Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “device packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 613 records · Page 34

Mid infrared LHS system packaging using flexible waveguides

As mid IR fiber optic systems are rapidly approaching a reality, so is the feasibility of fiber optic laser heterodyne systems. Laser heterodyne spectroscopy for high resolution monitoring of atmospheric gaseous pollutants is necessarily in the mid IR, the region in which the absorption signature of gaseous species is most prominent. It so happens that the lowest theoretical loss due to Rayleigh-Brillouin scattering also lies in the mid IR. Prospects of highly efficient laser heterodyne systems are thus very good. Such fibers are now beginning to be commercially available, and a test program is being conducted for such fibers with ambient temperature ranging from cryogenic to above room, and stringest mechanical flexibility requirements. Preliminary results are encouraging. A program is being started to explore the possibility of mid IR fiber optic device applications, by taking advantage of this phonon rich region. The potential long interaction length in fibers coupled with predicted extremely low losses point to stimulated Brillouin scattering based devices in the mW range. The generation of backscattered sBs at low laser powers is significant not only as an ultimate power limiting factor for laser transmission in fibers in the mid IR, but also the presence of frequency-shifted multiple order sBs Stokes and antiStokes lines will certainly have severe effect on the laser beats crucial in high resolution heterodyne spectroscopy.

Yu, Chung↗

ISSI IS46DR16640B-25DBA25 DDR2 SDRAM Total Ionizing Dose Characterization Test Report

The purpose of this testing is to characterize the ISSI IS46DR16640B-25DBA25 parameter degradation for total dose response. This test’s purpose is to evaluate and compare lot date codes for sensitivity. In the test, the device is exposed to both low dose and high dose rate (HDR) irradiations using gamma radiation. Device parameters such as leakage currents, quantity of upset bits or addresses, and overall chip and die health are investigated to determine which lot is more robust. These parameters directly affect the functionality of the memory within a system and may determine thresholds necessary to mitigate failure.

Total Ionizing Dose (TID)↗

Progress Toward a Format Standard for Flight Dynamics Models

In the beginning, there was FORTRAN, and it was... not so good. But it was universal, and all flight simulator equations of motion were coded with it. Then came ACSL, C, Ada, C++, C#, Java, FORTRAN-90, Matlab/Simulink, and a number of other programming languages. Since the halcyon punch card days of 1968, models of aircraft flight dynamics have proliferated in training devices, desktop engineering and development computers, and control design textbooks. With the rise of industry teaming and increased reliance on simulation for procurement decisions, aircraft and missile simulation models are created, updated, and exchanged with increasing frequency. However, there is no real lingua franca to facilitate the exchange of models from one simulation user to another. The current state-of-the-art is such that several staff-months if not staff-years are required to 'rehost' each release of a flight dynamics model from one simulation environment to another one. If a standard data package or exchange format were to be universally adopted, the cost and time of sharing and updating aerodynamics, control laws, mass and inertia, and other flight dynamic components of the equations of motion of an aircraft or spacecraft simulation could be drastically reduced. A 2002 paper estimated over $ 6 million in savings could be realized for one military aircraft type alone. This paper describes the efforts of the American Institute of Aeronautics and Astronautics (AIAA) to develop a standard flight dynamic model exchange standard based on XML and HDF-5 data formats.

Jackson, E. Bruce↗

The Virtual Tablet: Virtual Reality as a Control System

In the field of human-computer interaction, Augmented Reality (AR) and Virtual Reality (VR) have been rapidly growing areas of interest and concerted development effort thanks to both private and public research. At NASA, a number of groups have explored the possibilities afforded by AR and VR technology, among which is the IT Advanced Concepts Lab (ITACL). Within ITACL, the AVR (Augmented/Virtual Reality) Lab focuses on VR technology specifically for its use in command and control. Previous work in the AVR lab includes the Natural User Interface (NUI) project and the Virtual Control Panel (VCP) project, which created virtual three-dimensional interfaces that users could interact with while wearing a VR headset thanks to body- and hand-tracking technology. The Virtual Tablet (VT) project attempts to improve on these previous efforts by incorporating a physical surrogate which is mirrored in the virtual environment, mitigating issues with difficulty of visually determining the interface location and lack of tactile feedback discovered in the development of previous efforts. The physical surrogate takes the form of a handheld sheet of acrylic glass with several infrared-range reflective markers and a sensor package attached. Using the sensor package to track orientation and a motion-capture system to track the marker positions, a model of the surrogate is placed in the virtual environment at a position which corresponds with the real-world location relative to the user's VR Head Mounted Display (HMD). A set of control mechanisms is then projected onto the surface of the surrogate such that to the user, immersed in VR, the control interface appears to be attached to the object they are holding. The VT project was taken from an early stage where the sensor package, motion-capture system, and physical surrogate had been constructed or tested individually but not yet combined or incorporated into the virtual environment. My contribution was to combine the pieces of hardware, write software to incorporate each piece of position or orientation data into a coherent description of the object's location in space, place the virtual analogue accordingly, and project the control interface onto it, resulting in a functioning object which has both a physical and a virtual presence. Additionally, the virtual environment was enhanced with two live video feeds from cameras mounted on the robotic device being used as an example target of the virtual interface. The working VT allows users to naturally interact with a control interface with little to no training and without the issues found in previous efforts.

virtual control interface↗

Solid state remote power controllers for 120 VDC power systems

Remote Power controllers (RPCs) are devices that combine in one unit the capability to perform all the needed functions of load switching and provide total system protection of equipment and wires. The unique developments of solid-state RPCs for 120 Vdc power distribution systems are reviewed. The discussion covers design guidelines, power switch design concepts, and performance effectiveness. An NPN transistor is used as the the basic switch element. Since the ultimate goal of the 120 Vdc RPC program is to demonstrate technology readiness, the final phase is directed to the design, fabrication, and testing of multi-chip hybrid prototypes in hermetically sealed packages. RPCs have potential application in spacecraft and aircraft electrical systems, in transportation systems, and various industrial applications. The upper voltage limitation on the RPC design is related to the capability and availability of suitable high-voltage power transistors. The merits of solid-state RPCs are noted.

Sundberg, G. R.↗

Miniature Radioisotope Thermoelectric Power Cubes

Cube-shaped thermoelectric devices energized by a particles from radioactive decay of Cm-244 have been proposed as long-lived sources of power. These power cubes are intended especially for incorporation into electronic circuits that must operate in dark, extremely cold locations (e.g., polar locations or deep underwater on Earth, or in deep interplanetary space). Unlike conventional radioisotope thermoelectric generators used heretofore as central power sources in some spacecraft, the proposed power cubes would be small enough (volumes would range between 0.1 and 0.2 cm3) to play the roles of batteries that are parts of, and dedicated to, individual electronic-circuit packages. Unlike electrochemical batteries, these power cubes would perform well at low temperatures. They would also last much longer: given that the half-life of Cm-244 is 18 years, a power cube could remain adequate as a power source for years, depending on the power demand in its particular application.

Patel, Jagdish U.↗

Application of Ab Initio Methods in the Development of Advanced Technical Ceramics

A significant need exists to develop materials not only capable of providing desired electronic and mechanical properties but also survival at extreme temperatures during service and device fabrication, such as co-firing. Computational methods offers an efficient and systematic manner to design new materials and guide their development. As an example computational -based material approaches can be used to determine the suitability of a given materials as a practical thermoelectric for energy harvesting. In this presentation examples are given of applications to relevant technical ceramics such as thermoelectrics, dielectrics, and magnetic systems. The calculation were based on density functional theory and carried out with norm conserving and projector augmented wave (PAW) methods using commercial codes Materials Studio ( Biovia, Inc) with the Cambridge Serial Total Energy Package (CASTEP) and MedeA (Materials Design Inc.) utilizing the Vienna Ab-initio Simulation Package (VASP) as the respective computational engines. This study makes predictions of relevant technical properties of ceramic materials.

thermoelectric↗

NASA Tech Briefs, January 2013

Topics include: Single-Photon-Sensitive HgCdTe Avalanche Photodiode Detector; Surface-Enhanced Raman Scattering Using Silica Whispering-Gallery Mode Resonators; 3D Hail Size Distribution Interpolation/Extrapolation Algorithm; Color-Changing Sensors for Detecting the Presence of Hypergolic Fuels; Artificial Intelligence Software for Assessing Postural Stability; Transformers: Shape-Changing Space Systems Built with Robotic Textiles; Fibrillar Adhesive for Climbing Robots; Using Pre-Melted Phase Change Material to Keep Payloads in Space Warm for Hours without Power; Development of a Centrifugal Technique for the Microbial Bioburden Analysis of Freon (CFC-11); Microwave Sinterator Freeform Additive Construction System (MS-FACS); DSP/FPGA Design for a High-Speed Programmable S-Band Space Transceiver; On-Chip Power-Combining for High-Power Schottky Diode-Based Frequency Multipliers; FPGA Vision Data Architecture; Memory Circuit Fault Simulator; Ultra-Compact Transputer-Based Controller for High-Level, Multi-Axis Coordination; Regolith Advanced Surface Systems Operations Robot Excavator; Magnetically Actuated Seal; Hybrid Electrostatic/Flextensional Mirror for Lightweight, Large-Aperture, and Cryogenic Space Telescopes; System for Contributing and Discovering Derived Mission and Science Data; Remote Viewer for Maritime Robotics Software; Stackfile Database; Reachability Maps for In Situ Operations; JPL Space Telecommunications Radio System Operating Environment; RFI-SIM: RFI Simulation Package; ION Configuration Editor; Dtest Testing Software; IMPaCT - Integration of Missions, Programs, and Core Technologies; Integrated Systems Health Management (ISHM) Toolkit; Wind-Driven Wireless Networked System of Mobile Sensors for Mars Exploration; In Situ Solid Particle Generator; Analysis of the Effects of Streamwise Lift Distribution on Sonic Boom Signature; Rad-Tolerant, Thermally Stable, High-Speed Fiber-Optic Network for Harsh Environments; Towed Subsurface Optical Communications Buoy; High-Collection-Efficiency Fluorescence Detection Cell; Ultra-Compact, Superconducting Spectrometer-on-a-Chip at Submillimeter Wavelengths; UV Resonant Raman Spectrometer with Multi-Line Laser Excitation; Medicine Delivery Device with Integrated Sterilization and Detection; Ionospheric Simulation System for Satellite Observations and Global Assimilative Model Experiments - ISOGAME; Airborne Tomographic Swath Ice Sounding Processing System; flexplan: Mission Planning System for the Lunar Reconnaissance Orbiter; Estimating Torque Imparted on Spacecraft Using Telemetry; PowderSim: Lagrangian Discrete and Mesh-Free Continuum Simulation Code for Cohesive Soils; Multiple-Frame Detection of Subpixel Targets in Thermal Image Sequences; Metric Learning to Enhance Hyperspectral Image Segmentation; Basic Operational Robotics Instructional System; Sheet Membrane Spacesuit Water Membrane Evaporator; Advanced Materials and Manufacturing for Low-Cost, High-Performance Liquid Rocket Combustion Chambers; Motor Qualification for Long-Duration Mars Missions.

Source record↗

Low cost Get-Away-Special (GAS) furnace

A simple and inexpensive Space Shuttle experimental apparatus to conduct microgravity melting and solidification is presented. A GAS space furnace was initially developed as a student design project at the USAF Academy and further refined at NASA Lewis. The experiment package consists of a melting chamber, battery power system, temperature data recording systems, and electronic controller. The melting chamber is a thin-walled tube wrapped by heating resistance wire. Thermocouples are used to record the specimen thermal history. Power is supplied by 2-V batteries wired to produce 360 W. The mV output of the thermocouples is amplified, cold-junction compensated, and converted to a frequency which is then recorded on an off-the-shelf cassette tape recorder. A backup data recording system which digitizes the amplified signal and records the data on EEPROMs has also been included. This experimental device demonstrates that basic science research can be kept simple and inexpensive.

Turner, Glon D.↗

Development and use of a linear momentum exchange device

In 1981 the Marshall Space Flight Center (MSFC) began establishing an inhouse facility for testing control concepts to be applied to Large Space Structures (LSS). The original concept called for a long flexible beam suspended from the ceiling by a low friction support system. The lower end of the beam was to be mounted to the Advanced Gimbal System (AGS). Analysis and system engineering soon showed that a more tenable design would be where the whole system was inverted, i.e., the AGS hung from the ceiling with the beam hanging down from it. While this configuration, augmented by a base excitation table (RET) was being built, an ASTROMAST obtained from the Jet Propulsion Laboratory was extended, analyzed and tested. From that basic configuration was evolved the cruciform, VCOSS and ACES configurations as shown. The addition of the cruciform added low frequency nested modes and the additional instrument package at the tip contains gyros to monitor tip motion.

Doane, George B., III↗

Wide-Field-of-View, High-Resolution, Stereoscopic Imager

A device combines video feeds from multiple cameras to provide wide-field-of-view, high-resolution, stereoscopic video to the user. The prototype under development consists of two camera assemblies, one for each eye. One of these assemblies incorporates a mounting structure with multiple cameras attached at offset angles. The video signals from the cameras are fed to a central processing platform where each frame is color processed and mapped into a single contiguous wide-field-of-view image. Because the resolution of most display devices is typically smaller than the processed map, a cropped portion of the video feed is output to the display device. The positioning of the cropped window will likely be controlled through the use of a head tracking device, allowing the user to turn his or her head side-to-side or up and down to view different portions of the captured image. There are multiple options for the display of the stereoscopic image. The use of head mounted displays is one likely implementation. However, the use of 3D projection technologies is another potential technology under consideration, The technology can be adapted in a multitude of ways. The computing platform is scalable, such that the number, resolution, and sensitivity of the cameras can be leveraged to improve image resolution and field of view. Miniaturization efforts can be pursued to shrink the package down for better mobility. Power savings studies can be performed to enable unattended, remote sensing packages. Image compression and transmission technologies can be incorporated to enable an improved telepresence experience.

Prechtl, Eric F.↗

NASA Tech Briefs, September 2003

Topics include: Oxygen-Partial-Pressure Sensor for Aircraft Oxygen Mask; Three-Dimensional Venturi Sensor for Measuring Extreme Winds; Swarms of Micron-Sized Sensors; Monitoring Volcanoes by Use of Air-Dropped Sensor Packages; Capacitive Sensors for Measuring Masses of Cryogenic Fluids; UHF Microstrip Antenna Array for Synthetic- Aperture Radar; Multimode Broad-Band Patch Antennas; 164-GHz MMIC HEMT Frequency Doubler; GPS Position and Heading Circuitry for Ships; Software for Managing Parametric Studies; Software Aids Visualization of Computed Unsteady Flow; Software for Testing Electroactive Structural Components; Advanced Software for Analysis of High-Speed Rolling-Element Bearings; Web Program for Development of GUIs for Cluster Computers; XML-Based Generator of C++ Code for Integration With GUIs; Oxide Protective Coats for Ir/Re Rocket Combustion Chambers; Simplified Waterproofing of Aerogels; Improved Thermal-Insulation Systems for Low Temperatures; Device for Automated Cutting and Transfer of Plant Shoots; Extension of Liouville Formalism to Postinstability Dynamics; Advances in Thrust-Based Emergency Control of an Airplane; Ultrasonic/Sonic Mechanisms for Drilling and Coring; Exercise Device Would Exert Selectable Constant Resistance; Improved Apparatus for Measuring Distance Between Axles; Six Classes of Diffraction-Based Optoelectronic Instruments; Modernizing Fortran 77 Legacy Codes; Active State Model for Autonomous Systems; Shields for Enhanced Protection Against High-Speed Debris; Scaling of Two-Phase Flows to Partial-Earth Gravity; Neutral-Axis Springs for Thin-Wall Integral Boom Hinges.

Source record↗

Innovative Electrostatic Adhesion Technologies

Developing specialized Electro-Static grippers (commercially used in Semiconductor Manufacturing and in package handling) will allow gentle and secure Capture, Soft Docking, and Handling of a wide variety of materials and shapes (such as upper-stages, satellites, arrays, and possibly asteroids) without requiring physical features or cavities for a pincher or probe or using harpoons or nets. Combined with new rigid boom mechanisms or small agile chaser vehicles, flexible, high speed Electro-Static Grippers can enable compliant capture of spinning objects starting from a safe stand-off distance. Electroadhesion (EA) can enable lightweight, ultra-low-power, compliant attachment in space by using an electrostatic force to adhere similar and dissimilar surfaces. A typical EA enabled device is composed of compliant space-rated materials, such as copper-clad polyimide encapsulated by polymers. Attachment is induced by strong electrostatic forces between any substrate material, such as an exterior satellite panel and a compliant EA gripper pad surface. When alternate positive and negative charges are induced in adjacent planar electrodes in an EA surface, the electric fields set up opposite charges on the substrate and cause an electrostatic adhesion between the electrodes and the induced charges on the substrate. Since the electrodes and the polymer are compliant and can conform to uneven or rough surfaces, the electrodes can remain intimately close to the entire surface, enabling high clamping pressures. Clamping pressures of more than 3 N/cm2 in shear can be achieved on a variety of substrates with ultra-low holding power consumption (measured values are less than 20 microW/Newton weight held). A single EA surface geometry can be used to clamp both dielectric and conductive substrates, with slightly different physical mechanisms. Furthermore EA clamping requires no normal force be placed on the substrate, as conventional docking requires. Internally funded research and development has demonstrated that EA can function effectively in space, even in the presence of strong ultraviolet radiation, atomic oxygen, and free electrons. We created a test setup in an existing vacuum chamber to simulate low-Earth-orbit conditions. An EA mechanism was fabricated and installed in the chamber, instrumented, operated in a vacuum, and subjected to ultraviolet photons and free electrons generated by an in-chamber multipactor electron emitter. Extensions to EA that can add value include proximity and contact sensing and transverse motion or rotation, both of which could enhance docking or assembly applications. Possible next steps include development of targeted applications for ground investigation or on-orbit subsystem performance demonstrations using low cost access to space such as CubeSats.

Bryan, Tom↗

First On-Wafer Power Characterization of MMIC Amplifiers at Sub-Millimeter Wave Frequencies

Recent developments in semiconductor technology have enabled advanced submillimeter wave (300 GHz) transistors and circuits. These new high speed components have required new test methods to be developed for characterizing performance, and to provide data for device modeling to improve designs. Current efforts in progressing high frequency testing have resulted in on-wafer-parameter measurements up to approximately 340 GHz and swept frequency vector network analyzer waveguide measurements to 508 GHz. On-wafer noise figure measurements in the 270-340 GHz band have been demonstrated. In this letter we report on on-wafer power measurements at 330 GHz of a three stage amplifier that resulted in a maximum measured output power of 1.78mW and maximum gain of 7.1 dB. The method utilized demonstrates the extension of traditional power measurement techniques to submillimeter wave frequencies, and is suitable for automated testing without packaging for production screening of submillimeter wave circuits.

monolithic microwave integrated circircuit↗

Rad-Hard, Miniaturized, Scalable, High-Voltage Switching Module for Power Applications Rad-Hard, Miniaturized

A paper discusses the successful development of a miniaturized radiation hardened high-voltage switching module operating at 2.5 kV suitable for space application. The high-voltage architecture was designed, fabricated, and tested using a commercial process that uses a unique combination of 0.25 micrometer CMOS (complementary metal oxide semiconductor) transistors and high-voltage lateral DMOS (diffusion metal oxide semiconductor) device with high breakdown voltage (greater than 650 V). The high-voltage requirements are achieved by stacking a number of DMOS devices within one module, while two modules can be placed in series to achieve higher voltages. Besides the high-voltage requirements, a second generation prototype is currently being developed to provide improved switching capabilities (rise time and fall time for full range of target voltages and currents), the ability to scale the output voltage to a desired value with good accuracy (few percent) up to 10 kV, to cover a wide range of high-voltage applications. In addition, to ensure miniaturization, long life, and high reliability, the assemblies will require intensive high-voltage electrostatic modeling (optimized E-field distribution throughout the module) to complete the proposed packaging approach and test the applicability of using advanced materials in a space-like environment (temperature and pressure) to help prevent potential arcing and corona due to high field regions. Finally, a single-event effect evaluation would have to be performed and single-event mitigation methods implemented at the design and system level or developed to ensure complete radiation hardness of the module.

Adell, Philippe C.↗

Reliable, Low-Cost, Low-Weight, Non-Hermetic Coating for MCM Applications

Through an Air Force Research Laboratory sponsored STM program, reliable, low-cost, low-weight, non-hermetic coatings for multi-chip-module(MCK applications were developed. Using the combination of Sandia Laboratory ATC-01 test chips, AvanTeco's moisture sensor chips(MSC's), and silicon slices, we have shown that organic and organic/inorganic overcoatings are reliable and practical non-hermetic moisture and oxidation barriers. The use of the MSC and unpassivated ATC-01 test chips provided rapid test results and comparison of moisture barrier quality of the overcoatings. The organic coatings studied were Parylene and Cyclotene. The inorganic coatings were Al2O3 and SiO2. The choice of coating(s) is dependent on the environment that the device(s) will be exposed to. We have defined four(4) classes of environments: Class I(moderate temperature/moderate humidity). Class H(high temperature/moderate humidity). Class III(moderate temperature/high humidity). Class IV(high temperature/high humidity). By subjecting the components to adhesion, FTIR, temperature-humidity(TH), pressure cooker(PCT), and electrical tests, we have determined that it is possible to reduce failures 50-70% for organic/inorganic coated components compared to organic coated components. All materials and equipment used are readily available commercially or are standard in most semiconductor fabrication lines. It is estimated that production cost for the developed technology would range from $1-10/module, compared to $20-200 for hermetically sealed packages.

Jones, Eric W.↗

Novel approaches to the construction of miniaturized analytical instrumentation

This paper focuses on the design, construction, preliminary testing, and potential applications of three forms of miniaturized analytical instrumentation. The first is an optical fiber instrument for monitoring pH and other cations in aqueous solutions. The instrument couples chemically selective indicators that were immobilized at porous polymeric films with a hardware package that provides the excitation light source, required optical components, and detection and data processing hardware. The second is a new form of a piezoelectric mass sensor. The sensor was fabricated by the deposition of a thin (5.5 micron) film of piezoelectric aluminum nitride (AIN). The completed deposition process yields a thin film resonator (TFR) that is shaped as a 400 micron square and supports a standing bulk acoustic wave in a longitudinal mode at frequencies of approx. 1 GHz. Various deposition and vapor sorption studies indicate that the mass sensitivity of the TFR's rival those of the most sensitive mass sensors currently available, though offering such performance in a markedly smaller device. The third couples a novel form of liquid chromatography with microlithographic miniaturization techniques. The status of the miniaturization effort, the goal of which is to achieve chip-scale separations, is briefly discussed.

Porter, Marc D.↗

Novel approaches to the construction of miniaturized analytical instrumentation

This paper focuses on the design, construction, preliminary testing, and potential applications of three forms of miniaturized analytical instrumentation. The first is an optical fiber instrument for monitoring pH and other cations in aqueous solutions. The instrument couples chemically selective indicators that were immobilized at porous polymeric films with a hardware package that provides the excitation light source, required optical components, and detection and data processing hardware. The second is a new form of a piezoelectric mass sensor. The sensor was fabricated by the deposition of a thin (5.5 micron) film of piezoelectric aluminum nitride (AIN). The completed deposition process yields a thin film resonator (TFR) that is shaped as a 400 micron square and supports a standing bulk acoustic wave in a longitudinal mode at frequencies of approx. 1 GHz. Various deposition and vapor sorption studies indicate that the mass sensitivity of the TFR's rival those of the most sensitive mass sensors currently available, though offering such performance in a markedly smaller device. The third couples a novel form of liquid chromatography with microlithographic miniaturization techniques. The status of the miniaturization effort, the goal of which is to achieve chip-scale separations, is briefly discussed.

Porter, Marc D.↗