Reactions and diffusion between an Al film and a Ti substrate
The reaction between a 0.5 to 1.0 micron Al film and a thick Ti substrate to form TiAl3 occurs very rapidly on heating to 635 C and causes the Al to be confined to the surface region. After heating to 900 C, Ti3Al is formed with little release of Al into alpha-Ti. Further annealing at 900 C eventually causes the Ti3Al phase to decompose and a substantial amount of Al is released into alpha-Ti. The interdiffusion coefficient for Al in alpha-Ti at 900 C was found to increase by less than one order of magnitude as Al is varied from 0 to 20 at. pct. These data were obtained from the (101) X-ray diffraction intensity band using polycrystalline samples. Improvements in the analysis of X-ray diffraction data for the determination of composition profiles are discussed.