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Results for “CONTACT RESISTANCE”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 631 records · Page 35
All sourcesNASA NTRSDOE OSTI
NASA NTRS1989

Near contact phenomena and transient effects in far infrared photoconductors

A combination of experimental and modeling work is summarized in two areas: first, the calculation of excess free carrier and space charge distributions near contacts and their effects on device resistivity, and second, the characterization of a slow transient response (tau approx. 1 sec) in Ge:Be detectors which is due to trapping associated with Be(+) formation. In both cases, analytical models, based on continuity and rate equations, have been developed to enable the application of these findings to a wide variety of photoconductor materials.

Haegel, Nancy M.↗
NASA NTRS1996

SNS Devices With Pinhole-Defined Active Regions

Superconductor/normal conductor/superconductor (SNS) microbridge devices with pinhole-defined active regions undergoing development. Device includes thin, electrically insulating layer deposited epitaxially, with controlled formation of pinholes, on one of two superconducting layers. Normally conducting metal deposited epitaxially in pinholes and on insulating layer, forming electrical contact between two superconducting layers. Junction resistances and maximum junction voltages expected to be increased.

Hunt, Brian D.↗
NASA NTRS2000

Sensor arrays for detecting analytes in fluids

A sensor array for detecting an analyte in a fluid, comprising at least first and second chemically sensitive resistors electrically connected to an electrical measuring apparatus, wherein each of the chemically sensitive resistors comprises a mixture of nonconductive material and a conductive material. Each resistor provides an electrical path through the mixture of nonconductive material and the conductive material. The resistors also provide a difference in resistance between the conductive elements when contacted with a fluid comprising an analyte at a first concentration, than when contacted with an analyte at a second different concentration. A broad range of analytes can be detected using the sensors of the present invention. Examples of such analytes include, but are not limited to, alkanes, alkenes, alkynes, dienes, alicyclic hydrocarbons, arenes, alcohols, ethers, ketones, aldehydes, carbonyls, carbanions, polynuclear aromatics, organic derivatives, biomolecules, sugars, isoprenes, isoprenoids and fatty acids. Moreover, applications for the sensors of the present invention include, but are not limited to, environmental toxicology, remediation, biomedicine, material quality control, food monitoring and agricultural monitoring.

Lewis, Nathan S.↗
DOE OSTI2021

Fabrication of Poly-Si on Locally Etched SiOx as Passivating Contacts for c-Si Solar Cells

Proof-of-concept for polysilicon on locally etched oxide (PLEO) contacts. Room temperature approach (via MACE) to engineer pinholes decouples charge-carrier transport across contact from passivation scheme of choice. 19 and 17% PLEO devices fabricated on double-side textured and saw-damage etched n Cz wafers, respectively. Preliminary work on polysilicon on locally etched nitride/oxide (PLENO) contacts. 0.2 fA/cm2 achieved with p PLENO; contact displays Ohmic behavior but still very resistive due to low pinhole density.

c-Si↗
DOE OSTI2022

Correspondence: Bill of Materials Variation and Module Degradation in Utility-Scale PV Systems

We report photovoltaic (PV) modules of the same make and model are often assembled with different bills of materials (BOMs). In this correspondence, we revisit two case studies of utility-scale silicon PV systems in which these differing BOMs were associated with faster-than-expected degradation. In one of the sites, we found that different metallization paste had been used for grid lines in some cells leading to loss of contact to the cell and severe series resistance degradation. We provide details on the observation of this mechanism at two additional sites not described in the original article. In a second case study, we found that two different types of cell had been used, and that they could be distinguished by their back contact. Cells with uniform back contacts suffered from light and elevated temperature induced degradation (LeTID), while those with local back contacts did not. We also briefly describe BOM variations observed at other sites to illustrate the extent of the challenge. Our results from both sites underscore that variations in BOM, even among modules of the same make and model can lead to reliability challenges.

14 SOLAR ENERGY↗
DOE OSTI2020

Alkali resistant optical coatings for alkali lasers and methods of production thereof

In one embodiment, a method for forming an alkali resistant coating includes forming a first oxide material above a substrate and forming a second oxide material above the first oxide material to form a multilayer dielectric coating, wherein the second oxide material is on a side of the multilayer dielectric coating for contacting an alkali. In another embodiment, a method for forming an alkali resistant coating includes forming two or more alternating layers of high and low refractive index oxide materials above a substrate, wherein an innermost layer of the two or more alternating layers is on an alkali-contacting side of the alkali resistant coating, and wherein the innermost layer of the two or more alternating layers comprises at least one of: alumina, zirconia, and hafnia.

36 MATERIALS SCIENCE↗
NASA NTRS1982

Development of technique for air coating and nickel and copper metalization of solar cells

Solar cells were made with a variety of base metal screen printing inks applied over silicon nitride AR coating and copper electroplated. Fritted and fritless nickel and fritless tin base printing inks were evaluated. Conversion efficiencies as high as 9% were observed with fritted nickel ink contacts, however, curve shapes were generally poor, reflecting high series resistance. Problems encountered in addition to high series reistance included loss of adhesion of the nickel contacts during plating and poor adhesion, oxidation and inferior curve shapes with the tin base contacts.

Source record↗
DOE OSTI2022

Accurately measuring the ionic conductivity of membranes via the direct contact method

Accurately measuring the ionic conductivity of membranes is important both for assessing the performance of new membranes as well as for advancing the fundamental understanding of electric field-driven ion transport in membranes. Yet, despite a considerable number of reports on the topic, there is no standardized method for ionic conductivity measurements. One of the main challenges with ionic conductivity measurements is isolating the membrane resistance from the other resistances in the electrochemical cell. In this study, we present a detailed discussion of factors that affect ionic conductivity measurements with the commonly used direct contact method, in which the membrane contacts the electrodes. Such factors include external resistances due to imperfect contact between the membrane and electrodes, residual impedances due to the sample holder and wiring, and fringe effects. Further, we also present and validate simple methods for isolating the true membrane ionic conductivity in both the through-plane and in-plane orientations. These methods can be implemented with virtually any membrane to obtain accurate and reproducible ionic conductivity values. Finally, we outline recommendations for performing ionic conductivity measurements with the direct contact method and a set of parameters to verify when reporting these results.

36 MATERIALS SCIENCE↗
NASA NTRS1995

Out-of-plane properties

This paper summarizes three areas of research which were performed to characterize out-of-plane properties of composite materials. In the first investigation, a series of tests was run to characterize the through-the-thickness tensile strength for a variety of composites that included 2D braids, 2D and 3D weaves, and prepreg tapes. A new test method based on a curved beam was evaluated. Failures were significantly different between the 2D materials and the 3D weaves. The 2D materials delaminated between layers due to out-of-plane tensile stresses while the 3D weaves failed due to the formation of radial cracks between the surface plies caused by high circumferential stresses along the inner radius. The strength of the 2D textile composites did not increase relative to the tapes. Final failure in the 3D weaves was caused by a circumferential crack similar to the 2D materials and occurred at a lower bending moment than in other materials. The early failures in the 3D weaves were caused by radial crack formation rather than a low through-the-thickness strength. The second investigation focused on the development of a standard impact test method to measure impact damage resistance. The only impact tests that currently exist are compression after impact (CAI) tests which incorporate elements of both damage resistance and damage tolerance. A new impact test method is under development which uses a quasi-static indentation (QSI) test to directly measure damage resistance. Damage resistance is quantified in terms of the contact force to produce a unit of damage where a metric for damage may be area in C-scan, depth of residual dent , penetration, damage growth, etc. A final draft of an impact standard that uses a QSI test method will be presented to the ASTM Impact Task Group on impact. In the third investigation, the impact damage resistance behavior of a variety of textile materials was studied using the QSI test method. In this study, the force where large damage initiates was measured and the delamination size as a function of force was determined. The force to initiate large damage was significantly lower in braids and weaves. The delamination diameter - impact forace relationship was quanitfied using a damage resistance parameter, Q(*), which related delamination diameter to imapct force over a range of delamination sizes. Using this Q(*) parameter to rate the materials, the stitched uniweaves, toughened epoxy tapes, and through-the-thickness orthogonal interlock weave were the most damage resistant.

Jackson, Wade C.↗
NASA NTRS2006

Electrically Conductive Anodized Aluminum Surfaces

Anodized aluminum components can be treated to make them sufficiently electrically conductive to suppress discharges of static electricity. The treatment was conceived as a means of preventing static electric discharges on exterior satin-anodized aluminum (SAA) surfaces of spacecraft without adversely affecting the thermal-control/optical properties of the SAA and without need to apply electrically conductive paints, which eventually peel off in the harsh environment of outer space. The treatment can also be used to impart electrical conductivity to anodized housings of computers, medical electronic instruments, telephoneexchange equipment, and other terrestrial electronic equipment vulnerable to electrostatic discharge. The electrical resistivity of a typical anodized aluminum surface layer lies between 10(exp 11) and 10(exp 13) Omega-cm. To suppress electrostatic discharge, it is necessary to reduce the electrical resistivity significantly - preferably to < or = 10(exp 9) Omega-cm. The present treatment does this. The treatment is a direct electrodeposition process in which the outer anodized surface becomes covered and the pores in the surface filled with a transparent, electrically conductive metal oxide nanocomposite. Filling the pores with the nanocomposite reduces the transverse electrical resistivity and, in the original intended outer-space application, the exterior covering portion of the nanocomposite would afford the requisite electrical contact with the outer-space plasma. The electrical resistivity of the nanocomposite can be tailored to a value between 10(exp 7) and 10(exp 12) Omega-cm. Unlike electrically conductive paint, the nanocomposite becomes an integral part of the anodized aluminum substrate, without need for adhesive bonding material and without risk of subsequent peeling. The electrodeposition process is compatible with commercial anodizing production lines. At present, the electronics industry uses expensive, exotic, electrostaticdischarge- suppressing finishes: examples include silver impregnated anodized, black electroless nickel, black chrome, and black copper. In comparison with these competing finishes, the present nanocomposite finishes are expected to cost 50 to 20 percent less and to last longer.

Nguyen, Trung Hung↗
NASA NTRS1991

Measuring Electrical Resistivity Of Compacted Powder

Slightly modified micrometer used in conjunction with special cup to measure electrical resistance of specimen of powder as function of packing fraction. Powder pressed between anvils of micrometer, which make electrical contact with specimen. Device used in manufacturing batteries to determine effective electrical conductivities of powders loaded into plastic sheets to make battery substrates. Coupled with good mathematical description of expected conductivity of particulate composite as function of packing density. Also serves as tool for evaluating conductivity of dispersed phase, as well as evaluating electrical resistances of interparticle contacts.

Shlichta, Paul J.↗
NASA NTRS1944

Determination of the Actual Contact Surface of a Brush Contact

The number of partial contact surfaces of a brush-ring contact is measured by means of a statistical method. The particular brush is fitted with wicks - that is, insulated and cemented cylinders of brush material, terminating in the brush surface. The number of partial contact surfaces can be computed from the length of the rest periods in which such wicks remain without current. Resistance measurements enable the determination of the size of the contact surfaces. The pressure in the actual contact surface of a recently bedded brush is found to be not much lower than the Brinell hardness of the brush.

Holm, Ragnar↗
DOE OSTI2024

Effect of H + Exchange and Surface Impurities on Bulk and Interfacial Electrochemistry of Garnet Solid Electrolytes

Contact loss and current constriction pose significant challenges at the Li metal interface of solid-state batteries. For garnet-structured Li 7 La 3 Zr 2 O 12 (LLZO), these effects are amplified by Li + /H + exchange and surface contamination reactions, which lead to conductivity losses and poor Li wetting. In this study, we utilize a variety of surface treatment processes across 37 cells to selectively induce proton exchange and contamination reactions in LLZO. The resulting bulk and surface chemistry is systematically characterized and correlated to changes in electrochemical properties. Additionally, we combine impedance analysis and finite element method modeling to deconvolute sources of impedance contributions at the Li metal interface. Specifically, we show that constriction impedance at the Li metal interface arises not solely from voids, but also from ionically-resistive surface contaminants. Further, these findings emphasize the connection between ionic conductivity and constriction, demonstrating that micron-scale ionically-resistive components increase constriction even with identical contact geometries. Finally, we leverage our comprehensive dataset to highlight unstable overpotential growth as a failure mechanism, additionally showing that the phase of a cell’s impedance is a sensitive indicator for the onset of interfacial instability. Overall, this study clarifies the impacts of proton exchange and surface contamination on electrochemical properties at the Li|solid electrolyte interface and elucidates insights that are generalizable to other solid-state battery systems.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2023

Interface potentials inside solid-state batteries: Origins and implications

Interface resistance has become a significant bottleneck for solid-state batteries (SSBs). Most studies of interface resistance have focused on extrinsic mechanisms such as interface reactions and imperfect contact between electrodes and solid electrolytes. Interface potentials are an important intrinsic mechanism that is often ignored. Here, we highlight Kelvin probe force microscopy (KPFM) as a tool to image the local potential at interfaces inside SSBs, examining the existing literature and discussing challenges in interpretation. Drawing analogies with electron transport in metal/semiconductor interfaces, we showcase a formalism that predicts intrinsic ionic resistance based on the properties of the contacting phases, and we emphasize that future battery designs should start from material pairs with low intrinsic resistance. Here, we conclude by outlining future directions in the study of interface potentials through both theory and experiment.

25 ENERGY STORAGE↗
DOE OSTI2024

Corrosion protection of mild steel by superhydrophobic magnetite coating

Corrosion-resistant hydrophobic magnetite coatings on mild steel surfaces were developed by immersion method. The effect of steel surface roughness (R a ) on its hydrophobicity was systematically studied using contact angle measurement (CAM), scanning electron microscopy (SEM), and atomic force microscopy (AFM). The corrosion resistance of hydrophobic magnetite coatings was evaluated using a potentiodynamic polarization test. The durability of the coatings was assessed in air, tap water, and 3.5 wt% NaCl environments. Hydrophobic magnetite coating with a water contact angle of 146-152° showed excellent resistance to corrosion, longevity in atmospheric air, and significant self-cleaning properties. The primary focus of this study was to develop a quick and simple immersion technique to create hydrophobic surfaces on mild steel. Finally, results suggest that surface roughness plays a significant role in surface hydrophobicity, and enhancing the hydrophobicity of mild steel improves its corrosion resistance.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Review of metal-containing resists in electron beam lithography: perspectives for extreme ultraviolet patterning

Background: Metal-containing resists entered the mainstream semiconductor industry process flow to mitigate the low absorbance of extreme ultraviolet (EUV) radiation by thin films of organic resists that lead to poor sensitivity and their inability to handle rigors of development and etching conditions. Aim: The long and rich history of using metal-containing resists in electron beam lithography can offer interesting lessons, pointers, and insights to the relatively newcomer EUV lithography, which is slightly over a decade old. Approach: Electron beam lithography has been enjoying a considerable amount of freedom in the choice of resist materials for close to 50 years; especially the use of metal-containing resists to attain not only single digit nanometer resolution, higher sensitivity, and etch resistance but also lower line-edge roughness. Here, we make a comprehensive historical review of the progress made in the patterning of metal-containing resists in electron beam lithography and derive insights that can be potentially useful in EUV patterning. Perspectives: Small molecular weight resists are proven to be crucial for achieving higher resolution with low line-edge roughness. Simplifying process flow by reducing etch-stack-layers is conceivable with metal-containing resists, along with direct-patterning of functional materials for heterogeneous integration. Efficient contact hole patterning at tighter pitches may be incumbent on progress in positive-tone resist research.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
NASA NTRS1986

Adhesion and wear resistance of materials

Recent studies into the nature of bonding at the interface between two solids in contact or a solid and deposited film have provided a better understanding of those properties important to the adhesive wear resistance of materials. Analytical and experimental progress are reviewed. For simple metal systems the adhesive bond forces are related to electronic wave function overlap. With metals in contact with nonmetals, molecular-orbital energy, and density of states, respectively can provide insight into adhesion and wear. Experimental results are presented which correlate adhesive forces measured between solids and the electronic surface structures. Orientation, surface reconstruction, surface segregation, adsorption are all shown to influence adhesive interfacial strength. The interrelationship between adhesion and the wear of the various materials as well as the life of coatings applied to substrates are discussed. Metallic systems addressed include simple metals and alloys and these materials in contact with themselves, both oxide and nonoxide ceramics, diamond, polymers, and inorganic coating compounds, h as diamondlike carbon.

Buckley, D. H.↗