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At least 631 records · Page 35

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NASA NTRS1987

Adhesive properties of a semi-crystalline polyimide

Adhesive and film properties of a new semi-crystalline polyimide, designated LARC-CPI, having a glass transition temperature of 222 C and a crystalline melt temperature of 350 C are presented. The films exhibited excellent resistance to solvents and strong base. Compact tension specimens from LARC-CPI moldings displayed a fracture energy of 37.8 lb/sq in. Titanium tensile shear specimens gave strengths of 6250 psi initially at 25 C, 7120 psi at 25 C after 1000 hours at 232 C, 2800 psi at 232 C after annealing for 5 hours at 300 C, and 3670 psi at 232 C after 100 hours at 316 C in air.

Hergenrother, P. M.↗

NASA NTRS1990

High-Temperature Polyimide Resin

Improved polyimide resin used at continuous temperatures up to 700 degrees F (371 degrees C). PMR-II-50, serves as matrix for fiber-reinforced composites. Material combines thermo-oxidative stability with autoclave processability. Used in such turbine engine components as air-bypass ducts, vanes, bearings, and nozzle flaps. Other potential applications include wing and fuselage skins on high-mach-number aircraft and automotive engine blocks and pistons.

Vanucci, Raymond D.↗

NASA NTRS1990

LARC-I-TPI: A New Thermoplastic Polyimide

"LARC-I-TPI" denotes improved version of LARC-TPI class of thermoplastic polyimides: high-performance polymers developed for manufacture of strong, lightweight aircraft structures. Melt-flow and adhesive properties of new polymers make them attractive for use as matrix resins for composites, molding powders, adhesives, and coating films. Less toxic, improved LARC-I-TPI polymers formulated without 3, 3'-diaminobenzophenone, which is mutagenic and commercially unavailable.

St. Clair, Terry L.↗

NASA NTRS1990

A study of physical properties of ODPA-p-PDA polyimide films

Physical properties were investigated of ODPA-p-PDA polyimide films, including their lower molecular weight versions with phthalimide endcaps. Free volume, determined by low energy positron annihilation in the test films, was the major parameter of interest since all other physical properties are ostensibly related to it. It affects the dielectric constant as well as the saturation moisture pickup of the test films. An empirical relation was developed between the free volume and molecular weight of the test films, comparable to the Mark-Houwink relation between the polymer solution viscosity and the molecular weight. Development of such a relation constitutes a unique achievement since it enables researchers to estimate the molecular weight of an intractable polymer in solid state for the first time.

Singh, Jag J.↗

NASA NTRS1990

Computed structures of polyimides model compounds

Using a semi-empirical approach, a computer study was made of 8 model compounds of polyimides. The compounds represent subunits from which NASA Langley Research Center has successfully synthesized polymers for aerospace high performance material application, including one of the most promising, LARC-TPI polymer. Three-dimensional graphic display as well as important molecular structure data pertaining to these 8 compounds are obtained.

Tai, H.↗

NASA NTRS1990

LARC-TPI 1500 series controlled molecular weight polyimide

LARC-TPI, a linear high temperature thermoplastic polyimide, was developed several years ago at NASA Langley Research Center. This material has been commercialized by Mitsui Toatsu Chemicals, Inc., Tokyo, Japan, as a varnish and powder. More recently, a melt-extruded film of a controlled molecular weight of this same polymer has been supplied to NASA Langley Research Center for evaluation. This new form, called LARC-TPI 1500 series, has been prepared in three molecular weights - high, medium and low flow polymers. The subject of this investigation deals with the rheological properties of the high and medium flow powders and the adhesive properties of the medium flow melt-extruded film. Rheological studies indicate that the high and medium flow forms of the polymer fall in the flow range of injection moldable materials. Adhesive data generated on the medium flow extruded film shows this form to be well suited for structural adhesive bonding. The data are as good or better than that for LARC-TPI data of previous studies.

Progar, Donald↗

NASA NTRS1990

Effects of additives on the processing and properties of LARC-TPI polyimide

The blending of LARC-TPI polyimide with the thermotropic liquid crystal polymer designated Xydar and with four different oligomeric imide materials has facilitated the resulting resin systems' processing into films while enhancing their mechanical properties and lowering their coefficient of thermal expansion to virtually zero. Two film-formation processes have been evaluated: (1) the casting of polyamic acid films followed by thermal imidization and biaxial stretching, and (2) the blown-film melt-extrusion of fully imidized LARC-TPI polymer. The best results have been obtained through the use of Xydar as a processing aid at levels in the 10-30 percent range.

Elandjian, L.↗

NASA NTRS1990

Improved melt flow and physical properties of Mitsui Toatsu's LARC-TPI 1500 series polyimide

The basic thermal properties and melt behavior of an improved form of LARC-TPI polyimide, LARC-TPI 1500, are investigated and compared with those of LARC-TPI 1000 and 2000. The LARC-TPI 1500 powders are thermally stable and melt processable. The absolute molecular weight of the polymer varies from 20,000 to 30,000, indicating recurring unit numbers of about 40-60. The melt flow properties of LARC-TPI 1500 are comparable to those of other engineering plastics, such as PEEK, PSU, and PES. The flexural modulus of injection molded parts of LARC-TPI 1500 is the highest among commercial thermoplastic polymers.

Ohta, Masahiro↗

NASA NTRS1991

SiOx Protective Coat For Polyimide Sheet

Report and detailed appendix describe protective coat of SiOx (where x is 1.9 - 2.0) on Kapton H(R) polyimide sheet. Surface film protects substrate from bombardment by atomic oxygen. Intended for use as blanket substrate material of flexible array of solar photovoltaic cells on Space Station Freedom.

Banks, Bruce↗

NASA NTRS1991

Phenylated Polyimides With Greater Solubility

In experiments, 3,6-diphenylpyromellitic dianhydride monomer prepared and polymerized with several different diamines. Polyimides with pendent phenyl groups along polymer backbones considerably more soluble than PMDA-based materials. Increased solubility eases processing, providing increased potential use in variety of applications. Because most polymers soluble in organic solvents, usable in microelectronics applications. Excellent thermal stabilities and high transition temperatures make them ideally suited. Many polymers extremely rigid and useful as reinforcing polymers in molecular composites. More flexible compositions useful as matrix resins in carbon-reinforced composites.

Harris, Frank W.↗

NASA NTRS1990

Thermoplastic polyimide NEW-TPI (trademark)

Thermal and rheological properties of a commercial thermoplastic polyimide, NEW-TPI (trademark), were characterized. The as-received material possesses initially a transient crystallite form with a bimodal distribution in peak melting temperatures. After the melting of the initial crystallite structure, the sample can be recrystallized by various thermal treatments. A bimodal or single modal melting peak distribution is formed for annealing temperatures below or above 360 C, respectively. The recrystallized crystallinities are all transient in nature. The polymers are unable to be recrystallized after being subjected to elevated temperature annealing above 450 C. The recrystallization mechanism was postulated, and a simple kinetics model was found to describe the behavior rather satisfactory under the conditions of prolonged thermal annealing. Rheological measurements made in the linear viscoelastic range support the evidence observed in the thermal analysis. Furthermore, the measurements sustain the manufacturer's recommended processing window of 400 to 420 C for this material.

Hou, Tan-Hung↗

NASA NTRS1990

Plastic deformation mechanisms in polyimide resins and their semi-interpenetrating networks

High-performance thermoset resins and composites are critical to the future growth of space, aircraft, and defense industries in the USA. However, the processing-structure-property relationships in these materials remain poorly understood. In the present ASEE/NASA Summer Research Program, the plastic deformation modes and toughening mechanisms in single-phase and multiphase thermoset resins were investigated. Both thermoplastic and thermoset polyimide resins and their interpenetrating networks (IPNs and semi-IPNs) were included. The fundamental tendency to undergo strain localization (crazing and shear banding) as opposed to a more diffuse (or homogeneous) deformation in these polymers were evaluated. Other possible toughening mechanisms in multiphase thermoset resins were also examined. The topological features of network chain configuration/conformation and the multiplicity of phase morphology in INPs and semi-IPNs provide unprecedented opportunities for studying the toughening mechanisms in multiphase thermoset polymers and their fiber composites.

Jang, Bor Z.↗

NASA NTRS1990

Processable polyimide adhesive and matrix composite resin

A high temperature polyimide composition prepared by reacting 4,4'-isophthaloyldiphthalic anhydride with metaphenylenediamine is employed to prepare matrix resins, adhesives, films, coatings, moldings, and laminates, especially those showing enhanced flow with retention of mechanical and adhesive properties. It can be used in the aerospace industry, for example, in joining metals to metals or metals to composite structures. One area of application is in the manufacture of lighter and stronger aircraft and spacecraft structures.

Pratt, J. Richard↗

NASA NTRS1991

Viscoelastic properties of addition-cured polyimides used in high temperature polymer matrix composites

Viscoelastic properties of the addition cured polyimide, PMR-15, were studied using dynamic mechanical and stress relaxation tests. For temperatures below the glass transition temperature, T sub g, the dynamic mechanical properties measured using a temperature scan rate of 10 C/min were strongly affected by the presence of absorbed moisture in the resin. Dynamic mechanical properties measured as a function of time during an isothermal hold provided an indication of chemical changes occurring in the resin. For temperatures above (T sub g + 20 C), the storage modulus increased continuously as a function of time indicating that additional crosslinking is occurring in the resin. Because of these changes in chemical structures, the stress relaxation modulus could not be measured over any useful time interval for temperatures above T sub g. For temperatures below T sub g, dynamic mechanical properties appeared to be unaffected by chemical changes for times exceeding 1 hr. Since the duration of the stress relaxation tests was less than 1 hr, the stress relaxation modulus could be measured. As long as the moisture content of the resin was less than 2 pct, stress relaxation curves measured at different temperatures could be superimposed using horizontal shifts along the log(time) axis with only small shifts along the vertical axis.

Roberts, Gary D↗

NASA NTRS1991

Evaluation of long-duration exposure to the natural space environment on graphite-polyimide and graphite-epoxy mechanical properties

Experiment AO175 involved passive exposure (on oblique leading and trailing faces of LDEF) of carbon-fiber reinforced laminates of epoxy, bismaleimide, and polyimide resins. Post-flight evaluation included: optical examination of exposed surfaces, panel weight and distortion measurements, ultrasonic c-scan inspection, and conventional mechanical testing of coupons machined from the panel.

Vyhnal, Richard F.↗

NASA NTRS1989

Mechanism of electrical conductivity in an irradiated polyimide

A polyimide was exposed to 1.0 MeV electron radiation. The radiation-induced radical density and dc conductivity were measured at various post-irradiation times. The radiation-induced radical density was found to be correlated to the increased dc conductivity through a hopping model of conductivity. The post-irradiation radical species were identified.

Ries, H. R.↗

NASA NTRS1991

Characterization of thermoplastic polyimide NEW-TPI

Thermal and rheological properties of a commercial thermoplastic polyimide, NEW-TPI, were characterized. The as-received material possesses initially a transient crystallite form with a bimodal distribution in peak melting temperatures. After the meltings of the initial crystallite structures, the sample can be recrystallized by various thermal treatments. A bimodal or single-modal melting peak distribution is formed for annealing temperatures below or above 360 C, respectively. The recrystallized crystallinities are all transient in nature. The polymers are unable to be recrystallized after being subjected to elevated temperature annealing above 450 C. The recrystallization mechanism was postulated, and a simple kinetics model was found to describe the behavior satisfactorily under conditions of prolonged thermal annealing.

Hou, T. H.↗

NASA NTRS1990

Biaxial extrusion of polyimide LARC-TPI and LARC-TPI blends

Biaxial films of polyimide LARC-TPI and LARC-TPI/liquid crystal polymer Xydar were extruded directly from the melt for the first time via an innovative extrusion technique. Three types of films, neat LARC-TPI, LARC-TPI/10 wt pct and 30 wt pct blends were processed as a part of this NASA-funded program. Processability was greatly enhanced by incorporating Xydar. The coefficient of thermal expansion was reduced from 34 ppm/C for the neat LARC-TPI to 15 ppm/C for the 10 wt pct Xydar blend and ultimately down to 1 to 3 ppm/C for the 30 wt pct blend films in the direction of extrusion. The maximum improvement in stiffness was realized by incorporating 10 wt pct Xydar (2.8 GPa up to 4.9 GPa). Tensile strength, however, experienced a drop as a result of Xydar addition, probably caused by inefficient mixing of the two phases.

Haghighat, R. Ross↗