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All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Low voltage AC electroluminescence in silicon MOS capacitors

Low power silicon based light source and detector are attractive for on-chip photonic circuits given their ease of process integration. However, conventional silicon light emitting diodes emit photons with energies near the band edge where the corresponding silicon photodetectors lack responsivity. On the other hand, previously reported hot carrier electroluminescent silicon devices utilizing a reverse biased diode require high operating voltages. Here, we investigate hot carrier electroluminescence in silicon metal–oxide–semiconductor capacitors operating under transient voltage conditions. Further, during each voltage transient, large energy band bending is created at the edge of the source contact, much larger than what is achievable at a steady state. As a result, electrons and holes are injected efficiently from a single source contact into the silicon channel at the corresponding voltage transient, where they subsequently undergo impact ionization and phonon-assisted interband recombination. Notably, we show low voltage operation down to 2.8 V by using a 20 nm thick high-κ gate dielectric. We show further voltage scaling is possible by reducing the gate dielectric thickness, thus presenting a low voltage platform for silicon optoelectronic integrated circuits.

42 ENGINEERING↗
NASA NTRS1995

Secondary ion mass spectrometry (SIMS) analysis of hypervelocity microparticle impact sites on LDEF surfaces

Two dimensional elemental ion maps have been recorded for hundreds of microparticle impact sites and contamination features on LDEF surfaces. Since the majority of the analyzed surfaces were metal-oxide-silicon (MOS) impact detectors from the Interplanetary Dust Experiment, a series of 'standard' and 'blank' analyses of these surfaces are included. Hypervelocity impacts of forsterite olivine microparticles on activated flight sensors served as standards while stylus and pulsed laser simulated 'impacts' served as analytical blanks. Results showed that despite serious contamination issues, impactor residues can be identified in greater than 1/3 of the impact sites. While aluminum oxide particles could not be detected on aluminum surfaces, they were detected on germanium surfaces from row 12. Remnants of manmade debris impactors consisting of paint chips and bits of metal were identified on surfaces from LDEF Rows 3 (west or trailing side), 6 (south), 9 (ram or leading side), 12 (north) and the space end. Higher than expected ratios of manmade microparticle impacts to total microparticle impacts were found on the space end and the trailing side. These results were consistent with time-tagged and time-segregated microparticle impact data from the IDE and other LDEF experiments. A myriad of contamination interferences were identified and their effects on impactor debris identification mitigated during the course of this study. These interferences include pre-, post and inflight deposited surface contaminants as well as indigenous heterogeneous material contaminants. Non-flight contaminations traced to human origins, including spittle and skin oils, contributed significant levels of alkali-rich carbonaceous interferences. A ubiquitous layer of in-flight deposited silicaceous contamination varied in thickness with location on LDEF, even on a micro scale. In-flight deposited (low velocity) contaminants include urine droplets and bits of metal film from eroded thermal blankets.

Simon, C. G.↗
NASA NTRS2005

Impact of Device Scaling on Deep Sub-micron Transistor Reliability: A Study of Reliability Trends using SRAM

As microelectronics are scaled in to the deep sub-micron regime, users of advanced technology CMOS, particularly in high-reliability applications, should reassess how scaling effects impact long-term reliability. An experimental based reliability study of industrial grade SRAMs, consisting of three different technology nodes, is proposed to substantiate current acceleration models for temperature and voltage life-stress relationships. This reliability study utilizes step-stress techniques to evaluate memory technologies (0.25mum, 0.15mum, and 0.13mum) embedded in many of today's high-reliability space/aerospace applications. Two acceleration modeling approaches are presented to relate experimental FIT calculations to Mfr's qualification data.

CMOS integrated circuits↗
NASA NTRS2005

Nanoscale Materials Make for Large-Scale Applications

Since its dawning days, NASA has been at the forefront of developing and improving materials for aerospace applications. In particular, NASA requires dramatic advancements in material properties to enhance the performance, robustness, and reliability of its launch vehicles, spacecraft, and the International Space Station. Such advancements over the years include noise-abatement materials, fire-resistant fibers, heat-absorbing insulation, and light-but-strong moldable composites. In 1991, a new carbon fiber called a carbon nanotube was discovered and fully substantiated by a Japanese electron microscopist. Its dramatic strength and low density (20 times the tensile strength and one-sixth the density of steel) were turning the heads of materials scientists and engineers all around the world, including those who developed equipment for NASA. While NASA did not invent the carbon nanotube, it is working to advance the fibrous material for widespread, low-cost application in sending humans beyond low-Earth orbit, well into the outer reaches of the universe. Carbon nanotubes have the potential to reduce spacecraft weight by 50 percent or more, by replacing the heavier copper wires currently used, according to NASA scientists. Furthermore, NASA researchers have reported a new method for producing integrated circuits using carbon nanotubes instead of copper for interconnects. This technology has the capability to extend the life of the silicon chip industry by 10 years. Because of this growing interest in carbon nanotubes and their perpetual possibilities, NASA has funded both internal and external research in this field.

Source record↗
NASA NTRS2004

CMOS VLSI Active-Pixel Sensor for Tracking

An architecture for a proposed active-pixel sensor (APS) and a design to implement the architecture in a complementary metal oxide semiconductor (CMOS) very-large-scale integrated (VLSI) circuit provide for some advanced features that are expected to be especially desirable for tracking pointlike features of stars. The architecture would also make this APS suitable for robotic- vision and general pointing and tracking applications. CMOS imagers in general are well suited for pointing and tracking because they can be configured for random access to selected pixels and to provide readout from windows of interest within their fields of view. However, until now, the architectures of CMOS imagers have not supported multiwindow operation or low-noise data collection. Moreover, smearing and motion artifacts in collected images have made prior CMOS imagers unsuitable for tracking applications. The proposed CMOS imager (see figure) would include an array of 1,024 by 1,024 pixels containing high-performance photodiode-based APS circuitry. The pixel pitch would be 9 m. The operations of the pixel circuits would be sequenced and otherwise controlled by an on-chip timing and control block, which would enable the collection of image data, during a single frame period, from either the full frame (that is, all 1,024 ~ 1,024 pixels) or from within as many as 8 different arbitrarily placed windows as large as 8 by 8 pixels each. A typical prior CMOS APS operates in a row-at-a-time ( grolling-shutter h) readout mode, which gives rise to exposure skew. In contrast, the proposed APS would operate in a sample-first/readlater mode, suppressing rolling-shutter effects. In this mode, the analog readout signals from the pixels corresponding to the windows of the interest (which windows, in the star-tracking application, would presumably contain guide stars) would be sampled rapidly by routing them through a programmable diagonal switch array to an on-chip parallel analog memory array. The diagonal-switch and memory addresses would be generated by the on-chip controller. The memory array would be large enough to hold differential signals acquired from all 8 windows during a frame period. Following the rapid sampling from all the windows, the contents of the memory array would be read out sequentially by use of a capacitive transimpedance amplifier (CTIA) at a maximum data rate of 10 MHz. This data rate is compatible with an update rate of almost 10 Hz, even in full-frame operation

Pain, Bedabrata↗
DOE OSTI2020

FPDeep: Scalable Acceleration of CNN Training on Deeply-Pipelined FPGA Clusters

In this paper, we propose a framework called FPDeep, which uses a hybrid of model and layer paral- lelism to configure distributed reconfigurable clusters to train DNNs. This approach has numerous benefits. First, the design does not suffer from batch size growth. Second, novel workload and weight partitioning leads to balanced loads of both among nodes. And third, the entire system is fine-grained pipeline. This leads to high parallelism and utilization and also minimizes the time features need to be cached while waiting for back-propagation.

Wang, Tianqi↗
NASA NTRS2004

Background Count Rates and the Anti-Coincidence Detector on the Instrument on Astro-E2

Minimum ionizing particles incident on the XRS microcalorimeter array will deposit energy in the pixels on the same scale as an x-ray photon and would be confused with x-rays without an anti-coincidence detector. The XRS anti-coincidence detector is a silicon ionization detector placed directly behind the calorimeter array. Given an isotropic particle flux, 98% of those particles that pass through a calorimeter pixel will also deposit energy in the anti-coincidence detector. Particle events that are not rejected by coincidence are those that pass through at small angles relative to the plane of the array, and thus deposit more energy. Modeling with GEANT4 showed that only 0.1% of all protons incident on the array miss the anti-coincidence detector yet deposit less than 10 keV in a pixel. The unrejected background will thus be dominated by secondary events; we will provide an estimate of this rate. Protons incident on the thick silicon frame around the active area of the array deposit enough energy t o heat the whole chip slightly. This results in small simultaneous pulses on multiple pixels. These can be easily rejected by pixel-to-pixel coincidence. We will discuss the impact of these events on the instrument dead time and will present the expected rate. We will present laboratory background data demonstrating the performance of the anti-coincidence detector and the effectiveness of coincidence analysis in the laboratory environment.

Kilbourne, C. A.↗
NASA NTRSDate not supplied

Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated Circuits

A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/- 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.

DC Powered Oven↗
NASA NTRS2012

Fabrication of a Silicon Backshort Assembly for Waveguide-Coupled Superconducting Detectors

The Cosmology Large Angular Scale Surveyor (CLASS) is a ground-based instrument that will measure the polarization of the cosmic microwave background to search for evidence for gravitational waves from a posited epoch of inflation early in the Universe s history. This measurement will require integration of superconducting transition-edge sensors with microwave waveguide inputs with excellent control of systematic errors, such as unwanted coupling to stray signals at frequencies outside of a precisely defined microwave band. To address these needs we present work on the fabrication of micromachined silicon, producing conductive quarter-wave backshort assemblies for the CLASS 40 GHz focal plane. Each 40 GHz backshort assembly consists of three degeneratively doped silicon wafers. Two spacer wafers are micromachined with through-wafer vias to provide a 2.04 mm long square waveguide delay section. The third wafer terminates the waveguide delay in a short. The three wafers are bonded at the wafer level by Au-Au thermal compression bonding then aligned and flip chip bonded to the CLASS detector at the chip level. The micromachining techniques used have been optimized to create high aspect ratio waveguides, silicon pillars, and relief trenches with the goal of providing improved out of band signal rejection. We will discuss the fabrication of integrated CLASS superconducting detector chips with the quarter-wave backshort assemblies.

Crowe, Erik J.↗
DOE OSTI2021

High-Performance Piezoelectric MEMS Manufacturing & Application on Micro Power Generators (CRADA Final Report)

This project aimed to develop and characterize a micro-fabrication technology for wafer-scale heterogeneous integration of bulk piezoelectric materials on silicon substrates that could enable manufacturing of high-performance micro transducers. Typical technical challenges for piezoelectric microfabrication technologies are high-temperature processing, non-uniform film quality, and low process repeatability, which will be addressed during this project. Progress was made on preliminary research towards development of a technology platform that will enable a new micro-fabrication process to provide the highest electromechanical coupling among any other thin/thick-film deposition methods available today. This work has tested and characterized samples that we hope will further our goal of refining and enabling existing micro transducers to achieve unprecedentedly high performance. This project focused solely on the characterization of the proposed microfabrication process technology, and it did not consist of design or manufacturing of new transducers, such as sensors, actuators or energy harvesters based on this fabrication process. Future work will be aimed at the research and development of process steps specifically to enable integration of on-chip electronics with piezoelectric materials.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Energy efficient photonic memory based on electrically programmable embedded III-V/Si memristors: switches and filters

Abstract Over the past few years, extensive work on optical neural networks has been investigated in hopes of achieving orders of magnitude improvement in energy efficiency and compute density via all-optical matrix-vector multiplication. However, these solutions are limited by a lack of high-speed power power-efficient phase tuners, on-chip non-volatile memory, and a proper material platform that can heterogeneously integrate all the necessary components needed onto a single chip. We address these issues by demonstrating embedded multi-layer HfO 2 /Al 2 O 3 memristors with III-V/Si photonics which facilitate non-volatile optical functionality for a variety of devices such as Mach-Zehnder Interferometers, and (de-)interleaver filters. The Mach-Zehnder optical memristor exhibits non-volatile optical phase shifts > π with ~33 dB signal extinction while consuming 0 electrical power consumption. We demonstrate 6 non-volatile states each capable of 4 Gbps modulation. (De-) interleaver filters were demonstrated to exhibit memristive non-volatile passband transformation with full set/reset states. Time duration tests were performed on all devices and indicated non-volatility up to 24 hours and beyond. We demonstrate non-volatile III-V/Si optical memristors with large electric-field driven phase shifts and reconfigurable filters with true 0 static power consumption. As a result, co-integrated photonic memristors offer a pathway for in-memory optical computing and large-scale non-volatile photonic circuits.

Cheung, Stanley (ORCID:0000000248860013)↗
DOE OSTI2023

Vision-based localization for cooperative robot-CNC hybrid manufacturing

Wire and arc additive manufacturing (WAAM) has shown promise in recent years for producing large-scale parts with higher deposition rates than other additive processes. WAAM is often combined with subtractive machining to form a hybrid manufacturing process. This hybrid process can be realized by retrofitting computer numerical control (CNC) machines with deposition heads, adding spindles and deposition heads to robots, or developing part localization methods to transfer parts from an additive cell to a CNC machine. Here, a novel, robot-CNC hybrid configuration is introduced where a maneuverable robot is placed in front of a CNC machine to deposit material within the machine envelop. Furthermore, this method removes the need for part localization and the extensive machine modifications required for retrofitting; however, the problem of robot localization is also added. In this work, the effects of error in vision-based, contactless robot localization on machining parameters in a robot-machine hybrid process were studied. Performance was characterized on an implementation of this system using classical computer vision techniques. In addition, machining simulations were conducted to evaluate the effects of image-induced error on chip thickness, material removal rate, and machining allowance. Initial tests show that computer vision could adequately locate a robot for the hybrid WAAM process within .5 mm.

Hybrid manufacturing↗
DOE OSTI2022

System-on-chip approach microwave imaging reflectometer on DIII-D tokamak

System-on-chip millimeter wave integrated circuit technology is used on the two-dimensional millimeter-wave imaging reflectometer (MIR) upgrade for density fluctuation imaging on the DIII-D tokamak fusion plasma. Customized CMOS chips have been successfully developed for the transmitter module and receiver module array, covering the 55–75 GHz working band. The transmitter module has the capability of simultaneously launching eight tunable probe frequencies (>0 dBm output power each). The receiver enclosure contains 12 receiver modules in two vertical lines. The quasi-optical local oscillator coupling of previous MIR systems has been replaced with an internal active frequency multiplier chain for improved local oscillator power delivery and flexible installation in a narrow space together with improved shielding against electromagnetic interference. The 55–75 GHz low noise amplifier, used between the receiver antenna and the first-stage mixer, significantly improves module sensitivity and suppresses electronics noise. The receiver module has a 20 dB gain improvement compared with the mini-lens approach and better than –75 dBm sensitivity, and its electronics noise temperature has been reduced from 55 000 K down to 11 200 K. Further, the V-band MIR system is developed for co-located multi-field investigation of MHD-scale fluctuations in the pedestal region with W-band electron cyclotron emission imaging on DIII-D tokamak.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2023

Modular chip-integrated photonic control of artificial atoms in diamond waveguides

A central goal in creating long-distance quantum networks and distributed quantum computing is the development of interconnected and individually controlled qubit nodes. Atom-like emitters in diamond have emerged as a leading system for optically networked quantum memories, motivating the development of visible-spectrum, multi-channel photonic integrated circuit (PIC) systems for scalable atom control. However, it has remained an open challenge to realize optical programmability with a qubit layer that can achieve high optical detection probability over many optical channels. Here, we address this problem by introducing a modular architecture of piezoelectrically actuated atom-control PICs (APICs) and artificial atoms embedded in diamond nanostructures designed for high-efficiency free-space collection. The high-speed four-channel APIC is based on a splitting tree mesh with triple-phase shifter Mach–Zehnder interferometers. This design simultaneously achieves optically broadband operation at visible wavelengths, high-fidelity switching (>40dB) at low voltages, submicrosecond modulation timescales (>30MHz), and minimal channel-to-channel crosstalk for repeatable optical pulse carving. Via a reconfigurable free-space interconnect, we use the APIC to address single silicon vacancy color centers in individual diamond waveguides with inverse tapered couplers, achieving efficient single photon detection probabilities (∼15%) and second-order autocorrelation measurements g (2) (0)<0.14 for all channels. The modularity of this distributed APIC–quantum memory system simplifies the quantum control problem, potentially enabling further scaling to thousands of channels.

47 OTHER INSTRUMENTATION↗
NASA NTRS2015

Exploration Architecture with Quantum Inertial Gravimetry and In-Situ ChipSat Sensors

The Dual Exploration Architecture is a mission concept that combines remote sensing and in-situ observations into a single mission to answer planetary science questions that can only be answered with both types of data. Adoption of dual exploration architectures may short circuit the long, slow cycle of missions to inaccessible bodies by eliminating the need for separate precursor and follow-up missions. Additionally, the dual architecture possesses inherent flexibility that enables the design of adaptive, event-driven missions that are very different from traditional, largely pre-planned missions. Five key observations about the state and trends of planetary science exploration lead us to the dual architecture: increasing complexity of observations; scarcity of future mission opportunities; desire to capture transitory events; continued miniaturization of spacecraft components; and the Mars exploration cycle. Our goal in this study is to explore missions that can only happen using the dual architecture concept and find technology development needs that must be filled for those missions to compete. A survey of historical and current missions finds that opportunities for exploration are becoming less frequent, causing the flexibility and dual-nature elements of each mission to become more common. The dual exploration architecture takes these trends to their far conclusion, attempting to eliminate precursor and follow-up missions while still returning more scientific payoff. A study of the future of planetary science goals through the decadal survey reveals broad applicability of dual missions to solve mysteries that cannot be answered with a traditional mission architecture. These missions fall into three broad classes: choosing a local target from a global survey; dynamic/reactive science; and global in-situ networks. Two example missions of each class are notionally described. A deeper look at these dual architecture classes reveals four technology development needs that must be addressed for wide adoption of dual missions: passive landers; guided atmospheric probes; robust sensing packages; and small, precise orbital instruments. This study pursues a specific focus on two examples of such enabling technologies: the ChipSat and cold atom gravimetry. The ChipSat is a fully functional spacecraft-on-a-chip system that has broad versatility in the dual architecture mission space. Initial studies show that ChipSats could survive as passive impactor landers on bodies up to the size of Europa. Furthermore, COTS (Commercial Off-The-Shelf) components could provide an in-situ sensor suite that readily answers a number of pressing planetary science questions. Cold atom gravimetry uses inertial sensors based on light-pulse atom interferometry in a small form factor to map the gravity field of a body to precision equaling what would normally require two full spacecraft to achieve. The cold atom gravimeter provides an example of how advanced remote sensing capability can enable dual missions by providing greater returns in a significantly smaller package. Using the above two technologies, we study an example dual-architecture mission to both characterize and sample the subsurface oceans at Europa. The greatest scientific return in terms of detecting extraterrestrial life is in those regions where Europa’s ice crust is thin. The identification of regions with thin ice should therefore precede the selection of surface targets and dispatch of probes to those targets. This two-step process, if accomplished by separate flagship-scale missions, might take decades. As a result, a combined mission to both identify thin areas of Europa’s ice and follow up with surface observations at those regions is a good candidate for the dual-exploration architecture. This example mission consists of an orbiter spacecraft carrying a cold atom gravimeter capable of sensing or inferring the ice thickness on regional to local scales, along with a number of ChipSat probes capable of landing on the moon. The small size and weight of the ChipSats allows large numbers of them to be carried, ensuring that enough can be dropped to ensure survival of a minimum number of probes and potentially allowing for the in-situ sampling of multiple locations on the moon. The example missions and Europa case study show that amazing scientific return can obtained from dual-exploration architecture missions with a single launch by breaking the long timescales of planetary exploration and providing the flexibility to capturing transitory events and collect data across the local, regional, and global scales.

Exploration↗
NASA NTRS2003

The Star Formation History of Orion and its Environs

During the period of performance, we have obtained the following observations and carried out the analysis of the Orion associations itemized below. Optical Photometry: The Quest camera that had been damaged by lightning on Sept. 2001 was reconfigured to use 10 chips and only 3 filters instead of the original 4 but retaining its spatial coverage of 2.3deg wide in declination. During the Winter and Fall 2002 observing campaigns, we obtained multifilter photometry using the Quest camera on the 1mt Schmidt of the Venezuelan National Observatory, to continue the survey of the Orion clouds. In the Winter 2002 season, we obtained photometry for 10 scans at DEC=+5, 7 scans at DEC=-5. Several additional scans at DEC=-3 were obtained during the Fall 2002 observing campaign. Slit spectroscopy of bright candidates: During 2002 spectra for some 235 candidate PMS stars were obtained with the FAST spectrograph at the SAO 1.5m telescope in Mt. Hopkins. These objects, all brighter than V=16, are located in two strips centered at DEC=+l and -5, and spanning from RA=5h-6h. The spectra are being analyzed. Multifiber spectroscopy: Spectroscopy for our fainter (V less than or equal to 16) candidates has not kept pace with our spectroscopy of brighter candidates, because of the delay in the commissioning of the Hectospec and Hectoechelle multi-object spectrographs at the new 6.5m MMT. We obtained some data with the Hydra spectrograph on the WIYN telescope: Feb 1-4, 2002. Time granted to the project: "A Large Scale Survey of the Low-Mass Young Population in the Orion OB1 Association" (P.I.: C. Briceno). Three half-nights (we used the first half of the night, the second half of the night was used with the Mini-Mosaic imager by another team). Only the first half night was clear. We observed 3 fields centered in a 2.3 deg wide strip centered at DEC=-1 and spanning RA=Sh to 6h. A total of 250 spectra were obtained for the same number of candidate PMS stars. Nov. 13-15, 2002. Time granted to the project "Cluster survey of protoplanetary disk evolution", (P.I.: A. Sicilia-Aguilar). Clear weather throughout. We obtained spectra for some 200 candidate PMS stars in 3 fields located in a 2.3 deg wide strip centered at DEC=+l and spanning from RA=5h20m to 5h35m. Data for both observing runs is partially reduced and is being analyzed. U photometry: During Nov.29-Dec.4, 2002 we were granted time with the 4-shooter CCD Mosaic Camera at the SAO 1.2m telescope, to obtain U-band photometry of a subset of the newly identified T Tauri stars in the strip centered at DEC=-1. This sample is composed of strong H(alpha) emitting PMS stars (Classical T Tauri stars) located mostly in the Orion OB lb association, around the Orion Belt area. Our data will be combined with our calibration of the U-band excess (Gullbring et al. 1998) to derive mass accretion rates. Because of bad weather we observed only 20 stars during 1.5 clear nights. Near IR photometry: During Dec. 14-19, 2002 we used the IR Camera on the SAO 1.2m telescope, to obtain L-band photometry of a set of 17 the newly identified Orion OB 1a and 1b stars, in order to look for IR excess emission coming from the hotter inner parts of circumstellar disks. Again, mediocre weather prevented a larger set to be observed. These stars were also observed with the OSCIR mid-IR camera on Gemini North during later 2001. Our goal is to construct SEDs from the visual out to the mid-IR (by combining our optical/IR data with 2MASS JHK magnitudes) in order to explore disk dissipation at the critical ages of 5-10 Myr spanned by these stars.

Calvet, Nuria↗
NASA NTRS2013

Planar Superconducting Millimeter-Wave/Terahertz Channelizing Filter

This innovation is a compact, superconducting, channelizing bandpass filter on a single-crystal (0.45 m thick) silicon substrate, which operates from 300 to 600 GHz. This device consists of four channels with center frequencies of 310, 380, 460, and 550 GHz, with approximately 50-GHz bandwidth per channel. The filter concept is inspired by the mammalian cochlea, which is a channelizing filter that covers three decades of bandwidth and 3,000 channels in a very small physical space. By using a simplified physical cochlear model, and its electrical analog of a channelizing filter covering multiple octaves bandwidth, a large number of output channels with high inter-channel isolation and high-order upper stopband response can be designed. A channelizing filter is a critical component used in spectrometer instruments that measure the intensity of light at various frequencies. This embodiment was designed for MicroSpec in order to increase the resolution of the instrument (with four channels, the resolution will be increased by a factor of four). MicroSpec is a revolutionary wafer-scale spectrometer that is intended for the SPICA (Space Infrared Telescope for Cosmology and Astrophysics) Mission. In addition to being a vital component of MicroSpec, the channelizing filter itself is a low-resolution spectrometer when integrated with only an antenna at its input, and a detector at each channel s output. During the design process for this filter, the available characteristic impedances, possible lumped element ranges, and fabrication tolerances were identified for design on a very thin silicon substrate. Iterations between full-wave and lumped-element circuit simulations were performed. Each channel s circuit was designed based on the availability of characteristic impedances and lumped element ranges. This design was based on a tabular type bandpass filter with no spurious harmonic response. Extensive electromagnetic modeling for each channel was performed. Four channels, with 50-GHz bandwidth, were designed, each using multiple transmission line media such as microstrip, coplanar waveguide, and quasi-lumped components on 0.45- m thick silicon. In the design process, modeling issues had to be overcome. Due to the extremely high frequencies, very thin Si substrate, and the superconducting metal layers, most commercially available software fails in various ways. These issues were mitigated by using alternative software that was capable of handling them at the expense of greater simulation time. The design of on-chip components for the filter characterization, such as a broadband antenna, Wilkinson power dividers, attenuators, detectors, and transitions has been completed.

Ehsan, Negar↗
NASA NTRS2003

Catalyzed Combustion In Micro-Propulsion Devices: Project Status

In recent years, there has been a tendency toward shrinking the size of spacecraft. New classes of spacecraft called micro-spacecraft have been defined by their mass, power, and size ranges. Spacecraft in the range of 20 to 100 kg represent the class most likely to be utilized by most small sat users in the near future. There are also efforts to develop 10 to 20 kg class spacecraft for use in satellite constellations. More ambitious efforts will be to develop spacecraft less than 10 kg, in which MEMS fabrication technology is required. These new micro-spacecraft will require new micro-propulsion technology. Although micro-propulsion includes electric propulsion approaches, the focus of this proposed program is micro-chemical propulsion which requires the development of microcombustors. As combustors are scaled down, the surface to volume ratio increases. The heat release rate in the combustor scales with volume, while heat loss rate scales with surface area. Consequently, heat loss eventually dominates over heat release when the combustor size becomes smaller, thereby leading to flame quenching. The limitations imposed on chamber length and diameter has an immediate impact on the degree of miniaturization of a micro-combustor. Before micro-combustors can be realized, such a difficulty must be overcome. One viable combustion alternative is to take advantage of surface catalysis. Micro-chemical propulsion for small spacecraft can be used for primary thrust, orbit insertion, trajectory-control, and attitude control. Grouping micro-propulsion devices in arrays will allow their use for larger thrust applications. By using an array composed of hundreds or thousands of micro-thruster units, a particular configuration can be arranged to be best suited for a specific application. Moreover, different thruster sizes would provide for a range of thrust levels (from N s to mN s) within the same array. Several thrusters could be fired simultaneously for thrust levels higher than the basic units, or in a rapid sequence in order to provide gradual but steady low-g acceleration. These arrays of micro-propulsion systems would offer unprecedented flexibility and redundancy for satellite propulsion and reaction control for launch vehicles. A high-pressure bi-propellant micro-rocket engine is already being developed using MEMS technology. High pressure turbopumps and valves are to be incorporated onto the rocket chip . High pressure combustion of methane and O2 in a micro-combustor has been demonstrated without catalysis, but ignition was established with a spark. This combustor has rectangular dimensions of 1.5 mm by 8 mm (hydraulic diameter 3.9 mm) and a length of 4.5 mm and was operated at 1250 kPa with plans to operate it at 12.7 MPa. These high operating pressures enable the combustion process in these devices, but these pressures are not practical for pressure fed satellite propulsion systems. Note that the use of these propellants requires an ignition system and that the use of a spark would impose a size limitation to this micro-propulsion device because the spark unit cannot be shrunk proportionately with the thruster. Results presented in this paper consist of an experimental evaluation of the minimum catalyst temperature for initiating/supporting combustion in sub-millimeter diameter tubes. The tubes are resistively heated and reactive premixed gases are passed through the tubes. Tube temperature and inlet pressure are monitored for an indication of exothermic reactions and composition changes in the gases.

Sung, C. J.↗