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At least 595 records · Page 33

Reconstructing parent microstructures in martensitic and pearlitic Ti-Cu

Evaluating the microstructural evolution of parent phases has long been a challenge in metals with a partial or complete solid state transformation. Most parent microstructure evolution has to be inferred from the product microstructure, with some information permanently lost. Parent microstructure reconstructions relying on orientation relationships and EBSD data are a useful tool to overcome this challenge, though much background knowledge is required to do so. Here, this work introduces a reconstruction process for a eutectoid composition Ti-Cu binary alloy to evaluate the high temperature β-Ti phase from martensitic and pearlitic product microstructures. Martensitic microstructures were accurately reconstructed, enabling elucidation of β-Ti grain size and texture, and the employed script included for scientific reference. Pearlitic microstructures did not reconstruct effectively with the current process. However, new insight into the interfacial crystallographic orientations of pearlitic Ti-Cu microstructures was gleaned via this analysis, and future investigations of interest are discussed accordingly. Ultimately, these findings demonstrate tools widely implemented on conventional titanium and ferrous alloys can also be applied to understand parent microstructures in Ti-Cu and other alloys of emerging interest. This is especially of use as new manufacturing processes for such materials require understanding how parent phase microstructures respond to new, novel material processing such as AM.

36 MATERIALS SCIENCE↗

The onset of alloying in Cu-Ni powders under high-shear consolidation

Friction consolidation (FC) is a solid phase processing methodology that densifies a material through high-shear deformation and pressure at elevated temperature. The method has garnered interest in the scientific community because of its ability to produce extremely refined and homogeneous microstructures, off-axis texture development, and improved material properties. This manuscript presents an investigation of Cu and Ni material mixing via evaluation of morphological evolution, grain boundary characterization, and compositional analysis to provide insights on the operational alloying mechanisms occurring under high shear and elevated temperature. Using correlative microscopy techniques, we show alloying progresses via a combination of grain boundary diffusion and interfacial roughening at heterophane boundaries. Evidence supporting Cu infiltration along Ni-Ni grain boundaries along with asymmetric diffusion of Cu into Ni grains is highlighted. The resultant, consolidated microstructure was produced directly from a powder compact in ~30 s and exhibited a submicron, equiaxed grain size.

36 MATERIALS SCIENCE↗

Investigation of synchrotron X-ray induced oxidation of Ag–Cu thin-film

Combinatorial Ag-Cu thin-films were irradiated by synchrotron X-ray in air to investigate the beam damage on the surface of the thin-film. The main effect was found to be oxidation with the oxidation state primarily depending on film composition: CuO formed on the pure Cu film, whereas Cu 2 O formed in the presence of Ag. Meanwhile, formation of crystalline Ag 2 O 2 was favored and preferentially in the Ag-rich area. Lastly, these results are of great importance in studying the oxidation of noble metal nano-film, and in the characterization of nano-films using synchrotron X-ray.

36 MATERIALS SCIENCE↗

Fracture resistance of hierarchical Cu–Mo nanocomposite thin films

We report the fracture behavior of high-temperature co-sputtered Cu/Mo nanocomposite thin films was investigated through in situ 3-point bend testing of pre-notched microbeams in SEM. The as-synthesized nanocomposites present hierarchical nano/microstructures composed of a matrix of phase-separated Cu–Mo with nanoscale ligaments dispersed with sub-micron scale Cu-rich islands containing Mo nano-precipitates. Results show a significant crack growth resistance in the hierarchical nanocomposite, several times higher than that measured in Cu/Mo nanoscale multilayers. Based on electron microscopy characterization, three mechanisms of crack growth resistance in the hierarchical structures are proposed: crack bridging by the Cu-rich layer, crack deflection via shear along the Cu/Mo interface, and multiple cracking. This work demonstrates an approach to increase toughness in high strength nanocomposites through interface micro-structure design.

36 MATERIALS SCIENCE↗

Microstructure and mechanical properties of nanoscale Cu/(Ta50Nb25Mo25) multilayers

Nanoscale Cu/(Ta50Nb25Mo25) multilayers comprised of medium entropy alloy Ta50Nb25Mo25 and pure Cu are found to exhibit similar length-scale-dependent deformation mechanisms as metallic multilayers with elemental individual layers, i.e., confined layer slip at layer thickness of tens of nanometers and shear localization at several nanometers. The hardness of the nanoscale Cu/(Ta50Nb25Mo25) multilayers is higher as compared to the pure element FCC/BCC multilayers due to the extra solid solution strengthening contribution in the BCC layer. The synergy between the size effect and solid solution strengthening mechanism is discussed. In conclusion, this is an early report of the multi-component multilayers, which serves to provide directions for developing novel multilayer materials.

36 MATERIALS SCIENCE↗

Deformation behavior of nanoscale Al–Al 2 Cu eutectics studied by in situ micropillar compression

We report deformation behavior of nanoscale laser processed Al–Al 2 Cu eutectics at room temperature is characterized through in situ micro-pillar compression testing in a scanning transmission microscope. Interlamellar spacing of Al–Al 2 Cu eutectics varies from hundreds of nanometers to 20 nm. Three different sizes of micro-pillars are fabricated in order to study the deformation behaviors of single colony and multiple colonies, corresponding to the single crystal and polycrystal respectively. For single colonies, lamellar orientations parallel, normal or inclined to the loading direction were tested. The main findings are: 1) the plasticity mechanisms strongly depend on loading orientation: buckling and kinking in the parallel-loaded eutectics, planar sliding along Al–Al 2 Cu lamellar interfaces in the incline-loaded eutectics and localized shearing in the normal-loaded eutectics. 2) the incline-loaded eutectics exhibits the lowest compression flow strength, and the normal-loaded eutectics has the highest compression flow strength. 3) with decreasing inter-lamellar spacing, the strength increases and plasticity is uniformly distributed, as opposed to shear localization. Highest compressive plasticity is observed in polycrystalline eutectics with an ensemble of lamellar orientations with ~20 nm average spacing: 17.9% at flow stress of 1.63 GPa, and degenerate, bimodal morphology: 11.1% at flow stress of 1.36 GPa.

36 MATERIALS SCIENCE↗

Comparison of cracking behavior of nanocrystalline Cu film on substrates of different plastic deformation mechanisms

Nanocrystalline (NC) metallic thin films on metal substrates usually undergo substantial cracking at applied strains of a few percent due to strain concentration at the film/substrate interfaces. In this work, we show that the cracking of a nanocrystalline Cu film can be significantly inhibited by a NiTi substrate. NC Cu films are deposited on 304 stainless steel, Kapton and NiTi substrates, in which plastic deformation occurs via dislocation slip, molecule chain disentanglement and collective lattice shear, respectively. NC Cu film on NiTi substrate starts to show observable cracks at an applied strain of 24%, in contrast to 6% for that on steel and 15% for that on Kapton. Further, the crack density in the film on NiTi substrate is two to three orders lower than the counterparts. The discrepancy is suggested to attribute to the reduced local strain concentration enabled by the uniform lattice shear and high strain hardening of the NiTi substrate.

36 MATERIALS SCIENCE↗

Partitioning of tramp elements Cu and Si in a Ni-based superalloy and their effect on creep properties

An alloy's processing history, including melting, remelting or the choice of stock material, affects its purity and eventually involves tramp element pickup or retention. Herein, variants of a novel Ni-based superalloy were manufactured with different levels of purity. The so-called low purity alloys contained 0.138 wt. % Cu and 0.019 wt. % Si while the Cu and Si levels were below x-ray fluorescence (XRF) detection limits of 0.003 and 0.010 wt. %, respectively, in the high purity ingots. Atom-probe tomography (APT) was carried out and revealed Si partitioning at the following interfaces: grain boundaries, MC carbide/γ, M 3 B 2 boride/$γ$ and M 3 B 2 boride/$γ$'. Copper was found to primarily segregate to the $γ$' precipitates. An average of 2.4 × decrease in creep life and 4.3 × decrease in creep ductility was measured in the low purity alloys, which was attributed to the embrittlement caused by Si segregation to grain boundaries. Furthermore, the positive effect of B on the creep properties was mitigated by the presence of Si. Thermodynamic predictions for the matrix and γ' precipitate compositions represented the trends observed experimentally although the extent of preferential partitioning lacks accuracy. Monte Carlo simulations were performed to describe the partitioning of Cu and Si atoms to either $γ$ or $γ$' phases.

36 MATERIALS SCIENCE↗

Optoelectronic and material properties of solution-processed Earth-abundant Cu 2 BaSn(S, Se) 4 films for solar cell applications

Copper barium thioselenostannate, Cu 2 BaSnS 4-x Se x (CBTSSe), absorbers employ low-toxicity and abundant metals while offering low-cost manufacturing options, controllable stoichiometry and band gap tunability (from 2 eV at x = 0 to 1.55 eV at x = 3). CBTSSe can therefore be considered a prospective candidate for maintaining or improving upon the advantages of already commercialized Cu(In,Ga)(S,Se) 2 (CIGSSe) and CdTe absorbers. Here, we focus on solution-deposited stoichiometric CBTSSe films with band gap of 1.59 eV (x ≈ 3) and explore the fundamental film properties. Temperature- and excitation-dependent photoluminescence studies reveal a dominant defect emission at ~1.5 eV and a second deep defect feature at 1.15 eV. From time-resolved terahertz measurements, we find a charge carrier (electron and hole sum) mobility of ~140 cm 2 /Vs—i.e., comparable to values in CIGSSe or Cu 2 ZnSnS 4-x Se x (CZTSSe)—as well as a two-component minority carrier lifetime. A longer-lived lifetime component (~2 ns) arises from bulk recombination. However, strong recombination at the (bare) surface leads to a ~50 ps lifetime, inferior to state-of-the-art CIGSSe or CZTSSe absorbers. This recombination issue may worsen for CBTSSe/CdS interfaces, due to a cliff-like band alignment with 0.6 eV band offset, as revealed by ultraviolet photoemission spectroscopy. A low number of charge carriers within the absorber further contributes to a high series resistance. Employing these films, we also report the highest performance achieved from solution-processed trigonal CBTSSe thin-film photovoltaic devices, with open circuit voltage, short-circuit current density, fill factor and efficiency of 470 mV, 14.3 mA/cm 2 , 43.6% and 2.9%, respectively. The physical measurements provided on the stoichiometric solution-processed CBTSSe absorber further point to critical areas for future improvement of CBTSSe and related photovoltaic cells in the quest for higher efficiency devices based on earth abundant metals.

14 SOLAR ENERGY↗

Influence of non-magnetic Cu on enhancing the low temperature magnetic properties and Curie temperature of FeCoNiCrCu(x) high entropy alloys

The microstructure and magnetic properties of three face-centered cubic (FCC) FeCoNiCrCu(x) high entropy alloys (HEAs) (x=0, 0.5, 1) are investigated. Interestingly, addition of the nonmagnetic element Cu to FeCoNiCr HEA is found to enhance exchange interactions and low temperature saturation magnetization. The paramagnetic to ferromagnetic Curie transition temperature increases from 85 K for FeCoNiCr to 118 K for FeCoNiCrCu. This is counterintuitive since Cu is nonmagnetic; however, atom probe tomography revealed Cu rich clusters containing 5 at% Ni and 1 at% each of Fe, Co, Cr, within FCC matrix, these clusters altered the matrix composition and consequently its magnetic properties.

Chaudhary, Varun↗

In-situ TEM observation of shear induced microstructure evolution in Cu-Nb alloy

Phase boundaries in multiphase alloys govern defect interaction and chemical intermixing across different phases during plastic deformation. Dynamic interaction of defects with phase boundaries in multiphase alloys, especially for immiscible alloys, has been topic of significant research interest in recent years. In this work, we describe a novel approach for carrying out in-situ TEM shear deformation to directly observe interfacial microstructural evolution of a Cu-Nb alloy. A unique double shear specimen geometry is microfabricated by a focused ion beam technique to apply shear deformation upon push loading inside the TEM. From the real-time observation, we discover that the phase boundary with a zigzag morphology effectively blocks stacking faults nucleated in a Cu grain from slipping into a Nb grain. Meanwhile, the Cu phase bears the most plastic deformation through slip or twinning mechanisms. This work sheds light on understanding the shear deformation and the behavior of phase boundaries in multiphase alloys during shear deformation.

36 MATERIALS SCIENCE↗

Shear deformation of pure-Cu and Cu/Nb nano-laminates using micromechanical testing

Solid phase processing by introducing shear deformation into materials can result in unique microstructure evolution and enhanced mechanical properties, especially for immiscible systems such as Cu/Nb. To better understand the correlation between microstructure and deformation behavior during shear, a dedicated testing design of stress localization at predicted sites is necessary. In this study, a specialized S-shaped specimen geometry is implemented to apply localized simple-shear loading in pure-Cu and Cu/Nb accumulative roll-bonded nanolaminates. The nanoscale microstructure and proximity of interfaces in Cu/Nb offer a ~2.8-fold increase in shear stresses than pure-Cu. In pure-Cu, the plastic instability causes shear banding and an in-plane lattice rotation. In Cu/Nb, a partial bending of the interfaces occurred, resulting in a localized lattice rotation. The adapted geometry for micro-scale specimens thus successfully captures the shear deformation at predicted sites in two distinct material systems and could potentially be a powerful technique to study the deformation mechanisms.

36 MATERIALS SCIENCE↗

Age hardening response of Cu-30Ni alloys: The role of Si microalloying additions

Cu-30Ni alloys offer high strength and excellent corrosion resistance for maritime applications. While primarily a solid solution system, industrial alloys typically include microalloying additions of Fe, Mn, Nb and/or Si to enable age hardening. However, an understanding of the microstructural evolution during age hardening remains incomplete. Here, we conduct systematic ageing treatments and report the resulting hardness and microstructures. The Cu-30Ni alloy with Si aged at 650 °C for 6 h demonstrates significantly enhanced Vickers hardness, reaching ∼201 HV 1 compared to 103 HV 1 for the as-homogenised sample. Si-rich clusters and γ′ precipitates are identified, with their composition, size, and volume fraction quantified to determine their strengthening contributions. First-principles atomistic simulations elucidate the underlying formation mechanisms of these clusters and precipitates, highlighting the critical role of Si in driving their nucleation and growth. This study advances the design of high-strength, Cu alloys with the potential for corrosion resistance in demanding maritime environments.

Age hardening↗

To grind or not to grind? The influence of mechanical and thermal treatments on the $\mathrm{Cu/Zn}$ disorder in $\mathrm{Cu}$ 2 $\mathrm{ZnSn}$($\mathrm{S}$ x $\mathrm{Se}$ 1-x ) 4 monograins

We report that Kesterite-type based thin film solar cell technologies are mainly based on polycrystalline absorber layers. A promising low cost alternative technology uses Cu 2 ZnSn(S x Se 1-x ) 4 (CZTSSe) monograins (single crystals of 20–100 μm size) which are fixed in a polymer matrix to form a flexible solar cell. The Cu/Zn disorder is discussed as a possible reason for band tailing causing voltage losses limiting the efficiency of CZTSSe-based devices. The experimental determination of the order parameter Q which is a quantitative measure of Cu/Zn disorder, requires a differentiation between the isoelectronic cations Cu + and Zn 2+ . An in-depth analysis of neutron diffraction data allows the determination of type and concentration of intrinsic point defects including a distinction between Cu and Zn. Neutron diffraction requires large sample volumes, thus monograins offer the unique possibility to correlate structural disorder in CZTSSe with device performance parameters. In this study we tackle the influence of grinding the monograins on stoichiometry deviations, the Cu/Zn disorder as well as intrinsic point defects and optoelectronic properties of CZTSSe monograins. Moreover, an easy methodology based on Raman scattering spectroscopy is proposed for the assessment of Cu/Zn disorder in the CZTSSe compounds.

14 SOLAR ENERGY↗

Adsorbate-induced adatom formation on Au-Cu bimetallic alloys and its possible consequences for CO 2 electroreduction

The adsorbate-induced formation of sub-nanometer clusters on transition-metal single crystals observed in previous high-pressure microscopic studies hinted at the in-situ formation of unique active sites even on large nanoparticle catalysts. We propose that the adatom formation energy can be used as an energetic descriptor for the initial step toward the adsorbate-induced metal-cluster formation process. This descriptor can be efficiently computed using density functional theory (DFT) calculations and applied for screening and identification of metal catalysts where this phenomenon may play an important role in generating active sites in-situ. As a proof of concept, here, we construct an adatom formation energy database for three Au x Cu y alloys (x:y = 3:1, 1:1, or 1:3) and eighteen adsorbates (H, C, N, O, F, S, Cl, Br, I, CH x , NH x (x = 1 – 3), CO, NO, and OH) commonly involved in catalytic reactions. The energetics of adatom formation were examined in all cases where the (111) terrace, (211) step-edge, and (874) kink were the sources of the adatom. We demonstrate that the presence of an adsorbate could alter not only the energetics for adatom formation but also the elemental nature of the preferred adatom being formed. Using our database, we identified promising systems which favor adsorbate-induced adatom formation under near-ambient conditions. Specifically, CO-induced adatom formation on all three Au-Cu alloy surfaces could occur under CO 2 electroreduction (CO 2 RR) conditions. This phenomenon offers a qualitative explanation for the experimentally observed CO 2 RR activity on Au-Cu alloy catalysts. As a result, our methodology offers an easily expandable and efficient approach for large-scale catalyst screening with regards to adatom/cluster formation under reaction conditions and provides insight into the possible nature of active sites on alloy catalysts from a novel perspective.

Active site↗

High-throughput multimodal exploration of a nanocrystalline Cu-Ag library

Sputter-deposited, nanocrystalline Cu-Ag thin films produced across a broad compositional and deposition-parameter space were evaluated to unravel the process-structure-property relationships important for creating hard, conductive electrical contacts and coatings. Combinatorial deposition involving pulsed direct current magnetron sputtering of elemental targets enabled swift examination of nearly the full range of alloy compositions and a relevant portion of deposition atomistics. Several high-throughput characterization modalities were employed to evaluate the chemistry, structure, and properties of the films. The resultant hardness, modulus, film density, crystal texture, and resistivity were analyzed in terms of key deposition characteristics (incident atom kinetic energy and incidence angle) predicted by binary-collision, kinematic Monte Carlo simulations. The study revealed improved hardness, parabolic resistivity dependence on composition, and compositional and process dependencies of film tarnishing. The results are discussed in the context of variations in microstructure and film density. Transmission electron microscopy and X-ray diffraction demonstrate several forms of compositional variation including solute segregation to grain boundaries as well as periodic, intragranular compositional modulations. Annealing of a Cu-rich alloy film exhibiting grain boundary segregation showed that this as-deposited, compositional variation is not stable above 100 °C. Finally, the Cu-Ag system is shown to have potential for hard, conductive, tarnish-resistant and room temperature-stable nanocrystalline thin films across the composition space.

36 MATERIALS SCIENCE↗

Steric and Electronic Influence of Excited-State Decay in Cu(I) MLCT Chromophores

For the past eleven years, a dedicated effort in our research group focused on fundamentally advancing the photophysical properties of cuprous bis-phenanthroline-based metal-to-ligand charge transfer (MLCT) excited states. We rationalized that by gaining control over the numerous factors limiting the more widespread use of Cu I MLCT photosensitizers, they would be readily adopted in numerous light-activated applications given the earth-abundance of copper and the extensive library of 1,10-phenanthrolines developed over the last century. Significant progress has been achieved by recognizing valuable structure-property concepts developed by other researchers in tandem with detailed ultrafast and conventional time-scale investigations, in-silico-inspired molecular designs to predict spectroscopic properties, and applying novel synthetic methodologies. Ultimately, we achieved a plateau in exerting cooperative steric influence to control Cu I MLCT excited state decay. This led to combining sterics with π-conjugation and/or inductive electronic effects to further exert control over molecular photophysical properties. The lessons gleaned from our studies of homoleptic complexes were recently extended to heteroleptic bis(phenanthrolines) featuring enhanced visible light absorption properties and long-lived room-temperature photoluminescence. Furthermore, this Account navigates the reader through our intellectual journey of decision-making, molecular and experimental design, and data interpretation in parallel with appropriate background information related to the quantitative characterization of molecular photophysics using Cu I MLCT chromophores as prototypical examples.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Homologous Alkali Metal Copper Rare-Earth Chalcogenides A 2 Cu 2 n Ln 4 Q 7+ n ( n = 1, 2, 3)

Twenty-seven new members of the A 2 Cu 2n Ln 4 Q 7+n (A = Cs, Rb; Ln = La-Nd, Sm, Gd-Yb; Q = S, Se) homologous series were synthesized in one of three structural types (indicated by n = 1, 2, 3). All the compounds contained 3D frameworks with alkali-metal-containing tunnels. For each increment in n, one Cu 2 Q was added, which was incorporated into the framework as an edge-sharing tetrahedron by replacing a square planar chalcogenide site. High-throughput DFT calculations predicted many of the phases to be thermodynamically stable. These predictions were compared with the synthesis results for the phases formed in each composition space. In the syntheses, heavier lanthanides showed a preference to start forming the n = 3 ACu 3 Ln 2 Q 5 , which is consistent with the predictions. RbCuNd 2 Se 4 and RbCuTb 2 Se 4 were found to be thermally stable under vacuum at temperatures up to 1000 °C. Optical measurements revealed band gaps of 1.55(5) and 1.62(5) eV for CsCuCe 2 Se 4 and RbCuTb 2 Se 4 , respectively, and a work function of 4.83(5) eV for CsCuPr 2 Se 4 . Additionally, some n = 3 ACu 3 Ln 2 Qs compounds exhibit a negative phonon mode because of a copper atom coordination, which may distort to a trigonal planar geometry at sufficiently low temperatures. The dynamic instabilities and the predicted distortion in the copper tetrahedra for the n = 3 ACu 3 Ln 2 Q 5 compounds were found to have a linear relationship with the atomic number of the lanthanides and the electronegativity of the lanthanides. In conclusion, the A 2 Cu 2 n Ln 4 Q 7+n compounds can potentially find application as high-temperature thermoelectric materials and other semiconductors.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗