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At least 613 records · Page 34
All sourcesNASA NTRSDOE OSTI
NASA NTRS1990

Improved melt flow and physical properties of Mitsui Toatsu's LARC-TPI 1500 series polyimide

The basic thermal properties and melt behavior of an improved form of LARC-TPI polyimide, LARC-TPI 1500, are investigated and compared with those of LARC-TPI 1000 and 2000. The LARC-TPI 1500 powders are thermally stable and melt processable. The absolute molecular weight of the polymer varies from 20,000 to 30,000, indicating recurring unit numbers of about 40-60. The melt flow properties of LARC-TPI 1500 are comparable to those of other engineering plastics, such as PEEK, PSU, and PES. The flexural modulus of injection molded parts of LARC-TPI 1500 is the highest among commercial thermoplastic polymers.

Ohta, Masahiro↗
NASA NTRS1991

SiOx Protective Coat For Polyimide Sheet

Report and detailed appendix describe protective coat of SiOx (where x is 1.9 - 2.0) on Kapton H(R) polyimide sheet. Surface film protects substrate from bombardment by atomic oxygen. Intended for use as blanket substrate material of flexible array of solar photovoltaic cells on Space Station Freedom.

Banks, Bruce↗
NASA NTRS1991

Phenylated Polyimides With Greater Solubility

In experiments, 3,6-diphenylpyromellitic dianhydride monomer prepared and polymerized with several different diamines. Polyimides with pendent phenyl groups along polymer backbones considerably more soluble than PMDA-based materials. Increased solubility eases processing, providing increased potential use in variety of applications. Because most polymers soluble in organic solvents, usable in microelectronics applications. Excellent thermal stabilities and high transition temperatures make them ideally suited. Many polymers extremely rigid and useful as reinforcing polymers in molecular composites. More flexible compositions useful as matrix resins in carbon-reinforced composites.

Harris, Frank W.↗
NASA NTRS1990

Thermoplastic polyimide NEW-TPI (trademark)

Thermal and rheological properties of a commercial thermoplastic polyimide, NEW-TPI (trademark), were characterized. The as-received material possesses initially a transient crystallite form with a bimodal distribution in peak melting temperatures. After the melting of the initial crystallite structure, the sample can be recrystallized by various thermal treatments. A bimodal or single modal melting peak distribution is formed for annealing temperatures below or above 360 C, respectively. The recrystallized crystallinities are all transient in nature. The polymers are unable to be recrystallized after being subjected to elevated temperature annealing above 450 C. The recrystallization mechanism was postulated, and a simple kinetics model was found to describe the behavior rather satisfactory under the conditions of prolonged thermal annealing. Rheological measurements made in the linear viscoelastic range support the evidence observed in the thermal analysis. Furthermore, the measurements sustain the manufacturer's recommended processing window of 400 to 420 C for this material.

Hou, Tan-Hung↗
NASA NTRS1990

Plastic deformation mechanisms in polyimide resins and their semi-interpenetrating networks

High-performance thermoset resins and composites are critical to the future growth of space, aircraft, and defense industries in the USA. However, the processing-structure-property relationships in these materials remain poorly understood. In the present ASEE/NASA Summer Research Program, the plastic deformation modes and toughening mechanisms in single-phase and multiphase thermoset resins were investigated. Both thermoplastic and thermoset polyimide resins and their interpenetrating networks (IPNs and semi-IPNs) were included. The fundamental tendency to undergo strain localization (crazing and shear banding) as opposed to a more diffuse (or homogeneous) deformation in these polymers were evaluated. Other possible toughening mechanisms in multiphase thermoset resins were also examined. The topological features of network chain configuration/conformation and the multiplicity of phase morphology in INPs and semi-IPNs provide unprecedented opportunities for studying the toughening mechanisms in multiphase thermoset polymers and their fiber composites.

Jang, Bor Z.↗
NASA NTRS1990

Processable polyimide adhesive and matrix composite resin

A high temperature polyimide composition prepared by reacting 4,4'-isophthaloyldiphthalic anhydride with metaphenylenediamine is employed to prepare matrix resins, adhesives, films, coatings, moldings, and laminates, especially those showing enhanced flow with retention of mechanical and adhesive properties. It can be used in the aerospace industry, for example, in joining metals to metals or metals to composite structures. One area of application is in the manufacture of lighter and stronger aircraft and spacecraft structures.

Pratt, J. Richard↗
NASA NTRS1991

Viscoelastic properties of addition-cured polyimides used in high temperature polymer matrix composites

Viscoelastic properties of the addition cured polyimide, PMR-15, were studied using dynamic mechanical and stress relaxation tests. For temperatures below the glass transition temperature, T sub g, the dynamic mechanical properties measured using a temperature scan rate of 10 C/min were strongly affected by the presence of absorbed moisture in the resin. Dynamic mechanical properties measured as a function of time during an isothermal hold provided an indication of chemical changes occurring in the resin. For temperatures above (T sub g + 20 C), the storage modulus increased continuously as a function of time indicating that additional crosslinking is occurring in the resin. Because of these changes in chemical structures, the stress relaxation modulus could not be measured over any useful time interval for temperatures above T sub g. For temperatures below T sub g, dynamic mechanical properties appeared to be unaffected by chemical changes for times exceeding 1 hr. Since the duration of the stress relaxation tests was less than 1 hr, the stress relaxation modulus could be measured. As long as the moisture content of the resin was less than 2 pct, stress relaxation curves measured at different temperatures could be superimposed using horizontal shifts along the log(time) axis with only small shifts along the vertical axis.

Roberts, Gary D↗
NASA NTRS1991

Evaluation of long-duration exposure to the natural space environment on graphite-polyimide and graphite-epoxy mechanical properties

Experiment AO175 involved passive exposure (on oblique leading and trailing faces of LDEF) of carbon-fiber reinforced laminates of epoxy, bismaleimide, and polyimide resins. Post-flight evaluation included: optical examination of exposed surfaces, panel weight and distortion measurements, ultrasonic c-scan inspection, and conventional mechanical testing of coupons machined from the panel.

Vyhnal, Richard F.↗
NASA NTRS1989

Mechanism of electrical conductivity in an irradiated polyimide

A polyimide was exposed to 1.0 MeV electron radiation. The radiation-induced radical density and dc conductivity were measured at various post-irradiation times. The radiation-induced radical density was found to be correlated to the increased dc conductivity through a hopping model of conductivity. The post-irradiation radical species were identified.

Ries, H. R.↗
NASA NTRS1991

Characterization of thermoplastic polyimide NEW-TPI

Thermal and rheological properties of a commercial thermoplastic polyimide, NEW-TPI, were characterized. The as-received material possesses initially a transient crystallite form with a bimodal distribution in peak melting temperatures. After the meltings of the initial crystallite structures, the sample can be recrystallized by various thermal treatments. A bimodal or single-modal melting peak distribution is formed for annealing temperatures below or above 360 C, respectively. The recrystallized crystallinities are all transient in nature. The polymers are unable to be recrystallized after being subjected to elevated temperature annealing above 450 C. The recrystallization mechanism was postulated, and a simple kinetics model was found to describe the behavior satisfactorily under conditions of prolonged thermal annealing.

Hou, T. H.↗
NASA NTRS1990

Biaxial extrusion of polyimide LARC-TPI and LARC-TPI blends

Biaxial films of polyimide LARC-TPI and LARC-TPI/liquid crystal polymer Xydar were extruded directly from the melt for the first time via an innovative extrusion technique. Three types of films, neat LARC-TPI, LARC-TPI/10 wt pct and 30 wt pct blends were processed as a part of this NASA-funded program. Processability was greatly enhanced by incorporating Xydar. The coefficient of thermal expansion was reduced from 34 ppm/C for the neat LARC-TPI to 15 ppm/C for the 10 wt pct Xydar blend and ultimately down to 1 to 3 ppm/C for the 30 wt pct blend films in the direction of extrusion. The maximum improvement in stiffness was realized by incorporating 10 wt pct Xydar (2.8 GPa up to 4.9 GPa). Tensile strength, however, experienced a drop as a result of Xydar addition, probably caused by inefficient mixing of the two phases.

Haghighat, R. Ross↗
NASA NTRS1991

Crosslinking-property relationships in PMR polyimide composites. I

The effect of the crosslink density of the matrix on physical and mechanical properties of a graphite-fiber-reinforced PMR (for polymerization of monomer reactants) polyimide composites during isothermal aging was investigated in experiments where unidirectional composite specimens of Celion 6000/PMR-P1 were isothermally exposed at 288 C in air for various time periods up to 5000 hrs. It was found that, as the crosslink density increased, the glass transition temperature, density, and elevated-temperature interlaminar shear strength of a composite increased, while the initial moisture absorption and the coefficient of thermal expansion decreased. However, after reaching the highest possible matrix crosslink density, several of the composite properties began to deteriorate rapidly.

Pater, R. H.↗
NASA NTRS1990

Atomic oxygen undercutting of defects on SiO2 protected polyimide solar array blankets

Low Earth Orbital (LEO) atomic oxygen can oxidize SiO2-protected polyimide kapton solar array blanket material which is not totally protected as a result of pinholes or scratches in the SiO2 coatings. The probability of atomic oxygen reaction upon initial impact is low, thus inviting oxidation by secondary impacts. The secondary impacts can produce atomic oxygen undercutting which may lead to coating mechanical failure and ever increasing mass loss rates of kapton. Comparison of undercutting effects in isotropic plasma asher and directed beam tests are reported. These experimental results are compared with computational undercutting profiles based on Monte Carlo methods and their implication on LEO performance of protected polymers.

Banks, Bruce A.↗
NASA NTRS1992

New Cross-Linkable Polyimides

Methyl groups cross-link in air at 275 degrees C or upon ultraviolet irradiation to form insoluble polyimides. New materials particularly useful in electronics and microelectronics. Also useful as films, adhesives, and composite matrices.

Hergenrother, Paul M.↗
NASA NTRS1991

New addition curing polyimides

In an attempt to improve the thermal-oxidative stability (TOS) of PMR-type polymers, the use of 1,4-phenylenebis (phenylmaleic anhydride) PPMA, was evaluated. Two series of nadic end-capped addition curing polyimides were prepared by imidizing PPMA with either 4,4'-methylene dianiline or p-phenylenediamine. The first resulted in improved solubility and increased resin flow while the latter yielded a compression molded neat resin sample with a T(sub g) of 408 C, close to 70 C higher than PME-15. The performance of these materials in long term weight loss studies was below that of PMR-15, independent of post-cure conditions. These results can be rationalized in terms of the thermal lability of the pendant phenyl groups and the incomplete imidization of the sterically congested PPMA. The preparation of model compounds as well as future research directions are discussed.

Frimer, Aryeh A.↗
NASA NTRS1991

Squeeze flow and compaction behavior of toughened polyimide matrix composites

The main emphasis was placed upon the squeeze flow and compaction behavior of the Lewis Research Center (LaRC) research project series polyimide matrix composites. The measurement of squeeze film flow behavior was performed by a plastometer which monitors the change of thickness of a prepreg specimen laid between two parallel plates under the specified temperature and pressure history. A critical evaluation of the plastometer data was attempted by examining the morphology of the specimen at various points during the squeeze flow. The effects of crosslinks (Mc) of resin, imidization (B-ataging) condition, and pressure on the squeeze flow behavior were examined. Results are given.

Lee, Byung Lip↗
NASA NTRS1992

Effects of a noncoplanar biphenyldiamine on the processing and properties of addition polyimides

Addition curing polyimides, prepared from noncoplanar 2,2'-bis(trifluoromethyl) 4,4' diaminobiphenyl (BTDB) with various dianhydrides were evaluated as high temperature polymer matrix materials. T sub g of these polymers were measured by mechanical methods as well as by thermal mechanical analysis. Physical and mechanical properties as well as the thermo-oxidative stability of neat resins and the corresponding G40-600 graphite fiber reinforced composites were compared to that of PMR-II-50 and V-CAP-75.

Chuang, Kathy C.↗
NASA NTRS1991

Processing for maximizing the level of crystallinity in linear aromatic polyimides

The process of the present invention includes first treating a polyamide acid (such as LARC-TPI polyamide acid) in an amide-containing solvent (such as N-methyl pyrrolidone) with an aprotic organic base (such as triethylamine), followed by dehydrating with an organic dehydrating agent (such as acetic anhydride). The level of crystallinity in the linear aromatic polyimide so produced is maximized without any degradation in the molecular weight thereof.

St.clair, Terry L.↗