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At least 559 records · Page 31

Estimation of wintertime cloud radiative effects in the Western Arctic, a function of cloud-moisture-coupling and sea ice conditions

Cloud radiative effects are estimated using up- and downward ground-based observations of broadband thermal infrared sensors in cloudy conditions which are provided by the ARM data repository. The ARM Surface Radiation measurement is analyzed. To study the cloud radiative effects, the observed thermal infrared measurements under cloudy conditions are analyzed together with microphysical cloud properties like liquid and ice water path obtained from the CloudNet algorithms applied to the remote-sensing instrumentation suite at the ARM site in Utqiagvik. Cloud observations have been sorted depending on the coupling of the cloud with upwind water vapor transport events that can interact with sea ice upwind. Statistics of surface net thermal fluxes and cloud water/ice properties show a distinguished distribution for coupled and decoupled clouds. It was found that coupled clouds contain more liquid water and are more efficient reduce the cooling of surface LW radiation.

54 ENVIRONMENTAL SCIENCES↗

Topographic hydro-conditioning to resolve surface depression storage and ponding in a fully distributed hydrologic model

Land surface depressions play a central role in the transformation of rainfall to ponding, infiltration and runoff, yet digital elevation models (DEMs) used by spatially distributed hydrologic models that resolve land surface processes rarely capture land surface depressions at spatial scales relevant to this transformation. Methods to generate DEMs through processing of remote sensing data, such as optical and light detection and ranging (LiDAR) have favored surfaces without depressions to avoid adverse slopes that are problematic for many hydrologic routing methods. Here, in this study, we present a new topographic conditioning workflow, Depression-Preserved DEM Processing (D2P) algorithm, which is designed to preserve physically meaningful surface depressions for depression-integrated and efficient hydrologic modeling. D2P includes several features: (1) an adaptive screening interval for delineation of depressions, (2) the ability to filter out anthropogenic land surface features (e.g., bridges), (3) the ability to blend river smoothing (e.g., a general downslope profile) and depression resolving functionality. From a case study in the Goodwin Creek Experimental Watershed, D2P successfully resolved 86% of the ponds at a DEM resolution of 10 m. Topographic conditioning was achieved with minimum impact as D2P reduced the number of modified cells from the original DEM by 51% compared to a conventional algorithm. Furthermore, hydrologic simulation using a D2P processed DEM resulted in a more robust characterization on surface water dynamics based on higher surface water storage as well as an attenuated and delayed peak streamflow.

54 ENVIRONMENTAL SCIENCES↗

Decentralized Carrier Phase Shifting for Optimal Harmonic Minimization in Asymmetric Parallel-Connected Inverters

This paper presents a carrier phase shifting technique for minimizing the aggregate harmonics in networks of asymmetric parallel-connected inverters for distributed power generation system applications. The proposed technique is: 1) implemented in a decentralized manner, relying only on local voltage and current measurements, and 2) optimal in the sense that it minimizes a cost function representing the carrier-frequency current harmonics. The analysis indicates that the proposed optimal carrier phase shifting technique can enable order-of-magnitude reductions in harmonic power, and also universal improvements compared to symmetric carrier interleaving for asymmetric inverter networks. Moreover, compared to existing methods that require either centralized communication or information exchange between inverters to coordinate carriers, the proposed technique is completely decentralized, which provides important practical benefits for implementation, including improved robustness and reduced cost. The technique is experimentally validated on a network of three single-phase 2-kW inverters and demonstrates a 36.5% reduction in the weighted total harmonic distortion factor of the aggregate inverter current, and the ability to converge to the optimal carrier phase spacing dynamically in less than one line frequency cycle (16.7 ms) in steady state and transient operating conditions.

42 ENGINEERING↗

Demonstration of Embedded Sensors in Ceramic Structures

The Transformational Challenge Reactor (TCR) program seeks to demonstrate an advanced 3D printed nuclear reactor core. A binder jet additive manufacturing process is used to fabricate the complex SiC ceramic components of the TCR core. After printing, the components are densified via chemical vapor infiltration (CVI). This process allows complex cavities to be created in which sensors can be placed at strategic locations. Inserting the sensors during the CVI process allows the sensors to be embedded within the component as it is infiltrated. The primary challenge for embedding the sensors is identifying the sensors and sensor sheath materials that can survive the temperatures (>1,000°C) and chemical exposure to H 2 and HCl during CVI. The embedded sensors that are being investigated for use during TCR operation include thermocouples, self-powered neutron detectors, and spatially distributed fiber-optic temperature sensors. This report describes the CVI materials compatibility tests and initial trials for embedding functional sensors. Mo is identified as the most suitable sensor sheath material based on its availability in small diameter tubing, relatively low neutron absorption cross section, and compatibility with H 2 , HCl, and the surrounding SiC matrix at the process temperatures. Amorphous SiO2 fiber-optic samples with Au and Cu metal coatings were successfully embedded in SiC along with bare fibers, although the metal coatings showed some evidence of localized melting during CVI. Initial experiments attempting to embed functional sensors showed that the sensors can be embedded in 3D printed SiC parts, but there are still challenges that must be overcome to ensure that the sensors and sensor sheaths do not fail during CVI. In particular, Nb-sheathed Mo-Nb thermocouples failed at temperatures far lower than expected despite thermodynamic calculations and materials compatibility tests that show the Nb sheath to be compatible with the CVI environment. One potential explanation for the large expansion of the Nb sheath could be related to hydride formation in the lower temperature region of the sheath. Future work will focus on Mo-sheathed thermocouples instead of Nb. The fiberoptic sensors tested during the instrumented experiment broke due to the lack of mechanical protection after their polymer-based coatings were vaporized. Future instrumented experiments will use metal-coated optical fibers for strain sensing to provide additional mechanical protection. However, custom coatings with higher melting points than commercially available Au and Cu might be required. Regardless, fiber-optic sensors are still candidates for spatially distributed temperature measurements since they can be inserted into an embedded metal sheath after CVI.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

Distributed Fiber Optics Measurements of Rock Deformation and Failure in Triaxial Tests

The implementation of distributed strain measurement methods in triaxial and uniaxial tests have demonstrated the development of strain localization, even at early stages. This implies that single point measurement methods are location dependent. The use of distributed methods is required not only to improve the interpreted constitutive parameters obtained from triaxial tests, but also to understand the implications of strain localization in the failure process. Here, this work uses optical fibers in triaxial tests. The developed distributed measurement method was implemented on granite, gabbro, and sandstone samples and tested under different confining pressures, reaching 200 MPa on the granite sample. Using a temporal resolution of 0.25 Hz and 5 mm of spatial resolution, the strain evolution at over 300 locations at the sample surface was measured during testing. When compared to point sensing methods, the use of optical fiber greatly increases the number of measurements at the surface of the sample, and their interpolation provides the entire deformation of the sample surface. In all the tests performed, strain localizations were revealed before failure. A three-dimensional interpretation of a test, combining an optical scan of the sample and the distributed measurements, show good correlation between the fractures and the strain localization.

58 GEOSCIENCES↗

TRANSENSOR: Transformer Real-time Assessment INtelligent System with Embedded Network of Sensors and Optical Readout. Final Report

Utilities across the world are wrestling with evolving market dynamics, population growth and climate change. Distributed Energy Resources (DERs) such as solar photovoltaics, distributed generators and energy storage systems are becoming important parts of the U.S. energy mix. These factors are driving an increasing need for low-cost grid asset monitoring. Aside from being costly, traditional utility monitoring systems are not sufficiently robust and do not provide real-time visibility into the condition of grid assets such as transformers. Lack of accurate real-time measurements on performance has resulted in the use of lagging indicators, such as oil sample analysis. To address this need, an innovative embedded optical sensing technology, Transformer Real-time Assessment Intelligent System (TRANSENSOR) was developed, validated and demonstrated in this project. To date, TRANSENSOR has focused on transformers but is extendable to other grid assets. In addition to the technology being embedded into new transformers during manufacturing, a retrofit configuration that can be installed on existing transformers in the field was also developed. It is anticipated that the ability to retrofit existing transformers will help accelerate adoption of the underlying TRANSENSOR technology. Phase 1 of the project focused on laboratory development and qualification of the technology. Following iterations and exploration of relevant optical sensing modalities and multiplexed configurations of interest for the transformer environment, an effective candidate configuration was agreed upon, down-selected and custom-designed for embedding into General Electric (GE) network transformers. Two new GE 500 kilovolt ampere (kVA), 27 kilovolt (kV) distribution network transformers were built with embedded fiber-optic (FO) sensors and successfully qualified per industry standards at GE’s Shreveport, Louisiana facility during Phase 1 of the project. Following the successful completion of Phase 1, the team proceeded to Phase 2, which focused on a field demonstration of the technology. Over Phase 2, the first new GE transformer built with embedded fiber-optic sensors was installed in an above-ground cage and connected to the grid at Con Edison’s Astoria facility. A second transformer equipped with TRANSENSOR was installed in an underground vault. Additionally, an older (1982 year model) GE transformer in an above-ground cage was retrofitted with fiber- optic sensors and reconnected to the grid at ConEd’s facility. Analysis of data acquired from the sensors showed interesting correlations with transformer loading. Additionally, key events such as transformer low-voltage network connection, primary-side energizing, and a pressure loss event from an oil sampling were detected by the TRANSENSOR system. Online data processing/feature extraction algorithms for the second transformer in the underground vault detected key features and event alerts that were transmitted through a wireless 4G connection. The remote deployment concept showed promising results with data collection running for a total of 8 months across the three (3) GE transformers instrumented for the Phase 2 field demonstration. This sets the stage well for further development and commercialization.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Enhanced imaging of electronic hot spots using quantum squeezed light

Detecting electronic hot spots is important for understanding the heat dissipation and thermal management of electronic and semiconductor devices. Optical thermoreflective imaging is being used to perform precise temporal and spatial imaging of heat on wires and semiconductor materials. We apply quantum squeezed light to perform thermoreflective imaging on micro-wires, surpassing the shot-noise limit of classical approaches. We obtain a far-field temperature sensing accuracy of 42 mK after 50 ms of averaging and show that a 256×256 pixel image can be constructed with such sensitivity in 10 min. We can further obtain single-shot temperature sensing of 1.6 K after only 10 μs of averaging, enabling a dynamical study of heat dissipation. Not only do the quantum images provide accurate spatiotemporal information about heat distribution but also the measure of quantum correlation provides additional information, inaccessible by classical techniques, which can lead to a better understanding of the dynamics. We apply the technique to both aluminum and niobium microwires and discuss the applications of the technique in studying electron dynamics at low temperatures.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Influences of the South American Low-Level Jet on the Convective Environment in Central Argentina Using a Convection-Permitting Simulation

This study documents the spatial and temporal distribution of the South American low-level jet (SALLJ) and quantifies its impact on the convective environment using a 6.5-month convection-permitting simulation during the Remote Sensing of Electrification, Lightning, And Mesoscale/Microscale Processes with Adaptive Ground Observations and Clouds, Aerosols, and Complex Terrain Interactions (RELAMPAGO-CACTI) campaigns. Overall, the simulation reproduces the observed SALLJ characteristics in central Argentina near the Sierras de Córdoba (SDC), a focal point for terrain-focused upscale growth. SALLJs most frequently occur in the summer with maxima to the northwest and east of the SDC and minima over the higher terrain. The shallower SALLJs (<1750 m) have a strong overnight skew, while the elevated jets are more equally spread throughout the day. SALLJ periods often have higher amounts of low-level moisture and instability compared to non-SALLJ periods, with these impacts increasing over time when the SALLJ is present and decreasing afterward. The SALLJ may enhance low-level wind shear magnitudes (particularly when accounting for the jet height); however, enhancement is somewhat limited due to the presence of speed shear in most situations. SALLJ periods are associated with low-level directional shear favorable for organized convection and an orientation of cloud-layer wind shear parallel to the terrain, which could favor upscale growth. A case study is shown in which the SALLJ influenced both the magnitude and direction of wind shear concurrent with convective upscale growth near the SDC. This study highlights the complex relationship between the SALLJ and its impacts during periods of widespread convection.

54 ENVIRONMENTAL SCIENCES↗

Xyce Parallel Electronic Simulator Users' Guide (Version 7.2)

This manual describes the use of the Xyce Parallel Electronic Simulator. Xyce has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers. A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models. Device models that are specifically tailored to meet Sandias needs, including some radiation-aware devices (for Sandia users only). Object-oriented code design and implementation using modern coding practices. Xyce is a parallel code in the most general sense of the phrase - a message passing parallel implementation - which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows.

42 ENGINEERING↗

Xyce Parallel Electronic Simulator Users' Guide (V.7.1)

This manual describes the use of the Xyce Parallel Electronic Simulator. Xyce has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: 1) Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers. 2) A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models. 3) Device models that are specifically tailored to meet Sandia's needs, including some radiation-aware devices (for Sandia users only). 4) Object-oriented code design and implementation using modern coding practices. Xyce is a parallel code in the most general sense of the phrase a message passing parallel implementation which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows.

42 ENGINEERING↗

Xyce Parallel Electronic Simulator Users' Guide (V. 7.3)

This manual describes the use of the Xyce Parallel Electronic Simulator. Xyce has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers; A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models; Device models that are specifically tailored to meet Sandia's needs, including some radiation-aware devices (for Sandia users only); Object-oriented code design and implementation using modern coding practices. Xyce is a parallel code in the most general sense of the phrase—a message passing parallel implementation—which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows.

42 ENGINEERING↗

Xyce Parallel Electronic Simulator Users' Guide Version 7.4

This manual describes the use of the Xyce Parallel Electronic Simulator. Xyce has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: • Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers. • A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models. • Device models that are specifically tailored to meet Sandia’s needs, including some radiation-aware devices (for Sandia users only). • Object-oriented code design and implementation using modern coding practices. Xyce is a parallel code in the most general sense of the phrase — a message passing parallel implementation — which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows.

42 ENGINEERING↗

Xyce™ Parallel Electronic Simulator Users' Guide, Version 7.5.

This manual describes the use of the Xyce Parallel Electronic Simulator. Xyce has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: (1) Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers. (2) A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models. (3) Device models that are specifically tailored to meet Sandia's needs, including some radiation-aware devices (for Sandia users only). (4) Object-oriented code design and implementation using modern coding practices. Xyce is a parallel code in the most general sense of the phrase — a message passing parallel implementation — which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows.

97 MATHEMATICS AND COMPUTING↗

Xyce™ Parallel Electronic Simulator Users' Guide (V.7.6)

This manual describes the use of the Xyce™ Parallel Electronic Simulator. Xyce™ has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: (1) Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers. (2) A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models. (3) Device models that are specifically tailored to meet Sandia's needs, including some radiation-aware devices (for Sandia users only). (4) Object-oriented code design and implementation using modern coding practices. Xyce™ is a parallel code in the most general sense of the phrase—a message passing parallel implementation—which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel eficiency is achieved as the number of processors grows.

97 MATHEMATICS AND COMPUTING↗

Xyce™ Parallel Electronic Simulator Users’ Guide, Version 7.8

This manual describes the use of the Xyce Parallel Electronic Simulator. Xyce has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: (1) Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers. (2) A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models. (3) Device models that are specifically tailored to meet Sandia’s needs, including some radiation-aware devices (for Sandia users only). (4) Object-oriented code design and implementation using modern coding practices. Xyce is a parallel code in the most general sense of the phrase — a message passing parallel implementation — which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows.

42 ENGINEERING↗

Xyce™ Parallel Electronic Simulator Users' Guide (V.7.9)

This manual describes the use of the Xyce Parallel Electronic Simulator. Xyce has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: • Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers. • A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models. • Device models that are specifically tailored to meet Sandia’s needs, including some radiation-aware devices (for Sandia users only). • Object-oriented code design and implementation using modern coding practices. Xyce is a parallel code in the most general sense of the phrase — a message passing parallel implementation — which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows.

42 ENGINEERING↗

Xyce™ Parallel Electronic Simulator Users’ Guide, Version 7.10

This manual describes the use of the Xyce Parallel Electronic Simulator. Xyce has been designed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers. This development has focused on improving capability over the current state-of-the-art in the following areas: • Capability to solve extremely large circuit problems by supporting large-scale parallel computing platforms (up to thousands of processors). This includes support for most popular parallel and serial computers. • A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms. This allows one to develop new types of analysis without requiring the implementation of analysis-specific device models. • Device models that are specifically tailored to meet Sandia’s needs, including some radiation-aware devices (for Sandia users only). • Object-oriented code design and implementation using modern coding practices. Xyce is a parallel code in the most general sense of the phrase — a message passing parallel implementation — which allows it to run efficiently a wide range of computing platforms. These include serial, shared-memory and distributed-memory parallel platforms. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows.

97 MATHEMATICS AND COMPUTING↗

Making sense of vacancy correlations with single-crystal diffuse scattering data

Local ordering of atoms within a crystalline structure is increasingly recognized as essential to understanding the properties of a variety of interesting materials. This is shown by the success of pair distribution function (PDF) analysis of scattering data from powder samples to investigate departures from perfectly crystalline order (Billinge & Kanatzidis, 2004; Egami & Billinge, 2012). Diffuse scattering from single crystals can also be a powerful probe of local order, potentially providing key information that would be difficult to obtain from PDF methods; however, difficulties in both measurement and interpretation of data have too often restricted their use by a larger community. In this issue of IUCrJ, Rothet al.(2020) demonstrate how simple concepts can be applied to better understand single-crystal diffuse scattering from half-Heusler systems.

36 MATERIALS SCIENCE↗