to provide cost-effective, robust Telemetry, Tracking and Command (TT&C) services to the space missions of NASA and its international partners. It provides an expanded approach to the use of an array-based system. Instead of using the array as an element in the existing DSN, relying to a large extent on the DSN infrastructure, we explore a broader departure from the current DSN, using fewer elements of the existing DSN, and establishing a more modern Concept of Operations. This paper gives architecture of DSN-Array and its operation's philosophy. It also describes customer's view of operations, operations management and logistics - including maintenance philosophy, anomaly analysis and reporting.

operations concept↗

NASA NTRS1999

Phase array calibration orthogonal phase sequence

Methods and systems for calibrating an array antenna are described. The array antenna has a plurality of antenna elements each having a signal with a phase and an amplitude forming an array antenna signal. For calibration, the phase of each element signal is sequentially switched one at a time through four orthogonal phase states. At each orthogonal phase state, the power of the array antenna signal is measured. A phase and an amplitude error for each of the element signals is determined based on the power of the array antenna signal at each of the four orthogonal phase states. The phase and amplitude of each of the element signals is then adjusted by the corresponding phase and amplitude errors.

Sorace, Ronald E.↗

NASA NTRS2004

High density pixel array

A pixel array device is fabricated by a laser micro-milling method under strict process control conditions. The device has an array of pixels bonded together with an adhesive filling the grooves between adjacent pixels. The array is fabricated by moving a substrate relative to a laser beam of predetermined intensity at a controlled, constant velocity along a predetermined path defining a set of grooves between adjacent pixels so that a predetermined laser flux per unit area is applied to the material, and repeating the movement for a plurality of passes of the laser beam until the grooves are ablated to a desired depth. The substrate is of an ultrasonic transducer material in one example for fabrication of a 2D ultrasonic phase array transducer. A substrate of phosphor material is used to fabricate an X-ray focal plane array detector.

Wiener-Avnear, Eliezer↗

NASA NTRS2008

MEMS Microshutter Array System for James Webb Space Telescope

A complex MEMS microshutter array system has been developed at NASA Goddard Space Flight Center (GSFC) for use as a multi-object aperture array for a Near-Infrared Spectrometer (NIRSpec). The NIRSpec is one of the four major instruments carried by the James Webb Space Telescope (JWST), the next generation of space telescope after the Hubble Space Telescope retires. The microshutter arrays (MSAs) are designed for the selective transmission of light with high efficiency and high contrast. It is demonstrated in Figure 1 how a MSA is used as a multiple object selector in deep space. The MSAs empower the NIRSpec instrument simultaneously collect spectra from more than 100 targets therefore increases the instrument efficiency 100 times or more. The MSA assembly is one of three major innovations on JWST and the first major MEMS devices serving observation missions in space. The MSA system developed at NASA GSFC is assembled with four quadrant fully addressable 365x171 shutter arrays that are actuated magnetically, latched and addressed electrostatically. As shown in Figure 2, each MSA is fabricated out of a 4' silicon-on-insulator (SOI) wafer using MEMS bulk-micromachining technology. Individual shutters are close-packed silicon nitride membranes with a pixel size close to 100x200 pm (Figure 3). Shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. In order to prevent light leak, light shields are made on to the surrounding frame of each shutter to cover the gaps between the shutters and the Game (Figure 4). Micro-ribs and sub-micron bumps are tailored on hack walls and light shields, respectively, to prevent sticktion, shown in Figures 4 and 5. JWST instruments are required to operate at cryogenic temperatures as low as 35K, though they are to be subjected to various levels of ground tests at room temperature. The shutters should therefore maintain nearly flat in the entire temperature range between 35K and 300K. Through intensive numerical simulations and experimental studies, an optically opaque and electrically conductive metal-nitride thin film was selected as a coating material deposited on the shutters with the best thermal-expansion match to silicon nitride - the shutter blade thin film material. A shutter image shown in Figure 6 was taken at room temperature, presenting shutters slightly bowing down as expected. Shutters become flat when the temperature decreases to 35K. The MSAs are then bonded to silicon substrates that are fabricated out of 6" single-silicon wafers in the thickness of 2mm. The bonding is conducted using a novel single-sided indium flip-chip bonding technology. Indium bumps fabricated on a substrate are shown in Figure 7. There are 180,000 indium bumps for bonding a flight format MSA array to its substrate. Besides a MSA, each substrate houses five customer-designed ASIC (Application Specific Integrated Circuit) multiplexer/address chips for 2-dimensional addressing, twenty capacitors, two temperature sensors, numbers of resistors and all necessary interconnects, as shown in Figure 8. Complete MSA quadrant assemblies have been successfully manufactured and fully functionally tested. The assemblies have passed a series of critical reviews required by JWST in satisfying all the design specifications. The qualification tests cover programmable 2-D addressing, life tests, optical contrast tests, and environmental tests including radiation, vibration, and acoustic tests. A 2-D addressing pattern with 'ESA' letters programmed in a MSA is shown in Figure 9. The MSAs passed 1 million cycle life tests and achieved high optical contrast over 10,000. MSA teams are now making progress in final fabrication, testing and assembly (Figure 10). The delivery of flight-format MSA system is scheduled at the end of 2008 for being integrated to the focal plane of the NIRSpec detectors.

Li, Mary J.↗

NASA NTRS2008

Electromagnetically Clean Solar Arrays

The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the wiring on the back of the panel. Each step increases the potential for occurrence of latent defects, loss of process control, and attrition of components. An EMCSA panel includes an integral cover made from a transparent material. The silicone cover supplants the individual cover glasses on the cells and serves as an additional unitary structural support that offers the advantage, relative to glass, of the robust, forgiving nature of the silcone material. The cover contains pockets that hold the solar cells in place during the lamination process. The cover is coated with indium tin oxide to make its surface electrically conductive, so that it serves as a contiguous, electrically grounded shield over the entire panel surface. The cells are mounted in proximity to metallic printed wiring. The painted-wiring layer comprises metal-film traces on a sheet of Kapton (or equivalent) polyimide. The traces include contact pads on one side of the sheet for interconnecting the cells. Return leads are on the opposite side of the sheet, positioned to form the return currents substantially as mirror images of, and in proximity to, the cell sheet currents, thereby minimizing magnetic moments. The printed-wiring arrangement mimics the back-wiring arrangement of conventional solar arrays, but the current-loop areas and the resulting magnetic moments are much smaller because the return-current paths are much closer to the solar-cell sheet currents. The contact pads are prepared with solder fo electrical and mechanical bonding to the cells. The pocketed cover/shield, the solar cells, the printed-wiring layer, an electrical bonding agent, a mechanical-bonding agent, a composite structural front-side face sheet, an aluminum honeycomb core, and a composite back-side face sheet are all assembled, then contact pads are soldered to the cells and the agents are cured in a single lamination process.

Stem, Theodore G.↗

NASA NTRS2009

Estimating Transmitted-Signal Phase Variations for Uplink Array Antennas

A method of estimating phase drifts of microwave signals distributed to, and transmitted by, antennas in an array involves the use of the signals themselves as phase references. The method was conceived as part of the solution of the problem of maintaining precise phase calibration required for proper operation of an array of Deep Space Network (DSN) antennas on Earth used for communicating with distant spacecraft at frequencies between 7 and 8 GHz. The method could also be applied to purely terrestrial phased-array radar and other radio antenna array systems. In the DSN application, the electrical lengths (effective signal-propagation path lengths) of the various branches of the system for distributing the transmitted signals to the antennas are not precisely known, and they vary with time. The variations are attributable mostly to thermal expansion and contraction of fiber-optic and electrical signal cables and to a variety of causes associated with aging of signal-handling components. The variations are large enough to introduce large phase drifts at the signal frequency. It is necessary to measure and correct for these phase drifts in order to maintain phase calibration of the antennas. A prior method of measuring phase drifts involves the use of reference-frequency signals separate from the transmitted signals. A major impediment to accurate measurement of phase drifts over time by the prior method is the fact that although DSN reference-frequency sources separate from the transmitting signal sources are stable and accurate enough for most DSN purposes, they are not stable enough for use in maintaining phase calibrations, as required, to within a few degrees over times as long as days or possibly even weeks. By eliminating reliance on the reference-frequency subsystem, the present method overcomes this impediment. In a DSN array to which the present method applies (see figure), the microwave signals to be transmitted are generated by exciters in a signal-processing center, then distributed to the antennas via optical fibers. At each antenna, the signals are used to drive a microwave power-amplifier train, the output of which is coupled to the antenna for transmission. A small fraction of the power-amplifier-train output is sent back to the signal-processing center along another optical fiber that is part of the same fiber-optic cable used to distribute the transmitted signal to the antenna. In the signal-processing center, the signal thus returned from each antenna is detected and its phase is compared with the phase of the signal sampled directly from the corresponding exciter. It is known, from other measurements, that the signal-propagation path length from the power-amplifier-train output port to the phase center of each antenna is sufficiently stable and, hence, that sampling the signal at the power-amplifier-train output port suffices for the purpose of characterizing the phase drift of the transmitted signal at the phase center of the antenna

Paal, Leslie↗

NASA NTRS2009

Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays

The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices.

Jhabvala, Murzy↗

NASA NTRS2010

Spatio-Temporal Equalizer for a Receiving-Antenna Feed Array

A spatio-temporal equalizer has been conceived as an improved means of suppressing multipath effects in the reception of aeronautical telemetry signals, and may be adaptable to radar and aeronautical communication applications as well. This equalizer would be an integral part of a system that would also include a seven-element planar array of receiving feed horns centered at the focal point of a paraboloidal antenna that would be nominally aimed at or near the aircraft that would be the source of the signal that one seeks to receive (see Figure 1). This spatio-temporal equalizer would consist mostly of a bank of seven adaptive finite-impulse-response (FIR) filters one for each element in the array - and the outputs of the filters would be summed (see Figure 2). The combination of the spatial diversity of the feedhorn array and the temporal diversity of the filter bank would afford better multipath-suppression performance than is achievable by means of temporal equalization alone. The seven-element feed array would supplant the single feed horn used in a conventional paraboloidal ground telemetry-receiving antenna. The radio-frequency telemetry signals re ceiv ed by the seven elements of the array would be digitized, converted to complex baseband form, and sent to the FIR filter bank, which would adapt itself in real time to enable reception of telemetry at a low bit error rate, even in the presence of multipath of the type found at many flight test ranges.

Mukai, Ryan↗

NASA NTRS2010

DAMAS Processing for a Phased Array Study in the NASA Langley Jet Noise Laboratory

A jet noise measurement study was conducted using a phased microphone array system for a range of jet nozzle configurations and flow conditions. The test effort included convergent and convergent/divergent single flow nozzles, as well as conventional and chevron dual-flow core and fan configurations. Cold jets were tested with and without wind tunnel co-flow, whereas, hot jets were tested only with co-flow. The intent of the measurement effort was to allow evaluation of new phased array technologies for their ability to separate and quantify distributions of jet noise sources. In the present paper, the array post-processing method focused upon is DAMAS (Deconvolution Approach for the Mapping of Acoustic Sources) for the quantitative determination of spatial distributions of noise sources. Jet noise is highly complex with stationary and convecting noise sources, convecting flows that are the sources themselves, and shock-related and screech noise for supersonic flow. The analysis presented in this paper addresses some processing details with DAMAS, for the array positioned at 90 (normal) to the jet. The paper demonstrates the applicability of DAMAS and how it indicates when strong coherence is present. Also, a new approach to calibrating the array focus and position is introduced and demonstrated.

Brooks, Thomas F.↗

NASA NTRS2010

Experimental Charging Behavior of Orion UltraFlex Array Designs

The present ground based investigations give the first definitive look describing the charging behavior of Orion UltraFlex arrays in both the Low Earth Orbital (LEO) and geosynchronous (GEO) environments. Note the LEO charging environment also applies to the International Space Station (ISS). The GEO charging environment includes the bounding case for all lunar mission environments. The UltraFlex photovoltaic array technology is targeted to become the sole power system for life support and on-orbit power for the manned Orion Crew Exploration Vehicle (CEV). The purpose of the experimental tests is to gain an understanding of the complex charging behavior to answer some of the basic performance and survivability issues to ascertain if a single UltraFlex array design will be able to cope with the projected worst case LEO and GEO charging environments. Stage 1 LEO plasma testing revealed that all four arrays successfully passed arc threshold bias tests down to -240 V. Stage 2 GEO electron gun charging tests revealed that only the front side area of indium tin oxide coated array designs successfully passed the arc frequency tests

Golofaro, Joel T.↗

NASA NTRS2010

Optimal and Local Connectivity Between Neuron and Synapse Array in the Quantum Dot/Silicon Brain

This innovation is used to connect between synapse and neuron arrays using nanowire in quantum dot and metal in CMOS (complementary metal oxide semiconductor) technology to enable the density of a brain-like connection in hardware. The hardware implementation combines three technologies: 1. Quantum dot and nanowire-based compact synaptic cell (50x50 sq nm) with inherently low parasitic capacitance (hence, low dynamic power approx.l0(exp -11) watts/synapse), 2. Neuron and learning circuits implemented in 50-nm CMOS technology, to be integrated with quantum dot and nanowire synapse, and 3. 3D stacking approach to achieve the overall numbers of high density O(10(exp 12)) synapses and O(10(exp 8)) neurons in the overall system. In a 1-sq cm of quantum dot layer sitting on a 50-nm CMOS layer, innovators were able to pack a 10(exp 6)-neuron and 10(exp 10)-synapse array; however, the constraint for the connection scheme is that each neuron will receive a non-identical 10(exp 4)-synapse set, including itself, via its efficacy of the connection. This is not a fully connected system where the 100x100 synapse array only has a 100-input data bus and 100-output data bus. Due to the data bus sharing, it poses a great challenge to have a complete connected system, and its constraint within the quantum dot and silicon wafer layer. For an effective connection scheme, there are three conditions to be met: 1. Local connection. 2. The nanowire should be connected locally, not globally from which it helps to maximize the data flow by sharing the same wire space location. 3. Each synapse can have an alternate summation line if needed (this option is doable based on the simple mask creation). The 10(exp 3)x10(exp 3)-neuron array was partitioned into a 10-block, 10(exp 2)x10(exp 3)-neuron array. This building block can be completely mapped within itself (10,000 synapses to a neuron).

Duong, Tuan A.↗

NASA NTRS2010

Electrostatic Discharge Test of Multi-Junction Solar Array Coupons After Combined Space Environmental Exposures

A set of multi-junction GaAs/Ge solar array test coupons were subjected to a sequence of 5-year increments of combined environmental exposure tests. The test coupons capture an integrated design intended for use in a geosynchronous (GEO) space environment. A key component of this test campaign is conducting electrostatic discharge (ESD) tests in the inverted gradient mode. The protocol of the ESD tests is based on the ISO/CD 11221, the ISO standard for ESD testing on solar array panels. This standard is currently in its final review with expected approval in 2010. The test schematic in the ISO reference has been modified with Space System/Loral designed circuitry to better simulate the on-orbit operational conditions of its solar array design. Part of the modified circuitry is to simulate a solar array panel coverglass flashover discharge. All solar array coupons used in the test campaign consist of 4 cells. The ESD tests are performed at the beginning of life (BOL) and at each 5-year environment exposure point. The environmental exposure sequence consists of UV radiation, electron/proton particle radiation, thermal cycling, and ion thruster plume. This paper discusses the coverglass flashover simulation, ESD test setup, and the importance of the electrical test design in simulating the on-orbit operational conditions. Results from 5th-year testing are compared to the baseline ESD characteristics determined at the BOL condition.

Wright, Kenneth H.↗

NASA NTRS2010

Atmospheric Compensation for Uplink Arrays via Radiometry

Uplink arrays for communications applications are gaining increased visibility within the NASA and military community due to the enhanced flexibility and reliability they provide. When compared with the conventional large, single aperture antennas currently comprising the Deep Space Network (DSN), for example, smaller aperture antenna arrays have the benefits of providing fault tolerance (reduced single-point failure), reduced maintenance cost, and enhanced capabilities such as electronic beam-steering and multi-beam operation. However, signal combining of antenna array elements spaced many wavelengths apart becomes problematic due to the inherent instability of earth's turbulent atmosphere, particularly at the frequencies of interest to the DSN (i.e., Ka-band). Degradation in the power combining of the individual elements comprising the array arises due to uncorrelated phase errors introduced as the signals propagate through the troposphere. It is well known that the fundamental source of this error is due to the inhomogeneous distribution of water vapor in the atmosphere [1]. Several techniques have been proposed to circumvent this issue, including the use of phase calibration towers and a moon bounce to generate a feedback loop which would provide a means of intermittent calibration of the system phase errors (thermal drifts, atmosphere) [2,3]. However, these techniques require repositioning of the antenna elements to perform this operation which ultimately results in reduced system availability. And, though they are sufficient for compensating for slow varying phase drifts, they are insufficient to compensate for faster varying phase errors, such as those introduced by the atmosphere. In this paper, preliminary radiometry and interferometry measurements collected by the NASA Glenn Research Center are analyzed and indicate that the use of optimized water vapor radiometers as a feedback system in a communications platform could provide the necessary atmospheric compensation technique to enhance the beamforming of uplink arrays.

Nessel, James A.↗

NASA NTRS2004

Making Carbon-Nanotube Arrays Using Block Copolymers: Part 2

Some changes have been incorporated into a proposed method of manufacturing regular arrays of precisely sized, shaped, positioned, and oriented carbon nanotubes. Such arrays could be useful as mechanical resonators for signal filters and oscillators, and as electrophoretic filters for use in biochemical assays. A prior version of the method was described in Block Copolymers as Templates for Arrays of Carbon Nanotubes, (NPO-30240), NASA Tech Briefs, Vol. 27, No. 4 (April 2003), page 56. To recapitulate from that article: As in other previously reported methods, carbon nanotubes would be formed by decomposition of carbon-containing gases over nanometer-sized catalytic metal particles that had been deposited on suitable substrates. Unlike in other previously reported methods, the catalytic metal particles would not be so randomly and densely distributed as to give rise to thick, irregular mats of nanotubes with a variety of lengths, diameters, and orientations. Instead, in order to obtain regular arrays of spaced-apart carbon nanotubes as nearly identical as possible, the catalytic metal particles would be formed in predetermined regular patterns with precise spacings. The regularity of the arrays would be ensured by the use of nanostructured templates made of block copolymers.

Bronikowski, Michael↗

NASA NTRS2004

Aligning Arrays of Lenses and Single-Mode Optical Fibers

A procedure now under development is intended to enable the precise alignment of sheet arrays of microscopic lenses with the end faces of a coherent bundle of as many as 1,000 single-mode optical fibers packed closely in a regular array (see Figure 1). In the original application that prompted this development, the precise assembly of lenses and optical fibers serves as a single-mode spatial filter for a visible-light nulling interferometer. The precision of alignment must be sufficient to limit any remaining wavefront error to a root-mean-square value of less than 1/10 of a wavelength of light. This wavefront-error limit translates to requirements to (1) ensure uniformity of both the lens and fiber arrays, (2) ensure that the lateral distance from the central axis of each lens and the corresponding optical fiber is no more than a fraction of a micron, (3) angularly align the lens-sheet planes and the fiber-bundle end faces to within a few arc seconds, and (4) axially align the lenses and the fiber-bundle end faces to within tens of microns of the focal distance. Figure 2 depicts the apparatus used in the alignment procedure. The beam of light from a Zygo (or equivalent) interferometer is first compressed by a ratio of 20:1 so that upon its return to the interferometer, the beam will be magnified enough to enable measurement of wavefront quality. The apparatus includes relay lenses that enable imaging of the arrays of microscopic lenses in a charge-coupled-device (CCD) camera that is part of the interferometer. One of the arrays of microscopic lenses is mounted on a 6-axis stage, in proximity to the front face of the bundle of optical fibers. The bundle is mounted on a separate stage. A mirror is attached to the back face of the bundle of optical fibers for retroreflection of light. When a microscopic lens and a fiber are aligned with each other, the affected portion of the light is reflected back by the mirror, recollimated by the microscopic lens, transmitted through the relay lenses and the beam compressor/expander, then split so that half goes to a detector and half to the interferometer. The output of the detector is used as a feedback control signal for the six-axis stage to effect alignment.

Liu, Duncan↗

NASA NTRS2004

Curved-Focal-Plane Arrays Using Deformed-Membrane Photodetectors

A versatile and simple approach to the design and fabrication of curved-focal-plane arrays of silicon-based photodetectors is being developed. This approach is an alternative to the one described in "Curved Focal-Plane Arrays Using Back- Illuminated High-Purity Photodetectors" (NPO-30566), NASA Tech Briefs, Vol. 27, No. 10 (October 2003), page 10a. As in the cited prior article, the basic idea is to improve the performance of an imaging instrument and simplify the optics needed to obtain a given level of performance by making an image sensor (in this case, an array of photodetectors) conform to a curved focal surface, instead of designing the optics to project an image onto a flat focal surface. There is biological precedent for curved-focal-surface designs: retinas - the image sensors in eyes - conform to the naturally curved focal surfaces of eye lenses. The present approach is applicable to both front-side- and back-side-illuminated, membrane photodetector arrays and is being demonstrated on charge-coupled devices (CCDs). The very-large scale integrated (VLSI) circuitry of such a CCD or other array is fabricated on the front side of a silicon substrate, then the CCD substrate is attached temporarily to a second substrate for mechanical support, then material is removed from the back to obtain the CCD membrane, which typically has a thickness between 10 and 20 m. In the case of a CCD designed to operate in back-surface illumination, delta doping can be performed after thinning to enhance the sensitivity. This approach is independent of the design and method of fabrication of the front-side VLSI circuitry and does not involve any processing of a curved silicon substrate. In this approach, a third substrate would be prepared by polishing one of its surfaces to a required focal-surface curvature. A CCD membrane fabricated as described above would be pressed against, deformed into conformity with, and bonded to, the curved surface. The technique used to press and bond the CCD membrane would depend on the nature of the supporting material (see figure). For example, if the third substrate were made of quartz frit, the substrate would be prepared by suffusing it with epoxy. Then one would take advantage of the porosity of the frit by applying a partial vacuum to the opposite surface of the frit, causing atmospheric pressure to push the CCD membrane against the curved surface. The curing of the epoxy would bond the CCD membrane to the curved surface. Alternatively, if the third substrate were made of a nonporous material, the curved substrate surface would be prepared by coating it with a wax or an uncured epoxy. The CCD membrane would be pressed against the coated, curved surface by use of a suitably pressurized balloon. The CCD membrane would then become bonded to the curved surface by curing of the epoxy or freezing of the wax.

Nikzad, Shouleh↗

NASA NTRS2003

Determining Direction of Arrival at a Y-Shaped Antenna Array

An algorithm computes the direction of arrival (both azimuth and elevation angles) of a lightning-induced electromagnetic signal from differences among the times of arrival of the signal at four antennas in a Y-shaped array on the ground. In the original intended application of the algorithm, the baselines of the array are about 90 m long and the array is part of a lightning-detection-and-ranging (LDAR) system. The algorithm and its underlying equations can also be used to compute directions of arrival of impulsive phenomena other than lightning on arrays of sensors other than radio antennas: for example, of an acoustic pulse arriving at an array of microphones.

Starr, Stan↗

NASA NTRS2003

Surface-Micromachined Planar Arrays of Thermopiles

Planar two-dimensional arrays of thermopiles intended for use as thermal-imaging detectors are to be fabricated by a process that includes surface micromachining. These thermopile arrays are designed to perform better than do prior two-dimensional thermopile arrays. The lower performance of prior two-dimensional thermopile arrays is attributed to the following causes: The thermopiles are made from low-performance thermoelectric materials. The devices contain dielectric supporting structures, the thermal conductances of which give rise to parasitic losses of heat from detectors to substrates. The bulk-micromachining processes sometimes used to remove substrate material under the pixels, making it difficult to incorporate low-noise readout electronic circuitry. The thermoelectric lines are on the same level as the infrared absorbers, thereby reducing fill factor. The improved pixel design of a thermopile array of the type under development is expected to afford enhanced performance by virtue of the following combination of features: Surface-micromachined detectors are thermally isolated through suspension above readout circuitry. The thermopiles are made of such high-performance thermoelectric materials as Bi-Te and Bi-Sb-Te alloys. Pixel structures are supported only by the thermoelectric materials: there are no supporting dielectric structures that could leak heat by conduction to the substrate.

Foote, Marc C.↗