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At least 631 records · Page 35

Comparative Study of 3-Dimensional Woven Joint Architectures for Composite Spacecraft Structures

The National Aeronautics and Space Administration (NASA) Exploration Systems Mission Directorate initiated an Advanced Composite Technology (ACT) Project through the Exploration Technology Development Program in order to support the polymer composite needs for future heavy lift launch architectures. As an example, the large composite structural applications on Ares V inspired the evaluation of advanced joining technologies, specifically 3D woven composite joints, which could be applied to traditionally manufactured barrel segments. Implementation of these 3D woven joint technologies may offer enhancements in damage tolerance without sacrificing weight. However, baseline mechanical performance data is needed to properly analyze the joint stresses and subsequently design/down-select a preform architecture. Six different configurations were designed and prepared for this study; each consisting of a different combination of warp/fill fiber volume ratio and preform interlocking method (z-fiber, fully interlocked, or hybrid). Tensile testing was performed for this study with the enhancement of a dual camera Digital Image Correlation (DIC) system which provides the capability to measure full-field strains and three dimensional displacements of objects under load. As expected, the ratio of warp/fill fiber has a direct influence on strength and modulus, with higher values measured in the direction of higher fiber volume bias. When comparing the z-fiber weave to a fully interlocked weave with comparable fiber bias, the z-fiber weave demonstrated the best performance in two different comparisons. We report the measured tensile strengths and moduli for test coupons from the 6 different weave configurations under study.

Jones, Justin S.↗

Diffraction-Based Optical Switching with MEMS

In this article, we are presenting an overview of MEMS-based (Micro-Electro-Mechanical System) optical switch technology starting from the reflective two-dimensional (2D) and three-dimensional (3D) MEMS implementations. To further increase the speed of the MEMS from these devices, the mirror size needs to be reduced. Small mirror size prevents efficient reflection but favors a diffraction-based approach. Two implementations have been demonstrated, one using the Texas Instruments DLP (Digital Light Processing), and the other an LCoS-based (Liquid Crystal on Silicon) SLM (Spatial Light Modulator). These switches demonstrated the benefit of diffraction, by independently achieving high speed, efficiency, and high number of ports. We also demonstrated for the first time that PSK (Phase Shift Keying) modulation format can be used with diffraction-based devices. To be truly effective in diffraction mode, the MEMS pixels should modulate the phase of the incident light. We are presenting our past and current efforts to manufacture a new type of MEMS where the pixels are moving in the vertical direction. The original structure is a 32 x 32 phase modulator array with high contrast grating pixels, and we are introducing a new sub-wavelength linear array capable of a 310 kHz modulation rate

36 MATERIALS SCIENCE↗

Acceleration recorder and playback module

The present invention is directed to methods and apparatus relating to an accelerometer electrical signal recorder and playback module. The recorder module may be manufactured in lightweight configuration and includes analog memory components to store data. Signal conditioning circuitry is incorporated into the module so that signals may be connected directly from the accelerometer to the recorder module. A battery pack may be included for powering both the module and the accelerometer. Timing circuitry is included to control the time duration within which data is recorded or played back so as to avoid overloading the analog memory components. Multiple accelerometer signal recordings may be taken simultaneously without analog to digital circuits, multiplexing circuitry or software to compensate for the effects of multiplexing the signals.

Bozeman, Richard J., Jr.↗

Acceleration Recorder and Playback Module

The present invention is directed to methods and apparatus relating to an accelerometer electrical signal recorder and playback module. The recorder module may be manufactured in lightweight configuration and includes analog memory components to store data. Signal conditioning circuitry is incorporated into the module so that signals may be connected directly from the accelerometer to the recorder module. A battery pack may be included for powering both the module and the accelerometer. Timing circuitry is included to control the time duration within which data is recorded or played back so as to avoid overloading the analog memory components. Multiple accelerometer signal recordings may be taken simultaneously without analog to digital circuits, multiplexing circuitry or software to compensate for the effects of multiplexing the signals.

Bozeman, Richard J., Jr.↗

A Risk-Informed Approach to Trustworthiness Assessment in Digital Twins-Based Autonomous Control

In autonomous control systems, digital twins (DTs) are used to perform diagnostic and prognostic functions. The trustworthiness of these DTs is dependent on quality and coverage of the training data, model accuracy and integrity of sensor data. This work introduces a methodology to determine the trustworthiness of a DT system given faulty sensor data using a risk informed approach. Bayesian Belief Networks (BBNs) are used to propagate uncertainties and determine the probability of trustable recommendations. The decision to trust the control action provided by the DT is based on the DT output, expert opinion, and severity of problems. The performance of DTs is reliant on the data they are trained on. When they encounter out of distribution data, the trustworthiness of the recommendations decreases. To address this issue, we include an expert component that provides input on sensor degradation. For this, we utilize a generative artificial intelligence (AI) model, such as Generative Pretrained Transformer (GPT). The GPT functions as an expert with broad knowledge. The GPT is fine-tuned to understand and discriminate sensor degradation scenarios using manufactured data. This methodology is demonstrated through a case study on a Nearly Autonomous Management and Control System (NAMAC) during a steady state scenario. Various sensor degradation types with different severity levels are considered. Degraded sensor data is processed by the DT system and the fine-tuned GPT. Finally, using the BBN, we combine the GPT information and the DT output with its sources of uncertainty. This provides an output regarding the trustworthiness of the DT recommendation.

22 - GENERAL STUDIES OF NUCLEAR REACTORS↗

Space Shuttle Main Engine - The Relentless Pursuit of Improvement

The Space Shuttle Main Engine (SSME) is the only reusable large liquid rocket engine ever developed. The specific impulse delivered by the staged combustion cycle, substantially higher than previous rocket engines, minimized volume and weight for the integrated vehicle. The dual pre-burner configuration permitted precise mixture ratio and thrust control while the fully redundant controller and avionics provided a very high degree of system reliability and health diagnosis. The main engine controller design was the first rocket engine application to incorporate digital processing. The engine was required to operate at a high chamber pressure to minimize engine volume and weight. Power level throttling was required to minimize structural loads on the vehicle early in flight and acceleration levels on the crew late in ascent. Fatigue capability, strength, ease of assembly and disassembly, inspectability, and materials compatibility were all major considerations in achieving a fully reusable design. During the multi-decade program the design evolved substantially using a series of block upgrades. A number of materials and manufacturing challenges were encountered throughout SSME s history. Significant development was required for the final configuration of the high pressure turbopumps. Fracture control was implemented to assess life limits of critical materials and components. Survival in the hydrogen environment required assessment of hydrogen embrittlement. Instrumentation systems were a challenge due to the harsh thermal and dynamic environments within the engine. Extensive inspection procedures were developed to assess the engine components between flights. The Space Shuttle Main Engine achieved a remarkable flight performance record. All flights were successful with only one mission requiring an ascent abort condition, which still resulted in an acceptable orbit and mission. This was achieved in large part via extensive ground testing to fully characterize performance and to establish acceptable life limits. During the program over a million seconds of accumulated test and flight time was achieved. Post flight inspection and assessment was a key part of assuring proper performance of the flight hardware. By the end of the program the predicted reliability had improved by a factor of four. These unique challenges, evolution of the design, and the resulting reliability will be discussed in this paper.

VanHooser, Katherine P.↗

Characterization of edge damage induced on REBCO superconducting tape by mechanical slitting

Abstract Rare-earth barium-copper-oxide (REBCO) superconductors are high-field superconductors fabricated in a tape geometry that can be utilized in magnet applications well in excess of 20 T. Due to the multilayer architecture of the tape, delamination is one cause of mechanical failure in REBCO tapes. During a mechanical slitting step in the manufacturing process, edge cracks can be introduced into the tape. These cracks are thought to be potential initiation sites for crack propagation in the tapes when subjected to stresses in the fabrication and operation of magnet systems. We sought to understand which layers were the mechanically weakest by locating the crack initiation layer and identifying the geometrical conditions of the slitter that promoted or suppressed crack formation. The described cracking was investigated by selectively etching and characterizing each layer with scanning electron microscopy, laser confocal microscopy, and digital image analysis. Our analysis showed that the average crack lengths in the REBCO, LaMnO 3 (LMO) and Al 2 O 3 layers were 34 μ m, 28 μ m, and 15 μ m, respectively. The total number of cracks measured in 30 mm of wire length was between 3000 and 5700 depending on the layer and their crack densities were 102 cracks mm −1 for REBCO, 108 cracks mm −1 for LMO, and 183 cracks mm −1 for Al 2 O 3 . These results indicated that there are separate crack initiation mechanisms for the REBCO and the LMO layers, as detailed in the paper. With a better understanding of the crack growth behavior exhibited by REBCO tapes, the fabrication process can be improved to provide a more mechanically stable and cost-effective superconductor.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Scalable submicrometer additive manufacturing

High-throughput fabrication techniques for generating arbitrarily complex three-dimensional structures with nanoscale features are desirable across a broad range of applications. Two-photon lithography (TPL)–based submicrometer additive manufacturing is a promising candidate to fill this gap. However, the serial point-by-point writing scheme of TPL is too slow for many applications. Attempts at parallelization either do not have submicrometer resolution or cannot pattern complex structures. We overcome these difficulties by spatially and temporally focusing an ultrafast laser to implement a projection-based layer-by-layer parallelization. This increases the throughput up to three orders of magnitude and expands the geometric design space. We demonstrate this by printing, within single-digit millisecond time scales, nanowires with widths smaller than 175 nanometers over an area one million times larger than the cross-sectional area.

36 MATERIALS SCIENCE↗

Initial evaluation of commercially available InGaAsP DFB laser diodes for use in high-speed digital fiber optic transceivers

NASA has been pursuing the development of high-speed fiber-optic transceivers for use in a number of space data system applications. Current efforts are directed toward a high-performance all-integrated-circuit transceiver operating up to the 3-5 Gb/s range. Details of the evaluation and selection of candidate high-speed optical sources to be used in the space-qualified high-performance transceiver are presented. Data on the performance of commercially available DFB (distributed feedback) lasers are presented, and their performance relative to each other and to their structural design with regard to their use in high-performance fiber-optic transceivers is discussed. The DFB lasers were obtained from seven commercial manufacturers. The data taken on each laser included threshold current, differential quantum efficiency, CW side mode suppression radio, wavelength temperature coefficient, threshold temperature coefficient, natural linewidth, and far field pattern. It was found that laser diodes with buried heterostructures and first-order gratings had, in general, the best CW operating characteristics. The modulated characteristics of the DFB laser diodes are emphasized. Modulated linewidth, modulated side mode suppression ratio, and frequency response are discussed.

Cook, Anthony L.↗

Comparison of pulse shape discrimination performance of stilbene and liquid scintillator under high count-rate active interrogation conditions

Here, we compare the pulse-shape-discrimination performance of a large Stilbene detector, manufactured at the Lawrence Livermore National Laboratory, to a similarly sized liquid scintillator, made by Eljen Technologies, Inc. (type EJ309), under various high-count-rate scenarios, such as can be expected during Active Interrogation of objects using an electric neutron generator for detecting the presence of Special Nuclear Materials and contraband. Pulse Shape Discrimination (PSD) is performed with an extension of previously described wavelet and event fitting algorithms, which are also used to reject pileup events and to correct the energy calibration for event signals clipped during digitization. We find that strong PSD and pileup rejection cuts are required to function in this high-count-rate environment. Whereas the Stilbene detector has intrinsically better pulse-shape discrimination performance, the pulses of events from the liquid scintillator are somewhat narrower, reducing pileup. We use an event fitting cut that provides simultaneous PSD identification and pileup rejection. When applying the same cut to data taken with both detectors, we find that Stilbene has higher event use efficiency by about a factor of two and retains a better gamma rejection ratio compared to EJ309.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

RD53A: A large-scale prototype chip for the phase II upgrade in the serially powered HL-LHC pixel detectors

The phase II upgrade of the HL-LHC experiments within the LHC intends to deepen the studies of the Higgs boson and to allow the discovery of further particles by adding an integrated luminosity of about 4000 fb -1 over 10 years of operation. This upgrade would overwhelm the installed pixel detector readout chips with higher hit rates and radiation levels than ever before. To match these extreme requirements the RD53 collaboration, a joint effort between ATLAS and CMS, developed RD53A, a new generation pixel detector readout chip prototype manufactured in a 65 nm CMOS technology. It is half the size of the final pixel chips and designed to meet requirements in the face of 3 GHz/cm 2 hit rate after irradiation to 500 Mrad. The detector is able to use 50×50 μm 2 or 25×100 μm 2 pixels with high readout speed of up to 4 links per chip with 1.28 Gbit/s each. Shunt–LDO regulators integrated on the bottom of the chip provide the required voltages to the two power domains, analog and digital. These regulators enable serial powering of the pixel modules, which is the only feasible, radiation hard scheme to ensure acceptable power cable losses and to stay within the material budget for the future pixel detectors. Finally, an overview of the status and challenges of serial powering and the Shunt–LDO regulator development will be given.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

On-line, continuous monitoring in solar cell and fuel cell manufacturing using spectral reflectance imaging

A monitoring system 100 comprising a material transport system 104 providing for the transportation of a substantially planar material 102, 107 through the monitoring zone 103 of the monitoring system 100. The system 100 also includes a line camera 106 positioned to obtain multiple line images across a width of the material 102, 107 as it is transported through the monitoring zone 103. The system 100 further includes an illumination source 108 providing for the illumination of the material 102, 107 transported through the monitoring zone 103 such that light reflected in a direction normal to the substantially planar surface of the material 102, 107 is detected by the line camera 106. A data processing system 110 is also provided in digital communication with the line camera 106. The data processing system 110 is configured to receive data output from the line camera 106 and further configured to calculate and provide substantially contemporaneous information relating to a quality parameter of the material 102, 107. Also disclosed are methods of monitoring a quality parameter of a material.

14 SOLAR ENERGY↗

Additive Manufacturing of Biomechanically Tailored Meshes for Compliant Wearable and Implantable Devices

Abstract Additive manufacturing (AM) of medical devices such as orthopedic implants and hearing aids is highly attractive because of the potential of AM to match the complex form and mechanics of individual human bodies. Externally worn and implantable tissue‐support devices, such as ankle or knee braces, and hernia repair mesh, offer a new opportunity for AM to mimic tissue‐like mechanics and improve both patient outcomes and comfort. Here, it is demonstrated how explicit programming of the toolpath in an extrusion AM process can enable new, flexible mesh materials having digitally tailored mechanical properties and geometry. Meshes are fabricated by extrusion of thermoplastics, optionally with continuous fiber reinforcement, using a continuous toolpath that tailors the elasticity of unit cells of the mesh via incorporation of slack and modulation of filament–filament bonding. It is shown how the tensile mesh mechanics can be engineered to match the nonlinear response of muscle. An ankle brace with directionally specific inversion stiffness arising from embedded mesh is validated, and further concepts for 3D mesh devices are prototyped.

Pattinson, Sebastian W.↗

FPGA Flash Memory High Speed Data Acquisition

The purpose of this research is to design and implement a VHDL ONFI Controller module for a Modular Instrumentation System. The goal of the Modular Instrumentation System will be to have a low power device that will store data and send the data at a low speed to a processor. The benefit of such a system will give an advantage over other purchased binary IP due to the capability of allowing NASA to re-use and modify the memory controller module. To accomplish the performance criteria of a low power system, an in house auxiliary board (Flash/ADC board), FPGA development kit, debug board, and modular instrumentation board will be jointly used for the data acquisition. The Flash/ADC board contains four, 1 MSPS, input channel signals and an Open NAND Flash memory module with an analog to digital converter. The ADC, data bits, and control line signals from the board are sent to an Microsemi/Actel FPGA development kit for VHDL programming of the flash memory WRITE, READ, READ STATUS, ERASE, and RESET operation waveforms using Libero software. The debug board will be used for verification of the analog input signal and be able to communicate via serial interface with the module instrumentation. The scope of the new controller module was to find and develop an ONFI controller with the debug board layout designed and completed for manufacture. Successful flash memory operation waveform test routines were completed, simulated, and tested to work on the FPGA board. Through connection of the Flash/ADC board with the FPGA, it was found that the device specifications were not being meet with Vdd reaching half of its voltage. Further testing showed that it was the manufactured Flash/ADC board that contained a misalignment with the ONFI memory module traces. The errors proved to be too great to fix in the time limit set for the project.

Gonzalez, April↗

Effect of substrate roughness, slope, and body size on climbing behavior and performance of juvenile American eels ( Anguilla rostrata )

The effect of ramp slope and substrate grain size on the passage of juvenile American Eel ( Anguilla rostrata ) over indoor ramps was tested from May – August 2016. Two size classes of fish (300 glass eels 50 – 70 mm and 300 elvers 90-114 mm), five substrates varying in coarseness (Substrate 1: 0.18-0.25 mm grain size, Substrate 2: 0.25-0.60 mm grain size, Substrate 3; 0.60-1.00 mm grain size, Substrate 4: 1.00 – 2.00 mm grain size, Substrate 5: 2.00- 4.00 mm grain size), and three ramp slopes (25, 35 and 45 degrees) were explored. Individual fish were placed at the bottom of a ramp and given 30 minutes to ascend 0.5 m. Movements over the substrate were recorded with video footage and digitized. Fish length, fish weight, water temperature, and days the fish were held in captivity before being tested were also recorded and analyzed. Results indicated that substrate had a highly significant effect on glass and elver climbing performance, and slope had an effect on elver performance but not glass eel performance. The roughest substrate yielded the highest proportion of eels ascending the entire length of the ramp and the highest climbing speed in each parameter category. Further testing with more grain sizes and longer ramp lengths are required, and mass manufacturing processes for this substrate need to be explored.

13 HYDRO ENERGY↗

Simulation of Endovascular Aortic Repair Using 3D Printed Abdominal Aortic Aneurysm Model and Fluid Pump

Background: Abdominal aortic aneurysm (AAA) models can be manufactured with 3D printing technology. This study describes detailed methodology and validation of endovascular aortic repair (EVAR) simulation using 3D printed AAA model connected to hemodynamic pump. Method: The AAA model was printed with Objet500 Connex3 (Stratasys, Eden Prairie, MN) and connected to BDC PD-0500 fluid pump (BDC Laboratories, Wheat Ridge, CO). EVAR procedure metrics were benchmarked in two expert implanters and compared to 20 vascular surgical trainees with different levels of EVAR experience (< 20 or ≥ 20 cases). All simulations were performed using commercially available stent grafts, guidewires, catheters, fluoroscopic guidance and digital subtraction angiography. Studied outcomes included ability to complete the procedure independently, time to deploy aortic component, ability to cannulate contralateral gate and complete the repair, and total fluoroscopy and procedure times. Results: A total of 22 EVAR simulation procedures were performed with mean procedure time of 37 ± 12 min. Experienced trainees had significantly lower total procedural time (32 ± 9 vs. 44 ± 6 min, P = 0.003) and fluoroscopic time (13 ± 5 vs. 23 ± 8 min, P = 0.005). All experienced trainees completed the procedure independently in < 45 min, compared to six (46%) of those with less EVAR experience (P = 0.016). Among less experienced trainees, only two (15%) completed the entire procedure independently (P < 0.001). Benchmark implanters performed significantly better than both trainee groups in nearly all EVAR metrics. Conclusion: EVAR simulation was feasible and simulated all procedural steps with high fidelity. This model may be applicable for assessment of technical competencies and standard endovascular skill acquisition within vascular surgery training curricula.

3D PRINTING↗

Dynamic fracture of glass fiber-reinforced ductile polymer matrix composites and loading rate effect

Here, the dynamic fracture of S-2 glass fiber-reinforced polymer matrix composites (FRPMCs) was investigated in this study. The matrix ductility was improved by a recently developed network topology modification technique via mixing partially reacted substructures (mPRS). The composite material was manufactured and characterized by micro-CT scanning and scanning electron microscopy (SEM). Dynamic single-edge notched bending (d-SENB) experiments were performed on the composites by using a modified split-Hopkinson pressure bar. Each specimen’s fracture process was visualized by ultrafast X-ray imaging. Such in-situ radiography enabled identifying the damage initiation below 50-micron scale and inspecting its propagation through the internal structures of opaque composites, thereby accurately quantifying the composites’ mechanical properties. Furthermore, the identical d-SENB experiments were designed and the digital image correlation (DIC) was employed to monitor the stress wave propagation on the composite specimens. The force and deflection measurements were modified and correlated to the physical damage processes. Besides, quasi-static SENB experiments were conducted to identify the loading rate effects on the composites’ fracture behaviors. The force and deflection history, bending stiffness, energy dissipation, and fracture toughness at different loading rates were quantified and compared. Finally, post-fracture analysis by micro-CT scanning and SEM provided physical observations on the variation of the fracture morphology by different loading rates.

42 ENGINEERING↗

Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques

Copper-TSVs for 3D-IC-integration generate novel challenges for reliability analysis and prediction, e.g. the need to master multiple failure criteria for combined loading including residual stress, interface delamination, cracking and fatigue issues. So, the thermal expansion mismatch between copper and silicon leads to a stress situation in silicon surrounding the TSVs which is influencing the electron mobility and as a result the transient behavior of transistors. Furthermore, pumping and protrusion of copper is a challenge for Back-end of Line (BEoL) layers of advanced CMOS technologies already during manufacturing. These effects depend highly on the temperature dependent elastic-plastic behavior of the TSV-copper and the residual stresses determined by the electro deposition chemistry and annealing conditions. That’s why the authors pushed combined simulative/experimental approaches to extract the Young’s-modulus, initial yield stress and hardening coefficients in copper-TSVs from nanoindentation experiments, as well as the temperature dependent initial yield stress and hardening coefficients from bow measurements due to electroplated thin copper films on silicon under thermal cycling conditions. A FIB trench technique combined with digital image correlation is furthermore used to capture the residual stress state near the surface of TSVs. The extracted properties are discussed and used accordingly to investigate the pumping and protrusion of copper-TSVs during thermal cycling. Moreover, the cracking and delamination risks caused by the elevated temperature variation during BEoL ILD deposition are investigated with the help of fracture mechanics approaches.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗