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At least 559 records · Page 31

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NASA NTRS1983

Rigid closed-cell polyimide foams for aircraft applications and foam-in-place technology

Significant accomplishments generated are summarized. Testing of closed cell foams, which has resulted in the characterization of compositions which produce rigid foams for use in galley structure applications is reported. It is shown that the density, compressive strength and shear strength of the foams are directly related to the concentrations of the microballoons. The same properties are also directly related to the resin loading. Prototype samples of rigid closed cell foams meeting the requirements of the program were submitted. Investigation of the apparatus to produce polyimide foams using foam in place techniques, resulted in the selection of a spray gun apparatus, capable to deliver a mixture of microballoons and resin binder on substrates which cures to yield a closed cell foam. It is found that the adhesion of the foam on aluminum, titanium and steel substrates is satisfactory. It is concluded that the material meets the mechanical and thermal requirements of the program.

Gagliani, J.↗

NASA NTRS1983

The effect of a coating on the thermo-oxidative stability of Celion 6000 graphite fiber/PMR 15 polyimide composites

The thermooxidative stability in air at 316 C of unidirectional, uncoated and aluminum-coated Celion 6000 graphite fiber/PMR 15 polyimide composites has been determined for exposure times up to nominally 2000 h. Comparison of the weight loss data and microstructural integrity reveals that a thin aluminum-foil coating can provide significant protection from oxidation. A quantitative description of the average depth of the reaction zone and the maximum length of cracks produced during oxidation as a function of time in uncoated Celion 6000/PMR 15 are given.

Hurwitz, F. I.↗

NASA NTRS1983

Surface analysis of grapite fiber reinforced polyimide composites. I

The results of experimental analyses of the effects of pretreatment on bonding between composite materials are reported. The materials comprised graphite fibers in a polyimide matrix. The surfaces were bonded as-received or subjected to grit blasting, bead blasting, hand sanding, washes with ethanolic KOH, NH2NH2-H2O or H2SO4 + 0.30 H2O2 or flashblasting. SEM and X-ray photoelectron spectroscopy revealed fluorine contents in the as-received samples. Contact angles were determined by means of five different liquids with various surface tensions. The flashblast technique removed all fluorine from the samples. Low critical surface tensions were found in the composite surfaces with high fluorine concentrations. The surface scanning techniques are concluded to be useful for studying factors influencing the strength and durability of adhesively bonded composites.

Messick, D. L.↗

NASA NTRS1984

Siloxane containing addition polyimides

Addition polyimide oligomers have been synthesized from bis(gamma-aminopropyl) tetramethyldisiloxane and 3, 3', 4, 4'-benzophenonetetracarboxylic dianhydride using a variety of latent crosslinking groups as endcappers. The prepolymers were isolated and characterized for solubility (in amide, chlorinated and ether solvents), melt flow and cure properties. The most promising systems, maleimide and acetylene terminated prepolymers, were selected for detailed study. Graphite cloth reinforced composites were prepared and properties compared with those of graphite/Kerimid 601, a commercially available bismaleimide. Mixtures of the maleimide terminated system with Kerimid 601, in varying proportions, were also studied.

Maudgal, S.↗

NASA NTRS1986

Water-Soluble Thermoplastic Polyimides

Several thermoplastic polyimide resins that show potential as matrix resins developed. Number of processes for composite fabrication evaluated, including powder processing, which involves deposition of resin powder on graphite fiber from nonresin-solvent slurry. Although powder slurry approach is viable, use of solvent system more amenable with current prepreg manufacturing methods.

Pike, R. A.↗

NASA NTRS1985

Elastomer toughened polyimide adhesives

A rubber-toughened, addition-type polyimide composition is disclosed which has excellent high temperature bonding characteristics in the fully cured state and improved peel strength and adhesive fracture resistance physical property characteristics. The process for making the improved adhesive involves preparing the rubber-containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride has been mixed, and utilizing solvent or mixture of solvents for the reaction.

St.clair, A. K.↗

NASA NTRS1985

Effect of counterface material type and its topography on the tribological properties of polyimide composites

Graphite fiber reinforced polyimide composite pins were slid against seven different counterfaces to determine the effect of material type on the tribological properties of polymer composites. In addition, the effect of sliding a new pin on a pre-established transfer film was investigated. The results indicated that almost a five order of magnitude difference in composite wear rate can occur just by varying the counterface material. An attempt to make all surfaces as smooth as possible was made, but due to differences in material composition this was not possible and a range of surface roughnesses were obtained. The results indicate that the smoother the surface, the lower the composite wear rate; but that small protrusions (not discernible with arithmetic surface roughness measurements) can markedly increase wear rates. A pre-established transfer film improved both run in and steady state wear rates.

Fusaro, R. L.↗

NASA NTRS1985

STPI/LARC: A 200 deg C polyimide adhesive

A copolyimide, STPI/LARC, was prepared from the reaction of 3,3'4'benzophenonetetracarboxylic dianhydride (BTDA), equimolar quantities of m-phenylenediamine and 4,4'-oxydianiline, and a small amount of phthalic anhydride to control the molecular weight. The processability and adhesive properties of STPI/LARC were compared to those of a commercially available form of LARC-TPI. LARC-TPI, a thermoplastic polyimide, from the reaction of BTDA and 3,3'-diaminobenzophenone, had previously shown promise as a high temperature structural adhesive. Lap shear specimens were fabricated using adhesive tape prepared from each of the two polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to a 72-hour water-boil and to aging at 204 C.

Progar, D. J.↗

NASA NTRS1985

Graphite/PMR polyimide composites with improved toughness

The toughness of composites made with modified PMR (polymerization of monomer reactants) polyimides and Celion 6000 graphite fibers was studied. Various types/levels of monomer reactants containing flexible links were incorporated into PMR resin compositions used to prepare composites. The composites were evaluated for toughness using instrumented drop weight and 10 deg off axis tensile tests at room temperature, and for strength using flexure and short beam shear tests at room temperature and at elevated temperature. The effect of resin composition on composite processability, thermo-oxidative stability, toughness and mechanical properties are discussed.

Vannucci, R. D.↗

NASA NTRS1985

Thermal expansion of selected graphite reinforced polyimide-, epoxy-, and glass-matrix composite

The thermal expansion of three epoxy-matrix composites, a polyimide-matrix composite and a borosilicate glass-matrix composite, each reinforced with continuous carbon fibers, has been measured and compared. The expansion of a composite with a rubber toughened epoxy-matrix and P75S carbon fibers was very different from the expansion of two different single phase epoxy-matrix composites with P75S fibers although all three had the same stacking sequence. Reasonable agreement was obtained between measured thermal-expansion data and results from classical laminate theory. The thermal expansion of a material may change markedly as a result of thermal cycling. Microdamage, induced by 250 cycles between -156 C and 121 C in the graphite/polyimide laminate, caused a 53 percent decrease in the coefficient of thermal expansion. The thermal expansion of the graphite/glass laminate was not changed by 100 thermal cycles from -129 C to 38 C; however, a residual strain of about 10 x 10 to the minus 6 power was measured for the laminate tested.

Tompkins, S. S.↗

NASA NTRS1984

Preparation and properties of silane-endcapped polyimide adhesives

Silane-endcapped polyimide high temperature adhesive formulations were prepared by reacting anhydride-terminated poly(amic acid), obtained from benzophenonetetracarboxylic dianhydride and a diamine (3,3'-, 3,4'- or 4,4'-diaminodiphenylmethane and 3,3', 3,4'- or 4,4'-diaminobenzophenone) with varying amounts of gama-aminopropyltriethoxysilane in dimethylacetamide. Resin properties were evaluated by torsional braid analysis and thermogravimetric analysis. Lap shear strengths of some of the adhesive bonds were determined at room temperature and at 177 C before and after ageing at 200 C for 2500 h and after boiling in water for 72 h.

Maudgal, S.↗

NASA NTRS1984

Synthesis and characterization of a melt processable polyimide

A melt processable polyimide which contains sulfur and oxygen bridges between the aromatic rings (BDSDA/APB) was synthesized and characterized. Its physical, mechanical, thermal and flow properties were determined as was its resistance to some of the more commonly used solvents. The melt flow properties were measured for the temperature range 250 C - 350 C and under the conditions (stress/strain) encountered in commercial processes.

Burks, H. D.↗

NASA NTRS1984

Synthesis of tin-containing polyimide films

A series of tin-containing polyimide films derived from either 3,3',4,4'-benzophenone tetracarboxylic acid dianhydride or pyromellitic dianhydride and 4,4'-oxydianiline have been synthesized and their electrical properties examined. Highest quality materials (i.e., homogeneous, smooth surface, flexible) with the best electrical properties were doped with either SnCl2.2H2O or (n-Bu)2SnCl2. In all cases, extensive reactivity of the tin dopant with water, air or polyamic acid during imidization is observed. Lowered electrical surface resistivities appear to be correlatable with the presence of surface tin oxide on the film surface.

Ezzell, S. A.↗

NASA NTRS1984

Electrical properties of metal-doped pyridine-derived polyimide films

A series of polyimide films containing pyridine coordinating groups doped with cobalt or nickel ions has been examined. Using 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, films were prepared in combination with 4,4'-oxydianiline, 4,4'-dianiline sulfide, 3,3'-bis(aminopyridine) sulfide and 2,2'-dioxyphenelenebis (5,5'-aminopyridine). Room temperature volume resistivities have been found to decrease slightly with sulfur and pyridine containing diamines relative to diamines which do not contain these functionalities. Doping with cobalt and nickel additives results in further lowering of room temperature volume resistivity. Preliminary temperature profiling experiments have shown that volume resistivity decreases as T(g) is approached.

Khor, E.↗

NASA NTRS1984

Mechanical and spectroscopic properties of metal containing polyimides

The incorporation of specific metal ions into polyimides is described. Detailed studies have included various compounds of copper, lithium, and palladium as dopants. Addition of the metal during polymermzation or after formation of the polyamic acid precedes the thermal imidization step. With many dianhydride-diamine-dopant combinations high quality variously colored films are produced. Many metal doped films exhibit (1) improved high temperature adhesive properties, (2) increased electrical conductivity, (3) excellent thermal stability, (4) improved acid/base resistance, (5) increased modulus in flexible films and (6) excellent high temperature tensile strength. X-ray photo-electron spectroscopic study of these films suggests that many of the additives undergo chemical modification during thermal imidization. Palladium dopants appear to be partially reduced to the metallic state, while lithium and copper dopants are probably converted to their oxides. Ion etching experiments with Auger electron spectroscopy monitoring are discussed.

Taylor, L. T.↗

NASA NTRS1984

Novel metal-filled polyimide electrodes

Palladium-coated polyimide films are evaluated as electrochemical electrodes. The film electrodes exhibit essentially identical behavior compared to bulk palladium electrodes. In aqueous 0.5M H2SO4, current peaks due to oxide formation, oxide stripping, hydrogen adsorption, and H2 oxidation are observed. The ferri/ferrocyanide redox couple is grossly irreversible in the same electrolyte. Reversible electrochemical behavior is obtained for Fe(EDTA)(1-/2-) in 1M KCl/H2O, and for ferrocene/ferricenium in 0.1M TEAP/dimethylacetamide.

Furtsch, T. A.↗

NASA NTRS1986

Colorless Polyimide Containing Phenoxy-Linked Diamines

Tough, optically transparent films produced. Polyimides having this molecular structure form tough, transparent films. Films made transparent by careful control of manufacturing conditions, including use of highly purified monomers. Need for high-temperature, flexible polymeric films and coating materials that have high optical transparency in 300- to 600nm range of electro-magnetic spectrum for use on antennas, solar cells, and thermalcontrol coatings.

St. Clair, A. K.↗

NASA NTRS1986

Tougher Addition Polyimides Containing Siloxane

Laminates show increased impact resistances and other desirable mechanical properties. Bismaleamic acid extended by reaction of diaminosiloxane with maleic anhydride in 1:1 molar ratio, followed by reaction with half this molar ratio of aromatic dianhydride. Bismaleamic acid also extended by reaction of diaminosiloxane with maleic anhydride in 1:2 molar ratio, followed by reaction with half this molar ratio of aromatic diamine (Michael-addition reaction). Impact resistances improved over those of unmodified bismaleimide, showing significant increase in toughness. Aromatic addition polyimides developed as both matrix and adhesive resins for applications on future aircraft and spacecraft.

St. Clair, T. L.↗