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At least 55 records · Page 3

Modeling the curing process of thermosetting resin matrix composites

A model is presented for simulating the curing process of a thermosetting resin matrix composite. The model relates the cure temperature, the cure pressure, and the properties of the prepreg to the thermal, chemical, and rheological processes occurring in the composite during cure. The results calculated with the computer code developed on the basis of the model were compared with the experimental data obtained from autoclave-curved composite laminates. Good agreement between the two sets of results was obtained.

Loos, A. C.↗

Chemoviscosity modeling for thermosetting resin systems, part 3

A new analytical model for simulating chemoviscosity resin has been formulated. The model is developed by modifying the well established Williams-Landel-Ferry (WLF) theory in polymer rheology for thermoplastic materials. By introducing a relationship between the glass transition temperature (T sub g (t)) and the degree of cure alpha(t) of the resin system under cure, the WLF theory can be modified to account for the factor of reaction time. Temperature-dependent functions of the modified WLF theory parameters C sub 1 (T) and C sub 2 (T) were determined from the isothermal cure data. Theoretical predictions of the model for the resin under dynamic heating cure cycles were shown to compare favorably with the experimental data. This work represents a progress toward establishing a chemoviscosity model which is capable of not only describing viscosity profiles accurately under various cure cycles, but also correlating viscosity data to the changes of physical properties associated with the structural transformations of the thermosetting resin systems during cure.

Hou, T. H.↗

Instability-related delamination growth in thermoset and thermoplastic composites

Mixed-mode crack propagation in compressively loaded thermoset and thermoplastic composite columns with an imbedded through-width delamination is investigated. Beam theory is used to analyze the geometrically nonlinear load-deformation relationship of the delaminated subregion. The elastic restraint model (ERM), combined with existing FSM modeling of the crack-tip region, yields expressions for the Mode I and Mode II components of the strain energy release rate G(I) and G(II) to predict the critical load at the onset of delamination growth. Experimental data were generated for geometries yielding a wide range of G(I)/G(II) ratios at the onset of crack growth. A linear mixed-mode crack growth criterion in conjunctuion with the ERM provides good agreement between predicted and measured critical loads for both materials studied.

Gillespie, John W., Jr.↗

Acetylene-chromene terminated resins as high temperature thermosets

A novel phase transfer catalyzed process for the preparation of propargyl ethers has been developed. The propargyl ethers serve as precursors to a new class of thermosetting resins called acetylene-chromene terminated (ACT) resins. Heat treatment of a solution of propargyl ethers with various catalysts, followed by removal of solvent leads to the ACT resins via partial conversion of the propargyl ether groups to chromenes. This process reduces the energy content of the resin systems and reduces the amount of shrinkage found during cure. Due to the presence of the solvent the process is safe and gives rise to low viscosity products suitable for resin transfer molding and filament winding type applications. Due to the high glass transition temperature, high modulus, and low moisture uptake the cured resins display better than 232 C/wet performance. The thermal stability of the ACT resins in air at 204 C is superior to that of conventional bismaleimide resins. The resins also display excellent electrical properties.

Godschalx, J. P.↗

Flexible thermoset towpregs by electrostatic powder fusion coating

Thermoset prepregs of expoxy and polyimide have been produced by electrostatic deposition of charged fluidized polymer powders on spread continuous fiber tows. The powders are melted onto the fibers by radiant heating to adhere the polymer to the fiber. This process produces towpreg uniformly and rapidly without imposing severe stresses on the fibers. The towpregs produced by this novel process were consolidated to make unidirectional laminates for mechanical testing. Low void content samples have been made and demonstrated by C-scan and scanning electron microscopy. The mechanical properties of unidirectional laminates are equivalent to composites fabricated by conventional techniques.

Yang, Pei-Hua↗

Predicting Failure Behaviors Of Thermoset Polymers

Useful predictions made from measurements on test-tube quantities. Mathematical model for viscoelastic failure behavior of epoxy or other thermoset polymer reduces considerably time and expense necessary to evaluate new polymer. One quickly obtains first-order estimates of viscoelastic properties, and decides more easily whether material rejected or good candidate for more thorough evaluation. Only properties required by model are equilibrium pressure vs. volume vs. temperature (PVT) response and linear viscoelastic shear and bulk moduli.

Bowles, Kenneth J.↗

Lower temperature curing thermoset polyimides utilizing a substituted norbornene endcap

Methoxycarbonyl bridgehead substituted nadic diacid monomethyl ester, when used as an endcapping monomer, lowered the cure temperature of thermoset PMR polyimides without seriously affecting other desirable properties, such as glass transition temperature and thermal oxidative stability. The C-13 CP/MAS NMR of model compounds was used to follow the cure of resin systems using both the unmodified nadic endcap and the methoxycarbonyl-substituted endcap. Rheological analysis and differential scanning calorimetry DSC also provided evidence for the lower curing nature of the substituted endcap. Two regioisomers of the bridgehead-substituted endcap were isolated, and their chemical structures were elucidated by X-ray crystallography. The model compound and molecular modeling studies conducted ruled out the possibility of regioisomeric imide formation in the substituted endcaps.

Waters, John F.↗

A Method for Characterizing Thermoset Polyimides

Thermoset polyimides have great potential for successfully meeting tough stress and temperature challenges in the advanced aircraft development program. However, studies of structure-property relationships in these materials have not been very successful so far. Positron lifetime spectroscopy (PLS) has been used to investigate free volumes and associated parameters in a series of variable, segmental molecular weight samples. The free volume correlates well with the molecular weight M(sub c), the cross-link density v, and the coefficient of thermal expansion (CTE) of these materials. Currently, no other techniques are available for direct measurement of these parameters, particularly for polymers in solid phase. Experimental results and their interpretations are presented.

Ranganathaiah, C.↗

Morphology of Thermoset Polyimides by Positron Annihilation Spectroscopy

Thermoset polyimides have great potential for successfully meeting tough stress and temperature challenges in the advanced aircraft development program. However, studies of structure/property relationships in these materials have not been very successful so far. Positron annihilation spectroscopy has been used to investigate free volumes and associated parameters. It has been noted that the free volume correlates well with the molecular weight, cross-link density and thermal coefficient of expansion of these materials. Currently no other techniques are available for direct measurement of these parameters. Experimental results and their interpretations will be discussed.

Ranganathaiah, C.↗

Performance of Integrated Fiber Optic, Piezoelectric, and Shape Memory Alloy Actuators/Sensors in Thermoset Composites

Recently, scientists and engineers have investigated the advantages of smart materials and structures by including actuators in material systems for controlling and altering the response of structural environments. Applications of these materials systems include vibration suppression/isolation, precision positioning, damage detection and tunable devices. Some of the embedded materials being investigated for accomplishing these tasks include piezoelectric ceramics, shape memory alloys, and fiber optics. These materials have some benefits and some shortcomings; each is being studied for use in active material design in the SPICES (Synthesis and Processing of Intelligent Cost Effective Structures) Consortium. The focus of this paper concerns the manufacturing aspects of smart structures by incorporating piezoelectric ceramics, shape memory alloys and fiber optics in a reinforced thermoset matrix via resin transfer molding (RTM).

Trottier, C. Michael↗

Structure-Property Relationship in High Tg Thermosetting Polyimides

This viewgraph presentation gives an overview of the structure-property relationship in high glass transition temperatures (T(sub g)) thermosetting polyimides. The objectives of this work are to replace MDA in PMR-15 with 2,2-substituted benzidine and to evaluate the thermo-oxidative stability and mechanical properties of DMBZ-15 against PMR-15. Details are given on the T(sub g) of polyimide resins, the x-ray crystal structure of 2,2-Bis(trifluoro)benzidine (BFBZ), the isothermal aging of polyimide resins at 288 C under 1 atm of circulating air, the compressive strength of polyimide composites, and a gas evaluation profile of DMBZ-15 polyimide resins.

Chuang, Kathy C.↗

Viscoelastic and Mechanical Properties of Thermoset PMR-type Polyimide-Clay Nanocomposites

High temperature thermoset polyimide-clay nanocomposites were prepared by blending 2.5 and 5 wt% of an unmodified Na(+-) montmorillonite (PGV) and two organically modified FGV (PGVCl0COOH, PGVC12) with a methanol solution of PMR-15 precursor. The methanol facilitated the dispersal of the unmodified clay. Dynamic mechanical analysis results showed a significant increase in the thermomechanical properties (E' and E") of 2.5 wt% clay loaded nanocomposites in comparison with the neat polyimide. Higher glass transition temperatures were observed for 2.5 wt% nanocomposites compared to the neat polyimide. Flexural properties measurements for the 2.5 wt% nanocomposites showed a significant improvement in the modulus and strength, with no loss in elongation. This trend was not observed for the 5 wt% nanocomposites. An improvement in the CTE was observed for the PGV/PMR-15 nanocomposites, while a decrease was observed for the organically modified samples. This was attributed to potential variations in the interface caused by modifier degradation.

Abdalla, Mohamed O.↗

High Temperature Thermosetting Polyimide Nanocomposites Prepared with Reduced Charge Organoclay

The naturally occurring sodium and calcium cations found in bentonite clay galleries were exchanged with lithium cations. Following the cation exchange, a series of reduced charge clays were prepared by heat treatment of the lithium bentonite at 130 C, 150 C, or 170 C. Inductively coupled plasma (ICP) analysis showed that heating the lithium clay at elevated temperatures reduced its cation exchange capacity. Ion exchange of heat-treated clays with either a protonated alkyl amine or a protonated aromatic diamine resulted in decreasing amounts of the organic modifier incorporated into the lithium clay. The level of silicate dispersion in a thermosetting polyimide matrix was dependent upon the temperature of Li-clay heat treatment as well as the organic modification. In general, clays treated at 150 C or 170 C, and exchanged with protonated octadcylamine or protonated 2,2'-dimethlybenzidine (DMBZ) showed a higher degree of dispersion than clays treated at 130 C, or exchanged with protonated dodecylamine. Dynamic mechanical analysis showed little change in the storage modulus or T(sub g) of the nanocomposites compared to the base resin. However, long term isothermal aging of the samples showed a significant decrease in the resin oxidative weight loss. Nanocomposite samples aged in air for 1000 hours at 288 C showed of to a decrease in weight loss compared to that of the base resin. This again was dependent on the temperature at which the Li-clay was heated and the choice of organic modification.

Campbell, Sandi↗

Solvent Free Low-Melt Viscosity Imide Oligomers And Thermosetting Polyimide Composites

This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3',4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine' and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1-60 poise at 260-280" C. When the imide oligomer melt is cured at about 371 C. in a press or autoclave under 100-500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (T(sub g)) equal to and above 310 C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232-280 C. (450-535 F) without any solvent. These low-melt imide oligomers can be easily processed by resin transfer molding (RTM), vacuum-assisted resin transfer molding (VARTM) or the resin infusion process with fiber preforms e.g. carbon, glass or quartz preforms to produce polyimide matrix composites with 288-343C (550-650 F) high temperature performance capability.

Chuang, CHun-Hua↗

Evaluation of Nanoclay Exfoliation Strategies for Thermoset Polyimide Nanocomposite Systems

Prior works show exfoliated layered silicate reinforcement improves polymer composite properties. However, achieving full clay exfoliation in high performance thermoset polyimides remains a challenge. This study explores a new method of clay exfoliation, which includes clay intercalation by lower molecular weight PMR monomer under conditions of low and high shear and sonication, clay treatments by aliphatic and aromatic surfactants, and clay dispersion in primary, higher molecular weight PMR resin. Clay spacing, thermal, and mechanical properties were evaluated and compared with the best results available in literature for PMR polyimide systems.

Ginter, Michael J.↗

Liquid Crystalline Thermosets from Ester, Ester-imide, and Ester-amide Oligomers

Main chain thermotropic liquid crystal esters, ester-imides, and ester-amides were prepared from AA, BB, and AB type monomeric materials and end-capped with phenylacetylene, phenylmaleimide, or nadimide reactive end-groups. The end-capped liquid crystal oligomers are thermotropic and have, preferably, molecular weights in the range of approximately 1000-15,000 grams per mole. The end-capped liquid crystaloligomers have broad liquid crystalline melting ranges and exhibit high melt stability and very low melt viscosities at accessible temperatures. The end-capped liquid crystal oli-gomers are stable forup to an hour in the melt phase. They are highly processable by a variety of melt process shape forming and blending techniques. Once processed and shaped, the end-capped liquid crystal oigomers were heated to further polymerize and form liquid crystalline thermosets (LCT). The fully cured products are rubbers above their glass transition temperatures.

Dingemans, Theodorus J.↗

Solvent free low-melt viscosity imide oligomers and thermosetting polymide composites

.[.This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3',4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1-60 poise at 260-280.degree. C. When the imide oligomer melt is cured at about 371.degree. C. in a press or autoclave under 100-500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (T.sub.g) equal to and above 310.degree. C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232-280.degree. C. (450-535.degree. F.) without any solvent. These low-melt imide oligomers can be easily processed by resin transfer molding (RTM), vacuum-assisted resin transfer molding (VARTM) or the resin infusion process with fiber preforms e.g. carbon, glass or quartz preforms to produce polyimide matrix composites with 288-343.degree. C. (550-650.degree. F.) high temperature performance capability..]. .Iadd.This invention relates to compositions and a solvent-free reaction process for preparing imide oligomers and polymers specifically derived from effective amounts of dianhydrides such as 2,3,3',4'-biphenyltetracarboxylic dianhydride (a-BPDA), at least one aromatic polyamine and an end-cap such as 4-phenylethynyphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1-60 poise at 260.degree. C.-280.degree. C..Iaddend.

Chuang, Chun-Hua↗

Self-Healing Composite of Thermoset Polymer and Programmed Super Contraction Fibers

A composition comprising thermoset polymer, shape memory polymer to facilitate macro scale damage closure, and a thermoplastic polymer for molecular scale healing is disclosed; the composition has the ability to resolve structural defects by a bio-mimetic close-then heal process. In use, the shape memory polymer serves to bring surfaces of a structural defect into approximation, whereafter use of the thermoplastic polymer for molecular scale healing allowed for movement of the thermoplastic polymer into the defect and thus obtain molecular scale healing. The thermoplastic can be fibers, particles or spheres which are used by heating to a level at or above the thermoplastic's melting point, then cooling of the composition below the melting temperature of the thermoplastic. Compositions of the invention have the ability to not only close macroscopic defects, but also to do so repeatedly even if another wound/damage occurs in a previously healed/repaired area.

Li, Guoqiang↗