Atomic-Scale Mapping and Quantification of Local Ruddlesden–Popper Phase Variations
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As part of the Galilean Satellites Mappers Program, the South Polar region of Io was studied. Examination of the Voyager images had led to reassessment of the possible mechanisms by which certain units were created or modified in this area. Specifically, analyses have focused on determining the relative age of the mountain material and on the process by which the layered plains material was eroded.
Present and future technologies to facilitate lunar composition and resource assessment with applications to lunar surface construction are presented. We are particularly interested in the construction activity associated with lunar-based astronomy. We address, as an example, the use of ground-probing radar to help assess subsurface conditions at sites for observatories and other facilities.
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Many different spacecraft materials were flown as part of the Materials on International Space Station Experiment (MISSE). MISSE was exposed to the low Earth orbital environment of atomic oxygen, ultraviolet radiation, thermal cycling, and hard vacuum. A number of polymer samples did not survive the atomic oxygen attack. Mass and thickness loss measurements indicate the durability of the remaining polymeric materials to withstand the space environment. Results from the one-year exposure on MISSE-3 and MISSE-4 are compared to those from the four-year exposure on MISSE-1 and MISSE-2. Solar absorptance and infrared emittance measurements are given for thermal control materials. Transmission measurements are given where appropriate. A wide variety of polymeric materials were flown on MISSE, ranging from extremely thin films for solar sails to bulk materials. Some of the candidate solar sail materials were flown underneath magnesium fluoride windows to eliminate atomic oxygen effects and allow the study of ultraviolet radiation damage. Exposed seal materials include Viton , silicone, and fluorosilicone. Multi-layer insulation materials were flown, including atomic oxygen-resistant polymers. Also flown were candidate inflatable materials for a High Altitude Airship or inflatable lunar habitat. Polymer materials being flown on MISSE-6 are discussed.
Further described herein are extensions to the basic concept of LHs as electrode materials, include both new materials for use with LHs and higher order poly-layer hydroxides (PLHs) as well as methods for synthesizing improved LH material such as with conductive supports or through the use of cross-linking. Finally, also described herein are embodiments enabling the use of LHs as flow electrodes as well as the use of 2-d LH materials for surface redox reactions.
Advances in semiconductor device manufacturing are limited by our ability to precisely add and remove thin layers of material in multistep fabrication processes. Recent reports on atomic layer etching (ALE) have provided the means for the precise removal of inorganic thin films deposited by atomic layer deposition (ALD), opening new avenues for nanoscale device design. Here, we report on a new technique for the precise removal of metal organic thin films deposited by molecular layer deposition (MLD), which we term molecular layer etching. This etching process employs sequential exposures of lithium organic salt (LOS) and trimethylaluminum (TMA) precursors to produce self-limiting etching behavior. We employ quartz crystal microbalance experiments to demonstrate (i) etching of alucone films preloaded with LOS upon TMA exposures and (ii) layer-by-layer etching of alucone films using alternating exposures of LOS and TMA. We also identify the selectivity of these etching mechanisms. We probe the mechanism for the layer-by-layer etching of alucone using a quartz crystal microbalance and Fourier transform infrared spectroscopy and identify that the etching proceeds via heterolytic cleaving of Al-O bonds in alucone upon LOS exposure followed by methylation to produce volatile species upon TMA exposure. The etching process results in the removal of 0.4 nm/cycle of alucone at 160 °C and up to 3.6 nm/cycle of alucone at 266 °C in ex situ etching experiments on silicon wafers. This halogen-free etching process enables etching of MLD films and provides new fabrication pathways for the control of material geometries at the nanoscale.
Integrated damping mechanics for composite laminates with constrained interlaminar layers of polymer damping materials are developed. Discrete layer damping mechanics are presented for composite materials with damping layers, in connection with a semi-analytical method for predicting the modal damping in simply-supported specialty composite plates. Several application cases are used to demonstrate the advantages of the method. Damping predictions for graphite-epoxy composite plates of various laminations demonstrate the potential for higher damping than geometrically equivalent aluminum plates. The effects of aspect ratio, damping layer thickness, and fiber volume ratio on static and dynamic characteristics of the composite plate are also investigated.
Isotropic and anisotropic motions and molecular states of pyridine-d 5 , adsorbed on the surface within the pores of a layered Sn(IV) phosphonate–phosphate material (1) have been characterized thermodynamically and kinetically by solid-state NMR. The data obtained provide formulation of macrostructure and shapes of pores in 1.
Electronic identification devices containing radio-frequency identification (RFID) circuits and antennas would be fabricated integrally with the objects to be identified, according to a proposal. That is to say, the objects to be identified would serve as substrates for the deposition and patterning of the materials of the devices used to identify them, and each identification device would be bonded to the identified object at the molecular level. Vacuum arc vapor deposition (VAVD) is the NASA derived process for depositing layers of material on the substrate. This proposal stands in contrast to the current practice of fabricating RFID and/or memory devices as wafer-based, self-contained integrated-circuit chips that are subsequently embedded in or attached to plastic cards to make smart account-information cards and identification badges. If one relies on such a chip to store data on the history of an object to be tracked and the chip falls off or out of the object, then one loses both the historical data and the means to track the object and verify its identity electronically. Also, in contrast is the manufacturing philosophy in use today to make many memory devices. Today s methods involve many subtractive processes such as etching. This proposal only uses additive methods, building RFID and memory devices from the substrate up in thin layers. VAVD is capable of spraying silicon, copper, and other materials commonly used in electronic devices. The VAVD process sprays most metals and some ceramics. The material being sprayed has a very strong bond with the substrate, whether that substrate is metal, ceramic, or even wood, rock, glass, PVC, or paper. An object to be tagged with an identification device according to the proposal must be compatible with a vacuum deposition process. Temperature is seldom an issue as the substrate rarely reaches 150 F (66 C) during the deposition process. A portion of the surface of the object would be designated as a substrate for the deposition of the device. By use of a vacuum arc vapor deposition apparatus, a thin electrically insulating film would first be deposited on the substrate. Subsequent layers of materials would then be deposited and patterned by use of known integrated-circuit fabrication techniques. The total thickness of the deposited layers could be much less than the 100- m thickness of the thinnest state-of-the-art self-contained microchips. Such a thin deposit could be readily concealed by simply painting over it. Both large vacuum chambers for production runs and portable hand-held devices for in situ applications are available.
Most general aviation aircraft utilize single layer plexiglas material for the windshield and side windows. Adding noise control treatments to transparent panels is a challenging problem. In this paper, damped plexiglas windows are evaluated for replacement of conventional windows in general aviation aircraft to reduce the structure-borne and airborne noise transmitted into the interior. In contrast to conventional solid windows, the damped plexiglas window panels are fabricated using two or three layers of plexiglas with transparent viscoelastic damping material sandwiched between the layers. Results from acoustic tests conducted in the NASA Langley Structural Acoustic Loads and Transmission (SALT) facility are used to compare different designs of the damped plexiglas panels with solid windows of the same nominal thickness. Comparisons of the solid and damped plexiglas panels show reductions in the radiated sound power of up to 8 dB at low frequency resonances and as large as 4.5 dB over a 4000 Hz bandwidth. The weight of the viscoelastic treatment was approximately 1% of the panel mass. Preliminary FEM/BEM modeling shows good agreement with experimental results for radiated sound power.
Surveyor III soft-landed on the Moon at 00:04 GMT on April 20, 1967. Data obtained have significantly increased our knowledge of the Moon. The Surveyor III spacecraft was similar to Surveyor I; the only major change in scientific instrumentation was the addition of a soil mechanics surface sampler. Surveyor III results at this preliminary evaluation of data give valuable information about the relation between the surface skin of under-dense material responsible for the photometric properties and the deeper layers of material whose properties resemble those of ordinary terrestrial soils. In addition, they provide new insight into the relation between the general lunar surface as seen by Surveyor I and the interior of a large subdued crater. The new results have also contributed to our understanding of the mechanism of downhill transport. Many critical questions cannot, however, be answered until final reduction of experimental data.
Inkjet printing is a common commercial process. In addition to the familiar use in printing documents from computers, it is also used in some industrial applications. For example, wire manufacturers are required by law to print the wire type, gauge, and safety information on the exterior of each foot of manufactured wire, and this is typically done with inkjet or laser printers. The goal of this work was the creation of conductive inks that can be applied to a wire or flexible substrates via inkjet printing methods. The use of inkjet printing technology to print conductive inks has been in testing for several years. While researchers have been able to get the printing system to mechanically work, the application of conductive inks on substrates has not consistently produced adequate low resistances in the kilohm range. Conductive materials can be applied using a printer in single or multiple passes onto a substrate including textiles, polymer films, and paper. The conductive materials are composed of electrical conductors such as carbon nanotubes (including functionalized carbon nanotubes and metal-coated carbon nanotubes); graphene, a polycyclic aromatic hydrocarbon (e.g., pentacene and bisperipentacene); metal nanoparticles; inherently conductive polymers (ICP); and combinations thereof. Once the conductive materials are applied, the materials are dried and sintered to form adherent conductive materials on the substrate. For certain formulations, increased conductivity can be achieved by printing on substrates supported by low levels of magnetic field alignment. The adherent conductive materials can be used in applications such as damage detection, dust particle removal, smart coating systems, and flexible electronic circuitry. By applying alternating layers of different electrical conductors to form a layered composite material, a single homogeneous layer can be produced with improved electrical properties. It is believed that patterning alternate layers of different conductors may improve electrical pathways through alignment of the conductors and band gap optimization. One feature of this innovation is that flexible conductive traces could be accomplished with a conductive ink having a surface resistivity of less than 10 ohms/square. Another result was that a composite material comprising a mixture of carbon nanotubes and metallic nanoparticles could be applied by inkjet printing to flexible substrates, and the resulting applied material was one to two orders of magnitude more conductive than a material made by printing inks containing carbon nanotubes alone.
The present disclosure relates to a passivating contact that includes a dielectric layer constructed of a first material, an intervening layer constructed of a second material, and a substrate constructed of a semiconductor, where the dielectric layer is positioned between the substrate and the intervening layer, the dielectric layer has a first thickness, and the substrate has a second thickness. The passivating contact also includes a plurality of conductive pathways that include the second material and pass through the first thickness, the second material penetrates into the second thickness forming a plurality of penetrating regions within the substrate, and the plurality of conductive pathways are configured to allow current to pass through the first thickness.
There is disclosed ultrathin film material templating layers that force the morphology of subsequently grown electrically active thin films have been found to increase the performance of small molecule organic photovoltaic (OPV) cells. There is disclosed electron-transporting material, such as hexaazatriphenylene-hexacarbonitrile (HAT-CN) can be used as a templating material that forces donor materials, such as copper phthalocyanine (CuPc) to assume a vertical-standing morphology when deposited onto its surface on an electrode, such as an indium tin oxide (ITO) electrode. It has been shown that for a device with HAT-CN as the templating buffer layer, the fill factor and short circuit current of CuPc:C60 OPVs were both improved compared with cells lacking the HAT-CN template. This is explained by the reduction of the series resistance due to the improved crystallinity of CuPc grown onto the ITO surface.
Systems and methods for forming a magnetically-enabled part via additive manufacturing. The method includes depositing a layer of additive manufacturing material on a build plate, melting or sintering the layer of additive manufacturing material, depositing additional layers of additive manufacturing material on previous layers of additive manufacturing material, the additive manufacturing material of at least some of the additional layers being magnetically permeable, and melting or sintering the additional layers of additive manufacturing material such that the magnetically-enabled part has a transition region including at least some of the magnetically permeable additive manufacturing material.
Systems and methods for forming a magnetically-enabled part via additive manufacturing. The method includes depositing a layer of additive manufacturing material on a build plate, melting or sintering the layer of additive manufacturing material, depositing additional layers of additive manufacturing material on previous layers of additive manufacturing material, the additive manufacturing material of at least some of the additional layers being magnetically permeable, and melting or sintering the additional layers of additive manufacturing material such that the magnetically-enabled part has a transition region including at least some of the magnetically permeable additive manufacturing material.