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At least 595 records · Page 33
All sourcesNASA NTRSDOE OSTI
NASA NTRS1984

Synthesis and characterization of a melt processable polyimide

A melt processable polyimide which contains sulfur and oxygen bridges between the aromatic rings (BDSDA/APB) was synthesized and characterized. Its physical, mechanical, thermal and flow properties were determined as was its resistance to some of the more commonly used solvents. The melt flow properties were measured for the temperature range 250 C - 350 C and under the conditions (stress/strain) encountered in commercial processes.

Burks, H. D.↗
NASA NTRS1984

Synthesis of tin-containing polyimide films

A series of tin-containing polyimide films derived from either 3,3',4,4'-benzophenone tetracarboxylic acid dianhydride or pyromellitic dianhydride and 4,4'-oxydianiline have been synthesized and their electrical properties examined. Highest quality materials (i.e., homogeneous, smooth surface, flexible) with the best electrical properties were doped with either SnCl2.2H2O or (n-Bu)2SnCl2. In all cases, extensive reactivity of the tin dopant with water, air or polyamic acid during imidization is observed. Lowered electrical surface resistivities appear to be correlatable with the presence of surface tin oxide on the film surface.

Ezzell, S. A.↗
NASA NTRS1984

Electrical properties of metal-doped pyridine-derived polyimide films

A series of polyimide films containing pyridine coordinating groups doped with cobalt or nickel ions has been examined. Using 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, films were prepared in combination with 4,4'-oxydianiline, 4,4'-dianiline sulfide, 3,3'-bis(aminopyridine) sulfide and 2,2'-dioxyphenelenebis (5,5'-aminopyridine). Room temperature volume resistivities have been found to decrease slightly with sulfur and pyridine containing diamines relative to diamines which do not contain these functionalities. Doping with cobalt and nickel additives results in further lowering of room temperature volume resistivity. Preliminary temperature profiling experiments have shown that volume resistivity decreases as T(g) is approached.

Khor, E.↗
NASA NTRS1984

Mechanical and spectroscopic properties of metal containing polyimides

The incorporation of specific metal ions into polyimides is described. Detailed studies have included various compounds of copper, lithium, and palladium as dopants. Addition of the metal during polymermzation or after formation of the polyamic acid precedes the thermal imidization step. With many dianhydride-diamine-dopant combinations high quality variously colored films are produced. Many metal doped films exhibit (1) improved high temperature adhesive properties, (2) increased electrical conductivity, (3) excellent thermal stability, (4) improved acid/base resistance, (5) increased modulus in flexible films and (6) excellent high temperature tensile strength. X-ray photo-electron spectroscopic study of these films suggests that many of the additives undergo chemical modification during thermal imidization. Palladium dopants appear to be partially reduced to the metallic state, while lithium and copper dopants are probably converted to their oxides. Ion etching experiments with Auger electron spectroscopy monitoring are discussed.

Taylor, L. T.↗
NASA NTRS1984

Novel metal-filled polyimide electrodes

Palladium-coated polyimide films are evaluated as electrochemical electrodes. The film electrodes exhibit essentially identical behavior compared to bulk palladium electrodes. In aqueous 0.5M H2SO4, current peaks due to oxide formation, oxide stripping, hydrogen adsorption, and H2 oxidation are observed. The ferri/ferrocyanide redox couple is grossly irreversible in the same electrolyte. Reversible electrochemical behavior is obtained for Fe(EDTA)(1-/2-) in 1M KCl/H2O, and for ferrocene/ferricenium in 0.1M TEAP/dimethylacetamide.

Furtsch, T. A.↗
NASA NTRS1986

Colorless Polyimide Containing Phenoxy-Linked Diamines

Tough, optically transparent films produced. Polyimides having this molecular structure form tough, transparent films. Films made transparent by careful control of manufacturing conditions, including use of highly purified monomers. Need for high-temperature, flexible polymeric films and coating materials that have high optical transparency in 300- to 600nm range of electro-magnetic spectrum for use on antennas, solar cells, and thermalcontrol coatings.

St. Clair, A. K.↗
NASA NTRS1986

Tougher Addition Polyimides Containing Siloxane

Laminates show increased impact resistances and other desirable mechanical properties. Bismaleamic acid extended by reaction of diaminosiloxane with maleic anhydride in 1:1 molar ratio, followed by reaction with half this molar ratio of aromatic dianhydride. Bismaleamic acid also extended by reaction of diaminosiloxane with maleic anhydride in 1:2 molar ratio, followed by reaction with half this molar ratio of aromatic diamine (Michael-addition reaction). Impact resistances improved over those of unmodified bismaleimide, showing significant increase in toughness. Aromatic addition polyimides developed as both matrix and adhesive resins for applications on future aircraft and spacecraft.

St. Clair, T. L.↗
NASA NTRS1986

Fire-Resistant Polyimides Containing Phosphorus

Limiting oxygen index increased. Copolyimide with a group containing phosphorus synthesized from 1-2,4-diaminobenzene, m-phenylenediamine, and tetracarboxylic dianhydride. Copolymer more fire resistant than corresponding polyimide without phosphorus.

Mikroyannidis, J.↗
NASA NTRS1985

An improved processible acetylene-terminated polyimide for composites

The newest member of a family of thermosetting acetylene-substituted polyimide oligomers is HR600P. This oligomer is the isoimide version of the oligomer known as HR600P and Thermid 600. Although both types of material yield the same heat resistant end products after cure, HR600P has much superior processing characteristics. This attributed to its lower melting temperature (160 + or - 10 C, 320 + or - 20 F) in contrast to 202 C (396 F) for Thermid MC-600, its longer gel time at its processing temperature (16 to 30 minutes bvs 3 minutes), and its excellent solubility in low boiling solvents such as tetrahydrofuran, glymes, or 4:1 methyl ethyl ketone/toluene mixtures. These advantages provide more acceptable coating and impregnation procedures, allow for more complete removal at lower temperatures, provide a longer pot life or working time, and allow composite structure fabrication in conventional autoclaves used for epoxy composite curing. The excellent processing characteristics of HR600P allow its use in large area laminated structures, structural composites, and molding compositions.

Landis, A. L.↗
NASA NTRS1985

All-aromatic biphenylene end-capped polyquinoline and polyimide matrix resins

Biphenylene end-capped polyquinoline and polyimide resins afford low void content graphite-reinforced composites with good initial properties. However, with both resins, rapid degradation occurs during oxidative isothermal aging at elevated temperatures. The degradation is not observed during isothermal aging under a nitrogen atmosphere which suggests that the biphenylene end-cap (or the resulting crosslink/chain extension structures) is not particularly thermooxidatively stable. The nature of the thermooxidative instability is currently under investigation.

Droske, J. P.↗
NASA NTRS1985

Thermo-oxidative stability of graphite fiber/PMR-15 polyimide composites at 350 deg C

A series of graphite fiber/PMR-15 polyimide composites were subjected to isothermal aging at 350 C in flowing air (100 cc/min and 1000 cc/min) over a 520 hr time period. The graphite fibers were analyzed by ISS/SIMS techniques before composite fabrication. Fibers exposed at the surface of the composite due to the isothermal aging process were also analyzed by the ISS/SIMS method. Component and composite weight less studies were also conducted for similarly exposed materials. Optical micrograph investigations of composites to follow the progress of the thermo-oxidative process were also conducted. Flexural and interlaminar shear strengths of the imaged and aged composites were measured. The relationship of component and composite properties as they relate to the thermo-oxidative behavior of the materials was discussed.

Scola, D. A.↗
NASA NTRS1985

Microscopic evaluation of a polyimide (PMR-15)-graphite composite

An effort to evaluate the high temperature performance of a polyimide (PMR-15)-graphite composite which consists of several plies of woven strands of carbon fibers was undertaken. The longterm effect of high temperature on the dry material was studied by exposing polished test specimens of 473 F in a oven for nearly 400 hours. Periodically the specimens were removed and observed microscopically. Gradually surface cracks began to appear and the number of cracks increased over time. At the conclusion of the exposure the specimens were graudually ground down and observed in order to determine the depth of the cracks into the interior of the material. This procedure was repeated at an exposure temperature of 550 F.

Fedderly, J. J.↗
NASA NTRS1985

Process of end-capping a polyimide system

A process of endcapping a polyimide system with an endcapping agent in order to achieve a controlled decrease in molecular weight and melt viscosity along with predictable fracture resistance of the molded products is disclosed. The uncapped system is formed by combining an equimolar ratio of 4,4'-bis (3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA) and 1,-bis (aminophenoxy) benzene (APB) dissolved in bis (2-methoxyethyl)ether. The endcapped system is formed by dissolving APB in bis-(2-methoxyethyl)ether, adding the BDSDA. By varying the amount of endcapping from 0 to 4%, molecular weight is decreased from 13,900 to 8660. At a processing temperature of 250 C, there is a linear relationship between molecular weight and viscosity, with the viscosity decreasing by two orders of magnitude as the molecular weight decreased from 13,900 to 8660.

Stclair, T. L.↗
NASA NTRS1986

Structure-to-property Relationships in Addition Cured Polymers 2: Resin Tg Composite Initial Mechanical Properties of Norbornenyl Cured Polyimide Resins

PRM (polymerization of monomeric reactants) methodology was used to prepare thirty different polyimide oligomeric resins. Monomeric composition as well as chain length between sites of crosslinks were varied to examine their effects on glass transition temperature (Tg) of the cured/postcured resins. An almost linear correlation of Tg versus molecular distance between the crosslinks was observed. An attempt was made to correlate Tg with initial mechanical properties (flexural strength and interlaminar shear strength) of unidirectional graphite fiber composites prepared with these resins. However, the scatter in mechanical strength data prevented obtaining as clear a correlation as was observed for the structural modification/crosslink distance versus Tg. Instead, only a range of composite mechanical properties was obtained at the test temperatures studied (room temperature, 288 and 316 C). Perhaps more importantly, what did become apparent during the attempted correlation study was: (1) that PMR methodology could be used to prepare composites from resins that contain a wide variety of monomer modifications, and (2) that these composites almost invariably provided satisfactory initial mechanical properties as long as the resins selected were melt processable.

Alston, W. B.↗
NASA NTRS1985

Graphite/PMR polyimide composites with improved toughness

The toughness of composites made with modified PMR (Polymerization of monomer reactants) polyimides and Celion 6000 graphite fibers was studied. Various types/levels of monomer reactants containing flexible links were incorporated into PMR resin compositions used to prepare composites. The composites were evaluated for toughness using instrumented drop weight and 10 deg off axis tensile tests at room temperature, and for strength using flexure and short beam shear tests at room temperature and at elevated temperature. The effect of resin composition on composite processability, thermo-oxidative stability, toughness and mechanical properties are discussed.

Vannucci, R. D.↗
NASA NTRS1986

Evaluation of a novel thermoplastic polyimide for bonding titanium

A novel hot-melt processable polyimide has been synthesized and characterized as an adhesive for a titanium alloy. This system shows potential for applications with service temperatures near 200 C. A bonding cycle was developed from preliminary processing studies. The bonded specimens were tested at room temperature, 177 C and 204 C both before and after aging in air at 204 C for times up to 1000 hours. There was no appreciable change in strength after aging. Bonded specimens were exposed to boiling water continuously for a 72 hour period. These specimens exhibited some loss in strength due to this rather severe exposure.

Progar, D. J.↗
NASA NTRS1987

Polyimide Prepregs With Improved Tack

Drape and tack improved without loss of strength. Composites made with PMR-15 (or equivalent) polyimides have gained acceptance as viable engineering materials for high-use-temperature applications. Acceptance due to both thermo-oxidative stability of PMR-15 (or equivalent) and ease which PMR-15 (or equivalent) prepreg materials processed into composite structures.

Vanucci, R.↗
NASA NTRS1987

Polyimides Containing Carbonyl and Ether Connecting Groups

Semicrystallinity gives rise to tough, solvent-resistant polymers. New polyimides prepared from reaction of aromatic dianhydrides with new diamines containing carbonyl and ether connecting groups between aromatic rings. Damines prepared from reaction of 4-aminophenol with activated aromatic difluoro compounds in presence of potassium carbonate. These types of polymers have potential applications in molded products, films, adhesives, and composites.

Hergenrother, Paul M.↗