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At least 577 records · Page 32

Bonding similarities and differences between Y–Sb–Te and Sc–Sb–Te phase-change memory materials

The scandium (Sc) – alloyed Sb 2 Te 3 phase-change alloy has recently been found to enable ultrafast crystal nucleation due to the formation of Sc-stabilized octahedral motifs in the amorphous phase, rendering cache-type phase-change memory feasible. When yttrium (Y) is added, however, non-octahedral bonding patterns form in the amorphous Sb 2 Te 3 -based network even though Y has a valence electron configuration similar to that of Sc and also forms perfect octahedral bonding environments with tellurium in the YTe crystal. Here we elucidate the origin of this difference between Sc and Y, by carrying out thorough ab initio simulations and orbital-based bonding analyses on amorphous Y–Sb–Te and Sc–Sb–Te compounds. We also demonstrate how the smooth overlap of atomic positions (SOAP) similarity kernel can be used to quantify the structural similarity of local motifs in the amorphous phase with respect to various crystalline yttrium and scandium tellurides, both in the nearest-neighbor shell and beyond. We discover that the bonding contrast of Y- and Sc-centered structural motifs in amorphous Sb 2 Te 3 stems from their parent crystals at high Te concentrations. The larger atomic radius of Y and the weaker charge transfer when bonded with Te is found to allow more Te neighbors and cause a more open bonding environment, leading to higher coordination numbers and non-octahedral environments. We discuss the implications of the different local environments for practical applications in memory devices.

36 MATERIALS SCIENCE↗

Dynamic metal-linker bonds in metal–organic frameworks

Metal-linker bonds serve as the “glue” that binds metal ions to multitopic organic ligands in the porous materials known as metal–organic frameworks (MOFs). Despite ample evidence of bond lability in molecular and polymeric coordination compounds, the metal-linker bonds of MOFs were long assumed to be rigid and static. Given the importance of ligand fields in determining the behaviour of metal species, labile bonding in MOFs would help explain outstanding questions about MOF behaviour, while providing a design tool for controlling dynamic and stimuli-responsive optoelectronic, magnetic, catalytic, and mechanical phenomena. Here, in this work, we present emerging evidence that MOF metal-linker bonds exist in dynamic equilibria between weakly and tightly bond conformations, and that these equilibria respond to guest–host chemistry, drive phase change behavior, and exhibit size-dependence in MOF nanoparticles.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Effect of RF power and annealing on chemical bonding and morphology of a-CN{sub x} thin films as humidity sensor

Amorphous carbon nitride (a-CN{sub x}) thin films were deposited using radio frequency plasma enhanced chemical vapor deposition (rf-PECVD) technique. A set of a-CN{sub x} thin films were prepared using pure methane (CH{sub 4}) gas diluted with nitrogen (N{sub 2}) gas. The rf power was varied at 50, 60, 70, 80, 90 and 100 W. These films were then annealed at 400 °C in a quartz tube furnace in argon (Ar) gas. The effects of rf power and thermal annealing on the chemical bonding and morphology of these samples were studied. Surface profilometer was used to measure film thickness. Fourier transform infra-red spectroscopy (FTIR) and Field emission scanning electron microscopy (FESEM) measurements were used to determine their chemical bonding and morphology respectively. The deposition rate of the films increased constantly with increasing rf power up to 80W, before decreasing with further increase in rf power. Fourier transform infra-red spectroscopy (FTIR) studies showed a systematic change in the spectra and revealed three main peaks included C-N, C=N, C=C and C≡N triple bond. C=N and C≡N bonds decreased with increased C-N bonds after thermal annealing process. The FESEM images showed that the structure is porous for as-deposited and covered by granule-like grain structure after thermal annealing process was done. The resistance of the a-CN{sub x} thin film changed from 23.765 kΩ to 5.845 kΩ in the relative humidity range of 5 to 92 % and the film shows a good response and repeatability as a humidity sensing materials. This work showed that rf power and thermal annealing has significant effects on the chemical bonding and surface morphology of the a-CN{sub x} films and but yield films which are potential candidate as humidity sensor device.

36 MATERIALS SCIENCE↗

Unconventional hydrogen bonding to organic ions in the gas phase: Stepwise association of hydrogen cyanide with the pyridine and pyrimidine radical cations and protonated pyridine

Equilibrium thermochemical measurements using the ion mobility drift cell technique have been utilized to investigate the binding energies and entropy changes for the stepwise association of HCN molecules with the pyridine and pyrimidine radical cations forming the C{sub 5}H{sub 5}N{sup +·}(HCN){sub n} and C{sub 4}H{sub 4}N{sub 2}{sup +·}(HCN){sub n} clusters, respectively, with n = 1–4. For comparison, the binding of 1–4 HCN molecules to the protonated pyridine C{sub 5}H{sub 5}NH{sup +}(HCN){sub n} has also been investigated. The binding energies of HCN to the pyridine and pyrimidine radical cations are nearly equal (11.4 and 12.0 kcal/mol, respectively) but weaker than the HCN binding to the protonated pyridine (14.0 kcal/mol). The pyridine and pyrimidine radical cations form unconventional carbon-based ionic hydrogen bonds with HCN (CH{sup δ+}⋯NCH). Protonated pyridine forms a stronger ionic hydrogen bond with HCN (NH{sup +}⋯NCH) which can be extended to a linear chain with the clustering of additional HCN molecules (NH{sup +}⋯NCH··NCH⋯NCH) leading to a rapid decrease in the bond strength as the length of the chain increases. The lowest energy structures of the pyridine and pyrimidine radical cation clusters containing 3-4 HCN molecules show a strong tendency for the internal solvation of the radical cation by the HCN molecules where bifurcated structures involving multiple hydrogen bonding sites with the ring hydrogen atoms are formed. The unconventional H-bonds (CH{sup δ+}⋯NCH) formed between the pyridine or the pyrimidine radical cations and HCN molecules (11–12 kcal/mol) are stronger than the similar (CH{sup δ+}⋯NCH) bonds formed between the benzene radical cation and HCN molecules (9 kcal/mol) indicating that the CH{sup δ+} centers in the pyridine and pyrimidine radical cations have more effective charges than in the benzene radical cation.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Graphene-like conjugated π bond system in Pb{sub 1−x}Sn{sub x}Se

Following the identification of the π bond in graphene, in this work, a π bond constructed through side-to-side overlap of half-filled 6p{sub z} orbitals was observed in a non-carbon crystal of Pb{sub 1–x}Sn{sub x}Se (x ∼ 0.34) (PSS), a prototype topological crystalline insulator and thermoelectric material with a high figure-of-merit. PSS compounds with a rock-salt type cubic crystal structure were found to consist of σ bond connected covalent chains of Pb(Sn)-Se with an additional π bond that is shared as a conjugated system among the four nearest neighbor Pb pairs in square symmetry within all (001) monoatomic layers per cubic unit cell. The π bond formed with half-filled 6p{sub z} orbitals between Pb atoms is consistent with the calculated results from quantum chemistry. The presence of π bonds was identified and verified with electron energy-loss spectroscopy through plasmonic excitations and electron density mapping via an inverse Fourier transform of X-ray diffraction.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Physical mechanisms of copper-copper wafer bonding

The study of the physical mechanisms driving Cu-Cu wafer bonding allowed for reducing the bonding temperatures below 200 °C. Metal thermo-compression Cu-Cu wafer bonding results obtained at such low temperatures are very encouraging and suggest that the process is possible even at room temperature if some boundary conditions are fulfilled. Sputtered (PVD) and electroplated Cu thin layers were investigated, and the analysis of both metallization techniques demonstrated the importance of decreasing Cu surface roughness. For an equal surface roughness, the bonding temperature of PVD Cu wafers could be even further reduced due to the favorable microstructure. Their smaller grain size enhances the length of the grain boundaries (observed on the surface prior bonding), acting as efficient mass transfer channels across the interface, and hence the grains are able to grow over the initial bonding interface. Due to the higher concentration of random high-angle grain boundaries, this effect is intensified. The model presented is explaining the microstructural changes based on atomic migration, taking into account that the reduction of the grain boundary area is the major driving force to reduce the Gibbs free energy, and predicts the subsequent microstructure evolution (grain growth) during thermal annealing.

36 MATERIALS SCIENCE↗

Mechanisms of formation of chemical bonding and defect formation at the a-SiO 2 /BaTiO 3 interfaces

The structure and mechanisms of bonding and defect formation at the interfaces between amorphous silica (a-SiO2) and BaTiO3(0 0 1) were investigated using ab initio molecular dynamics. It was found that the nature of interfacial bonds crucially depends on the BaTiO3 surface termination. In particular, the interface between silica and TiO2-terminated BaTiO3 (BTO) slab is characterised by strong covalent Ti–O–Si bonds, while the interface between silica and BaO-terminated BTO demonstrates ionic character of interfacial bonds and exhibits bond instability. In both cases, the dynamics of oxygen species at oxide interfaces is a driving force of the formation of interfacial bonds and defects.

defects↗

Nature of Interatomic Bonding in Controlling the Mechanical Properties of Calcium Silicate Hydrates

Calcium silicate hydrate (C–S–H) is the most important phase of hydrated cement gel which is the key material in construction industry. It is well accepted that hardened cement paste consists of either poorly crystalline or completely disordered phases. Although a myriad of speculative atomistic models of disordered C–S–H have been proposed, the fundamental basis of structure–property relationships remain elusive. This study focuses upon the correlations between mechanical properties and electronic structure based on well‐defined quantum mechanical parameters. We use 20 CSH minerals with known structure to gain fundamental understanding of structure–property relationship. The results indicate Si–O bond order density, which represents the cumulative bond strength of SiO bonds, has no direct correlation with bulk mechanical properties which is counterintuitive and against conventional wisdom. The variations are determined more precisely by the overall atomic and electronic structure dictated by bond order density of the Ca–O and hydrogen bonds ( HB ). Most importantly, there is a multifaceted balance between different types of interatomic bonds including the HB s in controlling mechanical properties. HB s categorized in relation to next nearest neighbor ( NNN ) enable us to identify specific types of HB s that are prevalent in CSH . In certain crystals such as suolunite, the HB network is organized in such a unique way that enhances its mechanical properties. The approach and findings presented in this paper points to a broad roadmap for the developing next‐generation cements.

Dharmawardhana, Chamila↗

Diffusion bonding of IN 718 to VM 350 grade maraging steel

Diffusion bonding studies have been conducted on IN 718, VM 350 and the dissimilar alloy couple, IN 718 to maraging steel. The experimental processing parameters critical to obtaining consistently good diffusion bonds between IN 718 and VM 350 were determined. Interrelationships between temperature, pressure and surface preparation were explored for short bending intervals under vacuum conditions. Successful joining was achieved for a range of bonding cycle temperatures, pressures and surface preparations. The strength of the weaker parent material was used as a criterion for a successful tensile test of the heat treated bond. Studies of VM-350/VM-350 couples in the as-bonded condition showed a greater yielding and failure outside the bond region.

Crosby, S. R.↗

LARC-13 polyimide adhesive bonding

The development of an addition-curing polyimide adhesive suitable for low pressure bonding without the generation of volatiles during cure is reported. LARC-13 is designed for bonding of polyimide matrix composites and of titanium to be used above 500 F, and is based on an oligomeric bis-nadimide which allows its processing at 50 psi or less, making it suitable for the bonding of fragile honeycomb sandwich structures. Few volatiles are evolved during its cure allowing large enclosed structures to be bonded, and it has high room and elevated temperature strengths and good strength retention after short terms up to 1100 F. LARC-13 was successfully used to bond the outer and inner skins of a polyimide/graphite wing shear panel for 500 F use, and for a short-term exposure up to 1100 F. Preparation of the adhesive, bonding, aging, and testing of lap shear and honeycomb samples are discussed.

Saint Clair, T. L.↗

Fatigue behavior of adhesively bonded joints

The fatigue damage mechanism of composite to composite adhesively bonded joints was characterized. The mechanics of the possible modes of fatigue damage propagation in these joints when subjected to constant amplitude cyclic mechanical loading were investigated. The possible failure modes in composite bonded joints may be cyclic debonding (i.e., progressive separation of the adhesive), interlaminar damage (delamination), adherend fatigue or a combination of these. Two composite systems - graphite/epoxy adhesively bonded to graphite/epoxy and Kevlar 49/epoxy adhesively bonded to Kevlar 49/epoxy were investigated. Both composite systems consisted of quasi-isotropic lay-ups, i.e., 0 deg/-45 deg/+45 deg/90 degs. The two adhesives, employed in the study were (1) EC 3445 with cure temperature of 250 F for secondary bonding and (2) FM 300 with cure temperature of 350 F for co-cure bonding.

Mall, S.↗

Cyclic debonding of adhesively bonded composites

To analyze the fatigue behavior of a simple composite-to-composite bonded joint, a combined experimental and analytical study of the cracked-lap-shear specimen subjected to constant-amplitude cyclic loading was undertaken. Two bonded systems were studied: T300/5208 graphite/epoxy adherends bonded with adhesives EC 3445 and with FM-300. For each bonded system, two specimen geometries were tested: (1) a strap adherend of 16 plies bonded to a lap adherend of 8 plies, and (2) a strap adherend of 8 plies bonded to a lap adherend of 16 plies. In all specimens tested, the fatigue failure was in the form of cyclic debonding with some 0 deg fiber pull-off from the strap adherend. The debond always grew in the region of adhesive that had the highest mode I (peel) loading and that region was close to the adhesive-strap interface. Furthermore, the measured cyclic debond growth rates correlated well with total strain energy release rates G(T) as well as with its components G(I) (peel) and G(II) (shear) for the mixed-mode loading in the present study.

Mall, S.↗

Rapid adhesive bonding concepts for specimen and panel fabrication and field repair

The NASA Langley Research Center has developed bonding concepts for aerospace composite materials which employ induction heating to directly apply heat to the bond line and/or adherends without simultaneously heating the entire structure, supports, and fixtures of a bonding assembly. These methods have demonstrated bonding process time reductions of two to three orders of magnitude, by comparison with conventional press molding. Attention is presently given to rapid adhesive bonding for lap shear specimens for aerospace panel bonding or field repair, as well as for the field repair requirements of metallic and advanced polymeric matrix composite structures.

Stein, B. A.↗

Effects of partial interlaminar bonding on impact resistance and loaded-hole behavior of graphite/epoxy quasi-isotropic laminates

A partial-bonding interlaminar toughening concept was evaluated for resistance to impact and for behavior of a loaded hole. Perforated Mylar sheets were interleaved between all 24 plies of a graphite/epoxy quasi-isotropic lay-up. Specimens were impacted by aluminum spheres while under tensile or compressive loads. Impact-failure thresholds and residual strengths were obtained. Loaded-hole specimens were tested in three configurations that were critical in bearing, shear, or tension. Partial bonding reduced the tensile and compressive strengths of undamaged specimens by about one-third. For impact, partial bonding did not change the threshold for impact failure under tensile preload. However, under compressive preload, partial bonding caused serious degradation of impact resistance. Partial bonding reduced the maximum load-carrying capacity of all three types of loaded-hole specimens. Overall, partial bonding degraded both impact resistance and bearing strength of holes.

Illg, W.↗

Ultrasonic study of adhesive bond quality at a steel-to-rubber interface by using quadrature phase detection techniques

The quadrature phase detection technique was used to simultaneously monitor the phase and amplitude of a toneburst signal normally reflected from an adhesively bonded steel-to-rubber interface. The measured phase was found to show a positive shift for all bonded samples with respect to the disbonded state - the phase shift being larger for samples with weaker bonds, as manifested by smaller values of applied tensile loads at failure. A model calculation, which incorporates the concept of interfacial strength into the usual problem of wave propagation in multilayered media, was used to deduce a bond-quality parameter from an experimentally measured phase shift. This bond-quality parameter was found to be correlated with the tensile strength of the adhesive bonds at failure loads.

Smith, A. C.↗

Rapid induction bonding of composites, plastics, and metals

The Toroid Bonding Gun is and induction heating device. It is a self contained, portable, low powered induction welding system developed for bonding or joining plastic, ceramic, or metallic parts. Structures can be bonded in a factory or in a the field. This type of equipment allows for applying heat directly to the bond lines and/or to the adhesives without heating the entire structure, supports, and fixtures of a bonding assembly. The induction heating gun originally developed for use in the fabrication of space Gangs of bonders are now used to rapidly join composite sheet and structural components. Other NASA-developed applications of this bonding technique include the joining of thermoplastic composites, thermosetting composites, metals, and combinations of these materials.

Buckley, John D.↗

Ceramic susceptor for induction bonding of metals, ceramics, and plastics

A thin (.005) flexible ceramic susceptor (carbon) was discovered. It was developed to join ceramics, plastics, metals, and combinations of these materials using a unique induction heating process. Bonding times for laboratory specimens comparing state of the art technology to induction bonding were cut by a factor of 10 to 100 times. This novel type of carbon susceptor allows for applying heat directly and only to the bondline without heating the entire structure, supports, and fixtures of a bonding assembly. The ceramic (carbon film) susceptor produces molten adhesive or matrix material at the bond interface. This molten material flows through the perforated susceptor producing a fusion between the two parts to be joined, which in many instances has proven to be stronger than the parent material. Bonding can be accomplished in 2 minutes on areas submitted to the inductive heating. Because a carbon susceptor is used in bonding carbon fiber reinforced plastics and ceramics, there is no radar signature or return making it an ideal process for joining advanced aerospace composite structures.

Fox, Robert L.↗

A low-cost solar-cell front contact using trapped silver mesh and electrostatic bonding

A new system to provide a contact with a silver mesh trapped between the cell and an encapsulating glass cover is described. Borosilicate glass is joined to the cell by electrostatic bonding during which the glass is deformed around the silver mesh to form a permanent optically coupled integral bond to the cell. The hermetic seal prevents the silver from oxidizing and destroying the electrical contact formed during the bonding process. It is demonstrated that electrostatic glass/silicon bonds have excellent stability under a variety of accelerated environmental tests. Electrostatic bonds to thin films of AL2O3, Ta2O5, and ZrO2 on glass can be used to make antireflective coatings for solar cells manufactured by this process. Test solar cells were manufactured by electrostatic bonding with good curve fill factors and efficiencies of 10 percent.

Landis, Geoffrey A.↗