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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 595 records · Page 33
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

MOSAIC: Software for creating mosaics from collections of images

We have developed a powerful, versatile image processing and analysis software package called MOSAIC, designed specifically for the manipulation of digital astronomical image data obtained with (but not limited to) two-dimensional array detectors. The software package is implemented using the Interactive Data Language (IDL), and incorporates new methods for processing, calibration, analysis, and visualization of astronomical image data, stressing effective methods for the creation of mosaic images from collections of individual exposures, while at the same time preserving the photometric integrity of the original data. Since IDL is available on many computers, the MOSAIC software runs on most UNIX and VAX workstations with the X-Windows or Sun View graphics interface.

Varosi, F.↗
NASA NTRS1995

Advanced Dependent Pressure Vessel (DPV) nickel-hydrogen spacecraft cell and battery design

The dependent pressure vessel (DPV) nickel-hydrogen (NiH2) battery is being developed as a potential spacecraft battery design for both military and commercial satellites. Individual pressure vessel (IPV) NiH2 batteries are currently flying on more than 70 Earth orbital satellites and have accumulated more than 140,000,000 cell-hours in actual spacecraft operation. The limitations of standard NiH2 IPV flight battery technology are primarily related to the internal cell design and the battery packaging issues associated with grouping multiple cylindrical cells. The DPV cell design offers higher specific energy and reduced cost, while retaining the established IPV NiH2 technology flight heritage and database. The advanced cell design offers a more efficient mechanical, electrical and thermal cell configuration and a reduced parts count. The internal electrode stack is a prismatic flat-plate arrangement. The flat individual cell pressure vessel provides a maximum direct thermal path for removing heat from the electrode stack. The cell geometry also minimizes multiple-cell battery packaging constraints by using an established end-plateltie-rod battery design. A major design advantage is that the battery support structure is efficiently required to restrain only the force applied to a portion of the end cell. As the cells are stacked in series to achieve the desired system voltage, this increment of the total battery weight becomes small. The geometry of the DPV cell promotes compact, minimum volume packaging and places all cell terminals along the length of the battery. The resulting ability to minimize intercell wiring offers additional design simplicity and significant weight savings. The DPV battery design offers significant cost and weight savings advantages while providing minimal design risks. Cell and battery level design issues will be addressed including mechanical, electrical and thermal design aspects. A design performance analysis will be presented at both the cell and battery level. The DPV is capable of delivering up to 76 Watt-hours per kilogram (Wh/kg) at the cell level and 70 Wh/kg at the full battery level. This represents a 40 percent increase in specific energy at the cell level and a 60 percent increase in specific energy at the battery level compared to current IPV NiH2 technology.

Coates, Dwaine↗
DOE OSTI2025

InverseBench: Inverse design benchmark suite that contains inverse problems from science and engineering (InverseBench) v0.0.1

A software package that contains three inverse design blackbox problems to investigate the efficiency and accuracy of inverse design machine learning models. The software contains highly accurate forward machine learning models that can be used to assess the inverse predictions. The package also contains separate test data for each problem. The inverse design problems that are in the package are: airfoil inverse design, scalar boundary reconstruction and photonic surfaces inverse design.

Grbcic, Luka [Lawrence Berkeley National Laborator↗
DOE OSTI2024

MODAQ 2.0 (Modular Ocean Data AcQuisition System v2.0) [SWR-24-138]

MODAQ 2.0 is the continuation of the Modular Ocean/Offshore Data AcQuisition system which offers new benefits of being based on generally available hardware and open-source development tools. The MODAQ 2.0 project is the amalgamation of ROS packages, tools, and guidance for developing data acquisition and control applications for marine energy devices using a ROS2 based architecture. The MODAQ 2.0 Reference Design includes several packages that are targeted for the marine energy sector and allow most developers with a basic background in programming to spin up a high-quality DAQ and control system. It is comprised of multiple software repositories which can be found at the MODAQ2 GitHub Organization: https://github.com/NREL-MODAQ2

Nichols, Casey↗
NASA NTRS1972

Long life assurance study for manned spacecraft long life hardware. Volume 2: Long life assurance studies of EEE parts and packaging

Guidelines for the design, development, and fabrication of electronic components and circuits for use in spacecraft construction are presented. The subjects discussed involve quality control procedures and test methodology for the following subjects: (1) monolithic integrated circuits, (2) hybrid integrated circuits, (3) transistors, (4) diodes, (5) tantalum capacitors, (6) electromechanical relays, (7) switches and circuit breakers, and (8) electronic packaging.

Source record↗
NASA NTRS1982

Control law design to meet constraints using SYNPAC-synthesis package for active controls

Major features of SYNPAC (Synthesis Package for Active Controls) are described. SYNPAC employs constrained optimization techniques which allow explicit inclusion of design criteria (constraints) in the control law design process. Interrelationships are indicated between this constrained optimization approach, classical and linear quadratic Gaussian design techniques. Results are presented that were obtained by applying SYNPAC to the design of a combined stability augmentation/gust load alleviation control law for the DAST ARW-2.

Adams, W. M., Jr.↗
NASA NTRS1984

The electron Echo 6 mechanical deployment systems

The Echo 6 sounding rocket payload was flown on a Terrier boosted Black Brant vehicle on March 30, 1983. The experiment requirements resulted in the new design of a rocket propelled Throw Away Detector System (TADS) with onboard Doppler radar, a free-flyer forward experiment designated the Plasma Diagnostic Package (PDP), and numerous other basic systems. The design, developmental testing, and flight preparations of the payload and the mechanical deployment systems are described.

Meyers, S. C.↗
NASA NTRS2018

Cryogenic Angle Measurement at NASA Langley

NASA’s National Transonic Facility is one of the few cryogenic wind-tunnel facilities in the world, where tunnel conditions may reach -250 F. Model angle of attack (AoA) at NTF is typically measured by an on-board accelerometer package that is exposed to the cryogenic tunnel conditions. These NTF AoA packages house two Q-Flex accelerometers in a compact heated environment in order to maintain constant temperature of the sensors for stability. Recently, drift in sensor output was observed in one of the NTF AoA packages. The drift is correlated with the AoA package temperature and cryogenic soak time. This paper studies the temperature and time dependent behavior of the NTF AoA packages, and reviews their design and calibration. Recommended improvements to the AoA packages are made to improve the stability of the model angle of attack measurements at cryogenic conditions.

Toro, Kenneth G.↗
NASA NTRS2013

Packaging Technologies for 500C SiC Electronics and Sensors

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Chen, Liang-Yu↗
NASA NTRS1984

Design and operational features of the Ultraviolet Imaging Telescope flight and ground software

The NASA Office of Space Sciences and Applications is sponsoring a series of Space Shuttle missions named Astro-n which are dedicated to a variety of astronomical projects. These missions will be the first in which the Space Shuttle crew will be interactively operating an astronomical observatory which is fixed in the payload bay. The operation of an instrument in such an environment requires a considerable amount of software both on board and on the ground. The Spacelab Experiment Computer provides generalized interactive telemetry display and command processing services through the Experiment Computer Operating System. The experimenter must then design a software package for his Dedicated Experiment Processor which can provide complete control of his instrument as well as communicate with the Experiment Computer. This paper describes the design considerations and operational features of the Ultraviolet Imaging Telescope Dedicated Experiment Processor and Instrument Ground Support Equipment software.

Parise, R. A.↗
NASA NTRS2011

On-Wafer S-Parameter Measurements in the 325-508-GHz Band

New circuits have been designed and fabricated with operating frequencies over 325 GHz. In order to measure S-parameters of these circuits, an extensive process of wafer dicing and packaging, and waveguide transition design, fabrication, and packaging would be required. This is a costly and time-consuming process before the circuit can be tested in waveguide. The new probes and calibration procedures will simplify the testing process. New on-wafer probes, and a procedure for their calibration, have been developed that allow fast and inexpensive S-parameter characterization of circuits in the 325 -508 -GHz frequency band. The on-wafer probes transition from rectangular waveguide to coplanar waveguide probe tips with 40- m nominal signal-to-ground pin pitch so as to allow for probing circuits on a wafer. The probes with bias tees have been optimized for minimal insertion loss and maximum return loss when placed on 50-ohm structures to allow for calibration. The calibration process has been developed using the Thru-Reflect-Line Agilent algorithm with JPL determined calibration structures and calibration coefficients for the algorithm. This new test capability is presently unique to JPL. With it, researchers will be able to better develop circuits such as low-noise amplifiers, power amplifiers, multipliers, and mixers for heterodyne receivers in the 325-508-GHz frequency band for remote sensing/spectroscopy.

Fung, King Man↗
NASA NTRS1999

Technology Validation Program for Mars Aerobot Micromission

The Mars Aerobot Validation Program (MABVAP) was initiated in August 1997 to develop and validate key technologies needed for aerobot missions on Mars. The major elements of the program are the development of balloons for flight on Mars, robust techniques for deployment and inflation and modeling and simulation of balloon flight paths, selection, development and tests of available balloon materials, design and fabrication of balloons (both superpressure and solar-heated), design and fabrication of deployment and inflation systems for aerial deployment, design and fabrication of avionics to control deployment/inflation process and to get telemetry and video data. The program includes laboratory, wind tunnel, vacuum chamber tests of the system components and a number of tropospheric and stratospheric flight tests of deployment and inflation of light-film balloons in a simulated Martian environment Key issues in the design include: the use of proven materials or their combinations; the availability of adequate balloon fabrication technologies and processes; evacuation of gas from the balloon prior to packaging and the design of a balloon container capable of storing the balloon over a wide range of ambient pressures. Tests that have been made at JPL and at the Vertical Wind Tunnel at NASA Langley Research Center clarified many of the first order issues discussed above and lead to the baseline configuration with inflation from the bottom without a reefing mechanism.

Cutts, J.↗
NASA NTRS2005

Progress of the Dust Accumulation and Removal Technology Experiment (DART) for the Mars 2001 Lander

Dust deposition could be a significant problem for photovoltaic array operation for long duration missions on the surface of Mars. Measurements made by Pathfinder showed 0.3 percent loss of solar array performance per day due to dust obscuration. We have designed an experiment package, "DART", which is part of the Mars ISPP Precursor (MIP) package, to fly on the Mars-2001 Surveyor Lander. This mission, to launch in April 2001, will arrive on Mars in January 2002. The DART experiment is designed to quantify dust deposition from the Mars atmosphere, measure the properties of settled dust, measure the effect of dust deposition on array performance, and test several methods of clearing dust from solar cells.

Jenkins, Phillip↗
NASA NTRS1981

Advanced solar concentrator mass production, operation, and maintenance cost assessment

The object of this assessment was to estimate the costs of the preliminary design at: production rates of 100 to 1,000,000 concentrators per year; concentrators per aperture diameters of 5, 10, 11, and 15 meters; and various receiver/power conversion package weights. The design of the cellular glass substrate Advanced Solar Concentrator is presented. The concentrator is an 11 meter diameter, two axis tracking, parabolic dish solar concentrator. The reflective surface of this design consists of inner and outer groups of mirror glass/cellular glass gores.

Niemeyer, W. A.↗
NASA NTRS1991

High density packaging and interconnect of massively parallel image processors

This paper presents conceptual designs for high density packaging of parallel processing systems. The systems fall into two categories: global memory systems where many processors are packaged into a stack, and distributed memory systems where a single processor and many memory chips are packaged into a stack. Thermal behavior and performance are discussed.

Carson, John C.↗
NASA NTRS2001

Heterogeneous Integration, An Approach to High Density and High Flexibility Electronic Packaging

Key to the design of spacecraft for exploration of the outer planets will be the development of highly integrated and mass/volume efficient electronic systems. Exploration of the outer planets will require optimized propulsion approaches which mandates mass minimization. If one looks at a mission such as the Europa Lander, a high mass/volume efficiency feeds back directly into lower mass for radiation shielding. Concurrently the long mission lengths will drive the need for fault isolation and fault tolerance. The ability to build distributed electronic systems is an inherent requirement and one which is enabled by heterogeneous integration. The electronic packaging approach must be capable of interconnecting various components at a scale comparable with that on the components themselves (chip scale) and it must facilitate efficient integration of the electronics with elements of the spacecraft such as structure or antennae. The concept of 'Heterogeneous Integration' is being explored in the System On A Chip (SOAC) Project at JPL. The goal, of this approach to electronic packaging, is to enable the fabrication and assembly of complete electronic subsystems from components fabricated by a range of processes. Included in such a system could be MEMS sensors, SOI mixed signal ASICs, micro scale passive components and micro power. Secondarily the compact size will enable distributed architectures and integrated assemblies. Additional information is contained in the original extended abstract.

DAgostino, S. A.↗