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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 613 records · Page 34
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Initial Assessment of Availability and Reliability for the PIP-II Superconducting Radio Frequency Linear Accelerator Facility

The Proton Improvement Plan -II (PIP-II) is a high intensity and high energy proton accelerator which will be used to support the neutrino program at Fermilab. The accelerator will deliver a 2 mA average beam current at a kinetic energy of 800 MeV. Due to the requirements from experiments, this accelerator is designed to be a highly reliable and available system. A target availability of the complete accelerator facility was prescribed to be 90%. An availability and reliability assessment of the accelerator was carried out to ascertain that the design can meet the target availability specification. The results were estimated for the nominal operational mode, when an 800 MeV beam is delivered on the target and for the critical operational mode, when a 600 MeV output beam was incident on the target. The design of a complete accel-erator system is a complex arrangement of a large number of components. To simplify the analysis, a few components were shortlisted and based on their functions, an accelerator model was created. The model is represented in the form of reliability block diagrams. Availability and reliability were estimated for each operational mode. To increase the availa-bility and reliability of the overall accelerator, redundancy of one cavity per section in the superconducting portion of the Linac was introduced.

43 PARTICLE ACCELERATORS↗
DOE OSTI2021

3D superconducting radio-frequency resonators for quantum computing

Superconducting radiofrequency (SRF) technology is being used not only in discovery science programs and basic research but also for several applications that benefit society more directly. The advantage of superconducting resonators over those made of normal-conducting metal is their ability to store electromagnetic energy with much lower dissipation. The high quality factor and longer dissipation time provided by these superconducting resonators can deliver superior performance. Currently, the quantum processing architecture uses resonators and interconnecting circuits operating in the microwave regime with superconducting strip-line technology and low noise electronic devices for switching and communication. The performance of these devices can be enhanced by embedding them in 3D SRF cavity resonators to prolong the coherence time, which improves the utility of the device by reducing error rates and allowing more manipulations (calculations) before the quantum state decays. In this presentation, I will review the current technology and progress towards the three dimensional SRF cavities to enhance the coherence time.

Dhakal, Pashupati↗
DOE OSTI2022

Sensing units including a radio-frequency sensor, and related systems, devices, and methods

Systems, devices, and methods related to generating and/or transmitting sensor measurement data are described. A device may include a first conductive pad positioned on a first surface of a substrate. The device may also include a second conductive pad positioned on a second, opposite surface of the substrate. Further, the device may include an inductive coil coupled between the first electrical pad and the second electrical pad. Also, the device may include a third conductive pad positioned on a third surface of the substrate and configured to couple to a sensor. The device may include a fourth conductive pad positioned on a fourth surface of the substrate and configured to couple to the sensor. The device may be configured to wirelessly transmit a signal.

Smith, James A.↗
DOE OSTI2023

Radio frequency tuning using a multichip module electrical interconnect structure

A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.

Young, Barbara Diane↗