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At least 595 records · Page 33

Comparing Transition-Edge Sensor Response Times in a Modified Contact Scheme with Different Support Beams

We present measurements of the thermal conductance, G, and effective time constants, tau, of three transition-edge sensors (TESs) populated in arrays operated from 80-87mK with T(sub C) approximately 120mK. Our TES arrays include several variations of thermal architecture enabling determination of the architecture that demonstrates the minimum noise equivalent power (NEP), the lowest tau and the trade-offs among designs. The three TESs we report here have identical Mo/Cu bilayer thermistors and wiring structures, while the thermal architectures are: 1) a TES with straight support beams of 1mm length, 2) a TES with meander support beams of total length 2mm and with 2 phononfilter blocks per beam, and 3) a TES with meander support beams of total length 2mm and with 6 phonon-filter blocks per beam. Our wiring scheme aims to lower the thermistor normal state resistance R(sub N) and increase the sharpness of the transition alpha=dlogR/dlogT at the transition temperature T(sub C). We find an upper limit of given by (25+/-10), and G values of 200fW/K for 1), 15fW/K for 2), and 10fW/K for 3). The value of alpha can be improved by slightly increasing the length of our thermistors.

SAFARI instrument↗

Solid-state Image Sensor with Focal-plane Digital Photon-counting Pixel Array

A solid-state focal-plane imaging system comprises an NxN array of high gain. low-noise unit cells. each unit cell being connected to a different one of photovoltaic detector diodes, one for each unit cell, interspersed in the array for ultra low level image detection and a plurality of digital counters coupled to the outputs of the unit cell by a multiplexer(either a separate counter for each unit cell or a row of N of counters time shared with N rows of digital counters). Each unit cell includes two self-biasing cascode amplifiers in cascade for a high charge-to-voltage conversion gain (greater than 1mV/e(-)) and an electronic switch to reset input capacitance to a reference potential in order to be able to discriminate detection of an incident photon by the photoelectron (e(-))generated in the detector diode at the input of the first cascode amplifier in order to count incident photons individually in a digital counter connected to the output of the second cascade amplifier. Reseting the input capacitance and initiating self-biasing of the amplifiers occurs every clock cycle of an integratng period to enable ultralow light level image detection by the may of photovoltaic detector diodes under such ultralow light level conditions that the photon flux will statistically provide only a single photon at a time incident on anyone detector diode during any clock cycle.

Fossum, Eric R.↗

The X-ray Integral Field Unit (X-IFU) for Athena

Athena is designed to implement the Hot and Energetic Universe science theme selected by the European Space Agency for the second large mission of its Cosmic Vision program. The Athena science payload consists of a large aperture high angular resolution X-ray optics (2 m2 at 1 keV) and twelve meters away, two interchangeable focal plane instruments: the X-ray Integral Field Unit (X-IFU) and the Wide Field Imager. The X-IFU is a cryogenic X-ray spectrometer, based on a large array of Transition Edge Sensors (TES), oering 2.5 eV spectral resolution, with approximately 5" pixels, over a field of view of 5' in diameter. In this paper, we present the X-IFU detector and readout electronics principles, some elements of the current design for the focal plane assembly and the cooling chain. We describe the current performance estimates, in terms of spectral resolution, effective area, particle background rejection and count rate capability. Finally, we emphasize on the technology developments necessary to meet the demanding requirements of the X-IFU, both for the sensor, readout electronics and cooling chain.

X-ray↗

Mosaic Infrared Sensor for Space Astronomy (MIRSSA)

The development of mosaic infrared detector/focal plane arrays for space astronomy is reported. The Mosaic IR Sensor for Space Astronomy (MIRSSA) Program is an effort to develop PV HgCdTe detector arrays with the spectral response of up to 5 micron and silicon CCDs for low temperature applications. Desired background-limited performance (BLIP) for space applications requires an extremely high R sub A product which can be achieved by selecting the detector materials and the operating temperature. The parameters were determined by measurement of HgCdTe PV detector arrays at various temperatures in the SW and MW spectral bands. It is demonstrated that high performance PV HgCdTe detectors can be fabricated for low temperature applications.

Source record↗

PIPER Continuous Adiabatic Demagnetization Refrigerator

We report upon the development and testing of a 4-stage adiabatic demagnetization refrigerator (ADR) capable of continuous cooling at 0.100 Kelvin. This cooler is being built to cool the detector array aboard NASA's Primordial Inflation Polarization Explorer (PIPER) observatory. The goal of this balloon mission is to measure the primordial gravitational waves that should exist if the theory of cosmological inflation is correct. At altitude, the ADR will hold the array of transition-edge sensors at 100 mK continuously while periodically rejecting heat to a 1.2 K pumped helium bath. During testing on ground, the array is held at the same temperature but heat is rejected to a 4.2 K helium bath indicating the flexibility in this coolers design.

Magnetic Cooling Sub-Kelvin ADR↗

Approaches and Analysis for On-Focal-Plane Analog-to-Digital Conversion

This paper presents approaches for on-focal-plane analog-to-digital conversion (ADC). Common approaches and architectures for ADC and their utility for on-focal-plane integration are discussed. Candidate approaches are analyzed with respect to required amplifier gain, bandwidth, capacitance matching, noise and offsets as a function of ADC resolution. A column-parallel ADC architecture appears to be an effective compromise of chip area, power, circuit speed and ADC resolution. The discussion is valid for both infrared focal-plane arrays (FPAs) and visible image sensors.

analog-to-digital↗

Magnetic back-to-back locator

A back-to-back locator instrument includes a first portion with an array of two or more magnetic sensors, and an indicator arrangement. A second portion of the instrument includes an array of correspondingly located magnets. Each of the first and second portions includes a marking arrangement, which either allows marking of the underlying surface, or viewing of a mark on the surface for properly locating the instrument portion thereon. When the two portions are congruent or registered, the indicator arrangement gives a maximum indication of corresponding locations. In a particular use, corresponding locations on the inside and outside of a tank are identified. The indicator arrangement may include a separate indicator for each magnetic sensor. A flux concentrator may be associated with each magnetic sensor.

Phillips, Scott G.↗

Layered Internal-Photoemission Sensor

High quantum efficiency achieved without multiple layer contacts. Proposed infrared sensor based on photoemission from multiple layers of metal silicide sandwiched between layers of silicon. Suitable for use in focal-plane arrays. Layered internal-photoemission sensor has positive/intrinsic/negative structure modified by inclusion of layers or islands of metal silicide. Holes photo-excited from silicide regions and swept to detection by reverse-bias electric field in intrinsic silicon. Easier to make because internal layers allowed to "float" electrically, contact being made with only two outer semiconductor layers.

Fathauer, Robert W.↗

Dynamics of the Molten Contact Line

The purpose of this program is to develop a basic understanding of how a molten material front spreads over a solid that is below its melting point, arrests, and freezes. Our hope is that the work will contribute toward a scientific knowledge base for certain new applications involving molten droplet deposition, including the "printing" of arbitrary three-dimensional objects by precise deposition of individual molten microdrops that solidify after impact. Little information is available at this time on the capillarity-driven motion and arrest of molten contact line regions. Schiaffino and Sonin investigated the arrest of the contact line of a molten microcrystalline wax spreading over a subcooled solid "target" of the same material. They found that contact line arrest takes place at an apparent liquid contact angle that depends primarily on the Stefan number S=c(T(sub f) -T(sub t)/L based on the temperature difference between the fusion point and the target temperature, and proposed that contact line arrest occurs when the liquid's dynamic contact angle approaches the angle of attack of the solidification front just behind the contact line. They also showed, however, that the conventional continuum equations and boundary conditions have no meaningful solution for this angle. The solidification front angle is determined by the heat flux just behind the contact line, and the heat flux is singular at that point. By comparing experiments with numerical computations, Schiaffino and Sonin estimated that the conventional solidification model must break down within a distance of order 0.1 - 1 microns of the contact line. The physical mechanism for this breakdown is as yet undetermined, and no first-principles theory exists for the contact angle at arrest. Schiaffino and Sonin also presented a framework for understanding how to moderate Weber number molten droplet deposition in terms of similarity laws and experimentation. The study is based on experiments with three molten materials- molten wax on solid wax, water on ice, and mercury on frozen mercury- which between them span a considerable range of the deposition/solidification similarity parameters. Correlations are obtained for the spreading velocity, spreading time scales, the spreading factor (i.e. ratio of deposited drop's final footprint radius and the drop's initial radius), post-spreading liquid oscillation amplitudes and time scales, and bulk solidification time scales. Duthaler carried out an experimental and theoretical investigation of the relationship between the liquid's apparent contact angle and the Capillary number Ca=mu U/sigma based on contact line speed, for molten materials spreading over subcooled solids. This relationship is required for modeling of melt spreading. We have adapted Voinov's methodology to the molten contact line and formulated a theoretical model for the Ca vs. contact angle relationship, based Schiaffino and Sonin#s (1997a,b) wedge-like solidification front model. With the solidification front angle taken from Schiaffino and Sonin, the model is in good agreement with the experimental results for Ca vs. contact angle. Duthaler also extended the experimental investigation of droplet deposition and contact line freezing to more materials, including solder on glass, solder on solder, water on ice, and molten microcrystalline wax on wax. The latter also included tests on inclined targets. Deposition tests have also been done with molten octacosane (C28H58) on various targets. An important objective of our program has been the development of micron-scale sensors for measuring the transient temperature at a point on the substrate surface as a molten contact line moves over it. The expectation is that this temperature history will yield a better understanding of the thermal process in the contact line region. The sensors are of the thermistor type, either 2.5 microns or 1.5 microns square, microfabricated with silicon-based technology on either pure silicon or amorphous silicon dioxide chips. Each chip has 32 sensors distributed on its surface in arrays. The time response is better than 10 ms. At the time of writing, sensor calibration is in progress. Results on thermal transients during contact line passage will be discussed at the conference. While we expect that the data will provide information on the near-contact-line heat transfer process, we also foresee possible problems. First, the spatial resolution of the sensors may be insufficient to resolve the near-contact-line region. Second, the sensors protrude about 0.5 microns above the substrate surface, and may affect the contact line motion. Third, a sensor's temperature history depends on both the heat flux distribution into it from the fusion front and the thermal properties of the substrate below it and the solidified melt between it and the fusion front. The heat flux distribution in the contact line region must therefore be unfolded from computations of the overall system's transient thermal response.

Sonin, Ain A.↗

Integrated infrared and visible image sensors

Semiconductor imaging devices integrating an array of visible detectors and another array of infrared detectors into a single module to simultaneously detect both the visible and infrared radiation of an input image. The visible detectors and the infrared detectors may be formed either on two separate substrates or on the same substrate by interleaving visible and infrared detectors.

Fossum, Eric R.↗

Ka-band MMIC array system for ACTS aeronautical terminal experiment (Aero-X)

During the summer of 1994, the Advanced Communication Technology Satellite (ACTS) Aeronautical Terminal Experiment (Aero-X) was successfully completed by the NASA Lewis Research Center (LeRC) and the Jet Propulsion Laboratory (JPL). 4.8 and 9.6 Kbps duplex voice links were established between the LeRC Learjet and the ACTS Link Evaluation Terminal (LET) in Cleveland, Ohio, via the ACTS. The antenna system used in this demonstration was developed by LeRC and featured LeRC and US Air Force experimental arrays using GaAs MMIC devices at each radiating element for electronic beam steering and distributed power amplification. The antenna system consisted of three arrays mounted inside the LeRC Learjet, pointing out through the windows. An open loop tracking controller developed by LeRC used information from the aircraft position and attitude sensors to automatically steer the arrays toward ACTS during flight JPL ACTS Mobile Terminal (AMT) system hardware was used as transceivers both on the aircraft and at the LET. The single 32 element MMIC transmit array developed by NASA/LeRC and Texas Instruments has an EIRP of 23.4 dBW at boresight. The two 20 GHz MMIC receive arrays were developed in a cooperative effort with the USAF Rome Laboratory/Electronic System Center, taking advantage of existing USAF array development contracts with Boeing and Martin Marietta. The Boeing array has 23 elements and a G/T of 16/6 db/degK at boresight. The Martin Marietta array has 16 elements and a G/T of 16.1 db/degK at boresight. The three proof-of-concept arrays, the array control system and their integration and operation in the Learjet for Aero-X are described.

Raquet, Charles A.↗

Detector Arrays for the James Webb Space Telescope Near-Infrared Spectrograph

The James Webb Space Telescope's (JWST) Near Infrared Spectrograph (NIRSpec) incorporates two 5 micron cutoff (lambda(sub co) = 5 microns) 2048x2048 pixel Teledyne HgCdTe HAWAII-2RG sensor chip assemblies. These detector arrays, and the two Teledyne SIDECAR application specific integrated circuits that control them, are operated in space at T approx. 37 K. In this article, we provide a brief introduction to NIRSpec, its detector subsystem (DS), detector readout in the space radiation environment, and present a snapshot of the developmental status of the NIRSpec DS as integration and testing of the engineering test unit begins.

Rauscher, Bernard J.↗

Investigation of Boundary Layer Development in Multi-Stage Low Pressure

A review of recent literature has been made in the areas of unsteady measurement in turbomachinery and LP turbine design. This has included a detailed review of methods for extracting quantitative shear stress data from surface mounted hot-film arrays. Research goals were identified on the basis of the literature survey and following interaction with the GE and NASA contracts. Progress has also been made in the detailed planning of the research program. An array of hot-film sensors has been mounted at mid-span on a second stage nozzle blade ready for installation in the current turbine buildup. A new technique of applying the hot-film array using double sided adhesive is being tested. The temperature in the vicinity of the hot-films will be monitored using a thermocouple attached to the blade pressure surface. This will increase the accuracy of the data reduction process compared with the methods applied by Halstead et at. (1995) and others. Data obtained from this first set of sensors, along with data from the hot-wire investigation will help to determine the best locations for surface hot-film instrumentation for subsequent builds of the turbine. Other LSRT instrumentation issues which have been addressed include calibration of the torque measurement system and procurement of custom design hot-wire sensors required to compensate for the slope flow path. Preliminary attempts at modeling the boundary layer transition process have been completed. A steady, coupled viscous-inviscid flow solver (the MISES code of Drela and Youngren) was used to calculate the steady-flow boundary layer transition location.

Source record↗

Performance of the QWIP Focal Plane Array for NASA's Landsat 9 Mission

The flight focal plane array (FPA) for the Thermal Infrared Sensor 2 (TIRS-2) instrument, to be flown on Landsat 9, was built and characterized at NASA Goddard Space Flight Center (GSFC). The FPA was assembled using GaAs quantum well infrared photodetector (QWIP) arrays from the same lot as the TIRS instrument on Landsat 8. Each QWIP array is hybridized to an Indigo ISC9803 readout integrated circuit (ROIC) with 640 x 512, 25µm by 25µm pixels. Each QWIP hybrid was tested at the NASA/GSFC Detector Characterization Laboratory (DCL) as a single sensor chip assembly (SCA). The best SCAs in terms of performance were then built up into an FPA consisting of three SCAs, required to provide the necessary 15-degree field of view of the instrument. The FPA was tested to determine if project requirements were being met as a fully assembled unit. The performance of the QWIP SCAs and the fully assembled, NASA flight-qualified FPA will be reviewed.

Quantum well infrared photodiode↗

Curved-Focal-Plane Arrays Using Deformed-Membrane Photodetectors

A versatile and simple approach to the design and fabrication of curved-focal-plane arrays of silicon-based photodetectors is being developed. This approach is an alternative to the one described in "Curved Focal-Plane Arrays Using Back- Illuminated High-Purity Photodetectors" (NPO-30566), NASA Tech Briefs, Vol. 27, No. 10 (October 2003), page 10a. As in the cited prior article, the basic idea is to improve the performance of an imaging instrument and simplify the optics needed to obtain a given level of performance by making an image sensor (in this case, an array of photodetectors) conform to a curved focal surface, instead of designing the optics to project an image onto a flat focal surface. There is biological precedent for curved-focal-surface designs: retinas - the image sensors in eyes - conform to the naturally curved focal surfaces of eye lenses. The present approach is applicable to both front-side- and back-side-illuminated, membrane photodetector arrays and is being demonstrated on charge-coupled devices (CCDs). The very-large scale integrated (VLSI) circuitry of such a CCD or other array is fabricated on the front side of a silicon substrate, then the CCD substrate is attached temporarily to a second substrate for mechanical support, then material is removed from the back to obtain the CCD membrane, which typically has a thickness between 10 and 20 m. In the case of a CCD designed to operate in back-surface illumination, delta doping can be performed after thinning to enhance the sensitivity. This approach is independent of the design and method of fabrication of the front-side VLSI circuitry and does not involve any processing of a curved silicon substrate. In this approach, a third substrate would be prepared by polishing one of its surfaces to a required focal-surface curvature. A CCD membrane fabricated as described above would be pressed against, deformed into conformity with, and bonded to, the curved surface. The technique used to press and bond the CCD membrane would depend on the nature of the supporting material (see figure). For example, if the third substrate were made of quartz frit, the substrate would be prepared by suffusing it with epoxy. Then one would take advantage of the porosity of the frit by applying a partial vacuum to the opposite surface of the frit, causing atmospheric pressure to push the CCD membrane against the curved surface. The curing of the epoxy would bond the CCD membrane to the curved surface. Alternatively, if the third substrate were made of a nonporous material, the curved substrate surface would be prepared by coating it with a wax or an uncured epoxy. The CCD membrane would be pressed against the coated, curved surface by use of a suitably pressurized balloon. The CCD membrane would then become bonded to the curved surface by curing of the epoxy or freezing of the wax.

Nikzad, Shouleh↗

Wavelet compression techniques for hyperspectral data

Hyperspectral sensors are electro-optic sensors which typically operate in visible and near infrared bands. Their characteristic property is the ability to resolve a relatively large number (i.e., tens to hundreds) of contiguous spectral bands to produce a detailed profile of the electromagnetic spectrum. In contrast, multispectral sensors measure relatively few non-contiguous spectral bands. Like multispectral sensors, hyperspectral sensors are often also imaging sensors, measuring spectra over an array of spatial resolution cells. The data produced may thus be viewed as a three dimensional array of samples in which two dimensions correspond to spatial position and the third to wavelength. Because they multiply the already large storage/transmission bandwidth requirements of conventional digital images, hyperspectral sensors generate formidable torrents of data. Their fine spectral resolution typically results in high redundancy in the spectral dimension, so that hyperspectral data sets are excellent candidates for compression. Although there have been a number of studies of compression algorithms for multispectral data, we are not aware of any published results for hyperspectral data. Three algorithms for hyperspectral data compression are compared. They were selected as representatives of three major approaches for extending conventional lossy image compression techniques to hyperspectral data. The simplest approach treats the data as an ensemble of images and compresses each image independently, ignoring the correlation between spectral bands. The second approach transforms the data to decorrelate the spectral bands, and then compresses the transformed data as a set of independent images. The third approach directly generalizes two-dimensional transform coding by applying a three-dimensional transform as part of the usual transform-quantize-entropy code procedure. The algorithms studied all use the discrete wavelet transform. In the first two cases, a wavelet transform coder was used for the two-dimensional compression. The third case used a three dimensional extension of this same algorithm.

Evans, Bruce↗

Development of an End-to-End Demonstration Readout Chain for Athena-X-IFU

The X-IFU (X-ray Integral Field Unit) of the Athena (Advanced Telescope for High-ENergy Astrophysics) telescope, scheduled for launch in the early 2030's, will provide X-ray spectroscopy data with unprecedented spectral and spatial resolution. This will be achieved by a 3 kilo-pixel array of TES (transition-edge sensor) microcalorimeters. The complete detection chain is under development by a large international collaboration. The detector array will be provided by NASA Goddard Space Flight Center, the cold TDM (time domain multiplexing) electronics by NIST, the cold amplifier by VTT, the cold focal-plane assembly by SRON, the warm front-end electronics by APC, and the DRE (digital readout electronics) by IRAP. In order to perform an end-to-end demonstration of the X-IFU readout chain, a 50 mK test bench is being developed at IRAP in collaboration with CNES. The test bench is based on a two-stage ADR cryostat from Entropy GmbH and a 1024-pixel array from Goddard associated with its cold TDM readout from NIST. The setup will initially be validated using a warm electronic chain from NIST and Goddard. We will describe the complete system being installed in the cryostat and the first results obtained with these electronics. We will also review the status of the integration of the DRE prototype in the demonstration chain and the way forward in the integration and testing of the complete X-IFU readout chain.

S Beaumont↗

Hybrid UV Imager Containing Face-Up AlGaN/GaN Photodiodes

A proposed hybrid ultraviolet (UV) image sensor would comprise a planar membrane array of face-up AlGaN/GaN photodiodes integrated with a complementary metal oxide/semiconductor (CMOS) readout-circuit chip. Each pixel in the hybrid image sensor would contain a UV photodiode on the AlGaN/GaN membrane, metal oxide/semiconductor field-effect transistor (MOSFET) readout circuitry on the CMOS chip underneath the photodiode, and a metal via connection between the photodiode and the readout circuitry (see figure). The proposed sensor design would offer all the advantages of comparable prior CMOS active-pixel sensors and AlGaN UV detectors while overcoming some of the limitations of prior (AlGaN/sapphire)/CMOS hybrid image sensors that have been designed and fabricated according to the methodology of flip-chip integration. AlGaN is a nearly ideal UV-detector material because its bandgap is wide and adjustable and it offers the potential to attain extremely low dark current. Integration of AlGaN with CMOS is necessary because at present there are no practical means of realizing readout circuitry in the AlGaN/GaN material system, whereas the means of realizing readout circuitry in CMOS are well established. In one variant of the flip-chip approach to integration, an AlGaN chip on a sapphire substrate is inverted (flipped) and then bump-bonded to a CMOS readout circuit chip; this variant results in poor quantum efficiency. In another variant of the flip-chip approach, an AlGaN chip on a crystalline AlN substrate would be bonded to a CMOS readout circuit chip; this variant is expected to result in narrow spectral response, which would be undesirable in many applications. Two other major disadvantages of flip-chip integration are large pixel size (a consequence of the need to devote sufficient area to each bump bond) and severe restriction on the photodetector structure. The membrane array of AlGaN/GaN photodiodes and the CMOS readout circuit for the proposed image sensor would be fabricated separately.

Zheng, Xinyu↗