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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Plasma sprayed alumina and beryllia dielectric coatings for heat sinks in electronic packaging, emphasizing heat dissipation from heat/generating components
Slough characteristics measuring methods for clean packaging materials, considering Taber-Abraser, tumble-box and reciprocating-stylus method
MEMS packaging for biomedical applications can be achieved in several ways.
Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure.
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications.
A general purpose solver package for constructing and solving a range of sparse linear systems arising from discretization of PDEs on unstructured meshes is developed. Once the sparse symmetric complex matrix is constructed, it can be solved by either a preconditioned bi-conjugate gradient solver, a two-stage Cholesky LDLT factorization solver, or a hybrid solver combining the above two methods.
A general purpose solver package for constructing and solving a range of sparse linear systems arising from discretization of PDEs on unstructured meshes is developed. Once the sparse symmetric complex matrix is constructed, it can be solved by either a preconditioned bi-conjugate gradient solver, a two-stage Cholesky LDLT factorization solver, or a hybrid solver combining the above two methods. (More detailed than 95-0127).
Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.
This package provides space for mounting up to five MMIC chips and has three RF and five DC feed-throughs.
The ability to anodically bond Kovar to Pyrex 7740 significantly expands the packaging approaches available for MEMS devices. This technique greatly simplifies and reliably interconnects micropropulsion MEMS components (thrusters, valves) with the attached propellant system.
This paper summarizes and reports a radiation hardened spacecraft high temperature, high reliability Sensor/Circut Integrated Packaging Technology.
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size.
A viewgraph presentation on JPL's End Item Data Packages (EIDPs) is shown. The topics include: 1) Background and past efforts; 2) Current effort; and 3) First look; 4) Final look; and 5) Next steps.
This presentation includes NASA Electronic Parts and Packaging (NEPP) Program FY14 task overview plans and recent highlights.
The NEPP Program focuses on the reliability aspects of electronic devices (integrated circuits such as a processor in a computer). There are three principal aspects of this reliability: 1) Lifetime, inherent failure and design issues related to the EEE parts technology and packaging; 2) Effects of space radiation and the space environment on these technologies, and; 3) Creation and maintenance of the assurance support infrastructure required for mission success. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment, and to ensure that appropriate EEE parts research is performed to meet NASA mission assurance needs. NEPPs FY15 goals are to represent the NASA voice to the greater aerospace EEE parts community including supporting anti-counterfeit and trust, provide relevant guidance to cost-effective missions, aid insertion of advanced (and commercial) technologies, resolve unexpected parts issues, ensure access to appropriate radiation test facilities, and collaborate as widely as possible with external entities. In accordance with the changing mission profiles throughout NASA, the NEPP Program has developed a balanced portfolio of efforts to provide agency-wide assurance for not only traditional spacecraft developments, but also those in-line with the new philosophies emerging worldwide. In this presentation, we shall present an overview of this program and considerations for EEE parts assurance as applied to cost conscious missions.
This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.
This presentation will provide basic information about NASA's Electronic Parts and Packaging Program (NEPP), for sharing with representatives of the South Korean Aerospace Research Institute (KARI) as part of a larger presentation by Headquarters Office of Safety and Mission Assurance. The NEPP information includes mission and goals, history of the program, basic focus areas, strategies, deliverables and some examples of current tasks.