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At least 559 records · Page 31

Human Reliability Assessments: Using the Past (Shuttle) to Predict the Future (Orion)

NASA (National Aeronautics and Space Administration) Johnson Space Center (JSC) Safety and Mission Assurance (S&MA) uses two human reliability analysis (HRA) methodologies. The first is a simplified method which is based on how much time is available to complete the action, with consideration included for environmental and personal factors that could influence the human's reliability. This method is expected to provide a conservative value or placeholder as a preliminary estimate. This preliminary estimate or screening value is used to determine which placeholder needs a more detailed assessment. The second methodology is used to develop a more detailed human reliability assessment on the performance of critical human actions. This assessment needs to consider more than the time available, this would include factors such as: the importance of the action, the context, environmental factors, potential human stresses, previous experience, training, physical design interfaces, available procedures/checklists and internal human stresses. The more detailed assessment is expected to be more realistic than that based primarily on time available. When performing an HRA on a system or process that has an operational history, we have information specific to the task based on this history and experience. In the case of a Probabilistic Risk Assessment (PRA) that is based on a new design and has no operational history, providing a "reasonable" assessment of potential crew actions becomes more challenging. To determine what is expected of future operational parameters, the experience from individuals who had relevant experience and were familiar with the system and process previously implemented by NASA was used to provide the "best" available data. Personnel from Flight Operations, Flight Directors, Launch Test Directors, Control Room Console Operators, and Astronauts were all interviewed to provide a comprehensive picture of previous NASA operations. Verification of the assumptions and expectations expressed in the assessments will be needed when the procedures, flight rules, and operational requirements are developed and then finalized.

DeMott, Diana L.↗

Reliably Detectable Flaw Size for NDE Methods that Use Calibration

Probability of detection (POD) analysis is used in assessing reliably detectable flaw size in nondestructive evaluation (NDE). MIL-HDBK-1823 and associated mh1823 POD software gives most common methods of POD analysis. In this paper, POD analysis is applied to an NDE method, such as eddy current testing, where calibration is used. NDE calibration standards have known size artificial flaws such as electro-discharge machined (EDM) notches and flat bottom hole (FBH) reflectors which are used to set instrument sensitivity for detection of real flaws. Real flaws such as cracks and crack-like flaws are desired to be detected using these NDE methods. A reliably detectable crack size is required for safe life analysis of fracture critical parts. Therefore, it is important to correlate signal responses from real flaws with signal responses form artificial flaws used in calibration process to determine reliably detectable flaw size.

Koshti, Ajay M.↗

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses

Electronics packaging↗

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses.

Physics of Failure↗

2.5/3D Daisy Chain Reliability Evaluation

The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.

Ghaffarian, Reza↗

High Reliability Requires More than Providing Spares

It is sometimes optimistically hoped that a space life support system can be kept working throughout a long duration mission by repairing failed components, as long as sufficient spares are flown. It is usually assumed that the components have constant known failure rates. Then the needed numbers of spares can be computed to have any particular probability that all failed components can be replaced by available spares. This approach can provide high reliability if its favorable assumptions, including constant known failure rates, are satisfied. Other favorable assumptions are that the failures are statistically independent, repair will be successful without causing further failures, and all failures are due to internal component failures. These assumptions are not usually justified. The failure rates may be estimates that are inadequately verified because of insufficient testing. Failure rates may change due to materials substitutions, manufacturing changes, redesigns to fix failures, and new failures caused by redesigns. Failures that are not statistically independent may result from one common cause, such as a design or manufacturing error or a cascade of cause and effect, possibly caused by an external event such as a power outage. Repair may be unsuccessful or cause damage. Many failures occur at component interfaces or at the overall systems level, not within isolated components. Other failures causes are completely external to the system, due to assembly, maintenance, and operational errors or to unexpected environmental challenges. Replacement with sufficient spares can compensate for expected internal component failures but may not be able to cope with unpredictable design and manufacturing flaws, human errors, and environmental impacts. Reliability estimates based on providing sufficient spares to compensate for expected failures may be far too high. They are essentially upper bounds on reliability that might be approached if many frequent but often unconsidered failure causes can be eliminated.

spares↗

MEMS reliability assurance guidelines for space applications

This guideline was developed as an aid to help in the understanding of Microelectromechanical Systems (MEMS) reliability and to facilitate the insertion of this technology into high reliability applications. Modeled after the GaAs MMIC Reliability Assurance Guideline for Space Applications by Kayali, et al., is was felt that a guideline would be more advantageous to people than a strict specification.

microelectromechanical↗

Cost and Reliability Study for a Large Array of Small Reflector Antennas for JPL/NASA Deep Space Network (DSN)

A study is performed to estimate the cost of an array of small aperture reflector antennas to be used instead or in conjunction with the current large reflector antennas of the JPL/NASA Deep Space Network (DSN), for servicing present and future NASA missions which involve smaller spacecraft with limited power and smaller, lower gain antennas. The advantages of the array configuration in terms of cost and reliability are studied. A probabilistic determination of the reliability and availability of the array as a function of the number of array elements and the availability of individual array elements is made. The impact of additional marginal elements on the operational availability of the array is studied. Parametric cost and reliability plots are presented and directions for further investigation are outlined.

Resch, G.↗

Flash memory reliability NEPP 2008 task final report

This is the preliminary report which is based on the flash memory reliability studies conducted during the first year (2008) of the multi-year NEPP task. The report outlines the technology and reliability challenges for advanced flash memory technologies, summarizes the test results and analyses of reliability characterizations performed on the selected flash memory devices during 2008, and provides the preliminary thoughts on the risk mitigation approaches on using advanced flash memory technologies for space applications.

Chen, Yuan↗

Long-term reliability of hand-soldering M55365 Ta capacitors

This is a continuation of the report “Effects of Hand Soldering MIL-PRF-55365 Tantalum Capacitors,” which discusses the parametric effects of convection reflow soldering, JPL standard hand soldering, and optimized hand soldering on solid tantalum capacitors. The current focus is determining the long-term reliability effects of the various soldering techniques. Unfortunately, the 100-piece sample size chosen for the highly accelerated life tests was too small to reliably determine the effects of the different soldering techniques on the lifespan of the parts. In hindsight, this likely could have been predicted based on the large alphas and small betas of the Weibull failure distributions discovered during the scouting trials. Now that the effects of inadequate sample size are better understood, an opportunity exists to not only discover whether there are real differences in the reliability associated with the various soldering techniques, but also the potential to discover the voltage acceleration model and the temperature acceleration effect for these capacitors. It is recommended that the testing be repeated with a more appropriate sample size to capture this useful information.

Spence, Penelope↗

Reliability of CGA/LGA/HDI Package Board/Assembly

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of −55°C to maximum temperatures of either 100°C or 125°C with slow ramp-up rate (3°C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects’ use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗

Acceleration Factors for Reliability Assessment of Polymer Tantalum Capacitors

Using polymer tantalum capacitors in Hi-Rel systems requires an assessment of the reliability characteristics of the parts. For this assessment, tantalum capacitors are typically subjected to reliability testing at temperatures and voltages exceeding their specified values, and the failure rate (FR) — or the probability of failure during use conditions — is calculated based on voltage and temperature acceleration factors. In this work, various types and lots of polymer tantalum capacitors have been tested at highly accelerated life test (HALT) conditions and the acceleration factors have been determined using different techniques. It has been shown that the behavior of capacitors under HALT conditions can be described based on the time-dependent dielectric breakdown (TDDB) model, which explains the presence of infant mortality (IM) and wear-out failures using the same failure mechanisms and allows for an assessment of the acceleration factors. The difference in acceleration factors obtained using exponential and power models is discussed. Analysis shows that with proper derating, screening, and qualification testing, the reliability of frameless Hi-Rel COTS polymer tantalum capacitors is adequate for space missions.

Alex Eidelman↗

Acceleration Factors for Reliability Assessment of Polymer Tantalum Capacitors

Using polymer tantalum capacitors in Hi-Rel systems requires an assessment of the reliability characteristics of the parts. For this assessment, tantalum capacitors are typically subjected to reliability testing at temperatures and voltages exceeding their specified values, and the failure rate (FR) — or the probability of failure during use conditions — is calculated based on voltage and temperature acceleration factors. In this work, various types and lots of polymer tantalum capacitors have been tested at highly accelerated life test (HALT) conditions and the acceleration factors have been determined using different techniques. It has been shown that the behavior of capacitors under HALT conditions can be described based on the time-dependent dielectric breakdown (TDDB) model, which explains the presence of infant mortality (IM) and wear-out failures using the same failure mechanisms and allows for an assessment of the acceleration factors. The difference in acceleration factors obtained using exponential and power models is discussed. Analysis shows that with proper derating, screening, and qualification testing, the reliability of frameless Hi-Rel COTS polymer tantalum capacitors is adequate for space missions.

Alex Eidelman↗

Impact of Latency and Reliability on Separation Assurance with Remotely Piloted Aircraft in Terminal Operations

Remotely Piloted Aircraft (RPA) for cargo operations in the national airspace system will impact safety due to, among other factors, the latency and reliability of command & control, and of communication. This paper investigates the safety impact with increasing mix of RPA amidst manned traffic in a generic arrival pattern with three merging flows. Latency was modelled as the response time between air traffic control's determination of a resolution and the RPAs' initiation of the maneuver. Reliability was modelled as a message drop probability. The experiment was repeated with two different aircraft types having different performance characteristics as representatives of RPA for conducting automated cargo operations. Overall response time above thirty seconds and message drop probability over twenty percent caused losses of separation. Specific results depended on the RPA aircraft type. The detailed impacts of latency and reliability with increasing mix of RPA traffic are provided. Applications of the approach for further studies at increasing levels of automation are also discussed.

Vishwanath Bulusu↗

Impact of Latency and Reliability on Separation Assurance with Remotely Piloted Aircraft in Terminal Operations

Remotely Piloted Aircraft (RPA) for cargo operations in the national airspace system will impact safety due to, among other factors, the latency and reliability of command & control, and of communication. This paper investigates the safety impact with increasing mix of RPA amidst manned traffic in a generic arrival pattern with three merging flows. Latency was modelled as the response time between air traffic control's determination of a resolution and the RPAs' initiation of the maneuver. Reliability was modelled as a message drop probability. The experiment was repeated with two different aircraft types having different performance characteristics as representatives of RPA for conducting automated cargo operations. Overall response time above thirty seconds and message drop probability over twenty percent caused losses of separation. Specific results depended on the RPA aircraft type. The detailed impacts of latency and reliability with increasing mix of RPA traffic are provided. Applications of the approach for further studies at increasing levels of automation are also discussed.

Vishwanath Bulusu↗

Statistical Distribution of Gear Surface Fatigue Lives at High Reliability

The reliability of gears is important for a wide variety of applications, and the gearing community has a desire for better prediction of fatigue life at very high reliability. To improve predictions, a set of 950 NASA-conducted gear surface fatigue test results were gathered, pooled together using the general standardized Weibull variate, and then fit to a Weibull three-parameter distribution. An iterative fitting method was developed and then applied to the gear fatigue data to determine the values of the distribution parameters. Additional analyses were done using bearing and gear data that demonstrate a trend of increasing minimum life coefficient as correlated to the timeframe of the fatigue testing, and material cleanliness is proposed as a primary explanation for such correlation. It is noted that this observed trend supports published findings from analytical modeling and experimental studies that improvements to material cleanliness improves minimum fatigue life. Further use and study of the three-parameter Weibull distribution is recommended as a tool to quantify fatigue life most accurately in the high reliability regime.

gear↗

Improved Aerothermal Reliability Analysis Enabled by the Mars Sample Return Earth Entry System Aerothermal Database

The Mars Sample Return (MSR) campaign is a series of missions designed to retrieve Martian rock and soil samples for detailed study on Earth. The campaign is split into three primary phases: sample collection with the Mars2020 rover, retrieval with the Sample Return Lander (SRL) and Mars Ascent Vehicle (MAV), and then return to Earth with the Earth Return Orbiter (ERO) and Capture, Containment, and Return System (CCRS) [1]. The final sequence in the Earth return phase is the delivery and entry of the Earth Entry System (EES) sample return capsule. Due to unprecedented planetary protection concerns, the sample return capsule is subject to strict reliability requirements. To this end, the MSR-EES aerothermal team has implemented a flexible aerothermal database architecture capable of integration with state-of-the-art trajectory codes to provide a more rigorous aerothermal reliability analysis. The EES database enables the generation of environments at any location on the heatshield and can incorporate trajectory uncertainties to both statistically quantify aerothermal environments for arcjet testing and produce material response boundary conditions to rigorously select thermal protection system (TPS) sizing environments. This poster will not discuss the fundamental modeling assumptions included in the database, and will instead focus on the downstream reliability analyses that can be performed with a database of this architecture.

MSR-EES↗

Reliable Power Hibernation and Recovery for Solar Powered Lunar Missions

NASA Glenn Research Center has been working on a solution to surviving the lunar night based on the discovery that Li-Ion cells can survive the freeze/thaw process. This implies that a lunar surface spacecraft could hibernate through the coldest portions of the night and recover at lunar dawn. Survival and recovery also depend on power electronics capable of tolerating the cold and reliably starting at lunar dawn based on solar array output alone. GRC is working with STMD Space Technology Research Grant investigators to characterize Li-ion cells through the freeze-thaw process and fully understand the electro-chemical and thermal-mechanical processes to assure reliable cell hibernation and recovery. Further, we are working with investigators to determine what power semiconductor material, transistor technology, and power architecture is best suited for reliable cold start at lunar dawn and methodically restoring the power system to full operation for the next lunar cycle.

Spacecraft Power↗