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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 631 records · Page 35
All sourcesNASA NTRSDOE OSTI
NASA NTRS1976

Material and design considerations of encapsulants for photovoltaic arrays in terrestrial applications

Procedures for analyzing cyclic mechanical stresses in encapsulated photovoltaic arrays designed for terrestrial application are discussed. The concept of 'thermal stiffness', the product of alpha and Young's modulus, is presented, and its usefulness for minimizing mechanical stresses is demonstrated. The concept of the 'proportional-limit' helps indicate the upper limit of design stress for plastics. System design is considered with attention to cell dimensions, cell to substrate adhesive, single encapsulant system, double layer encapsulant, and stresses in the interconnects. The permeability of polymeric materials to gases is examined.

Carroll, W.↗
NASA NTRS1991

NSI customer service representatives and user support office: NASA Science Internet

The NASA Science Internet, (NSI) was established in 1987 to provide NASA's Offices of Space Science and Applications (OSSA) missions with transparent wide-area data connectivity to NASA's researchers, computational resources, and databases. The NSI Office at NASA/Ames Research Center has the lead responsibility for implementing a total, open networking program to serve the OSSA community. NSI is a full-service communications provider whose services include science network planning, network engineering, applications development, network operations, and network information center/user support services. NSI's mission is to provide reliable high-speed communications to the NASA science community. To this end, the NSI Office manages and operates the NASA Science Internet, a multiprotocol network currently supporting both DECnet and TCP/IP protocols. NSI utilizes state-of-the-art network technology to meet its customers' requirements. THe NASA Science Internet interconnects with other national networks including the National Science Foundation's NSFNET, the Department of Energy's ESnet, and the Department of Defense's MILNET. NSI also has international connections to Japan, Australia, New Zealand, Chile, and several European countries. NSI cooperates with other government agencies as well as academic and commercial organizations to implement networking technologies which foster interoperability, improve reliability and performance, increase security and control, and expedite migration to the OSI protocols.

Source record↗
NASA NTRS1998

Twelve Channel Optical Fiber Connector Assembly: From Commercial Off the Shelf to Space Flight Use

The commercial off the shelf (COTS) twelve channel optical fiber MTP array connector and ribbon cable assembly is being validated for space flight use and the results of this study to date are presented here. The interconnection system implemented for the Parallel Fiber Optic Data Bus (PFODB) physical layer will include a 100/140 micron diameter optical fiber in the cable configuration among other enhancements. As part of this investigation, the COTS 62.5/125 microns optical fiber cable assembly has been characterized for space environment performance as a baseline for improving the performance of the 100/140 micron diameter ribbon cable for the Parallel FODB application. Presented here are the testing and results of random vibration and thermal environmental characterization of this commercial off the shelf (COTS) MTP twelve channel ribbon cable assembly. This paper is the first in a series of papers which will characterize and document the performance of Parallel FODB's physical layer from COTS to space flight worthy.

Ott, Melaine N.↗
NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗
NASA NTRS1974

Development for application of parylene coatings

A practical method of applying a parylene (paraxylene) coating to hybrid microcircuit devices was developed for the prevention of circuit malfunctions existing prior to package sealing or formed upon exposure to the service environment. It was found that paralene and an associated primer (if used) had generally little or no adverse effect on the active and passive elements of typical hybrid microcircuits. Exceptions were related to high frequency circuitry, low resistivity thick film resistors, and highly sensitive PIN diodes. Advantages of the use of the coating included increased dielectric strength and increased interconnection bond strength. Coating service life in nitrogen or nitrogen with low levels of oxygen as a contaminant is shown to be in excess of 1000 hours at 150 C and can be projected to be in excess of 5000 hours at 125 C.

Oberin, F. W.↗
DOE OSTI2022

-Omics potential of in vitro skin models for radiation exposure

There is a growing need to uncover biomarkers of ionizing radiation exposure that leads to a better understanding of how exposures take place, including dose type, rate, and time since exposure. As one of the first organs to be exposed to external sources of ionizing radiation, skin is uniquely positioned in terms of model systems for radiation exposure study. The simultaneous evolution of both MS-based -omics studies, as well as in vitro 3D skin models, has created the ability to develop a far more holistic understanding of how ionizing radiation affects the many interconnected biomolecular processes that occur in human skin. However, there are a limited number of studies describing the biomolecular consequences of low-dose ionizing radiation to the skin. As a result, this review will seek to explore the current state-of-the-art technology in terms of in vitro 3D skin models, as well as track the trajectory of MS-based -omics techniques and their application to ionizing radiation research, specifically, the search for biomarkers within the low-dose range.

3D tissue model↗
DOE OSTI2025

Ultra-light antennas via charge programmed deposition additive manufacturing

Abstract The demand for lightweight antennas in 5 G/6 G communication, wearables, and aerospace applications is rapidly growing. However, standard manufacturing techniques are limited in structural complexity and easy integration of multiple material classes. Here we introduce charge programmed multi-material additive manufacturing platform, offering unparalleled flexibility in antenna design and the capability for rapid printing of intricate antenna structures that are unprecedented or necessitate a series of fabrication routes. Demonstrating its potential, we present a transmitarray antenna composed of an interconnected, multi-layered array of dielectric/conductive S-ring unit cells, reducing 94% mass of conventional antenna configurations. A fully printed circular polarized transmitarray system fed by a source and a Risley prism antenna system operating at 19 GHz both show close alignment between testing results and numerical simulations. This printing method establishes a universal platform, propelling discovery of new antenna designs and enabling data-driven design and optimizations where rapid production of antenna designs is crucial.

Science & Technology - Other Topics↗
NASA NTRS1982

The design and development of a rectangular, shingle-type photovoltaic module

A shingle-type photovoltaic module has been designed and developed to meet the requirements of specifications for residential applications. The module is ideally suited for installation directly to the sheathing of a sloping, south-facing roof of a residential, industrial, or commercial building. The design requirements are examined, taking into account also module safety requirements. Aspects of module design and analysis are discussed, giving attention to installation details, solar cells and electrical circuit design, the encapsulation system, substrate lamination, and the module-to-module interconnecting cable. Details of module assembly experience and test and outdoor exposure experience are also considered.

Shepard, N. F., Jr.↗
NASA NTRS2005

NASA Tech Briefs, April 2005

Gas-Tolerant Device Senses Electrical Conductivity of Liquid Nanoactuators Based on Electrostatic Forces on Dielectrics Replaceable Microfluidic Cartridges for a PCR Biosensor CdZnTe Image Detectors for Hard-X-Ray Telescopes High-Aperture-Efficiency Horn Antenna Full-Circle Resolver-to-Linear-Analog Converter Continuous, Full-Circle Arctangent Circuit Advanced Three-Dimensional Display System Automatic Focus Adjustment of a Microscope Topics covered include: FastScript3D - A Companion to Java 3D; Generating Mosaics of Astronomical Images; Simulating Descent and Landing of a Spacecraft; Simulating Vibrations in a Complex Loaded Structure; Rover Sequencing and Visualization Program; Software Template for Instruction in Mathematics; Support for User Interfaces for Distributed Systems; Nanostructured MnO2-Based Cathodes for Li-Ion/Polymer Cells; Multi-Layer Laminated Thin Films for Inflatable Structures; Two-Step Laser Ranging for Precise Tracking of a Spacecraft; Growing Aligned Carbon Nanotubes for Interconnections in ICs; Multilayer Composite Pressure Vessels; Texturing Blood-Glucose-Monitoring Optics Using Oxygen Beams; Fault-Tolerant Heat Exchanger; Atomic Clock Based on Opto-Electronic Oscillator; Microfocus/Polycapillary-Optic Crystallographic X-Ray Sys; Depth-Penetrating Luminescence Thermography of Thermal- Barrier Coatings; One-Dimensional Photonic Crystal Superprisms; Measuring Low-Order Aberrations in a Segmented Telescope; Mapping From an Instrumented Glove to a Robot Hand; Application of the Hilbert-Huang Transform to Financial Data; Optimizing Parameters for Deep-Space Optical Communication; and Low-Shear Microencapsulation and Electrostatic Coating.

Source record↗
NASA NTRS2004

Scalable Multiprocessor for High-Speed Computing in Space

A report discusses the continuing development of a scalable multiprocessor computing system for hard real-time applications aboard a spacecraft. "Hard realtime applications" signifies applications, like real-time radar signal processing, in which the data to be processed are generated at "hundreds" of pulses per second, each pulse "requiring" millions of arithmetic operations. In these applications, the digital processors must be tightly integrated with analog instrumentation (e.g., radar equipment), and data input/output must be synchronized with analog instrumentation, controlled to within fractions of a microsecond. The scalable multiprocessor is a cluster of identical commercial-off-the-shelf generic DSP (digital-signal-processing) computers plus generic interface circuits, including analog-to-digital converters, all controlled by software. The processors are computers interconnected by high-speed serial links. Performance can be increased by adding hardware modules and correspondingly modifying the software. Work is distributed among the processors in a parallel or pipeline fashion by means of a flexible master/slave control and timing scheme. Each processor operates under its own local clock; synchronization is achieved by broadcasting master time signals to all the processors, which compute offsets between the master clock and their local clocks.

Lux, James↗
NASA NTRS2016

Processing and Characterization of Thousand-Hour 500 C Durable 4H-SiC JFET Integrated Circuits

This work reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 hours of stable electrical operation at 500 C in air ambient. These ICs are based on 4H-SiC junction field effect transistor (JFET) technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over 1-m scale vertical topology. Following initial burn-in, important circuit parameters remain stable for more than 1000 hours of 500 C operational testing. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

JFET↗
NASA NTRSDate not supplied

The Electron Heat Fluxes Associated with Electron Precipitation in the Region of Diffuse Aurora

Electron heat flux that comes from the magnetosphere to the upper ionospheric altitudes controls the value of electron temperature in the core plasma, and, as a result, the total electron density content that is required for different kinds of space weather applications. Knowing the thermal electron heat flux at the upper ionospheric boundaries is the Achilles' heel of all ionospheric models. Such a thermal heat flux setting is especially difficult to justify in the region of the diffuse aurora that is connected to a large energy reservoir of electrons with energies of a few kiloelectron volts, the Earth's plasma sheet, where magnetosphere-ionosphere coupling processes are strongly interconnected. We use the simulated heat flux provided by SuperThermal Electron Transport (STET) code to estimate electron temperatures at the upper ionospheric altitudes and compare these results with corresponding observations from the Defense Meteorological Satellite Program satellite during Saint Patrick's Days 2013 and 2015 Geomagnetic Storms.

George V. Khazanov↗
NASA NTRS1986

Radiative transfer in a sphere illuminated by a parallel beam - An integral equation approach

The problem of multiple scattering of nonpolarized light in a planetary body of arbitrary shape illuminated by a parallel beam is formulated using the integral equation approach. There exists a simple functional whose stationarity condition is equivalent to solving the equation of radiative transfer and whose value at the stationary point is proportional to the differential cross section. The analysis reveals a direct relation between the microscopic symmetry of the phase function for each scattering event and the macroscopic symmetry of the differential cross section for the entire planetary body, and the interconnection of these symmetry relations and the variational principle. The case of a homogeneous sphere containing isotropic scatterers is investigated in detail. It is shown that the solution can be expanded in a multipole series such that the general spherical problem is reduced to solving a set of decoupled integral equations in one dimension. Computations have been performed for a range of parameters of interest, and illustrative examples of applications to planetary problems as provided.

Shia, R.-L.↗
NASA NTRS1996

Bonneville, Power Administration Timing System

Time is an integral part of the Bonneville Power Administration's (BPA) operational systems. Generation and power transfers are planned in advance. Utilities coordinate with each other by making these adjustments on a timed schedule. Price varies with demand, so billing is based on time. Outages for maintenance are scheduled to assure they do not interrupt reliable power delivery. Disturbance records are aligned with recorded timetags for analysis and comparison with related information. Advanced applications like traveling wave fault location and real-time phase measurement require continuous timing with high precision. Most of BPA is served by a Central Time System (CTS) at the Dittmer Control Center near Portland, OR. This system keeps time locally and supplies time to both the control center systems and field locations via a microwave signal. It is kept synchronized to national standard time and coordinated with interconnected utilities. It is the official BPA time. Powwer system control and operation is described, followed by a description of BPA timing systems including CTS, the Fault Location Acquisition Reporter, time dissemination, and phasor measurements. References are provided for further reading.

Martin, Kenneth E.↗
NASA NTRS2014

Microstructure and Oxidation of a MAX Phase/Superalloy Hybrid Interface

Corrosion resistant, strain tolerant MAX phase coatings are of interest for turbine applications. Thin Cr2AlC MAX phase wafers were vacuum diffusion bonded to an advanced turbine disk alloy, LSHR, at 1100 C. The interface, examined by optical and scanning electron microscopy, revealed a primary diffusion zone consisting of ~ 10 micrometers of beta-Ni(Co)Al, decorated with various NiCoCrAl, MC and M3B2 precipitates. On the Cr2AlC side, an additional ~40 micrometers Al-depletion zone of Cr7C3 formed in an interconnected network with the beta-Ni(Co)Al. Oxidation of an exposed edge at 800 C for 100 h produced a fine-grained lenticular alumina scale over Cr2AlC and beta-Ni(Co)Al, with coarser chromia granules over the Cr7C3 regions. Subsequent growth of the diffusion layers was only ~ 5 micrometers in total. A residual stress of ~ 500 MPa was estimated for the MAX phase layer, but no interfacial damage was observed. Subsequent tests for 1000 h reveal similar results.

heat resistant alloys↗
NASA NTRS2016

Processing and Characterization of Thousand-Hour 500 C Durable 4H-SiC JFET Integrated Circuits

This work reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 hours of stable electrical operation at 500 C in air ambient. These ICs are based on 4H-SiC junction field effect transistor (JFET) technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over approximately 1-micrometer scale vertical topology. Following initial burn-in, important circuit parameters remain stable for more than 1000 hours of 500 C operational testing. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

Microelectronics↗
DOE OSTI2022

EVSE Cybersecurity and Resilience

Consequence-driven Cybersecurity Analysis for Extreme Fast Charging Electric Vehicle Infrastructure Electric vehicle (EV) development and associated charging infrastructure are expected to advance rapidly. Thirty percent of all global vehicle sales may be EVs and hybrid EVs by 2025, and they will rely on increasingly sophisticated strategies for grid integration. Next-generation EV charging infrastructure is expected to include interconnected renewable resources, such as photovoltaic (PV) arrays and battery storage systems, along with grid-edge devices. Although distributed energy resources (DERs) are useful in several ways, such as peak shaving at high demand times and backup supply for added resilience, the integration of vehicle charging and DERs could create more avenues for cyberattack. Physical and/or remote access to EV charging station components, including charge ports, power electronics, controllers, and local generation (e.g., PV and energy storage) could be paths to cause power fluctuations, leading to altered operations at the charging station, escalated privileges to administrative systems, exfiltration of financial information (including personally identifiable information), and reduced grid stability. One compromised EV supply equipment component can open the door to a variety of exploitable vulnerabilities. Cloud computing and mobile application control have the potential to expand the threat surface to non-repudiation and firmware integrity challenges. Vendor clouds have access to hundreds of chargers, and if compromised, can scale the attack surface exponentially. The high power and voltage levels of xFC infrastructure (e.g., 400 kW at 1000- V DC) increase the hazards and ability to impact the grid and vehicles more than lower-power charging systems. Legacy communications systems and protocols could also put EV infrastructure at risk of cyberattacks requiring a robust patch management process. Communications networks link EVs and chargers to several stakeholders - including charging station operators, grid operators, vendors/manufacturers, and aggregators - who have both physical and network access to share information for control, monitoring, and analytics. Information in these networks that is vulnerable to compromise includes the state of charge, charging duration, payment information, electricity price, and load control. Analyzing and prioritizing these interconnections risks could help address cybersecurity related to data leakage and manipulation.

charging↗
NASA NTRS1983

Multibus-based parallel processor for simulation

A Multibus-based parallel processor simulation system is described. The system is intended to serve as a vehicle for gaining hands-on experience, testing system and application software, and evaluating parallel processor performance during development of a larger system based on the horizontal/vertical-bus interprocessor communication mechanism. The prototype system consists of up to seven Intel iSBC 86/12A single-board computers which serve as processing elements, a multiple transmission controller (MTC) designed to support system operation, and an Intel Model 225 Microcomputer Development System which serves as the user interface and input/output processor. All components are interconnected by a Multibus/IEEE 796 bus. An important characteristic of the system is that it provides a mechanism for a processing element to broadcast data to other selected processing elements. This parallel transfer capability is provided through the design of the MTC and a minor modification to the iSBC 86/12A board. The operation of the MTC, the basic hardware-level operation of the system, and pertinent details about the iSBC 86/12A and the Multibus are described.

Ogrady, E. P.↗