Results for “Silicon on insulators” — Page 30

DOE OSTI2019

Magnetic Spectra of Soft Magnetic Composites Based on Fe-Si-Cr-B Amorphous and Carbonyl-Iron Powders

Fe–Si–Cr–B amorphous and carbonyl-iron powders insulated with phosphoric acid solution were used to prepare soft magnetic composites. The mass ratios of phosphoric acid insulation solution and the carbonyl-iron powder dependences of the magnetic spectrum, the density, and the resistivity were studied. Both the real part and the imaginary part of the core’s complex permeability increased after an initial decrease with the acid mass ratio increasing. This is similar to the variation tendency of the core’s density and opposite to the variation tendency of the core’s resistivity. The amount of the air gap, reflected by the density, was proposed to be the most important factor that has a great influence on the composite’s magnetic properties. The increase of the air gap reduced the effective demagnetizing field and the resistivity. This improved the permeability and the hysteresis loss and deteriorated the eddy-current loss. Carbonyl-iron powder addition was found to improve the moldability and the permeability of the composite based on the Fe-Si-Cr-B amorphous powder, although its loss was higher than that of the amorphous powder. All these findings can be referenced when designing an amorphous-based soft magnetic composite (SMC) core with balanced permeability, loss, and cost for high-frequency inductor within a MHz band.

36 MATERIALS SCIENCE↗

NASA NTRS2004

High-Temperature Probe Station Developed to Characterize Microwave Devices Through 500 C

A photograph and a block diagram of the high-temperature probe station are shown. The system consists of the ceramic heater mounted on a NASA shuttle tile insulator, a direct current power supply, a personal-computer-based data acquisition and temperature controller, microwave probes, a microscope, and a network analyzer. The ability to perform microwave tests at high temperatures is becoming necessary. There is now a need for sensors and communication circuits that can operate at 500 C and above for aircraft engine development and monitoring during flight. To address this need, researchers have fabricated devices using wide bandgap semiconductors such as SiC with targeted operating temperatures of 500 to 600 C. However, the microwave properties of these devices often change drastically with temperature, so any designs that are intended to be used in such an environment must be characterized at high temperatures. For some reliability, lifetime, and direct-current testing, the device under test can be packaged and characterized in an oven. However, for RF and microwave measurements, it is usually not possible to establish a calibrated reference plane at the device terminals within a package. In addition, the characteristics of the package would vary over a 500 C temperature range, and this would have to be accounted for when the data were analyzed. A high temperature probe station allows circuits and devices to be characterized through on wafer measurements across a broad temperature range with known reference plane. The conventional, commercially available thermal wafer-probe stations that are used to evaluate microwave devices across a controlled temperature range have a typical upper limit of 200 C. Standalone thermal heating chucks are available with an extended upper temperature range of 300 to 400 C. To effectively characterize devices at temperatures up to and surpassing 500 C, Glenn researchers developed a custom probe station. In the past, custom probe stations have been developed to test devices under other extreme environments, such as cryogenic temperatures as low as 37 K. Similarly, this custom probe station was specifically modified for high-temperature use. It allows devices to be measured quickly and flexibly, without the use of wire bonds and test fixtures. The probe station is shown making scattering parameter measurements from 1 to 50 GHz with a Hewlett-Packard 8510C Network Analyzer. There is a half-wafer of silicon directly on top of the heater to provide a uniform heated platform for our sample. A quarter wafer of silicon carbide forms the substrate for our test circuit of several transmission lines.

Downey, Alan N.↗

DOE OSTI2023

Effect of Diphenyl Content on Viscoelasticity of Poly(dimethyl- co -diphenyl)siloxane Melt and Network

Polydimethylsiloxane (PDMS) is one of the most widely used polymeric materials for sealants, adhesives, lubricants, and thermal as well as electrical insulation. At low temperatures, however, PDMS is subject to crystallization that can cause deterioration in mechanical function. A common way to suppress such crystallization is through the incorporation of phenylsiloxane into the backbone of polysiloxane. Nevertheless, the introduction of phenyl components, even in small quantities, could potentially change the properties of the siloxane in a significant way. In this work, a series of mechanical tests and finite element simulations were performed to study the macroscale viscoelasticity of two poly(dimethyl-co-diphenyl)siloxane formulations in order to understand the effects of a few percent diphenyl contents on the viscoelasticity of the polysiloxane material. Here, we utilized the small-angle X-ray scattering to investigate the microscopic structures of the copolymers and broadband dielectric spectroscopy and rheology to probe the chain dynamics at the microscale. The results of these characterizations were used to inform the finite element simulations. We found that the degree of cross-linking does not significantly alter the microstructure but can profoundly affect the viscoelastic response of the copolymer networks. The corresponding hysteretic behavior is interpreted in terms of reptation-like motion and relaxation of the effective free chains in the cured polymer network. The relaxation of the copolymer chains is slowed significantly by even a small increase in the molar ratio of the diphenyl component.

36 MATERIALS SCIENCE↗

NASA NTRS1995

NASA Tech Briefs, November 1995

The contents include: 1) Mission Accomplished; 2) Resource Report: Marshall Space Flight Center; 3) NASA 1995 Software of the Year Award; 4) Microbolometers Based on Epitaxial YBa2Cu3O(sub 7-x) Thin Films; 5) Garnet Random-Access Memory; 6) Fabrication of SNS Weak Links on SOS Substrates; 7) High-Voltage MOSFET Switching Circuit; 8) Asymmetric Switching for a PWM H-Bridge Power Circuit; 9) Better Ohmic Contacts for InP Semiconductor Devices; 10) Low-Bandgap Thermovoltaic Materials and Devices; 11) Digital Frequency-Differencing Circuit; 12) Imaging Magnetometer; 13) Computer-Assisted Monitoring of a Complex System; 14) Buffered Telemetry Demodulator; 15) Compact Multifunction Inspection Head; 16) Optical Detection of Fractures in Ceramic Diaphragms; 17) Eddy-Current Detection of Cracks in Reinforced Carbon/Carbon; 18) Apparent Thermal Conductivity of Multilayer Insulation; 19) Optimizing Misch-Metal Compositions in Metal Hydride Anodes; 20) Device for Sampling Surface Contamination; 21) Probabilistic Failure Assessment for Fatigue; 22) Probabilistic Fatigue and Flaw-Propagation Analysis; 23) Windows Program for Driving the TDU-850 Printer; 24) Subband/Transform MATLAB Functions for Processing Images; 25) Computing Equilibrium Chemical Compositions; 26) Program Processes Thermocouple Readings; 27) ICAN-Second-Generation Integrated Composite Analyzer; 28) Integrated Composite Analyzer with Damping Capabilities; 29) Computing Efficiency of Transfer of Microwave Power; 30) Program Calculates Power Demands of Electronic Designs; 31) Cost-Estimation Program; 32) Program Estimates Areas Required by Electronic Designs; 33) Program to Balance Mapped Turbopump Assemblies; 34) BiblioTech; 35) Controlling Mirror Tilt With a Bimorph Actuator; 36) Burst-Disk Device Simulates Effect of Pyrotechnic Device; 37) Bearing-Mounting Concept Accommodates Thermal Expansion; 38) Parallel-Plate Acoustic Absorbers for Hot Environments; 39) Adjustable-Length Strut Withstands Large Cyclic Loads; 40) Tool Indicates Contact Angles in Bearing Raceways; 41) Gravity Slides With Magnetic Braking; 42) High-Torque, Lightweight, Pneumatically Driven Wrench for Small Spaces; 43) Device for Testing Compatibility of an O-Ring; 44) Magnetic Heat Pump Containing Flow Diverters; 45) Variable-Tilt Helicopter Rotor Mast; 46) "Beach-Ball" Robotic Rovers; 47) Apparatus Would Measure Temperatures of Ball Bearings; 48) Flexible Borescope for Inspecting Ducts; 49) Texturing Copper To Reduce Secondary Emission of Electrons; 50) Automated Laser Cutting in Three Dimensions; 51) Algorithm Helps Monitor Engine Operation; 52) Flexible Revision of Data-Processing Communications; 53) Software for Managing the Use of Land; 54) Thermal Strap Increases Cryocooling Efficiency; 55) Reversible Nut With Engagement Indication; 56) Control Algorithms for Kinematically Redundant Manipulators; 57) Computed Hydrogen-Flow Splits in a Rocket Engine; 58) Pressure and Thermal Modeling of Rocket Launches; 59) Field of View of a Spacecraft Antenna: Analysis and Software; 60) Digital Controller for Laser-Beam-Steering Subsystem; 61) More About Beam-Steering Subsystem for Laser Communication; 62) Digital Controller for Laser-Beam-Steering Subsystem: Part 2; 63) Interface Circuit Board for Space-Shuttle Communications; 64) Automated Planning of Spacecraft Telecommunications; 65) Artifacts of Spectral Analysis of Instrument Readings; 66) Neural-Network Controller for Vibration Suppression; 67) Adaptive Finite-Element Computation in Fracture Mechanics; 68) Attitude Control for the Cassini Spacecraft; 69) Analytical Model for Fluid Dynamics in a Microgravity Environment; 70) Study of Rocket-Engine Joints Bonded by NVCU/NARloy-Z; 71) Improved Silicon Nitride for Advanced Heat Engines; 72) Parameters for Welding Aluminum/Lithium Alloys; 73) Lightweight Composite Intertank Structure; 74) Foil Patches Seal Small Vacuum Leaks; 75) Data Base on Cables and Connectors; 76) Effect of Clock Mode on Radiation Hardnessf an ADC; and 77) Fault-Tolerant Control for a Robotic Inspection System.

Source record↗

NASA NTRS2012

Regolith Derived Heat Shield for Planetary Body Entry and Descent System with In Situ Fabrication

This NIAC project investigated an innovative approach to provide heat shield protection to spacecraft after launch and prior to each EDL thus potentially realizing significant launch mass savings. Heat shields fabricated in situ can provide a thermal-protection system for spacecraft that routinely enter a planetary atmosphere. By fabricating the heat shield with space resources from materials available on moons and asteroids, it is possible to avoid launching the heat-shield mass from Earth. Regolith has extremely good insulating properties and the silicates it contains can be used in the fabrication and molding of thermal-protection materials. Such in situ developed heat shields have been suggested before by Lewis. Prior research efforts have shown that regolith properties can be compatible with very-high temperature resistance. Our project team is highly experienced in regolith processing and thermal protection systems (TPS). Routine access to space and return from any planetary surface requires dealing with heat loads experienced by the spacecraft during reentry. Our team addresses some of the key issues with the EDL of human-scale missions through a highly innovative investigation of heat shields that can be fabricated in space by using local resources on asteroids and moons. Most space missions are one-way trips, dedicated to placing an asset in space for economical or scientific gain. However, for human missions, a very-reliable heat-shield system is necessary to protect the crew from the intense heat experienced at very high entry velocities of approximately 11 km/s at approximately Mach 33 (Apollo). For a human mission to Mars, the return problem is even more difficult, with predicted velocities of up to 14 km/s, at approximately Mach 42 at the Earth-atmosphere entry. In addition to human return, it is very likely that future space-travel architecture will include returning cargo to the Earth, either for scientific purposes or for commercial reasons. Platinum, titanium, helium 3, and other metals, elements and minerals are all high-value commodities in limited supply on Earth, and it may be profitable to mine these substances throughout the Solar System and return them to Earth, if an economical method can be found. To date, several private corporations have been launched to pursue these goals. Because the heat shield is the last element to be used in an Earth-return mission, a high penalty is paid in the propellant mass required to carry the heat shield to the destination and back. If the heat shield could be manufactured in space, and then outfitted on the spacecraft prior to the reentry at Earth, then significant propellant and mass savings could be achieved during launch and space operations. Preliminary mission architecture scenarios are described, which explain the potential benefits that may be derived from using an in-situ fabricated regolith heat shield. In order to prove that this is a feasible technology concept, this project successfully fabricated heat shield materials from mineral simulant materials of lunar and Martian regolith by two methods: 1) Sintering and 2) Binding the simulant with a "room-temperature vulcanizing" (RTV) silicone formulated to withstand high temperatures. Initially a third type of fabrication was planned using the hot waste stream from regolith ISRU processes. This fabrication method was discarded since the resulting samples would be too dense and brittle for heat shields. High temperature flame tests at KSC and subsequent arc jet tests at Ames Research Center (ARC) have proved promising. These coupon tests show favorable materials properties and have the potential to be a new way of fabricating heat shields for space entry into planetary atmospheres.

Hogue, Michael D.↗

NASA NTRS2013

Regolith Derived Heat Shield for Planetary Body Entry and Descent System with In Situ Fabrication

This NIAC project investigated an innovative approach to provide heat shield protection to spacecraft after launch and prior to each EDL thus potentially realizing significant launch mass savings. Heat shields fabricated in situ can provide a thermal-protection system for spacecraft that routinely enter a planetary atmosphere. By fabricating the heat shield with space resources from materials available on moons and asteroids, it is possible to avoid launching the heat-shield mass from Earth. Regolith has extremely good insulating properties and the silicates it contains can be used in the fabrication and molding of thermal-protection materials. Such in situ developed heat shields have been suggested before by Lewis. Prior research efforts have shown that regolith properties can be compatible with very-high temperature resistance. Our project team is highly experienced in regolith processing and thermal protection systems (TPS). Routine access to space and return from any planetary surface requires dealing with heat loads experienced by the spacecraft during reentry. Our team addresses some of the key issues with the EDL of human-scale missions through a highly innovative investigation of heat shields that can be fabricated in space by using local resources on asteroids and moons. Most space missions are one-way trips, dedicated to placing an asset in space for economical or scientific gain. However, for human missions, a very-reliable heat-shield system is necessary to protect the crew from the intense heat experienced at very high entry velocities of approximately 11 km/s at approximately Mach 33 (Apollo). For a human mission to Mars, the return problem is even more difficult, with predicted velocities of up to 14 km/s, at approximately Mach 42 at the Earth-atmosphere entry. In addition to human return, it is very likely that future space-travel architecture will include returning cargo to the Earth, either for scientific purposes or for commercial reasons. Platinum, titanium, helium 3, and other metals, elements and minerals are all high-value commodities in limited supply on Earth, and it may be profitable to mine these substances throughout the Solar System and return them to Earth, if an economical method can be found. To date, several private corporations have been launched to pursue these goals. Because the heat shield is the last element to be used in an Earth-return mission, a high penalty is paid in the propellant mass required to carry the heat shield to the destination and back. If the heat shield could be manufactured in space, and then outfitted on the spacecraft prior to the reentry at Earth, then significant propellant and mass savings could be achieved during launch and space operations. Preliminary mission architecture scenarios are described, which explain the potential benefits that may be derived from using an in-situ fabricated regolith heat shield. In order to prove that this is a feasible technology concept, this project successfully fabricated heat shield materials from mineral simulant materials of lunar and Martian regolith by two methods: 1) Sintering and 2) Binding the simulant with a "room-temperature vulcanizing" (RTV) silicone formulated to withstand high temperatures. Initially a third type of fabrication was planned using the hot waste stream from regolith ISRU processes. This fabrication method was discarded since the resulting samples would be too dense and brittle for heat shields. High temperature flame tests at KSC and subsequent arc jet tests at Ames Research Center (ARC) have proved promising. These coupon tests show favorable materials properties and have the potential to be a new way of fabricating heat shields for space entry into planetary atmospheres.

Hogue, Michael D.↗

DOE OSTI2025

Tunable 3D Aerosol Jet Printing of Low‐Power Redox‐Gated Transistors with Multicomponent Inks

Printed hybrid electronics (PHE) offer a promising alternative for microelectronics fabrication, addressing some limitations of traditional subtractive manufacturing. Despite the versatility of PHE, particularly in the customization of printing inks, these devices have not yet matched the performance of silicon-based electronics due to challenges in gating mechanisms and operational stability. However, the potential of low-voltage redox-gating to achieve significant carrier modulations in correlated metal oxides remains unexplored in PHE. This study systematically investigates vanadium dioxide (VO 2 ) nanoparticles and redox inks, linking their organization in solution to their morphology, phase state, and properties in solid films and multilayered structures. Using an aerosol jet printer (AJP), a solid-state VO 2 transistor is fabricated, operating at just 0.4 V gating voltage. The printed VO 2 films demonstrate redox-modulated conductivity and consistent transistor behavior. The solid-state redox gating materials also provide long-term stability, with the device maintaining performance over 6000 cycles without degradation. These results highlight the potential of redox gating to enhance the application of functional nanoparticles in printed hybrid microelectronics, especially for flexible, low-voltage, and energy-efficient devices.

36 MATERIALS SCIENCE↗