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At least 631 records · Page 35
All sourcesNASA NTRSDOE OSTI
NASA NTRS1991

High molecular weight first generation PMR polyimides for 343 C applications

The effect of molecular weight on 343 C thermo-oxidative stability (TOS), mechanical properties, and processability, of the first generation PMR polyimides was studied. Graphite fiber reinforced PMR-15, PMR-30, PMR-50, and PMR-75 composites (corresponding to formulated molecular weights of 1500, 3000, 5000, and 7500, respectively) were fabricated using a simulated autoclave process. The data reveals that while alternate autoclave cure schedules are required for the high molecular weight resins, low void laminates can be fabricated which have significantly improved TOS over PMR-15, with only a small sacrifice in mechanical properties.

Malarik, Diane C.↗
NASA NTRS1992

Structure-to-property relationships in addition cured polymers. 4: Correlations between thermo-oxidative weight losses of norbornenyl cured polyimide resins and their composites

Relationships are identified between the thermo-oxidative stability (TOS) at 316 C of a wide variety of PMR (polymerization of monomeric reactants) addition cured polyimide resins and their corresponding graphite fiber composites. Weight loss results at 316 C confirmed the expected relationship of increasing aliphatic endcap content with decreasing TOS. Moreover, the resin TOS study also showed an unexpected linear correlation of decreasing weight loss to increasing ratio of benzylic diamine to aliphatic endcap in the range of the stoichiometries studied. Only after long term 316 C aging does the dianhydride used with the benzylic diamines become an additional factor in influencing the amount of PMR resin and composite weight losses. Also, the benzylic systems consistently showed much lower resin and composite weight losses at 316 C than the corresponding nonbenzylic norbornenyl resins and composites, except when the nonbenzylic diamine monomer does not contain a connecting group. Instead, this diamine resulted in a 316 C resin and composite weight loss that was only competitive with benzylic type diamines. Results show excellent correlation between TOS of all graphite fiber PMR composites and resins.

Alston, William B.↗
NASA NTRS1992

The study of the thermal behavior of a new semicrystalline polyimide

Thermal properties of a new semicrystalline polyimide synthesized from 3,3',4,4' benzophenone tetracarboxylic dianhydride (BTDA) and 2,2 dimethyl 1,2-(4 aminophenoxy) propane (DMDA) were studied. Heat capacities in the solid and liquid states of BTDA-DMDA were measured. The heat capacity increase at the glass transition temperature (T sub g = 230 C) is 145 J/(C mol) for amorphous BTDA-DMDA. The equilibrium heat of fusion of the BTDA-DMDA crystals was obtained using wide angle X ray diffraction and differential scanning calorimetry measurements, and it is 75.8 kJ/mol. Based on the information of crystallinity and the heat capacity increase at T sub g, a rigid amorphous fraction is identified in semicrystalline BTDA-DMDA samples. The rigid amorphous fraction represents an interfacial region between the crystalline and amorphous states. In particular, this fraction increases with the crystallinity of the sample which should be associated with crystal sizes, and therefore, with crystal morphology. It was also found that this polymer has a high temperature crystal phase upon annealing above its original melting temperature. The thermal degradation activation energies are determined to be 154 and 150 kJ/mol in nitrogen and air, respectively.

Cheng, Stephen Z. D.↗
NASA NTRS1992

Evaluation of long-duration exposure to the natural space environment on the mechanical properties of carbon-reinforced epoxy and polyimide composites

Experiment AO175 involved passive exposure of carbon-fiber reinforced laminates of epoxy, bismaleimide, and polyimide resins. The post-flight evaluation includes the following: optical examination of exposed surfaces and polished cross-sections; panel weight and distortion measurements; ultrasonic c-scan inspection; and conventional mechanical testing of coupons machined from the panels.

Vyhnal, Richard F.↗
NASA NTRS1992

Polyimide molding powder, coating, adhesive, and matrix resin

The invention is a polyimide prepared from 3,4'-oxydianiline (3,4'-ODA) and 4,4'-oxydiphthalic anhydride (ODPA), in 2-methoxyethyl ether (diglyme). The polymer was prepared in ultra high molecular weight and in a controlled molecular weight form which has a 2.5 percent offset in stoichiometry (excess diamine) with a 5.0 percent level of phthalic anhydride as an endcap. This controlled molecular weight form allows for greatly improved processing of the polymer for moldings, adhesive bonding, and composite fabrication. The higher molecular weight version affords tougher films and coatings. The overall polymer structure groups in the dianhydride, the diamine, and a metal linkage in the diamine affords adequate flow properties for making this polymer useful as a molding powder, adhesive, and matrix resin.

St.clair, Terry L.↗
NASA NTRS1992

SiO(X) coatings for atomic oxygen protection of polyimide Kapton in low earth orbit

Sputter-deposited SiO(X) (where X between 1.9 and 2.0) thin film coatings have been found to be durable to atomic oxygen. Such coatings will be used to protect polyimide Kapton photovoltaic array blankets from atomic oxygen attack in low earth orbit (LEO) on the Space Station Freedom (SSF). Monte Carlo modeling of atomic oxygen attack at defect sites in protected Kapton exposed in laboratory RF plasma ashers and on solar tracking photovoltaic arrays in space has been conducted to enable understanding of degradation processes relevant to the durability of the SSF solar array blanket. SiO(X) protective coating performance data from RF plasma asher tests will be presented, along with Monte Carlo modeling considerations, to enable the projection of in-space durability of the SSF solar array blankets based on ground laboratory test results.

Banks, Bruce A.↗
NASA NTRS1991

Viscoelastic properties of addition-cured polyimides used in high temperature polymer matrix composites

The viscoelastic properties of an addition-cured polyimide, PMR-15, were evaluated through dynamic mechanical and stress relaxation testing. Below the glass transition temperature, the dynamic mechanical properties of the composites are strongly affected by the absorbed moisture in the resin. At temperature 20 C and more above the glass transition temperature, the storage modulus increases continuously with time, indicating that additional crosslinking is occurring in the resin. For resin moisture contents less than 2 percent, stress relaxation curves measured at different temperatures can be superimposed using horizontal shifts along the log(time) axis with only small shifts along the vertical axis.

Roberts, Gary D.↗
NASA NTRS1992

High molecular weight first generation PMR polyimides for 343 C applications

The effect of molecular weight on 343 C thermo-oxidative stability (TOS), mechanical properties, and processability, of the first generation PMR polyimides was studied. Graphite fiber reinforced PMR-15, PMR-30, PMR-50, and PMR-75 composites (corresponding to formulated molecular weights of 1500, 3000, 5000, and 7500, respectively) were fabricated using a simulated autoclave process. The data reveal that while alternate autoclave cure schedules are required for the high molecular weight resins, low void laminates can be fabricated which have significantly improved TDS over PMR-15, with only a small sacrifice in mechanical properties.

Malarik, D. C.↗
NASA NTRS1993

Thin Hot-Film Sensors On Polyimide Film

Array of closely spaced hot-film sensors with thickness well below critical reference height with regard to air-flow pattern nonintrusively detect laminar boundary-layer transitions with very high resolution. Method developed at NASA Langley Research Center to fabricate such sensors on polyimide films to detect boundary-layer transitions with resolution as high as 0.050 in. These films formed by combination of vacuum deposition and photolithography.

Hopson, Purnell↗
NASA NTRS1993

Polyimide from bis(n-isoprenyl)s of aryl diamides

A process and polyimide product formed by the reaction of a bismaleimide with a bis(amidediene) is disclosed wherein the bis(amidediene) is formed by reacting an excess of an acid chloride with 1,4-N,N'-diisoprenyl 2,3,5,6-tetramethy1 benzene.

Smith, Joseph G., Jr.↗
NASA NTRS1993

An XPS study of space-exposed polyimide film

X-ray photoelectron spectroscopy was used to assess changes induced in the surface chemistry of Kapton H (Du Pont Trademark) polyimide strips exposed to the low Earth orbit environment at the space-end of the LDEF satellite on Experiment A0133. Results from flight specimens are compared to material cut from the same lot and stored at room temperature under standard atmospheric conditions. One notable difference was a nearly two-fold increase in surface oxygen (atom-percent composition) for specimens exposed to the direct space environment as compared to controls. In addition, space exposed specimens contained distinct silicon peaks (2p 103.2 eV and 2s 154.2 eV) in their spectra. These peaks were absent in control spectra. It is likely that the increase in oxygen is associated with the silicon. This is in agreement with reports of widespread silicon contamination throughout the LDEF satellite.

Lee, Myung↗
NASA NTRS1992

Lower temperature curing thermoset polyimides utilizing a substituted norbornene endcap

Methoxycarbonyl bridgehead substituted nadic diacid monomethyl ester, when used as an endcapping monomer, lowered the cure temperature of thermoset PMR polyimides without seriously affecting other desirable properties, such as glass transition temperature and thermal oxidative stability. The C-13 CP/MAS NMR of model compounds was used to follow the cure of resin systems using both the unmodified nadic endcap and the methoxycarbonyl-substituted endcap. Rheological analysis and differential scanning calorimetry DSC also provided evidence for the lower curing nature of the substituted endcap. Two regioisomers of the bridgehead-substituted endcap were isolated, and their chemical structures were elucidated by X-ray crystallography. The model compound and molecular modeling studies conducted ruled out the possibility of regioisomeric imide formation in the substituted endcaps.

Waters, John F.↗
NASA NTRS1985

Enhancement of molecular weight build up in polyimides using ether solvents

Two linear polyimides were prepared in various ether and amide solvents. The inherent viscosity was then monitored as a function of time. The polymers made in the ether solvents consistently gave higher inherent viscosities, and thus molecular weights, than the same polymers made in the amide solvents. This molecular weight buildup is attributed to the unique solvation mechanism of the ether solvents which enhances the basicity of the amines via hydrogen bonding.

Egli, Annemarie H.↗
NASA NTRS1987

Selected spectroscopic and magnetic properties of lanthanide complexes in polyimide XU-218

Polyimide XU-218 films containing approximately 5 wt pct of Eu(III), Gd(III), Tb(III), and Er(III) were prepared, and the effects of complexing each of the metals with the following four ligands were investigated: N-phenylphthalamate (NPPA), 2,4-pentanedionate (AcAc), 1,3-diphenyl 1,3-propanedionate (DBM), and a new hexa-aza-macrocyclic (MAC) ligand. The tris-chelated complexes of the mononegative ligands NPPA, AcAc, and DBM produced transparent, flexible films, which had magnetic and spectral properties very similar to those of the parent lanthanide complexes, while complexes of MAC showed problems due to the presence of lattice water and yielded dark brittle films. AcAc caused little or no effect on the glass transition temperature (Tg), while NPPA and DBM complexes lowered Tg to 269-290 C, and MAC indicated moisture by inflexion at 95-100 C with a true Tg at 320 C. All lanthanide-containing films were paramagnetic.

Stoakley, D. M.↗
NASA NTRS1994

Polyimides Containing Pendent Ethynyl Groups

Series of novel diamines containing pendent ethynyl groups synthesized and reacted with various dianhydrides to form polyamide acids cyclodehydrated to form polyimides containing pendent ethynyl groups. Copolyimides of these diamines and other diamines also prepared. Upon heating, ethynyl groups in these polymers react with one another to form cross-linked molecular structures. As result of curing reaction, resistance to solvents, glass-transition temperature, and modulus of elasticity of polymer of this type generally increase, accompanied by corresponding decrease in tensile elongation and toughness. Cured polymers used as films, moldings, adhesives, and composite matrices.

Hergenrother, Paul M.↗
NASA NTRS1994

More About V-CAP Polyimides

V-CAP polyimides are processible matrix resins extending continuous-use temperature of composite materials. Under contract to NASA, General Electric used VCAP to fabricate and successfully test hot section of forward exhaust fairing on their F110 engine. Also used in other components of jet engines and airframes, including vanes, fan frames, cowls, and wing panels. Nonaerospace applications include brake linings, bearings, grinding wheels and slip seals, commutators in electric motors, and parts of motors in refrigerator compressors. Future applications include printed-circuit boards and components of nacelles in jet engines.

Vannucci, Raymond D.↗
NASA NTRS1994

Low-Dielectric-Constant Polyimide Fibers

In experiments performed at NASA Langley Research Center, low-dielectric-constant polyimide fibers produced by use of resin extrusion. These fibers also have high thermal stability and good tensile properties. Useful in industrial and aerospace applications in which fibers required to have dielectric constants less than 3, high thermal stability, and tensile properties in range of those of standard textile fibers. Potential applications include use in printed circuit-boards and in aircraft composites.

Dorogy, William E., Jr.↗
NASA NTRS1994

Modified LaRC(TM)-IA Polyimides

Modified versions of thermoplastic polyimide LaRC(TM)-IA incorporate various amounts of additional, rigid moieties into backbones of LaRC(TM)-IA molecules. Modified versions more resistant to solvents and exhibit higher glass-transition temperatures, yet retain melt-flow processability of unmodified LaRC(TM)-IA.

St. Clair, Terry L.↗