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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Device set to allow heat to flow across gap (switch "on") or decrease rate of transfer of heat to relatively low value (switch "off"). Operates at temperatures in approximate range of 100 to 1,500 degree C. Central cylindrical object thermally connected to (or disconnected from) environment by filling gap between inner and outer sleeves of switch (or evacuating gap) to increase (or decrease) thermal conduction across gap.
A document discusses a thin layer of composite material, made from nano scale particles of nickel and Teflon, placed within a battery cell as a layer within the anode and/or the cathode. There it conducts electrons at room temperature, then switches to an insulator at an elevated temperature to prevent thermal runaway caused by internal short circuits. The material layer controls excess currents from metal-to-metal or metal-to-carbon shorts that might result from cell crush or a manufacturing defect
Automatic switch uses short stainless steel tube with copper heat sinks to accelerate helium gas cooling and provides good thermal conductivity and good thermal insulation.
Efficiently simulating large circuits is crucial to the development of superconducting nanowire-based electronics. However, current simulation tools for this technology are not adapted to the scaling of circuit size and complexity. We focus on the multilayered heater-nanocryotron (hTron), a promising superconducting nanowire-based switch used in applications such as superconducting nanowire single-photon detector readout. Previously, the hTron was modeled using traditional finite-element methods, which fall short in simulating systems at a larger scale. An empirical-based method would be better adapted to this task, enhancing both simulation speed and agreement with experimental data. In this work, we perform switching current and activation delay measurements on 17 hTron devices. We then develop a method for extracting physical fitting parameters used to characterize the devices. We build a SPICE behavioral model that reproduces the static and transient device behavior using these parameters, and validate it by comparing its performance to a model developed in prior work, showing an improvement in simulation time by several orders of magnitude. Furthermore, our model provides circuit designers with a tool to help understand the hTron’s behavior during all design stages, thus enabling broader use of the hTron across various new areas of application.
Proposed heat switch transfers heat from source to sink in regular cycles. Self-sustaining; actuated by transferred heat, contains no moving parts, and needs no external heaters or electronic circuitry to synchronize heat-transfer periods or control heat-transfer rates. Intended for use in gas-sorption refrigerator.
No abstract provided
A thermal conduction switch includes a thermally-conductive first member having a first thermal contacting structure for securing the first member as a stationary member to a thermally regulated body or a body requiring thermal regulation. A movable thermally-conductive second member has a second thermal contacting surface. A thermally conductive coupler is interposed between the first member and the second member for thermally coupling the first member to the second member. At least one control spring is coupled between the first member and the second member. The control spring includes a NiTiFe comprising shape memory (SM) material that provides a phase change temperature <273 K, a transformation range <40 K, and a hysteresis of <10 K. A bias spring is between the first member and the second member. At the phase change the switch provides a distance change (displacement) between first and second member by at least 1 mm, such as 2 to 4 mm.
This paper presents an advanced miniature heat transport system for thermal control of small spacecraft. The thermal system consists of a loop heat pipe (LHP) with multiple evaporators and multiple deployable radiators for heat transfer, and variable emittance coatings on the radiators for performance enhancement. Thermoelectric coolers are used to control the loop operating temperature. The thermal system combines the functions of variable conductance heat pipes, thermal switches, thermal diodes, and the state-of-the-art LHPs into a single integrated thermal system. It retains all the performance characteristics of state-of-the-art LHPs and offers additional advantages to enhance the functionality, performance, versatility, and reliability of the system. Steady state and transient analytical models have been developed, and scaling criteria have also been established. A breadboard unit has been built for functional testing in laboratory and thermal vacuum environments. Experimental results show excellent performance of the thermal system and correlate very well with theoretical predictions.
The MLHP Thermal Management System consists of a loop heat pipe (LHP) with multiple evaporators and condensers, thermal electrical coolers, and deployable radiators coated with variable emittance coatings (VECs). All components are miniaturized. It retains all the performance characteristics of state-of-the-art LHPs and offers additional advantages to enhance the functionality, versatility, and reliability of the system, including flexible locations of instruments and radiators, a single interface temperature for multiple instruments, cooling the on instruments and warming the off instruments simultaneously, improving. start-up success, maintaining a constant LHP operating temperature over a wide range of instrument powers, effecting automatic thermal switching and thermal diode actions, and reducing supplemental heater powers. It can fully achieve low mass, low power and compactness necessary for future small spacecraft. Potential applications of the MLHP thermal technology for future missions include: 1) Magnetospheric Constellation; 2) Solar Sentinels; 3) Mars Science Laboratory; 4) Mars Scouts; 5) Mars Telecom Orbiter; 6) Space Interferometry Mission; 7) Laser Interferometer Space Antenna; 8) Jupiter Icy Moon Orbiter; 9) Terrestrial Planet Finder; 10) Single Aperture Far-Infrared Observatory, and 11) Exploration Missions. The MLHP Thermal Management System combines the operating features of a variable conductance heat pipe, a thermal switch, a thermal diode, and a state-of-the-art LHP into a single integrated thermal system. It offers many advantages over conventional thermal control techniques, and can be a technology enabler for future space missions. Successful flight validation will bring the benefits of MLHP technology to the small satellite arena and will have cross-cutting applications to both Space Science and Earth Science Enterprises.
Two automatic, flexible connection thermal control switches have been designed and tested in a thermal vacuum facility and in the Get Away Special (GAS) container flown on the third Shuttle flight. The switches are complementary in that one switch passes heat when the plate on which it is mounted exceeds some selected temperature and the other switch will pass heat only when the mounting plate temperature is below the selected value. Both switches are driven and controlled by phase-change capsule motors and require no other power source or thermal sensors.
Regenerative Fuel Cells (RFCs) enable lunar surface hardware, from pressurized rovers to surface habitats, to survive the lunar night by providing the required energy storage with a lower mass than state of the art battery systems. RFCs consist of fuel cell and electrolyzer electrochemical stack(s), a fluidic balance of plant, and electrical balance of plant. Fuel cells operate by converting the stored chemical energy of reactants into DC electrical power, heat, and water. When supplied DC power from an available external source, electrolyzers regenerate the reactants through electrolysis. The balance of plant is a critical part of the integrated system consisting of many individual components and provides fluid pressure management and conditioning, fluid storage, and thermal management. Component technology development is required to create an RFC system that will be capable of surviving the harsh lunar environment and maximize specific energy (W-hr/kg). One critical component requiring development includes a kW-scale high flux thermal switch. The primary requirement for the thermal switch is the ability to maintain low thermal resistance with the RFC heat rejection interface during the lunar day to maximize heat rejection while switching to a high thermal resistance during the lunar night such that the RFC can conserve as much thermal energy as possible. Different technology including freeze tolerant pumped loop, passive louvers, and variable conductance heat pipes were assessed as potential solutions. NASA is exploring development options through internal and external partnerships to develop this technology critical for a spaceflight RFC system.
A bistable switching element is made of a material whose electrical resistance reversibly decreases in response to intercalation by positive ions. Flow of positive ions between the bistable switching element and a positive ion source is controlled by means of an electrical potential applied across a thermal switching element. The material of the thermal switching element generates heat in response to electrical current flow therethrough, which in turn causes the material to undergo a thermal phase transition from a high electrical resistance state to a low electrical resistance state as the temperature increases above a predetermined value. Application of the electrical potential in one direction renders the thermal switching element conductive to pass electron current out of the ion source. This causes positive ions to flow from the source into the bistable switching element and intercalate the same to produce a non-volatile, low resistance logic state. Application of the electrical potential in the opposite direction causes reverse current flow which de-intercalates the bistable logic switching element and produces a high resistance logic state.
Shape memory alloys (SMAs) can produce large strains when deformed (e.g., up to 8%). Heating results in a phase transformation and associated recovery of all the accumulated strain. This strain recovery can occur against large forces, resulting in their use as actuators. Thus an SMA element can integrate both sensory and actuation functions, by inherently sensing a change in temperature and actuating by undergoing a shape change as a result of a temperature-induced phase transformation. Two aspects of our work on cryogenic SMAs are addressed here. First - a shape memory alloy based cryogenic thermal conduction switch for operation between dewars of liquid methane and liquid oxygen in a common bulkhead arrangement is discussed. Such a switch integrates the sensor element and the actuator element and can be used to create a variable thermal sink to other cryogenic tanks for liquefaction, densification, and zero boil-off systems for advanced spaceport applications. Second - fabrication via arc-melting and subsequent materials testing of SMAs with cryogenic transformation temperatures for use in the aforementioned switch is discussed.
The following summarizes the activities performed under NASA grant NAG10-323 from September 1, 2002 through September 30, 2004 at the. Univ ersity of Central Florida. A version of this has already been submitt ed for publication in the international journal Swart Materials and S tructures in December 2004. Additionally, a version of this has alrea dy appeared in print in Advances in Cryogenic Engineering, American Institute of Physics, (2004) 50A 26-3; in an article entitled "A Shape Memory Alloy Based Cryogenic Thermal Conduction Switch" by V.B. Krish nan. J.D. Singh. T.R. Woodruff. W.U. Notardonato and R. Vaidyanathan (article is attached at the end of this report).
This paper summarizes the technology development progress made during year one of the three-year JPL PALETTE project, which is funded by the NASA STMD Game Changing Development (GCD) Program. The project goal is to ensure that a full “palette” of flight-ready (high TRL) thermal “toolbox” elements is available so that engineers can create passive, ultra-isolative thermal designs for science instruments on a variety of carriers in lunar/planetary extreme environments. PALETTE is structured to meet the need via four design/build/test tasks and four analysis/study tasks. This paper focuses on Tasks 1-4, the four design/build/test tasks. Task 1 involves the development of nested thermally-switched enclosures featuring a reverse-operation DTE thermal switch (ROD-TSW) in series with a propylene miniaturized loop heat pipe (mini-LHP). Task 2 involves the development of a parabolic reflector radiator (PRR) for low latitude lunar sites. Task 3 involves the development of a low effective emissivity (e*) multilayer insulation (MLI) known as “spacerless” MLI. Finally, Task 4 involves the development of low conductance (G) thermal isolators. Available test results for all four tasks will be summarized in the paper, as will the plans for the remainder of the PALETTE project.
Polymeric thermal switches that can reversibly tune and significantly enhance their thermal conductivities are desirable for diverse applications in electronics, aerospace, automotives, and medicine; however, they are rarely achieved. Here, we report a polymer-based thermal switch consisting of an end-linked star-shaped thermoset with two independent thermal conductivity tuning mechanisms—strain and temperature modulation—that rapidly, reversibly, and cyclically modulate thermal conductivity. The end-linked star-shaped thermoset exhibits a strain-modulated thermal conductivity enhancement up to 11.5 at a fixed temperature of 60 °C (increasing from 0.15 to 2.1 W m –1 K –1 ). Additionally, it demonstrates a temperature-modulated thermal conductivity tuning ratio up to 2.3 at a fixed stretch of 2.5 (increasing from 0.17 to 0.39 W m –1 K –1 ). When combined, these two effects collectively enable the end-linked star-shaped thermoset to achieve a thermal conductivity tuning ratio up to 14.2. Moreover, the end-linked star-shaped thermoset demonstrates reversible tuning for over 1000 cycles. The reversible two-way tuning of thermal conductivity is attributed to the synergy of aligned amorphous chains, oriented crystalline domains, and increased crystallinity by elastically deforming the end-linked star-shaped thermoset.
An investigation to adapt axial grooved designs to the gammit of heat pipe thermal control techniques, with particular emphasis on those suited for cryogenic applications was conducted. In addition to considering both active and passive gas control, diode designs utilizing liquid or gas blockage, or a liquid trap, are evaluated. The use of the liquid trap as a secondary heat pipe for forward mode operation during diode shutdown is also studied. This latter function is basically that of a thermal switch. Finally, a system capable of hybrid functions consisting of gas-controlled variable conductance and liquid trap diode shutdown or thermal switching is defined.