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At least 613 records · Page 34

Polyimides From BTDA, m-PDA, and HDA

Aliphatic segments in polyimide backbones achieve low molding temperatures and resistance to solvents. Low molding temperatures in combination with good solvent resistance make these polymers candidates for use in aerospace applications.

Delano, Chadwick B.↗

Trifluorophenylethylidene Condensation Polyimides

Report describes synthesis and properties of trifluorophenylethylidene (3F) condensation polyimides. Properties of these new polymers make suitable thermal-control coatings, interlayer dielectrics in advanced wafer chips, and electronic-multilevel-interconnection layers.

Alston, William B.↗

Spectroscopic comparison of effects of electron radiation on mechanical properties of two polyimides

The differences in the radiation durabilities of two polyimide materials, Du Pont Kapton and General Electric Ultem, are compared. An explanation of the basic mechanisms which occur during exposure to electron radiation from analyses of infrared (IR) and electron paramagnetic resonance (EPR) spectroscopic data for each material is provided. The molecular model for Kapton was, in part, established from earlier modeling for Ultem (pp. 1293-1298 of IEEE Transactions on Nuclear Science, December 1984). Techniques for understanding the durability of one complex polymer based on the understanding of a different and equally complex polymer are demonstrated. The spectroscopic data showed that the primary radiation-generated change in the tensile properties of Ultem (a large reduction in tensile elongation) was due to crosslinking, which followed the capture by phenyl radicals of hydrogen atoms removed from gem-dimethyl groups. In contrast, the tensile properties of Kapton remained unchanged because radical-radical recombination, a self-mending process, took place.

Long, Edward R., Jr.↗

Counterface effects on the tribological properties of polyimide composites

Graphite fiber reinforced polyimide composite pins were slid against seven different counterfaces to determine the effect of material type on the tribological properties of polymer composites. In addition, the effect of sliding a new pin on a pre-established transfer film was investigated. The results indicated that almost a five order of magnitude difference in composite wear rate can occur just by varying the counterface material. An attempt to make all surfaces as smooth as possible was made, but due to differences in material composition this was not possible and a range of surface roughnesses were obtained. The results indicate that the smoother the surface, the lower the composite wear rate; but that small protrusions (not discernible with arithmetic surface roughness measurements) can markedly increase wear rates. A pre-established transfer film improved both run in and steady state wear rates.

Fusaro, Robert L.↗

Crosslinking-property relationships in PMR polyimide composites. I

The thermooxidatively-induced crosslinking/ physical and mechanical property relationships of graphite fiber-reinforced PMR polyimide-matrix composites were studied during isothermal exposure of the composite specimens at 288 C in air for periods of up to 5000 hr. The crosslinking densities due to this treatment were estimated on the basis of the kinetic theory of rubber elasticity and shifts in the glass transition temperature T(g). Several linear relationships are noted between crosslink density and physical and mechanical properties: T(g), initial weight loss, and elevated temperature interlaminar shear strength increase with crosslink density, while initial moisture absorption decreases. After achieving the highest crosslink density, several of the composite properties begin to decrease from their maximum values.

Pater, R. H.↗

Structure-to-property relationships in addition cured polymers. II - Resin Tg and composite initial mechanical properties of norbornenyl cured polyimide resins

PRM (polymerization of monomeric reactants) methodology was used to prepare thirty different polyimide oligomeric resins. Monomeric composition as well as chain length between sites of crosslinks were varied to examine their effects on glass transition temperature (Tg) of the cured/postcured resins. An almost linear correlation of Tg versus molecular distance between the crosslinks was observed. An attempt was made to correlate Tg with initial mechanical properties (flexural strength and interlaminar shear strength) of unidirectional graphite fiber composites prepared with these resins. However, the scatter in mechanical strength data prevented obtaining as clear a correlation as was observed for the structural modification/crosslink distance versus Tg. Instead, only a range of composite mechanical properties was obtained at the test temperatures studied (room temperature, 288 and 316 C). Perhaps more importantly, what did become apparent during the attempted correlation study was: (1) that PMR methodology could be used to prepare composites from resins that contain a wide variety of monomer modifications, and (2) that these composites almost invariably provided satisfactory initial mechanical properties as long as the resins selected were melt processable.

Alston, William B.↗

Thermal expansion of selected graphite-reinforced polyimide-, epoxy-, and glass-matrix composites

The thermal expansion of continuous carbon-fiber reinforced composites with epoxy-, polyimide-, and borosilicate glass-matrices has been measured and compared. The expansion of a rubber-toughened epoxy-matrix/P75S carbon-fiber composite was very different from the expansion of two different single-phase epoxy-matrix/P75S composites, although all three had the same stacking sequence. Reasonable agreement was obtained between measured thermal expansion data and results from classical laminate theory. Microdamage in the graphite/polyimide laminate, induced by 250 cycles between -156 and 121 C, caused a 53 percent decrease in the coefficient of thermal expansion. The thermal expansion of the graphite/glass laminate was not changed after 100 thermal cycles from -129 to 38 C; however, a residual strain of about 10 x 10 to the -6 was observed for the laminate tested.

Tompkins, S. S.↗

A mechanistic study of polyimide formation from diester-diacids

Previous work has noted the presence of anhydride during the imidization step of polyimide polymer processing from diester-diacids and diamines. Comparison of the relative rates of reactions among model compounds demonstrates the intermediacy of anhydride in the imidization reaction. IR and NMR observations of mixtures of monomers confirm the production of anhydride as a necessary intermediate in the imidization reaction.

Johnston, James C.↗

Readily Processable Polyimide

Polymer exhibits resistance to hydraulic fluid, excellent processability, and extremely high adhesive strength. Synthesis involves reaction of new diamine, 1,3-bis 2-ethyl ether, with 3,3',4,4'-benzophenonetetracarboxylic dianhydride to form polyamic acid and subsequent conversion to polyimide.

Hergenrother, Paul M.↗

Synthesis and characterization of processable polyimides with enhanced thermal stability

Many of the emerging applications of polymers on space vehicles require materials with outstanding thermal stability. These polymers must also be readily processable in order to facilitate their use. The syntheses and polymerization of a cardo dianhydride were investigated. This monomer was prepared via the reaction of N-methyl 4-nitrophthalimide with a cardo diol. Polyimides containing oxyalkylene linkages were studied. The effects of two additional structural modifications on the polymers' properties were investigated. The effects of carrying out the preparation of poly(amic acid)s under non-equilibrium conditions were examined. Approaches that were investigated included the in-situ neutralization of the generated amic acid and its in-situ esterification.

Harris, Frank W.↗

An investigation of physical properties of thermoplastic polyimides

Thermoplastic polyimides are a class of promising high temperature polymers for aerospace applications. NASA-developed LARC-TPI is a prominent member of this family of polymers. Its physical characteristics have been measured as a function of its curing schedule. The results and their possible interpretations are discussed.

Singh, Jag J.↗

Correlations of norbornenyl crosslinked polyimide resin structures with resin thermo-oxidative stability, resin glass transition temperature and composite initial mechanical properties

PMR (polymerization of monomeric reactants) methodology was used to prepare 70 different polyimide oligomeric resins and 30 different unidirectional graphite fiber/polyimide composites. Monomeric composition as well as chain length between sites of crosslinks were varied to examine their effects on resin thermo-oxidative stability and glass transition temperature (Tg) of the cured/postcured resins. A linear correlation of decreasing 316 C resin weight loss/surface area versus (1) decreasing aliphatic content, or (2) increasing benzylic/aliphatic content stoichiometry ratio over a wide range of resin compositions was observed. An almost linear correlation of Tg versus molecular distance between the crosslinks was also observed. An attempt was made to correlate Tg with initial composite mechanical properties (flexural strength and interlaminar shear strength). However, the scatter in mechanical strength data prevented obtaining a clear correlation. Instead, only a range of composite mechanical properties was obtained at 25, 288, and 316 C. Perhaps more importantly, what did become apparent during the correlation study was (1) the PMR methodology could be used to prepare composites from resins containing a wide variety of monomer modifications, (2) that these composites almost invariably provided satisfactory initial mechanical properties as long as the resins formulated exhibited satisfactory processing flow, and (3) that PMR resins exhibited predictable rates of 316 C weight loss/surface area based on their benzylic/aliphatic stoichiometery ratio.

Alston, William B.↗

Polyimide processing additives

A method has been found for enhancing the melt flow of thermoplastic polyimides during processing. A high molecular weight 422 copoly(amic acid) or copolyimide was fused with approximately 0.05 to 5 pct by weight of a low molecular weight amic acid or imide additive, and this melt was studied by capillary rheometry. Excellent flow and improved composite properties on graphite resulted from the addition of a PMDA-aniline additive to LARC-TPI. Solution viscosity studies imply that amic acid additives temporarily lower molecular weight and, hence, enlarge the processing window. Thus, compositions containing the additive have a lower melt viscosity for a longer time than those unmodified.

Pratt, J. R.↗

Cure study of soluble aromatic polyimide films

Several soluble aromatic poly(amic acid) films were staged at intervals to 325 C and characterized by IR spectroscopy and various solution property techniques. A series of films in which the polymer had been endcapped in an effort to control chain extension was also examined. Much of the behavior observed is consistent with an interpretation that a reduction in molecular weight occurred during cure before the ultimate molecular weight was achieved as a polyimide.

Young, Philip R.↗

High temperature polyimide blends

In a continuing effort to synthesize polymers that are readily processable and that exhibit state-of-the-art characteristics, LARC-TPI (Mitsui) and polyimidesulfone (PISO2) were blended and subjected to a limited melt flow and thermal properties characterization. Mitsui Toatsu of Japan, working under a licensing agreement with NASA, synthesized an imidized version of LARC-TPI molding powder that exhibited an extraordinarily high level of softening when heated to 300 C. Subsequently, a study of the calorimetric and rheological properties was accomplished by NASA-Langley on that material. The thermoplastic polyimidesulfone that possesses processability similar to polysulfones and the solvent resistance of the polyimides was synthesized and characterized at NASA-Langley in the early 1980's.

Burks, Harold D.↗

Tearing of thin polyimide films

Films of BTDA-ODA polyimide up to 58 microns thick were torn at constant cross-head speed in 'trousers' tests. In common with previous results on polyolefins, the work of tearing was found to increase markedly with specimen thickness. A model for the increase, based on the volume of plastically deformed material adjacent to the crack plane, was found to be only qualitatively valid. The experimental slope of a plot of tearing energy (per unit area) against thickness was 70 MJ/cu m. Optical and scanning electron micrographs of torn films are discussed in regard to the modes of failure.

Hinkley, J. A.↗

Additives Lower Pickup Of Moisture By Polyimides

Series of new polyimide-processing additives decrease free volume and pickup of moisture in new 422 copolyimide. Physical properties of several copolyimides synthesized from linear BDSDA/ODA/MPD homopolymers investigated previously, by positron-annihilation spectroscopy, with results indicating copolyimides have unique transition molecular structure characterized by higher electron densities and stronger bonds. Transition structure permits both physical and chemical entry of water molecules into it.

St. Clair, Terry L.↗

Characterization of cobalt(II) chloride-modified condensation polyimide films

The effect of solvent extraction on the properties of cobalt(II) chloride-modified polyimide films was investigated. Solvent-cast films were prepared from solutions of cobalt chloride in poly(amide acid)/N,N-dimethylacetamide (DMAc) and were subsequently dried and cured in static air, forced air, or inert gas ovens with controlled humidity. The films were extracted by either of the three processes (1) soaking in a tray with distilled water at room temperature, (2) soxhlett extraction with distilled water, or (3) soxhell extraction with DMAc. Extraction with DMAc was found to remove both cobalt and chlorine from the films and to slightly increase bulk thermal stability and both surface resistivity and electrical resistivity.

Rancourt, J. D.↗