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At least 613 records · Page 34

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NASA NTRS2001

Offering an Array of Improvements

Sensors Unlimited, Inc., with SBIR funding from NASA's Langley Research Center, Goddard Space Flight Center, Marshall Space Flight Center, and the Jet Propulsion Laboratory, developed a monolithic focal plane array for near-infrared imaging. The company developed one- (1- D) and two-dimensional (2-D) imaging arrays consisting of a highly reliable InGaAs p-I-n diode as a photodetector for monitoring a variety of applications, including single element device applications in receivers. The InGaAs 1-D and 2-D arrays have many applications. For example, they monitor the performance of dense wavelength division multiplexing (DWDM) systems- the process of packaging many channels into a single fiber-optic cable. Sensors Unlimited commercially offers its LXTM and LYTM Series InGaAs linear arrays for reliable DWDM performance monitoring. The LX and LY arrays enable instrument module designs with no moving parts, which provides for superior uniformity, and fast, linear outputs that remain stable over a wide temperature range. Innovative technologies derived from the monolithic focal plane array have enabled telecommunication companies to optimize existing bandwidth in their fiber-optic networks in order to support a high volume of network traffic. At the same time, the technologies obtained from the array have the potential for reducing costs, while increasing performance from Sensors Unlimited's current product lines.

Source record↗

NASA NTRS2004

Subsurface Sampling and Sensing Using Burrowing Moles

Finding evidence for life on Mars will likely require accessing the subsurface since the Martian surface is both hostile to life and to preservation of biosignatures due to the cold dry conditions, the strong W environment, and the presence of strong oxidants. Systems are needed to probe beneath the sun and oxidant baked surface of Mars and return samples to the surface for analysis or to bring the instrument sensing underground. Recognizing this need, the European Space Agency incorporated a small subsurface penetrometer or Mole onto the Beagle 2 Mars lander. Had the 2003 landing been successful, the Mole would have collected samples from 1-1.5 m depth and delivered them to an organic analysis instrument on the surface. The de- vice called the Planetary Underground Tool (PLUTO), also measured soil mechanical and thermophysical properties. Constrained by the small mass and volume allowance of the Beagle lander, the PLUTO mole was a slender cylinder only 2 cm diameter and 28 cm long equipped with a small sampling device designed to collect samples and bring them to the surface for analysis by other instrument. The mass of the entire system including deployment mechanism and tether was 1/2 kg. sensor package underground to make in situ measurements. The Mars Underground Mole (MUM) is a larger Mole based on the PLUTO design but incorporating light collection optics that interface to a fiber optic cable in the tether that transmits light to a combined stimulated emission Raman Spectrometer and Short Wave Infrared (SWIR) reflectance Spectrometer with sensitivity from 0.7 to 2.5 micrometers. This instrument is called the Dual Spectral Sensor and uses a Digital Array Scanning Interferometer as the sensor technology, a type of fourier transform interferometer that uses fixed element prisms and thus is highly rugged compared to a Michaelson interferometer. Due to the size limitations of an on-Mole instrument compartment, and the availability of a tether, the sensor head, light sources, and control electronics for the instrument are on the surface. The DSS sensor is capable of sensing a wide range of minerals relevant to Mars Astrobiology objectives including hydrated minerals, clays, carbonates, sulfates, and ice. Additionally, Raman spectroscopy is effective for detecting organics. The MUM is designed to achieve a maximum depth of penetration of 5 m in Mars regolith and can be repeatedly deployed and retrieved. The ability to perform repeated sampling, combined with the low mass and power requirements, means that Moles could be incorporated into a rover mission as well as used on a stationary platform. The Mole mechanism is a pointed slender cylinder that advances into soil by way of an internal sliding hammer mechanism. Part of the energy released by the spring-loaded hammer with each shock is transferred to the Mole casing and from there to the soil, resulting in penetration by displacing and compressing the surrounding soil. A backwards-directed impulse as a re- action to each forward shock is transferred via a suppressor mass against a second weaker spring allowing forward motion without requiring reactive forces provided by the lander. The Mole tip can be opened to collect soil samples. The Mole casing is tethered to a supporting mechanism that supplies power. Components supporting the Mole on the surface include a launch tube, tether reel and winch for pulling in tether, in addition to the tether itself.

Stoker, C. R.↗

NASA NTRS2007

Electronics for Low Temperature Space Exploration Missions

Exploration missions to outer planets and deep space require spacecraft, probes, and on-board data and communication systems to operate reliably and efficiently under severe harsh conditions. On-board electronics, in particular those in direct exposures to the space environment without any shielding or protection, will encounter extreme low temperature and thermal cycling in their service cycle in most of NASA s upcoming exploration missions. For example, Venus atmosphere, Jupiter atmosphere, Moon surface, Pluto orbiter, Mars, comets, Titan, Europa, and James Webb Space Telescope all involve low-temperature surroundings. Therefore, electronics for space exploration missions need to be designed for operation under such environmental conditions. There are ongoing efforts at the NASA Glenn Research Center (GRC) to establish a database on the operation and reliability of electronic devices and circuits under extreme temperature operation for space applications. This work is being performed under the Extreme Temperature Electronics Program with collaboration and support of the NASA Electronic Parts and Packaging (NEPP) Program. The results of these investigations will be used to establish safe operating areas and to identify degradation and failure modes, and the information will be disseminated to mission planners and system designers for use as tools for proper part selection and in risk mitigation. An overview of this program along with experimental data will be presented.

Patterson, Richard L.↗

NASA NTRS2009

Internet Protocol Display Sharing Solution for Mission Control Center Video System

With the advent of broadcast television as a constant source of information throughout the NASA manned space flight Mission Control Center (MCC) at the Johnson Space Center (JSC), the current Video Transport System (VTS) characteristics provides the ability to visually enhance real-time applications as a broadcast channel that decision making flight controllers come to rely on, but can be difficult to maintain and costly. The Operations Technology Facility (OTF) of the Mission Operations Facility Division (MOFD) has been tasked to provide insight to new innovative technological solutions for the MCC environment focusing on alternative architectures for a VTS. New technology will be provided to enable sharing of all imagery from one specific computer display, better known as Display Sharing (DS), to other computer displays and display systems such as; large projector systems, flight control rooms, and back supporting rooms throughout the facilities and other offsite centers using IP networks. It has been stated that Internet Protocol (IP) applications are easily readied to substitute for the current visual architecture, but quality and speed may need to be forfeited for reducing cost and maintainability. Although the IP infrastructure can support many technologies, the simple task of sharing ones computer display can be rather clumsy and difficult to configure and manage to the many operators and products. The DS process shall invest in collectively automating the sharing of images while focusing on such characteristics as; managing bandwidth, encrypting security measures, synchronizing disconnections from loss of signal / loss of acquisitions, performance latency, and provide functions like, scalability, multi-sharing, ease of initial integration / sustained configuration, integration with video adjustments packages, collaborative tools, host / recipient controllability, and the utmost paramount priority, an enterprise solution that provides ownership to the whole process, while maintaining the integrity of the latest technological displayed image devices. This study will provide insights to the many possibilities that can be filtered down to a harmoniously responsive product that can be used in today's MCC environment.

Brown, Michael A.↗

NASA NTRS2012

The Effects of Thermal Cycling on Gallium Nitride and Silicon Carbide Semiconductor Devices for Aerospace Use

Electronics designed for use in NASA space missions are required to work efficiently and reliably under harsh environment conditions. These Include radiation, extreme temperatures, thermal cycling, to name a few. Preliminary data obtained on new Gallium Nitride and Silicon Carbide power devices under exposure to radiation followed by long term thermal cycling are presented. This work was done in collaboration with GSFC and JPL in support of the NASA Electronic Parts and Packaging (NEPP) Program

Patterson, Richard L.↗

NASA NTRS2020

Advanced Silicon Avalanche Photodiodes on NASA's Global Ecosystem Dynamics Investigation (GEDI) Mission

Silicon Avalanche Photodiodes (APDs) are used in NASA’s Global Ecosystem Dynamics Investigation (GEDI) which was launched in December 2018 and is currently measuring the Earth’s vegetation vertical structure from the International Space Station. The APDs were specially made for space lidar with a much lower hole-to-electron ionization coefficient ratio (k-factor ~0.008) than that of commercially available silicon APDs in order to reduce the APD excess noise from the randomness of the avalanche gain. A silicon heater resistor was used under the APD chip to heat the device up to 70°C and improve its quantum efficiency at 1064 nm laser wavelength while maintaining a low dark current such that the overall signal to noise ratio is improved. Special APD protection circuits were used to raise the overload damage threshold to prevent device damage from strong laser return by specular surfaces, such as still water bodies, and space radiation events. The APD and a hybrid transimpedance amplifier circuit were hermetically sealed in a package with a sufficiently low leak rate to ensure multi-year operation lifetime in space. The detector assemblies underwent a series of pre-launch tests per NASA Goddard Environmental Verification Standard for space qualification. They have performed exactly as expected with GEDI in orbit. A detailed description of the GEDI detector design, signal and noise model, and test results are presented in this paper.

Sun, Xiaoli↗

NASA NTRS2002

Commercial-Off-The-Shelf Microelectromechanical Systems (MEMS) Flow-Measurement Probes Fabricated And Assembled

As an alternative to conventional tubing instrumentation for measuring airflow, designers and technicians at the NASA Glenn Research Center have been fabricating packaging components and assembling a set of unique probes using commercial-off-the-shelf microelectromechanical systems (MEMS) integrated circuits (computer chips). Using MEMS as an alternative has some compelling advantages over standard measurement devices. Sensor technologies have matured through high-production usage in industries such as automotive and aircraft manufacturers. Currently, MEMS are the choice in applications such as tire pressure monitors, altimeters, pneumatic controls, cable leak detectors, and consumer appliances. Conventional instrumentation uses tubing buried in the model aerodynamic surfaces or wind tunnel walls. The measurements are made when pressure is introduced at the tube opening. The pressure then must travel the tubing for lengths ranging from 20 to hundreds of feet before reaching an electronic signal conditioner. This condition causes a considerable amount of damping and requires measurements to be made only after the test rig has reached steady-state operation. The electronic MEMS pressure sensor is able to take readings continuously under dynamic states in nearly real time. The use of stainless steel tubing for pressure measurements requires many tubes to be cleaned, cut to length, carefully installed, and delicately deburred and spliced for use. A cluster of a few hundred 1/16-in.- (0.0625-in.-) diameter tubes (not uncommon in research testing facilities) can be several inches in diameter and may weigh enough to require two men to handle. Replacing hard tubing with electronic chips can eliminate much of the bulk. Each sensor would fit on the tip of the 1/16-in. tubing with room to spare. The P592 piezoresistive silicon pressure sensor (Lucas NovaSensor, Fremont, CA) was chosen for this project because of its cost, availability, and tolerance to extreme ambient conditions. The chip is 1 mm square by 0.6 mm thick (0.039 by 0.023 in.) with 0.12-mm (0.005-in.) wire connection tabs. Three MEMS chips were used to build the first type of flow-angularity probe. This MEMS probe will be demonstrated as an alternative to a standard tube type "Cobra Probe" now used routinely in wind tunnel and aeronautical hardware applications. The response time and accuracy would allow the probe to be translated on an actuator across a flow field, yielding precision dynamic measurements not possible with conventional instrumentation. The low profile, the minimal power requirement, the rugged construction, and the moderate cost all contribute to making MEMS sensors the enticing choice instrument in future research measurement needs. The MEMS probe efforts are a continuation of work initiated by Brian Willis, without whose foresight and efforts this project would never have been realized. This task was funded through cooperation with the NASA Electronic Parts and Packaging (NEPP) program at the Jet Propulsion Laboratory.

Redding, Chip↗

NASA NTRS2011

Users Guide on Scaled CMOS Reliability: NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance

Reliability of advanced CMOS technology is a complex problem that is usually addressed from the standpoint of specific failure mechanisms rather than overall reliability of a finished microcircuit. A detailed treatment of CMOS reliability in scaled devices can be found in Ref. 1; it should be consulted for a more thorough discussion. The present document provides a more concise treatment of the scaled CMOS reliability problem, emphasizing differences in the recommended approach for these advanced devices compared to that of less aggressively scaled devices. It includes specific recommendations that can be used by flight projects that use advanced CMOS. The primary emphasis is on conventional memories, microprocessors, and related devices.

Scaled CMOS↗

DOE OSTI2021

Highly Integrated Wide Bandgap Power Module for Next Generation Plug-In Vehicles (Final Report)

Wide bandgap devices are key enablers for high power density traction inverters. A highly integrated wide bandgap (WBG) power module enables higher temperature operation, higher inverter efficiency and overall smaller die area with the same power delivery. However, it requires careful design of the power module to take advantage of all the superior material properties that silicon carbide (SiC) provides over conventional silicon (Si) Insulated Gate Bipolar Transistor (IGBT) based design. This project developed an efficient and densely packed SiC power module for an automotive traction inverter application. Extensive study was performed to select the best performing SiC die considering a wide range of temperature variation, suitability to integrate into target packaging, robust body diode performance and overall high electrical efficiency. Multiple design ideas were explored to achieve lower stray inductance for both power loop and signal loop, uniform current distribution, compact form factor, and very high thermal performance. The final power module package includes all six inverter switches in the same module (six-pack) with die sintered at both bottom and top surfaces utilizing high performance substrate to achieve high electrical and thermal performance. Two power module variants were developed using 900 V and 1200 V devices for operating at two different high voltage levels (> 600 V HV battery). Both power modules were comprehensively characterized, and high efficiency operation of the inverter was confirmed through analysis. Finally, a complete functional inverter was built with the 1200V power modules using other essential components (HV capacitors, gate driver board, controller board, current sensor, connectors etc.) and tested using GM’s standard test procedure. There are several challenges associated with adopting WBG devices for high voltage operation. In order to assess and mitigate those challenges, GM and subrecipients of this project have conducted multiple detailed studies. This includes phase current reconstruction using integrated Rogowski coil, device junction temperature estimation using on-state gate resistance, modeling and testing the effect of high voltage and fast switching on motor insulation and bearings, partial discharge inception voltage measurement under different environmental conditions. Findings of all these studies are summarized in this report.

33 ADVANCED PROPULSION SYSTEMS↗

NASA NTRS2018

NASA Electronic Parts and Packaging (NEPP) Program: Resources for SmallSats on EEE Parts

From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.

Electrical↗

NASA NTRS2018

NASA Electronic Parts and Packaging (NEPP) Program - Resources for SmallSats on EEE Parts

Parts assurance↗

DOE OSTI2022

Dynamics of deuterium retention and desorption from plasma-facing materials in fusion reactor-relevant conditions

Hydrogen isotopes retention and desorption during and after discharges in fusion devices are still not well understood due to the complex device conditions and limitations of in-situ diagnostics and measurements. Here, we simulated well-diagnosed recent experiments at the DIII-D facility to benchmark our ITMC-DYN integrated package of modeling deuterium diffusion, retention, and desorption during and after D discharge irradiation. Modeling results were compared with detail experimental data of D desorption fluxes for various irradiation conditions. We predicted the temporal evolution of free and trapped D distribution in tungsten (W) plasma-facing material (PFM). Effects of key parameters namely diffusion coefficient, recombination rate, trapping energies against different defect types, were examined in these simulations. Existing experimental data of these parameters in literature varies significantly which makes it harder to identify key mechanisms and physics responsible for hydrogen isotope retention and desorption. The purpose of this work is to accurately simulate recent well-diagnosed reactor experiments given the uncertainties in such parameters and identify mechanisms responsible for the retention and desorption. We implemented the best identified diffusion, recombination, and trapping parameters in ITMC-DYN package that integrate both various collisional and thermal processes. We predicted, for example, that sample cooling between discharges in DIII-D operations can significantly affect the spatial distribution of trapped D in W under reactor irradiation conditions. Correct prediction of desorption spectra from samples irradiated during 10 DIII-D discharges showed that up to 35% of D can be retained in high binding energy defects such as vacancy clusters or voids.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

DOE OSTI2023

Low-loss adiabatic fiber-optic coupler for cryogenic photonics

Recent developments in quantum light–matter coupled systems and quantum transducers have highlighted the need for cryogenic optical measurements. In this study, we present a packaged fiber-optic coupler with a coupling efficiency of over 50% for telecom wavelength light down to the mK temperature range. Besides the high coupling efficiency, our method enables sensitive photonic device measurements that are immune to mechanical vibrations present in cryogenic setups.

Optics↗

DOE OSTI2024

Cadmium-Free QD Building Blocks for Human Centric Lighting

This project developed Cd-free quantum dot (QD) downconverters for efficacious human-centric lighting (HCL) light emitting diode (LED) devices. Solid state HCL devices address the lack of light in the cyan wavelength region (460-490 nm) in white LEDs by enhancing the melanopic daylight efficacy ratio (MDER) value. MDER is a metric that indicates the degree to which artificial lighting stimulates nonvisual biological processes in the retina responsible for regulating circadian rhythms compared with natural lighting. The peak sensitivity of melanopsin in the retina is at 479 nm, therefore artificial lighting which can fill the well-known “cyan gap” may improve human health. Due to the Restriction of Hazardous Substances (RoHS) regulations, cadmium-free core/shell/shell QDs are the primary targets for low toxicity, tunable downconverters. Cyan- and red-emitting core/shell/shell QDs were implemented in LED devices toward achieving a brightness of 210 lm/W at 4000 K, CRI 90, and MDER > 0.7. Synthetic development of Cd-free materials yielded cyan InP/ZnS QDs with a photoluminescence quantum yield (PLQY) of ~60% between 480-490 nm, and red InP/ZnSe/(ZnSeS)/ZnS QDs reaching ~80% PLQY at 620-630 nm. We successfully demonstrated that the inclusion of cyan QDs increased the MDER value to ≥0.7, but the brightness of the HCL LED devices was hindered due to low PLQY values. However, upon substitution of the Cd-free cyan QD with a low-Cd QD with >90% PLQY, brightness improved by 25% over the Cd-free device to 179 lm/W. Despite the technical obstacles remaining toward improving emission characteristics and stability of QDs under high flux, we have confirmed the promise of narrow, tunable QD emitters in SSL packages toward the goal of healthy, human-centric lighting.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

NASA NTRS2002

Human Motion Tracking and Glove-Based User Interfaces for Virtual Environments in ANVIL

The Army/NASA Virtual Innovations Laboratory (ANVIL) at Marshall Space Flight Center (MSFC) provides an environment where engineers and other personnel can investigate novel applications of computer simulation and Virtual Reality (VR) technologies. Among the many hardware and software resources in ANVIL are several high-performance Silicon Graphics computer systems and a number of commercial software packages, such as Division MockUp by Parametric Technology Corporation (PTC) and Jack by Unigraphics Solutions, Inc. These hardware and software platforms are used in conjunction with various VR peripheral I/O (input / output) devices, CAD (computer aided design) models, etc. to support the objectives of the MSFC Engineering Systems Department/Systems Engineering Support Group (ED42) by studying engineering designs, chiefly from the standpoint of human factors and ergonomics. One of the more time-consuming tasks facing ANVIL personnel involves the testing and evaluation of peripheral I/O devices and the integration of new devices with existing hardware and software platforms. Another important challenge is the development of innovative user interfaces to allow efficient, intuitive interaction between simulation users and the virtual environments they are investigating. As part of his Summer Faculty Fellowship, the author was tasked with verifying the operation of some recently acquired peripheral interface devices and developing new, easy-to-use interfaces that could be used with existing VR hardware and software to better support ANVIL projects.

Joseph D. Dumas, II↗

NASA NTRS2014

Badger COMET Compartmentalized Onboard Material Extrusion Technology

In response to the 2014 NASA Academic Innovation Challenge, the University of Wisconsin – Madison team presents the design of a collapsible Fused Deposition Modeling (FDM) system for in situ manufacturing in a space habitat environment, the Badger Compartmentalized Onboard Material Extrusion Technology (COMET). The proposed mechanism incorporates one year of design and testing on an array of current additive manufacturing techniques, with the goal of providing a reliable and maintainable manufacturing solution. Seven Level 1 requirements were employed to guide the design process, based on information in the challenge, communications with NASA, and the evolving systems feedback of project work groups. These requirements provided a baseline for the development of the System Requirements Document (SRD, Appendix I), which framed the design of the system. The design requirements deemed critical to the success of the systems are as follows: - The system shall compose an FDM workstation capable of producing parts within industry standard tolerances. - The system shall reduce to a minimum of 50 percent or less of its deployed volume when not in use, and must collapse without the need for disassembly. - The system shall meet all relevant NASA safety and functional standards. The final design for the Badger COMET was selected from multiple design iterations, which balanced the critical design requirements listed above with system reliability, with the final goal of providing a minimal system weight. The system collapses in the vertical direction, allowing for a maximum reduction in volume. Guide rods and precision, anti-backlash lead screws provide all linear movement in the device. Stepper motors were chosen to actuate each system axis, due to their high precision and repeatable accuracy. The system is controlled through an on-board computer system and embedded electronics package.

Frederick T. Elder↗

DOE OSTI2024

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging.

ADVANCED PROPULSION SYSTEMS↗

DOE OSTI2024

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [11] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project evaluates, designs, and develops thermal management strategies that use dielectric fluid (single-phase heat transfer) as coolants.

ADVANCED PROPULSION SYSTEMS↗