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At least 577 records · Page 32

Electrochemical oxygen concentrator as an oxygen compressor

A solid polymer electrolyte (SPE) oxygen compressor is described which generates pressures of 3000 psi. The SPE is a cation exchange membrane with chemical compatibility, and has the capability of withstanding 5000 psi. Other features of the compressor described include: gasketless sealing, porus plate cell supports, and conductive cooling. Results are presented of a computer program which defines the power of the system as a function of density, temperature, pressure, membrane thickness, and water content.

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Characterization of the relationship of the cure cycle chemistry to cure cycle processing properties

Dynamic dielectric analysis (DDA) is used to study curing polymer systems and thermoplastics. Measurements are made over a frequency range of six decades. This wide range of frequencies increases the amount of information which can be obtained. The data is analyzed in terms of the frequency dependence of the complex permittivity epsilon sup *, specific conductivity sigma (ohm/cm) and the relaxation time tau, parameters which are characteristic of the cure state of the material and independent of the size of the sample.

Kranbuehl, D. E.↗

Aging Wire Insulation Assessment by Phase Spectrum Examination of Ultrasonic Guided Waves

Wire integrity has become an area of concern to the aerospace community including DoD, NASA, FAA, and Industry. Over time and changing environmental conditions, wire insulation can become brittle and crack. The cracks expose the wire conductor and can be a source of equipment failure, short circuits, smoke, and fire. The technique of using the ultrasonic phase spectrum to extract material properties of the insulation is being examined. Ultrasonic guided waves will propagate in both the wire conductor and insulation. Assuming the condition of the conductor remains constant then the stiffness of the insulator can be determined by measuring the ultrasonic guided wave velocity. In the phase spectrum method the guided wave velocity is obtained by transforming the time base waveform to the frequency domain and taking the phase difference between two waveforms. The result can then be correlated with a database, derived by numerical model calculations, to extract material properties of the wire insulator. Initial laboratory tests were performed on a simple model consisting of a solid cylinder and then a solid cylinder with a polymer coating. For each sample the flexural mode waveform was identified. That waveform was then transformed to the frequency domain and a phase spectrum was calculated from a pair of waveforms. Experimental results on the simple model compared well to numerical calculations. Further tests were conducted on aircraft or mil-spec wire samples, to see if changes in wire insulation stiffness can be extracted using the phase spectrum technique.

Anastasi, Robert F.↗

X-Aerogels for Structural Components and High Temperature Applications

Future NASA missions and space explorations rely on the use of materials that are strong ultra lightweight and able to withstand extreme temperatures. Aerogels are low density (0.01-0.5 g/cu cm) high porosity materials that contain a glass like structure formed through standard sol-gel chemistry. As a result of these structural properties, aerogels are excellent thermal insulators and are able to withstand temperatures in excess of l,000 C. The open structure of aerogels, however, renders these materials extremely fragile (fracturing at stress forces less than 0.5 N/sq cm). The goal of NASA Glenn Research Center is to increase the strength of these materials by templating polymers and metals onto the surface of an aerogel network facilitating the use of this material for practical applications such as structural components of space vehicles used in exploration. The work this past year focused on two areas; (1) the research and development of new templated aerogels materials and (2) process development for future manufacturing of structural components. Research and development occurred on the production and characterization of new templating materials onto the standard silica aerogel. Materials examined included polymers such as polyimides, fluorinated isocyanates and epoxies, and, metals such as silver, gold and platinum. The final properties indicated that the density of the material formed using an isocyanate is around 0.50 g/cc with a strength greater than that of steel and has low thermal conductivity. The process used to construct these materials is extremely time consuming and labor intensive. One aspect of the project involved investigating the feasibility of shortening the process time by preparing the aerogels in the templating solvent. Traditionally the polymerization used THF as the solvent and after several washes to remove any residual monomers and water, the solvent around the aerogels was changed to acetonitrile for the templating step. This process took a couple of days. It was experimentally determined that the polymerization reaction could be done in acetonitrile instead of THF with no detrimental effects to the properties of the resulting aerogel. Other changes in the time needed to crosslink the gels in the isocyanate solution as well as changes to the subsequent washing procedure could also shorten the processing time with no effect on the properties. Processing methods were also developed that allowed a variety of shapes as well as sizes of these materials to be formed.

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Electrochemical evaluation of the p-Si/conducting polymer interfacial properties

Results are presented from an experimental investigation of the contact resistance and interfacial properties of a p-Si/conducting polymer interface for solar cell applications. The electronic character of the polymer/semiconductor function is determined by studying the electrochemical behavior of both poly(isothianapthene) (PITN) and polypyrrole (PP) in an acetonitrile solution on p-silicon electrodes. The results obtained indicate that while PITN is intrinsically more conductive than PP, neither passivates surface states nor forms ohmic contact.

Nagasubramanian, G.↗

Reflective Silvered Polyimide Films Via In Situ Thermal Reduction Silver (I) Complexes

Self-metallizing. flexible polyimide films with highly reflective surfaces are prepared by an in situ self-metallization procedure involving thermally initiated reduction of polymer-soluble silver(I) complexes. Polyamic acid solutions are doped with silver(I) acetate and solubilizing agents. Thermally curing the silver(I) doped resins leads to flexible. metallized films which have reflectivities as high as 100%. abrasion-resistant surfaces. thermal stability and, in some cases, electrical conductivity, rendering them useful for space applications.

Southward, Robin E.↗

Novel Nanotube Manufacturing Streamlines Production

Nanotubes have novel qualities that make them uniquely qualified for a plethora of uses, including applications in electronics, optics, and other scientific and industrial fields. The NASA process for creating these nanostructures involves using helium arc welding to vaporize an amorphous carbon rod and then form nanotubes by depositing the vapor onto a water-cooled carbon cathode, which then yields bundles, or ropes, of single-walled nanotubes at a rate of 2 grams per hour using a single setup. This eliminates costs associated with the use of metal catalysts, including the cost of product purification, resulting in a relatively inexpensive, high-quality, very pure end product. While managing to be less expensive, safer, and simpler, the process also increases the quality of the nanotubes. Goddard's Innovative Partnerships Program (IPP) Office promoted the technology, and in 2005, Boise-based Idaho Space Materials Inc. (ISM) was formed and applied for a nonexclusive license for the single-walled carbon nanotube (SWCNT) manufacturing technology. ISM commercialized its products, and the inexpensive, robust nanotubes are now in the hands of the scientists who will create the next generation of composite polymers, metals, and ceramics that will impact the way we live. In fact, researchers are examining ways for these newfound materials to be used in the manufacture of transistors and fuel cells, large screen televisions, ultra-sensitive sensors, high-resolution atomic force microscopy probes, supercapacitors, transparent conducting films, drug carriers, catalysts, and advanced composite materials, to name just a few of the myriad technologies to benefit.

Source record↗

A Numerical Study on the Effect of Facesheet-Core Disbonds on the Buckling Load of Curved Honeycomb Sandwich Panels

A numerical study on the effect of facesheet-core disbonds on the post-buckling response of curved honeycomb sandwich panels is presented herein. This work was conducted as part of the development of a damage tolerance approach for the next-generation Space Launch System heavy lift vehicle payload fairing. As such, the study utilized full-scale fairing barrel segments as the structure of interest. The panels were composed of carbon fiber reinforced polymer facesheets and aluminum honeycomb core. The panels were analyzed numerically using the finite element method. Facesheet and core nodes in a predetermined circular region were detached to simulate a disbond induced via low-speed impact between the outer mold line facesheet and honeycomb core. Surface-to-surface contact in the disbonded region was invoked to prevent interpenetration of the facesheet and core elements. The diameter of this disbonded region was varied and the effect of the size of the disbond on the post-buckling response was observed. A significant change in the slope of the edge load-deflection response was used to determine the onset of global buckling and corresponding buckling load.

structural failure↗

Overview of Photonic Materials for Application in Space Environments

Future space systems will he based on components evolving from the development and refinement of new and existing photonic materials. Optically based sensors, inertial guidance, tracking systems, communications, diagnostics, imaging and high speed optical processing are but a few of the applications expected to widely utilize photonic materials. The response of these materials to space environment effects (SEE) such as spacecraft charging, orbital debris, atomic oxygen, ultraviolet irradiation, temperature and ionizing radiation will be paramount to ensuring successful space applications. The intent of this paper is to, address the latter two environments via a succinct comparison of the known sensitivities of selected photonic materials to the temperature and ionizing radiation conditions found in space and enhanced space environments Delineation of the known temperature and radiation induced responses in LiNbO3, AlGaN, AlGsAs,TeO2, Si:Ge, and several organic polymers are presented. Photonic materials are realizing rapid transition into applications for many proposed space components and systems including: optical interconnects, optical gyros, waveguide and spatial light modulators, light emitting diodes, lasers, optical fibers and fiber optic amplifiers. Changes to material parameters such as electrooptic coefficients, absorption coefficients, polarization, conductivity, coupling coefficients, diffraction efficiencies, and other pertinent material properties examined for thermo-optic and radiation induced effect. Conclusions and recommendations provide the reader with an understanding of the limitations or attributes of material choices for specific applications.

Taylor, E. W.↗

Space Transportation System (STS)-117 External Tank (ET)-124 Hail Damage Repair Assessment

Severe thunderstorms with associated hail and high winds struck the STS-117 stack on February 26, 2007. Peak winds were recorded at 62 knots with hail sizes ranging from 0.3 inch to 0.8 inch in diameter. As a result of the storm, the North Carolina Foam Institute (NCFI) type 24-124 Thermal Protection System (TPS) foam on the liquid oxygen (LO2) ogive acreage incurred significant impact damage. The NCFI on the ET intertank and the liquid hydrogen (LH2) acreage sustained hail damage. The Polymer Development Laboratory (PDL)-1034 foam of the LO2 ice frost ramps (IFRs) and the Super-Lightweight Ablator (SLA) of the LO2 cable tray also suffered minor damage. NASA Engineering and Safety Center (NESC) was asked to assess the technical feasibility of repairing the ET TPS, the reasonableness of conducting those repairs with the vehicle in a vertical, integrated configuration at the Kennedy Space Center (KSC) Vehicle Assemble Building (VAB), and to address attendant human factors considerations including worker fatigue and the potential for error. The outcome of the assessment is recorded in this document.

Wilson, Timmy R.↗

Regenerative fuel cell energy storage system for a low earth orbit space station

A study was conducted to define characteristics of a Regenerative Fuel Cell System (RFCS) for low earth orbit Space Station missions. The RFCS's were defined and characterized based on both an alkaline electrolyte fuel cell integrated with an alkaline electrolyte water electrolyzer and an alkaline electrolyte fuel cell integrated with an acid solid polymer electrolyte (SPE) water electrolyzer. The study defined the operating characteristics of the systems including system weight, volume, and efficiency. A maintenance philosophy was defined and the implications of system reliability requirements and modularization were determined. Finally, an Engineering Model System was defined and a program to develop and demonstrate the EMS and pacing technology items that should be developed in parallel with the EMS were identified. The specific weight of an optimized RFCS operating at 140 F was defined as a function of system efficiency for a range of module sizes. An EMS operating at a nominal temperature of 180 F and capable of delivery of 10 kW at an overall efficiency of 55.4 percent is described. A program to develop the EMS is described including a technology development effort for pacing technology items.

Martin, R. E.↗

Use of unbalanced laminates as a screening method for microcracking

State-of-the-art, high temperature polyimide matrix composites, reinforced with continuous graphite fibers are known to be susceptible to intraply cracking when thermally cycled over their useful service temperature range. It is believed that the transply cracking, in part, results from residual stresses caused by differences in coefficients of thermal expansion (CTE) between the polymer matrix and the reinforcement. Thermal cycling tests to investigate this phenomenon involve expensive time and energy consuming programs which are not economically feasible for use as a part of a materials screening process. As an alternative to thermal cycling studies, a study of unbalanced crossply graphite fiber reinforcement composites was conducted to assess the effect of the composite ply layup and surface condition on the residual stresses that remain after the processing of these materials. The residual stresses were assessed by measuring the radii of curvature of the types of laminates that were studied. The temperature at which stress-free conditions existed were determined and a dye penetrant method was used to observe surface damage resulting from excessive residual stress buildup. These results are compared with some published results of thermal cycling tests that were previously conducted on balanced polyimide composites.

Papadopoulos, Demetrios S.↗

Use of unbalanced laminates as a screening method for microcracking

State-of-the-art, high temperature polyimide matrix composites, reinforced with continuous graphite fibers are known to be susceptible to intraply cracking when thermally cycled over their useful service temperature range. It is believed that the transply cracking, in part, results from residual stresses caused by differences in coefficients of thermal expansion (CTE) between the polymer matrix and the reinforcement. Thermal cycling tests to investigate this phenomenon involve expensive time and energy consuming programs which are not economically feasible for use as a part of a materials screening process. As an alternative to thermal cycling studies, a study of unbalanced crossply graphite fiber reinforcement composites was conducted to assess the effect of the composite ply layup and surface condition on the residual stresses that remain after the processing of these materials. The residual stresses were assessed by measuring the radii of curvature of the types of laminates that were studied. The temperature at which stress-free conditions existed were determined and a dye penetrant method was used to observe surface damage resulting from excessive residual stress buildup. These results are compared with some published results of thermal cycling tests that were previously conducted on balanced polyimide composites.

Papadopoulos, Demetrios S.↗

Polymer matrix and graphite fiber interface study

Hercules AS4 graphite fiber, unsized, or with EPON 828, PVA, or polysulfone sizing, was combined with three different polymer matrices. These included Hercules 3501-6 epoxy, Hercules 4001 bismaleimide, and Hexcel F155 rubber toughened epoxy. Unidirectional composites in all twelve combinations were fabricated and tested in transverse tension and axial compression. Quasi-isotropic laminates were tested in axial tension and compression, flexure, interlaminar shear, and tensile impact. All tests were conducted at both room temperature, dry and elevated temperature, and wet conditions. Single fiber pullout testing was also performed. Extensive scanning electron microphotographs of fracture surfaces are included, along with photographs of single fiber pullout failures. Analytical/experimental correlations are presented, based on the results of a finite element micromechanics analysis. Correlations between matrix type, fiber sizing, hygrothermal environment, and loading mode are presented. Results indicate that the various composite properties were only moderately influenced by the fiber sizings utilized.

Adams, D. F.↗

The photolysis of NH3 in the presence of substituted acetylenes - A possible source of oligomers and HCN on Jupiter

An NMR spectral study is presently conducted of NH3 photolysis in the presence of substituted acetylenes with NMR spectra and gas chromatography. Quantum yields and percentage conversions to products are reported. It is shown that acetylenic hydrocarbons generated during methane photolysis in Jupiter's stratosphere can react with radicals formed by NH3 photolysis to yield nonvolatile, yellow-brown polymers, alkylnitriles, and in due course, HCN, as observed on Jupiter.

Ferris, James P.↗

LiGa(OTf)(sub 4) as an Electrolyte Salt for Li-Ion Cells

Lithium tetrakis(trifluoromethane sulfo - nato)gallate [abbreviated "LiGa(OTf)4" (wherein "OTf" signifies trifluoro - methanesulfonate)] has been found to be promising as an electrolyte salt for incorporation into both liquid and polymer electrolytes in both rechargeable and non-rechargeable lithium-ion electrochemical cells. This and other ingredients have been investigated in continuing research oriented toward im proving the performances of rechargeable lithium-ion electrochemical cells, especially at low temperatures. This research at earlier stages, and the underlying physical and chemical principles, were reported in numerous previous NASA Tech Briefs articles. As described in more detail in those articles, lithiumion cells most commonly contain nonaqueous electrolyte solutions consisting of lithium hexafluorophosphate (LiPF6) dissolved in mixtures of cyclic and linear alkyl carbonates, including ethylene carbonate (EC), propylene carbonate (PC), dimethyl carbonate (DMC), diethyl carbonate (DEC), and ethyl methyl carbonate (EMC). Although such LiPF6-based electrolyte solutions are generally highly ionically conductive and electrochemically stable, as needed for good cell performance, there is interest in identifying alternate lithium electrolyte salts that, relative to LiPF6, are more resilient at high temperature and are less expensive. Experiments have been performed on LiGa(OTf)4 as well as on several other candidate lithium salts in pursuit of this interest. As part of these experiments, LiGa(OTf)4 was synthesized by the reaction of Ga(OTf)3 with an equimolar portion of LiOTf in a solvent consisting of anhydrous acetonitrile. Evaporation of the solvent yielded LiGa(OTf)4 as a colorless crystalline solid. The LiGa(OTf)4 and the other salts were incorporated into solutions with PC and DMC. The resulting electrolyte solutions exhibited reasonably high ionic conductivities over a relatively wide temperature range down to 40 C (see figure). In cyclic voltammetry measurements, LiGa(OTf)4 and the other salts exhibited acceptably high electrochemical stability over the relatively wide potential window of 0 to 5 V versus Li+/Li. 13C nuclear-magneticresonance measurements yielded results that suggested that in comparison with the other candidate salts, LiGa(OTf)4 exhibits less ion pairing. Planned further development will include optimization of the salt and solvent contents of such electrolyte solutions and incorporation of LiGa(OTf)4 into gel and solid-state polymer electrolytes. Of the salts, LiGa(OTf)4 is expected to be especially desirable for incorporation into lithium polymer electrolytes, wherein decreased ion pairing is advantageous and the large delocalized anions can exert a plasticizing effect.

Reddy, V. Prakash↗

Long-term photothermal/humidity testing of photovoltaic module polymer insulations and cover films

The life expectancies of Tedlar and other polymer films considered for use as cover materials in terrestrial photovoltaic (PV) modules were investigated by exposing them for more than 13,000 h on an outdoor test stand and for up to 10,000 h in several accelerated multistress environments. Visual observations and diagnostic analyses of weight and mechanical strength losses were periodically conducted to assess the nature and rate of degradation of mechanical properties and to assess the effects of film thickness and UV stabilizer content. Spectroscopic analyses of pristine and degraded materials linked weight and mechanical property losses to the underlying photothermal/photooxidation chemistry. It is shown that heavy doses of UV stabilizers prolong, while elevated temperatures shorten, the useful life of these materials; humidity plays only a minor role. The most heavily UV-stabilized films are expected to operate usefully in a PV module front-cover application for only five to ten years. The performance of none of the tested films appears consistent with the 20-30 year life goals of the PV industry.

Mon, G.↗

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗