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At least 631 records · Page 35

Nuclear response of additive manufactured GRCop-84 copper for use in Lower hybrid launchers in a fusion environment

Recent advances in selective laser melting (SLM) 3D printing technology allow additive manufacture of lower hybrid current drive (LHCD) RF launchers from a new material, Glenn Research Copper 84 (GRCop-84), a Cr 2 Nb (8 at. % Cr, 4 at. % Nb) precipitation hardened alloy, in configurations unachievable with conventional machining. Tensile strength and thermal conductivity are compared to other competing high conductivity copper alloys for fusion use. Swelling and conductivity at 100 DPA when exposed to the Hanford Fast Flux Test Facility neutron spectrum is predicted in the 1–2 % and 65-70% IACS range, respectively, by comparison to copper alloys with similar precipitate and grain size. Finally, self-similar ion irradiation of a GRCop-84 target at 430 °C to 20 DPA resulted in no noticeable void formation in FIB cross sections or TEM lamella.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗

Macro copper-graphene composites with enhanced electrical conductivity

Composites demonstrating simultaneously enhanced-electrical conductivity, current density and lowered-temperature coefficient of resistance (TCR) compared to copper have been highly sought after for their advantages in efficient energy transport behavior. While such conductors have been demonstrated in 1D (nanowires) and 2D (films) samples, achieving similar behavior in 3D has been challenging owing to the limitations of the synthesis techniques used. In this paper, novel macro-scale 3D copper conductors were demonstrated with simultaneously increased electrical conductivity and decreased temperature coefficient of resistance (TCR) through the addition of graphene. Hot-extrusion was used to manufacture over 1-m-long, 2-mm-diameter copper-graphene composites with varying graphene content and defect density. Results showed that the electrical conductivity and current density in composites with low defect density graphene increased monotonically as a function of graphene content. They also demonstrated a significant decrease of over 17% in TCR with the addition of only 15 ppm graphene along with over 52% improvement in current density. Comparatively composites with high defect density graphene demonstrated lower electrical conductivity and current density. This study provides first-of-its-kind evidence of 3D metal composites whose bulk electrical performance has been enhanced using graphene additive in minute quantities. Further developments in this area are essential to achieve high performance composite conductors that can improve energy transport efficiency and pave way for industrial adoption of such materials in the future.

36 MATERIALS SCIENCE↗

Friction extrusion of ODS copper rod made from powder

Meters-long oxide dispersion strengthened copper rods were manufactured directly from powder by a single-step process, called friction extrusion. The average grain size was 880 nm, which was refined 40 times from powder precursor due to extensive shear deformation. Meanwhile, the average size of alumina particles was 60 nm which retains a decent oxide dispersion strengthening. Here, mechanical properties, including hardness, tensile strength, and ductility, were tested and found to have better or similar values than conventional sintered-then-extruded oxide dispersion strengthened copper materials. The presented technique promises a convenient avenue for the fabrication of oxide dispersion strengthened copper from powder.

36 MATERIALS SCIENCE↗

Synthesis, structure and characterization of two new copper(I)-thioarsenates (III) constructed by the [AsS{sub 3}]{sup 3-} and CuS{sub x} units

Two new copper(I)-thioarsenates(III), CsCu{sub 2}AsS{sub 3}(1) and KCu{sub 4}AsS{sub 4}(2), have been synthesized solvothermally in the presence of copper powder. Compound 1 is built up of trigonal AsS{sub 3} pyramid, tetrahedral CuAsS{sub 3} and CuS{sub 3} moieties forming 4-membered, 5-membered and 6-membered rings. The fusion of these rings produces layered anions [Cu{sub 2}AsS{sub 3}]{sup -}, and cesium cations are located between metal-sulfide layers. The structure of 2 consists of infinite [Cu{sub 2}S{sub 2}]{sup 2-} chain and layered [Cu{sub 6}As{sub 2}S{sub 6}] linked to form a three-dimensional anionic framework, [Cu{sub 4}AsS{sub 4}]{sup -}, and containing channels in which the potassium cations reside. - Graphical abstract: Qne layered CsCu{sub 2}AsS{sub 3} and one framework KCu{sub 4}AsS{sub 4} possessing noncondensed [AsS{sub 3}]{sup 3-} unit have been synthesized solvothermally. The optical band gaps of the two compounds are 2.3 and 1.8 eV, respectively. Highlights: Black-Right-Pointing-Pointer We obtained two new copper(I)-thioarsenate(III), CsCu{sub 2}AsS{sub 3} and KCu{sub 4}AsS{sub 4}. Black-Right-Pointing-Pointer Both compounds possess noncondensed [AsS{sub 3}]{sup 3-} unit and represent new structure types. Black-Right-Pointing-Pointer The optical band gaps of the two compounds are 2.3 eV and 1.8 eV, respectively.

36 MATERIALS SCIENCE↗

Study of the crystallographic phase change on copper (I) selenide thin films prepared through chemical bath deposition by varying the pH of the solution

Copper (I) selenide thin films with orthorhombic and cubic structure were deposited on glass substrates by using the chemical bath deposition technique. The effects of the solution pH on the films growth and subsequently the structural, optical and electrical properties of the films were studied. Films with orthorhombic structure were obtained from baths wherein both metal complex and hydroxide coexist; while films with cubic structure were obtained from baths where the metal hydroxide there is no present. The structural modifications are accompanied by changes in bandgap energy, morphology and electrical resistivity of the films. - Graphical abstract: “Study of the crystallographic phase change on copper (I) selenide thin films prepared through chemical bath deposition by varying the pH of the solution” by M. G. Sandoval-Paz, C. A. Rodríguez, P. F. Porcile-Saavedra, C. Trejo-Cruz. Display Omitted - Highlights: • Copper (I) selenide thin films were obtained by chemical bath deposition. • Orthorhombic to cubic phase change was induced by varying the reaction solution pH. • Orthorhombic phase is obtained mainly from a hydroxides cluster mechanism. • Cubic phase is obtained mainly from an ion by ion mechanism. • Structural, optical and electrical properties are presented as a function of pH.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Mechanical characterization of copper coated carbon nanotubes reinforced aluminum matrix composites

In this investigation, carbon nanotube (CNT) reinforced aluminum composites were prepared by the molecular-level mixing process using copper coated CNTs. The mixing of CNTs was accomplished by ultrasonic mixing and ball milling. Electroless Cu-coated CNTs were used to enhance the interfacial bonding between CNTs and aluminum. Scanning electron microscope analysis revealed the homogenous dispersion of Cu-coated CNTs in the composite samples compared with the uncoated CNTs. The samples were pressureless sintered under vacuum followed by hot rolling to promote the uniform microstructure and dispersion of CNTs. In 1.0 wt.% uncoated and Cu-coated CNT/Al composites, compared to pure Al, the microhardness increased by 44% and 103%, respectively. As compared to the pure Al, for 1.0 wt.% uncoated CNT/Al composite, increase in yield strength and ultimate tensile strength was estimated about 58% and 62%, respectively. However, in case of 1.0 wt.% Cu-coated CNT/Al composite, yield strength and ultimate tensile strength were increased significantly about 121% and 107%, respectively. - Graphical Abstract: Copper coated CNTs were synthesized by the electroless plating process. Optimizing the plating bath to (1:1) by wt CNTs with Cu, thickness of Cu-coated CNTs has been reduced to 100 nm. Cu-coated CNTs developed the stronger interfacial bonding with the Al matrix which resulted in the efficient transfer of load. Highlights: • Copper coated CNTs were synthesized by the electroless plating process. • Thickness of Cu-coated CNTs has been reduced to 100 nm by optimized plating bath. • In 1.0 wt.% Cu-coated CNT/Al composite, microhardness increased by 103%. • Cu-coated CNTs transfer load efficiently with stronger interfacial bonding. • In 1.0 wt.% Cu-coated CNT/Al composite, Y.S and UTS increased by 126% and 105%.

36 MATERIALS SCIENCE↗

Process development of 99.95% pure copper processed via selective electron beam melting and its mechanical and physical properties

Highlights: • Additively manufactured dense copper samples (>99.5%) • Measured electrical conductivity >58 MS/m (>100% IACS) • Equiaxed grain structure • 177 N/mm{sup 2} tensile strength, 87 N/mm{sup 2} yield strength, 59% elongation at fracture - Abstract: Additive manufacturing by selective electron beam melting (SEBM) was used to fabricate pure copper specimens. A process window at process temperature of 530 °C, gives the required beam powers and deflection speeds for manufacturing dense specimens (>99.5%). The microstructure of SEBM specimens was analyzed by using optical and scanning electron microscopy (SEM). Electrical conductivity, thermal conductivity, hardness, and mechanical performance were investigated by using eddy current, laser flash analysis, Vickers hardness and tensile tests, respectively. It was found that the variation of beam power and scan speed results in different microstructures from columnar to nearly equiaxed grain. The electrical conductivity of SEBM-processed specimens was above 58 MS/m (>100 IACS) while their hardness was around 55 HV0.05 and 46 HV5 without any dependency on processing parameters within the process window. The tensile tests revealed how vertical cracks affect the mechanical strength under tensile loading condition. The results of this study not only show a reliable process window but also introduce the links between processing parameters, defect formations, conductivity and mechanical strength of pure copper specimens manufactured by SEBM.

36 MATERIALS SCIENCE↗

Growth and characterization of diammonium copper disulphate hexahydrate single crystal

Graphical abstract: Diammonium copper disulphate hexahydrate (DACS) is one of the most promising inorganic dielectric crystals with exceptional mechanical properties. Good quality crystals of DACS were grown by using solution method in a period of 30 days. The grown crystals were subjected to single crystal X-ray diffraction analysis in order to establish their crystalline nature. Thermo gravimetric, differential thermal analysis, FTIR, and UV–vis–NIR analysis were performed for the crystal. Several solid state physical parameters have been determined for the grown crystals. The dielectric constant and the dielectric loss and AC conductivity of the grown crystal were studied as a function of frequency and temperature has been calculated and plotted. - Highlights: • Diammonium copper disulphate is grown for the first time and CCDC number obtained. • Thermal analysis is done to see the stability range of the crystals. • Band gap and UV cut off wavelength of the crystal are determined to be 2.4 eV and 472.86 nm, respectively. • Dielectric constant, dielectric loss and AC conductivity are plotted as a function of applied field. - Abstract: Diammonium copper disulphate hexahydrate is one of the most promising inorganic crystals with exceptional dielectric properties. A good quality crystal was harvested in a 30-day period using solution growth method. The grown crystal was subjected to various characterization techniques like single crystal X-ray diffraction analysis, thermo gravimetric, differential thermal analysis, FTIR, and UV–vis–NIR analysis. Unit cell dimensions of the grown crystal have been identified from XRD studies. Functional groups of the title compounds have been identified from FTIR studies. Thermal stability of the samples was checked by TG/DTA studies. Band gap of the crystal was calculated. The dielectric constant and dielectric loss were studied as a function of frequency of the applied field. AC conductivity was plotted as a function of temperature.

36 MATERIALS SCIENCE↗

Effect of structure, size and copper doping on the luminescence properties of ZnS

Highlights: • Blue and green emission intensity form ZnS is sensitive to crystallographic form. • For ZnS nanoparticles, emission characteristics are not affected by copper doping. • Cu solubility poor in ZnS nanoparticles compared to corresponding bulk. - Abstract: Luminescence properties of wurtzite and cubic forms of bulk ZnS have been investigated in detail and compared with that of ZnS nanoparticles. Blue emission observed in both hexagonal and cubic forms of undoped bulk ZnS is explained based on electron–hole recombination involving electron in conduction band and hole trapped in Zn{sup 2+} vacancies where as green emission arises due to electron hole recombination from Zn{sup 2+} and S{sup 2−} vacancies. Conversion of wurtzite form to cubic form is associated with relative increase in intensity of green emission due to increased defect concentration brought about by high temperature heat treatment. Copper doping in ZnS, initially leads to formation of both Cu{sub Zn} and Cu{sub i} (interstitial copper) centers, and latter to mainly Cu{sub Zn} centers as revealed by variation in relative intensities of blue and green emission from the samples.

36 MATERIALS SCIENCE↗

Soft X-ray absorption spectroscopy investigation of the surface chemistry and treatments of copper indium gallium diselenide (CIGS)

The surface and near surface structure of copper-indium-gallium-selenide (CIGS) absorber layers is integral to the producing a high-quality photovoltaic junction. By using X-ray absorption spectroscopy (XAS) and monitoring multiple elemental absorption edges with both theory and experiment, we are able to identify several features of the surface of CIGS as a function of composition and surface treatments. The XAS data shows trends in the near surface region of oxygen, copper, indium and gallium species as the copper content is varied in the films. The oxygen surface species are also monitored through a series of experiments that systematically investigates the effects of water and various solutions of: ammonium hydroxide, cadmium sulfate, and thiourea. These being components of cadmium sulfide chemical bath deposition (CBD). Characteristics of the CBD are correlated with a restorative effect that produces as normalized, uniform surface chemistry as measured by XAS. This surface chemistry is found in CIGS solar cells with excellent power conversion efficiency (<19%). The results provide new insight for CIGS processing strategies that seek to replace CBD and/or cadmium sulfide.

14 SOLAR ENERGY↗

Encumbering the Copper(I)-Diimine Coordination Sphere with a Benzyl Group: Impact on the Stability and Photoredox Properties

Copper(I)-bisdiimine complexes, [Cu(NN) 2 ] + (where NN represents a diimine such as phenanthroline or bipyridine derivatives), are considered promising photosensitizers for various photochemical applications. However, their effectiveness is subject to several key challenges. In particular, controlling steric strain around the copper(I) center by introducing appropriate substituents (R) at the α-position of the nitrogen atoms is crucial for optimizing the excited-state properties of the complex. In brief, increasing the size of R leads to longer emission lifetimes and higher quantum yields. Additionally, the energy of the singlet excited state rises with increasing steric bulk, enhancing photoinduced reactivity. However, excessive steric strain from bulky substituents can significantly destabilize the coordination sphere. To balance complex stability with increased steric bulk around the metal center, we have developed two novel non-symmetrical ligands featuring branched alkyl chains and benzyl groups at the α-position of the nitrogen atoms. Here, our findings demonstrate that intramolecular π-stacking interactions between the benzyl group and the opposing phenanthroline ligand contribute to stabilizing the coordination sphere. Furthermore, the flexibility of the benzyl group reinforces the tetrahedral geometry around copper(I), resulting in an increased singlet excitedstate energy compared to benchmark complexes. Notably, we show that this enhancement in excited-state energy translates into greater excited-state reactivity.

Copper(I)↗

Insights into the Dynamic Interfacial and Bulk Composition of Copper-Modified, Hydrogen-Alloyed, Palladium Nanocubes under Electrocatalytic Conditions

Understanding and controlling the alloying properties of nanomaterials under electrochemical conditions are critically important for fields ranging from energy storage and catalysis to electrochromic window technology. Hydrogen-absorbing nanomaterials, like palladium, are especially interesting due to their ability to reversibly absorb and store hydrogen in their lattice at near-stoichiometric amounts. Palladium’s work function is also significantly deeper than that of most transition metals, which enables electrochemical underpotential deposition of conformal monolayer and submonolayer amounts of transition metals onto the palladium surface. The simultaneous existence of these two properties is unique and opens new and exciting avenues for electrochemical applications. However, the intersection of surface-modified, hydrogen-alloyed palladium nanomaterials is poorly understood, and specifically, how these structures evolve during electrochemical operating conditions remains an open question. Here, we synthesize {100}-terminated palladium nanocubes and deposit between 0.5 and 22 monolayers of copper at the palladium surface. We then electrochemically alloy these surface-modified structures with hydrogen. Using a combination of analytical electrochemistry, spectroscopy, and microscopy, we track the positional evolution of the Cu at the surface of Pd, its impact on palladium’s ability to absorb hydrogen, and copper’s effect on hydrogen evolution electrocatalysis. We show that Cu readily alloys into the palladium nanocube at potentials more negative than the Cu 2+/0 deposition, but a 0.5 monolayer thick copper layer remains at the Pd surface regardless of potential. Finally, we discuss the implications of these findings within the framework of CO 2 reduction catalysis for carbon–carbon bond-forming chemistry.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Generation of Axially Chiral Fluoroallenes through a Copper-Catalyzed Enantioselective β-Fluoride Elimination

Herein we report the copper-catalyzed silylation of propargylic difluorides to generate axially chiral, tetrasubstituted monofluoroallenes in both good yields (27 examples >80%) and enantioselectivities (82-98% ee). Compared to previously reported synthetic routes to axially chiral allenes (ACAs) from prochiral substrates, a mechanistically distinct reaction has been developed: the enantiodiscrimination between enantiotopic fluorides to set an axial stereocenter. DFT calculations and vibrational circular dichroism (VCD) suggest that β-fluoride elimination from an alkenyl copper intermediate likely proceeds through a syn -β-fluoride elimination pathway rather than an anti -elimination pathway. The effects of the C1-symmetric Josiphos-derived ligand on reactivity and enantioselectivity were investigated. Not only does this report showcase that alkenyl copper species (like their alkyl counterparts) can undergo β-fluoride elimination, but this elimination can be achieved in an enantioselective fashion.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Template Synthesis Of Copper Nanowires Via Electrodeposition Technique And Their Characterization

Copper nanowires have been synthesized successfully using template assisted electrodeposition technique. Commercial polycarbonate membrane (Whatman, Japan) having pore diameter 100 nm, thickness 10 {mu}m and pore density 10{sup 7} pores/cm{sup 2} was used as template. Scanning electron microscopy and X-ray diffraction techniques were used to characterize the synthesized copper nanowires. XRD and SEM results reveal that polycrystalline copper nanowires were obtained with fcc lattice structure having diameter equal to the diameter of the template used.

36 MATERIALS SCIENCE↗

Transmission electron microscopy of the amorphization of copper indium diselenide by in situ ion irradiation

Copper indium diselenide (CIS), along with its derivatives Cu(In,Ga)(Se,S){sub 2}, is a prime candidate for use in the absorber layers of photovoltaic devices. Due to its ability to resist radiation damage, it is particularly well suited for use in extraterrestrial and other irradiating environments. However, the nature of its radiation hardness is not well understood. In this study, transmission electron microscopy (TEM) with in situ ion irradiation was used to monitor the dynamic microstructural effects of radiation damage on CIS. Samples were bombarded with 400 keV xenon ions to create large numbers of atomic displacements within the thickness of the TEM samples and thus explore the conditions under which, if any, CIS could be amorphized. By observing the impact of heavily damaging radiation in situ--rather than merely the end-state possible in ex situ experiments--at the magnifications allowed by TEM, it was possible to gain an understanding of the atomistic processes at work and the underlying mechanism that give rise to the radiation hardness of CIS. At 200 K and below, it was found that copper-poor samples could be amorphized and copper-rich samples could not. This difference in behavior is linked to the crystallographic phases that are present at different compositions. Amorphization was found to progress via a combination of one- and two-hit processes. The radiation hardness of CIS is discussed in terms of crystallographic structures/defects and the consequences these have for the ability of the material to recover from the effects of displacing radiation.

36 MATERIALS SCIENCE↗

A reliable control system for measurement on film thickness in copper chemical mechanical planarization system

In recent years, a variety of film thickness measurement techniques for copper chemical mechanical planarization (CMP) are subsequently proposed. In this paper, the eddy-current technique is used. In the control system of the CMP tool developed in the State Key Laboratory of Tribology, there are in situ module and off-line module for measurement subsystem. The in situ module can get the thickness of copper film on wafer surface in real time, and accurately judge when the CMP process should stop. This is called end-point detection. The off-line module is used for multi-points measurement after CMP process, in order to know the thickness of remained copper film. The whole control system is structured with two levels, and the physical connection between the upper and the lower is achieved by the industrial Ethernet. The process flow includes calibration and measurement, and there are different algorithms for two modules. In the process of software development, C++ is chosen as the programming language, in combination with Qt OpenSource to design two modules’ GUI and OPC technology to implement the communication between the two levels. In addition, the drawing function is developed relying on Matlab, enriching the software functions of the off-line module. The result shows that the control system is running stably after repeated tests and practical operations for a long time.

42 ENGINEERING↗

Synthesis and mechanical behavior of nanoporous nanotwinned copper

We synthesize nanoporous copper (NP Cu) through electrochemical dealloying of amorphous Cu{sub 0.41}Si{sub 0.59} under compressive residual stress. Transmission Electron Microscopy reveals that struts are nanocrystalline with grain size equal to the strut thickness. Moreover, a significant population of twins with spacing ∼7 nm is present within each imaged grain. The hardness of this nanocrystalline, nanotwinned NP Cu is approximately one order of magnitude greater than reports on NP Cu in the literature. The yield strength of individual struts inferred through dimensional analysis is approximately an order of magnitude greater than bulk copper and compares well with other nanostructured copper systems.

36 MATERIALS SCIENCE↗

Surface plasmon enhanced photoluminescence from copper nanoparticles: Influence of temperature

Anomalous temperature dependence of surface plasmon enhanced photoluminescence from copper nanoparticles embedded in a silica host matrix has been observed. The quantum yield of photoluminescence increases as the temperature increases. The key role of such an effect is the interplay between the surface plasmon resonance and the interband transitions in the copper nanoparticles occurring at change of the temperature. Namely, the increase of temperature leads to the red shift of the resonance. The shift leads to increase of the spectral overlap of the resonance with photoluminescence band of copper as well as to the decrease of plasmon damping caused by interband transitions. Such mechanisms lead to the increase of surface plasmon enhancement factor and, consequently, to increase of the quantum yield of the photoluminescence.

36 MATERIALS SCIENCE↗