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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 541 records · Page 30
All sourcesNASA NTRSDOE OSTI
DOE OSTI2023

Design of an Emittance Compensation Superconducting Magnet Package for LCLS-II-HE's SRF Photo-Injector

An SRF photo-injector (low frequency, quarter-wave resonator plus emittance compensation magnet) is planned for LCLS-II-HE as it can provide a higher cathode gradient and better electron beam quality than other types of CW electron guns. The magnet package is located immediately downstream of the SRF cavity, and incorporates a solenoid doublet, bucking coils for reduction of the fringe field, normal/skew quadrupoles and horizontal/vertical dipoles. All the magnets are wound of NbTi wire and operate in liquid helium environment. The solenoid package is located inside the SRF gun cryomodule. Design considerations include space limitations, optimal emittance compensation, the magnetic field limits in the superconducting wire and quench protection. The solenoid coils must provide a peak excitation > 25 kgauss 2 ·cm, a fringe field < 20 gauss at the wall of the SRF cavity, an integrated dipole field < 90 gauss·cm and an integrated quadrupole field < 10 gauss. As a result, a genetic algorithm was used to optimize the solenoid design. Correction dipoles and quadrupoles were designed using coil dominated Walstrom style coils.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
NASA NTRS1997

A Packaged Silicon MEMS Vibratory Gyroscope for Microspacecraft

In this paper, we present recent work on the design, fabrication, and packaging of a silicon MIcro-Electro-Mechanical System (MEMS) microgyroscope designed for space applications. A hermetically sealed package that houses the microgyroscope and most of its control electronics has been built and tested.

MEMS micro-electromechanical system microspacecraf↗
NASA NTRS2005

Visualization Methods for Viability Studies of Inspection Modules for the Space Shuttle

An effective simulation of an object, process, or task must be similar to that object, process, or task. A simulation could consist of a physical device, a set of mathematical equations, a computer program, a person, or some combination of these. There are many reasons for the use of simulators. Although some of the reasons are unique to a specific situation, there are many general reasons and purposes for using simulators. Some are listed but not limited to (1) Safety, (2) Scarce resources, (3) Teaching/education, (4) Additional capabilities, (5) Flexibility and (6) Cost. Robot simulators are in use for all of these reasons. Virtual environments such as simulators will eliminate physical contact with humans and hence will increase the safety of work environment. Corporations with limited funding and resources may utilize simulators to accomplish their goals while saving manpower and money. A computer simulation is safer than working with a real robot. Robots are typically a scarce resource. Schools typically don t have a large number of robots, if any. Factories don t want the robots not performing useful work unless absolutely necessary. Robot simulators are useful in teaching robotics. A simulator gives a student hands-on experience, if only with a simulator. The simulator is more flexible. A user can quickly change the robot configuration, workcell, or even replace the robot with a different one altogether. In order to be useful, a robot simulator must create a model that accurately performs like the real robot. A powerful simulator is usually thought of as a combination of a CAD package with simulation capabilities. Computer Aided Design (CAD) techniques are used extensively by engineers in virtually all areas of engineering. Parts are designed interactively aided by the graphical display of both wireframe and more realistic shaded renderings. Once a part s dimensions have been specified to the CAD package, designers can view the part from any direction to examine how it will look and perform in relation to other parts. If changes are deemed necessary, the designer can easily make the changes and view the results graphically. However, a complex process of moving parts intended for operation in a complex environment can only be fully understood through the process of animated graphical simulation. A CAD package with simulation capabilities allows the designer to develop geometrical models of the process being designed, as well as the environment in which the process will be used, and then test the process in graphical animation much as the actual physical system would be run . By being able to operate the system of moving and stationary parts, the designer is able to see in simulation how the system will perform under a wide variety of conditions. If, for example, undesired collisions occur between parts of the system, design changes can be easily made without the expense or potential danger of testing the physical system.

Mobasher, Amir A.↗
NASA NTRS1989

Hybrid propulsion technology program. Volume 2: Technology definition package

A concept design study was performed to configure two sizes of hybrid boosters; one which duplicates the advanced shuttle rocket motor vacuum thrust time curve and a smaller, quarter thrust level booster. Two sizes of hybrid boosters were configured for either pump-fed or pressure-fed oxygen feed systems. Performance analyses show improved payload capability relative to a solid propellant booster. Size optimization and fuel safety considerations resulted in a 4.57 m (180 inch) diameter large booster with an inert hydrocarbon fuel. The preferred diameter for the quarter thrust level booster is 2.53 m (96 inches). The demonstration plan would culminate with test firings of a 3.05 m (120 inch) diameter hybrid booster.

Jensen, Gordon E.↗
NASA NTRS1990

Examples of finite element mesh generation using SDRC IDEAS

IDEAS (Integrated Design Engineering Analysis Software) offers a comprehensive package for mechanical design engineers. Due to its multifaceted capabilities, however, it can be manipulated to serve the needs of electrical engineers, also. IDEAS can be used to perform the following tasks: system modeling, system assembly, kinematics, finite element pre/post processing, finite element solution, system dynamics, drafting, test data analysis, and project relational database.

Zapp, John↗
NASA NTRS2010

Evaluation of 3D Plus Packaging Test Structures for NASA Goddard Space Flight Center

Environmental tests were performed on packaging test structures designed and manufactured for ESA and CNES by 3D PLus ELectronics. The design provided circuit elements that acted as thermal, mechanical and moisture sensors. Other design features showed the compatibility of the packaging with chip passives, bare electronic dice and plastic encapsulated microcircuits packaged together in an innovative, stacked multichip module. The NASA GSFC testing augmented long duration testing on the same units carried out by ESA and CNES. The NASA portion demonstrated packaging stability over temperature, in moisture, with voltage stress, in shock and in vibration environments.

Plante, Jeannette↗
NASA NTRS2012

Development and Validation of an Interactive Liner Design and Impedance Modeling Tool

The Interactive Liner Impedance Analysis and Design (ILIAD) tool is a LabVIEW-based software package used to design the composite surface impedance of a series of small-diameter quarter-wavelength resonators incorporating variable depth and sharp bends. Such structures are useful for packaging broadband acoustic liners into constrained spaces for turbofan engine noise control applications. ILIAD s graphical user interface allows the acoustic channel geometry to be drawn in the liner volume while the surface impedance and absorption coefficient calculations are updated in real-time. A one-dimensional transmission line model serves as the basis for the impedance calculation and can be applied to many liner configurations. Experimentally, tonal and broadband acoustic data were acquired in the NASA Langley Normal Incidence Tube over the frequency range of 500 to 3000 Hz at 120 and 140 dB SPL. Normalized impedance spectra were measured using the Two-Microphone Method for the various combinations of channel configurations. Comparisons between the computed and measured impedances show excellent agreement for broadband liners comprised of multiple, variable-depth channels. The software can be used to design arrays of resonators that can be packaged into complex geometries heretofore unsuitable for effective acoustic treatment.

Howerton, Brian M.↗
DOE OSTI2021

Packaging of an 8-kV Silicon Carbide Diode Module with Double-Side Cooling and Sintered-Silver Joints

Packaging innovations are needed for medium-voltage wide bandgap power semiconductor modules to enable their adaptation in grid applications. A unique challenge for packaging medium-voltage power modules is managing the trade-off between insulation demand and heat dissipation. The focus of this work was on developing a packaging innovation that improves the module heat dissipation and offers more flexibility to its insulation design. Two strategies were explored for the packaging of an 8-kV SiC diode rectifier module:(1) double-side cooling and (2) sintered-silver bonding. Double-side cooling was realized by using short metal posts rather than long and thin wire bonds for device interconnection, forming a low-profile package with devices sandwiched between two insulated metal substrates. Sintered-silver bonding enabled the devices to function reliably at over 250 °C. Simulations of the packaged module showed a low interconnect inductance of 2.67 nH and a 50% less heat transfer coefficient required to cool the chips. Prototypes of the module were fabricated, and preliminary electrical testing results validated the package design.

27 ARPA - Advanced Research Projects Agency-Energy↗
NASA NTRS1985

An advanced solid state pressure transducer for high reliability SSME application

New methods to advance the state-of-the-art of pressure sensors for the Space Shuttle Main Engine were demonstrated. The results of the feasibility and breadboard demonstration phase and the current status of the research development prototype follow-on phase are presented. A technology breakthrough utilizing silicon piezoresistive technology was achieved in the first phase. A transducer design concept for the SSME application utilizes packaging materials with similar thermal coefficients of expansion and maintains the transducer seals primarily in compression. The silicon chip design will provide dual sensing outputs with laser trimmable integrated compensating electronics. The silicon resistor ion implant dose was customized for the SSME temperature requirement. A basic acoustic modeling software program was developed to evaluate the frequency response characteristics for the package design.

Johnson, R. L.↗
NASA NTRS1974

Apollo experience report: A use of network simulation techniques in the design of the Apollo lunar surface experiments package support system

A case study of data-communications network modeling and simulation is presented. The applicability of simulation techniques in early system design phases is demonstrated, and the ease with which model parameters can be changed and comprehensive statistics gathered is shown. The discussion of the model design and application also yields an insight into the design and implementation of the Apollo lunar surface experiments package ground-support system.

Gustafson, R. A.↗
NASA NTRS2000

Automation of the CFD Process on Distributed Computing Systems

A script system was developed to automate and streamline portions of the CFD process. The system was designed to facilitate the use of CFD flow solvers on supercomputer and workstation platforms within a parametric design event. Integrating solver pre- and postprocessing phases, the fully automated ADTT script system marshalled the required input data, submitted the jobs to available computational resources, and processed the resulting output data. A number of codes were incorporated into the script system, which itself was part of a larger integrated design environment software package. The IDE and scripts were used in a design event involving a wind tunnel test. This experience highlighted the need for efficient data and resource management in all parts of the CFD process. To facilitate the use of CFD methods to perform parametric design studies, the script system was developed using UNIX shell and Perl languages. The goal of the work was to minimize the user interaction required to generate the data necessary to fill a parametric design space. The scripts wrote out the required input files for the user-specified flow solver, transferred all necessary input files to the computational resource, submitted and tracked the jobs using the resource queuing structure, and retrieved and post-processed the resulting dataset. For computational resources that did not run queueing software, the script system established its own simple first-in-first-out queueing structure to manage the workload. A variety of flow solvers were incorporated in the script system, including INS2D, PMARC, TIGER and GASP. Adapting the script system to a new flow solver was made easier through the use of object-oriented programming methods. The script system was incorporated into an ADTT integrated design environment and evaluated as part of a wind tunnel experiment. The system successfully generated the data required to fill the desired parametric design space. This stressed the computational resources required to compute and store the information. The scripts were continually modified to improve the utilization of the computational resources and reduce the likelihood of data loss due to failures. An ad-hoc file server was created to manage the large amount of data being generated as part of the design event. Files were stored and retrieved as needed to create new jobs and analyze the results. Additional information is contained in the original.

Tejnil, Ed↗
NASA NTRS2007

Compact Packaging of Photonic Millimeter-Wave Receiver

A carrier structure made from a single silicon substrate is the basis of a compact, lightweight, relatively inexpensive package that holds the main optical/electronic coupling components of a photonic millimeter-wave receiver based on a lithium niobate resonator disk. The design of the package is simple and provides for precise relative placement of optical components, eliminating the need for complex, bulky positioning mechanisms like those commonly used to align optical components to optimize focus and coupling. Although a prototype of the package was fabricated as a discrete unit, the design is amenable to integration of the package into a larger photonic and/or electronic receiver system. The components (see figure) include a lithium niobate optical resonator disk of 5-mm diameter and .200- m thickness, positioned adjacent to a millimeter- wave resonator electrode. Other components include input and output coupling prisms and input and output optical fibers tipped with ball lenses for focusing and collimation, respectively. Laser light is introduced via the input optical fiber and focused into the input coupling prism. The input coupling prism is positioned near (but not in contact with) the resonator disk so that by means of evanescent-wave coupling, the input laser light in the prism gives rise to laser light propagating circumferentially in guided modes in the resonator disk. Similarly, a portion of the circumferentially propagating optical power is extracted from the disk by evanescent-wave coupling from the disk to the output coupling prism, from whence the light passes through the collimating ball lens into the output optical fiber. The lens-tipped optical fibers must be positioned at a specified focal distance from the prisms. The optical fibers and the prisms must be correctly positioned relative to the resonator disk and must be oriented to obtain the angle of incidence (55 in the prototype) required for evanescent-wave coupling of light into and out of the desired guided modes in the resonator disk. To satisfy all these requirements, precise alignment features are formed in the silicon substrate by use of a conventional wet-etching process. These features include a 5-mm-diameter, 50- m-deep cavity that holds the disk; two trapezoidal-cross-section recesses for the prisms; and two grooves that hold the optical fibers at the correct positions and angles relative to the prisms and disk. The fiber grooves contain abrupt tapers, near the prisms, that serve as hard stops for positioning the lenses at the focal distance from the prisms. There are also two grooves for prismadjusting rods. The design provides a little slack in the prism recesses for adjusting the positions of the prisms by means of these rods to optimize the optical coupling.

Nguyen, Hung↗
NASA NTRS2003

High Power Laser Diode Arrays for 2-Micron Solid State Coherent Lidars Applications

Laser diode arrays are critical components of any diode-pumped solid state laser systems, constraining their performance and reliability. Laser diode arrays (LDAs) are used as the pump source for energizing the solid state lasing media to generate an intense coherent laser beam with a high spatial and spectral quality. The solid state laser design and the characteristics of its lasing materials define the operating wavelength, pulse duration, and power of the laser diodes. The pump requirements for high pulse energy 2-micron solid state lasers are substantially different from those of more widely used 1-micron lasers and in many aspects more challenging [1]. Furthermore, the reliability and lifetime demanded by many coherent lidar applications, such as global wind profiling from space and long-range clear air turbulence detection from aircraft, are beyond the capability of currently available LDAs. In addition to the need for more reliable LDAs with longer lifetime, further improvement in the operational parameters of high power quasi-cw LDAs, such as electrical efficiency, brightness, and duty cycle, are also necessary for developing cost-effective 2-micron coherent lidar systems for applications that impose stringent size, heat dissipation, and power constraints. Global wind sounding from space is one of such applications, which is the main driver for this work as part of NASA s Laser Risk Reduction Program. This paper discusses the current state of the 792 nm LDA technology and the technology areas being pursued toward improving their performance. The design and development of a unique characterization facility for addressing the specific issues associated with the LDAs for pumping 2-micron coherent lidar transmitters and identifying areas of technological improvement will be described. Finally, the results of measurements to date on various standard laser diode packages, as well as custom-designed packages with potentially longer lifetime, will be reported.

Amzajerdian, Farzin↗
DOE OSTI2021

Thermal Hydraulic Experimental Test Article (FY21 Final Report)

The Thermal Hydraulic Experimental Test Article (THETA) is a facility that will be used to develop sodium components and instrumentation as well as acquire experimental data for validation of reactor thermal hydraulic and safety analysis codes. The facility will simulate nominal conditions as well as protected/unprotected loss of flow accidents in a sodium-cooled fast reactor (SFR). High fidelity distributed temperature profiles of the developed flow field will be acquired with Rayleigh backscatter based optical fiber temperature sensors. The facility is being designed in partnership with systems code experts to tailor the experiment to ensure the most relevant and highest quality data for code validation. THETA is comprised of a traditional primary and secondary system. The primary system is submerged in the pool of sodium and consists of a pump, electrically heated core, intermediate heat exchanger, and connected piping and thermal barriers (redan). The secondary system, located outside of the sodium pool, consists of a pump, sodium to air heat exchanger, and connected piping and valves. Figure 1 illustrates the main components of the primary system. THETA has been installed in the Mechanisms Engineering Test Loop (METL) with the primary system in the 28 inch Test Vessel #4, Figure 2 and Figure 3. Since the FY20 THETA status report, further water shakedown testing was performed, some final welding modifications were performed, all system components were sanitized, dry assembled, and commissioned. The THETA submersible electromagnetic flowmeter was welded closed to hermetically seal internal components from sodium followed by a helium leak check for the final time. Following installation of THETA into vessel #4, all data acquisition and control systems were brought online and commissioned at room temperature in the argon gas space of the empty vessel. The vessel zone 1 heaters were reinstalled and the flange was then insulated. The vessel 4 heaters were brought to a temperature of 100 °C and the THETA pump was jogged at 600 RPM to ensure it was functioning correctly. The secondary, AC Conduction based electromagnetic pump from CMI Novacast (product number CA-15) was ordered and will be delivered in late calendar year 2021. The custom designed permanent magnet based secondary flowmeter was designed, a drawing package and manufacturing specification created and quote requested from a machine shop. The intermediate heat exchanger design was completed and a drawing package is currently in progress. During the middle of calendar year 2021 the Building 308 sodium scrubber system was shut down in order to replaced some corroded piping and facilitate improvements on the system, thus requiring the sodium in METL to remain frozen. This has imposed a delay in filling vessel 4 with sodium to begin THETA testing. Sodium testing is expected to begin in early fiscal year 2022 as all THETA primary systems are operational.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
DOE OSTI2020

BioSTEAMDevelopmentGroup/thermosteam

BioSTEAM is a fast and flexible package for the design, simulation, and techno-economic analysis of biorefineries under uncertainty. BioSTEAM’s framework is built to streamline and automate early-stage technology evaluations and to enable rigorous sensitivity and uncertainty analyses. Complete biorefinery configurations are available at the Bioindustrial-Park GitHub repository, BioSTEAM’s premier repository for biorefinery models and results. The long-term growth and maintenance of BioSTEAM is supported through both community-led development and the research institutions invested in BioSTEAM. Through the open-source and community-lead platform, BioSTEAM aims to foster communication and transparency within the biorefinery research community for an integrated effort to expedite the evaluation of candidate biofuels and bioproducts. Additionally, an agile life cycle assessment (LCA) platform has been designed to interface with BioSTEAM, BioSTEAM-LCA. This open-source, installable package allows users to perform streamlined LCAs of biorefineries. The focus of BioSTEAM-LCA is to streamline and automate early-stage environmental impact analyses of processes and technologies, and to enable rigorous sensitivity and uncertainty analyses linking process design, performance, economics, and environmental impacts. ThermoSTEAM is a standalone thermodynamic engine capable of estimating mixture properties, solving thermodynamic phase equilibria, and modeling stoichiometric reactions. ThermoSTEAM builds upon chemicals, the chemical properties component of the Chemical Engineering Design Library, with a robust and flexible framework that facilitates the creation of property packages. The Biorefinery Simulation and Techno-Economic Analysis Modules (BioSTEAM) is dependent on ThermoSTEAM for the simulation of unit operations.

Cortes-Peña, Yoel↗
NASA NTRS1991

A portable Ku-band front-end test package for beam-waveguide antenna performance evaluation

A 34-m beam-waveguide (BWG) antenna has been built a Deep Space Station 13 (DDS 13) in the Goldstone Deep Space Communications Complex. This antenna is designed to be efficient at X-, Ku-, and Ka-bands, and it is the first NASA tracking antenna to use a BWG design. The design of a Ku-band test package for the new BWG antenna at 11.7-12.2 GHz is presented. Results of linear polarization measurements with the test package on the ground are also presented. This report is the fifth in a series of articles concerned with test package design and performance.

Otoshi, T. Y.↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗