Stress ratio effect on cyclic debonding in adhesively bonded composite joints
A study was conducted to investigate the stress ratio effect on cyclic debond growth behavior in adhesively bonded composite joints. The system studied consisted of graphite/epoxy adherends bonded with a toughened epoxy adhesive. This study showed that the strain energy release rate range was the driving factor for cyclic debonding of the tested bonded system when subjected to cyclic loads with different stress ratios for both mode I and mixed mode I-II loadings.