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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3

Fault Tolerant Magnetic Bearing Testing and Conical Magnetic Bearing Development for Extreme Temperature Environments

During the six month tenure of the grant, activities included continued research of hydrostatic bearings as a viable backup-bearing solution for a magnetically levitated shaft system in extreme temperature environments (1000 F), developmental upgrades of the fault-tolerant magnetic bearing rig at the NASA Glenn Research Center, and assisting in the development of a conical magnetic bearing for extreme temperature environments, particularly turbomachinery. It leveraged work from the ongoing Smart Efficient Components (SEC) and the Turbine-Based Combined Cycle (TBCC) program at NASA Glenn Research Center. The effort was useful in providing technology for more efficient and powerful gas turbine engines.

Keith, Theo G., Jr.↗

Extreme-Temperature Carbon- and Ceramic-Matrix Composite Nozzle Extensions for Liquid Rocket Engines

The United States (US) National Aeronautics and Space Administration (NASA) and its US industry partners are developing extreme-temperature composite nozzle extensions for a variety of cryogenic liquid rocket engine propulsion systems. Applications under consideration at the NASA Marshall Space Flight Center (MSFC) include launch vehicle (upper stage), in-space, and lunar lander descent/ascent propulsion systems. Composite material systems of interest include carbon-carbon (C-C) and carbon/silicon-carbide (C-SiC) composites, as well as modified versions of such composites (coatings, mixed matrices, oxidation inhibitors, etc.). Missions addressed include access to low Earth orbit, the lunar surface, and more distant destinations. Cryogenic upper-stage and in-space liquid rocket engines are optimized for performance through the use of high area ratio nozzles to fully expand combustion gases to low exit pressures, increasing exhaust velocities. As a result of the large size of such nozzles, and the related engine performance requirements, composite nozzle extensions are being considered to reduce mass impacts. Currently, metallic and foreign composite nozzle extensions used on the Atlas V, Delta IV, Falcon 9, and Ariane 5 launch vehicles represent the state-of-the-art. Such extensions are limited to use at or slightly above 2000°F (1093°C). Materials under development by MSFC and its industry partners have the potential to operate at temperatures up to (or above) 4250°F (2343°C). Marshall Space Flight Center efforts are aimed at (a) further developing the technology and databases needed to enable the use of composite nozzle extensions on cryogenic liquid rocket engines, (b) developing and demonstrating low-cost capabilities for testing and qualifying such nozzle extensions, and (c) advancing the US domestic supply chain for nozzle extensions. Through the Small Business Innovation Research (SBIR) and Small Business Technology Transfer (STTR) Programs, low-level internal MSFC research projects, and teaming arrangements with domestic industry partners, composite material design, development, hot-fire test, and evaluation efforts are progressing. Hot- fire engine tests of subscale hardware have been conducted using oxygen/hydrogen (LOX/H2), oxygen/methane (LOX/CH4), and oxygen/kerosene (LOX/RP-1) propellants. These engine tests at MSFC have enabled the evaluation of both heritage and state-of-the-art material systems, demonstrating the initial capabilities of the extreme temperature materials and their fabrication methods. Recent, ongoing, and potential future work supporting cryogenic propulsion systems development will be presented. The composite nozzle extension technology and test capabilities being developed are intended to support both NASA and US Department of Defense requirements, as well as those of the broader Commercial Space industry.

Valentine, Peter G.↗

Operation of a Giant Magnetoresistive (GMR) Digital Isolator, Type IL510, Under Extreme Temperatures

A relatively new type of signal isolation based on Giant Magnetoresistive (GMR) technology was investigated for potential use in harsh temperature environments. Operational characteristics of the 2Mbps single channel, IL510-Series commercial-off-the-shelf (COTS) digital isolator chip was obtained under extreme temperature exposure and thermal cycling in the range of -190 C to +120 C. The isolator was evaluated in terms of its output signal delivery and stability, output rise (t(sub r)) and fall times (t(sub f)), and propagation delays at 50% level between input and output during low to high (t(sub PLH)) and high to low (t(sub PHL)) transitions. The device performed very well throughout the entire test temperature range as no significant changes occurred either in its function or in its output signal timing characteristics. The limited thermal cycling, which comprised of 12 cycles between -190 C and +120 C, also had no influence on its performance. In addition, the device packaging underwent no structural damage due to the extreme temperature exposure. These preliminary results indicate that this semiconductor chip has the potential for use in a temperature range that extends beyond its specified regime. Additional and more comprehensive testing, however, is required to establish its operation and reliability and to determine its suitability for long-term use in space exploration missions.

Patterson, Richard↗

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗

Performance of the THS4302 and the Class V Radiation-Tolerant THS4304-SP Silicon Germanium Wideband Amplifiers at Extreme Temperatures

This report discusses the performance of silicon germanium, wideband gain amplifiers under extreme temperatures. The investigated devices include Texas Instruments THS4304-SP and THS4302 amplifiers. Both chips are manufactured using the BiCom3 process based on silicon germanium technology along with silicon-on-insulator (SOI) buried oxide layers. The THS4304-SP device was chosen because it is a Class V radiation-tolerant (150 kRad, TID silicon), voltage-feedback operational amplifier designed for use in high-speed analog signal applications and is very desirable for NASA missions. It operates with a single 5 V power supply [1]. It comes in a 10-pin ceramic flatpack package, and it provides balanced inputs, low offset voltage and offset current, and high common mode rejection ratio. The fixed-gain THS4302 chip, which comes in a 16-pin leadless package, offers high bandwidth, high slew rate, low noise, and low distortion [2]. Such features have made the amplifier useful in a number of applications such as wideband signal processing, wireless transceivers, intermediate frequency (IF) amplifier, analog-to-digital converter (ADC) preamplifier, digital-to-analog converter (DAC) output buffer, measurement instrumentation, and medical and industrial imaging.

Patterson, Richard L.↗

Novel Lightweight Insulation Protects Fuel Tanks from Extreme Temperatures

Quest Thermal Group developed its integrated multi-layer insulation (IMLI) with funding from the NASA SBIR/STTR program. IMLI is high-performance insulation that protects spacecraft and cryogenic systems from extreme temperatures at a lighter weight than traditional MLI. IMLI performed successful flight demonstrations on NASA’s Robotic Refueling Mission 3 in 2018 and NASA’s Green Propellant Infusion Mission in partnership with large business Ball Aerospace in 2019, opening the door for additional opportunities with NASA and commercial customers.

SBIR/STTR↗

Apparatus for measurement of thermal conductivity of insulation systems subjected to extreme temperature differences

Advanced aerospace designs require thermal insulation systems which are consistent with cryogenic fluids, high thermal loads, and design restrictions such as weight and volume. To evaluate the thermal performance of these insulating systems, an apparatus capable of measuring thermal conductivity using extreme temperature differences (27 to 1100 K) is being developed. This system is described along with estimates of precision and accuracy in selected operating conditions. Preliminary data are presented.

Dube, W. P.↗

Self-Adaptive System based on Field Programmable Gate Array for Extreme Temperature Electronics

In this work, we report the implementation of a self-adaptive system using a field programmable gate array (FPGA) and data converters. The self-adaptive system can autonomously recover the lost functionality of a reconfigurable analog array (RAA) integrated circuit (IC) [3]. Both the RAA IC and the self-adaptive system are operating in extreme temperatures (from 120 C down to -180 C). The RAA IC consists of reconfigurable analog blocks interconnected by several switches and programmable by bias voltages. It implements filters/amplifiers with bandwidth up to 20 MHz. The self-adaptive system controls the RAA IC and is realized on Commercial-Off-The-Shelf (COTS) parts. It implements a basic compensation algorithm that corrects a RAA IC in less than a few milliseconds. Experimental results for the cold temperature environment (down to -180 C) demonstrate the feasibility of this approach.

adaptive hardwares↗

Flexible Diaphragm Withstands Extreme Temperatures

Diaphragm seal retains flexibility throughout temperature range of -200 to +600 degree F (-129 to +316 degree C). Diaphragm durable, simple, versatile, and relatively inexpensive to manufacture. Suitable for refrigeration seals, autoclaves, storage lockers, and other sealing applications subjected to extreme temperature differentials.

Lerma, G.↗

Climate Change: A New Metric to Measure Changes in the Frequency of Extreme Temperatures using Record Data

Consensus on global warming is the result of multiple and varying lines of evidence, and one key ramification is the increase in frequency of extreme climate events including record high temperatures. Here we develop a metric- called "record equivalent draws" (RED)-based on record high (low) temperature observations, and show that changes in RED approximate changes in the likelihood of extreme high (low) temperatures. Since we also show that this metric is independent of the specifics of the underlying temperature distributions, RED estimates can be aggregated across different climates to provide a genuinely global assessment of climate change. Using data on monthly average temperatures across the global landmass we find that the frequency of extreme high temperatures increased 10-fold between the first three decades of the last century (1900-1929) and the most recent decade (1999-2008). A more disaggregated analysis shows that the increase in frequency of extreme high temperatures is greater in the tropics than in higher latitudes, a pattern that is not indicated by changes in mean temperature. Our RED estimates also suggest concurrent increases in the frequency of both extreme high and extreme low temperatures during 2002-2008, a period when we observe a plateauing of global mean temperature. Using daily extreme temperature observations, we find that the frequency of extreme high temperatures is greater in the daily minimum temperature time-series compared to the daily maximum temperature time-series. There is no such observable difference in the frequency of extreme low temperatures between the daily minimum and daily maximum.

Munasinghe, L.↗

Qualification of Fiber Optic Cables for Martian Extreme Temperature Environments

Means have been developed for enabling fiber optic cables of the Laser Induced Breakdown Spectrometer instrument to survive ground operations plus the nominal 670 Martian conditions that include Martian summer and winter seasons. The purpose of this development was to validate the use of the rover external fiber optic cabling of ChemCam for space applications under the extreme thermal environments to be encountered during the Mars Science Laboratory (MSL) mission. Flight-representative fiber optic cables were subjected to extreme temperature thermal cycling of the same diurnal depth (or delta T) as expected in flight, but for three times the expected number of in-flight thermal cycles. The survivability of fiber optic cables was tested for 600 cumulative thermal cycles from -130 to +15 C to cover the winter season, and another 1,410 cumulative cycles from -105 to +40 C to cover the summer season. This test satisfies the required 3 times the design margin that is a total of 2,010 thermal cycles (670 x 3). This development test included functional optical transmission tests during the course of the test. Transmission of the fiber optic cables was performed prior to and after 1,288 thermal cycles and 2,010 thermal cycles. No significant changes in transmission were observed on either of the two representative fiber cables subject through the 3X MSL mission life that is 2,010 thermal cycles.

Ramesham, Rajeshuni↗

First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits

A separate submission to this conference reports that 4H-SiC Junction Field Effect Transistor (JFET) digital and analog Integrated Circuits (ICs) with two levels of metal interconnect have reproducibly demonstrated electrical operation at 500 C in excess of 1000 hours. While this progress expands the complexity and durability envelope of high temperature ICs, one important area for further technology maturation is the development of reasonably accurate and accessible computer-aided modeling and simulation tools for circuit design of these ICs. Towards this end, we report on development and verification of 25 C to 500 C SPICE simulation models of first order accuracy for this extreme-temperature durable 4H-SiC JFET IC technology. For maximum availability, the JFET IC modeling is implemented using the baseline-version SPICE NMOS LEVEL 1 model that is common to other variations of SPICE software and importantly includes the body-bias effect. The first-order accuracy of these device models is verified by direct comparison with measured experimental device characteristics.

JFET↗

Extreme Temperature Additively Manufactured GRX-810 Alloy Development and Hot-fire Testing for Liquid Rocket Engines

Additive manufacturing (AM) has revolutionized component design for liquid rocket engines by offering rapid manufacturing capabilities. This has led to significant opportunities for development and flight programs in the propulsion industry, resulting in cost and schedule savings, as well as performance improvements through new designs and alloy development. A noteworthy example is the GRX-810 oxide dispersion strengthened (ODS) alloy, which was specifically developed for extreme temperatures. This Ni-Co-Cr based alloy was created using integrated computational materials engineering (ICME) techniques to focus on a new class of materials with exceptional temperature and oxidation-resistant properties. The GRX-810 alloy utilizes AM processes to incorporate nano-scale yttria particles throughout its microstructure, resulting in remarkable enhancements. Compared to traditional Nickel-based superalloys, the GRX-810 alloy offers a two-fold increase in tensile strength, 1,000-fold better creep properties, and two-fold improvement in oxidation resistance. NASA successfully demonstrated the development and manufacturing of components using the GRX-810 alloy through laser powder bed fusion (L-PBF) and laser powder directed energy deposition (LP-DED) processes. Extensive efforts were made to model, evaluate metallurgical properties, develop heat treatment processes, characterize the microstructure, and determine mechanical properties. The GRX-810 alloy was specifically designed for aerospace applications, including liquid rocket engine injectors, preburners, turbines, and hot-section components, capable of withstanding temperatures up to 1,100 °C. The objective of this alloy development is to bridge the temperature gap between traditional Nickel-based superalloys and refractory alloys. This paper provides a comprehensive comparison of the GRX-810 alloy with other aerospace alloys, discussing its microstructure, mechanical properties, processing advancements, component development, and hot-fire testing results. The ultimate goal of this development was to elevate the Technology Readiness Level (TRL) of the GRX-810 alloy, enabling its integration into NASA and commercial aerospace applications.

GRX-810↗

Extreme Temperature Additively Manufactured GRX-810 Alloy Development and Hot-fire Testing for Liquid Rocket Engines

Additive manufacturing (AM) has revolutionized component design for liquid rocket engines by offering rapid manufacturing capabilities. This has led to significant opportunities for development and flight programs in the propulsion industry, resulting in cost and schedule savings, as well as performance improvements through new designs and alloy development. A noteworthy example is the GRX-810 oxide dispersion strengthened (ODS) alloy, which was specifically developed for extreme temperatures. This Ni-Co-Cr based alloy was created using integrated computational materials engineering (ICME) techniques to focus on a new class of materials with exceptional temperature and oxidation-resistant properties. The GRX-810 alloy utilizes AM processes to incorporate nano-scale yttria particles throughout its microstructure, resulting in remarkable enhancements. Compared to traditional Nickel-based superalloys, the GRX-810 alloy offers a two-fold increase in tensile strength, 1,000-fold better creep properties, and two-fold improvement in oxidation resistance. NASA successfully demonstrated the development and manufacturing of components using the GRX-810 alloy through laser powder bed fusion (L-PBF) and laser powder directed energy deposition (LP-DED) processes. Extensive efforts were made to model, evaluate metallurgical properties, develop heat treatment processes, characterize the microstructure, and determine mechanical properties. The GRX-810 alloy was specifically designed for aerospace applications, including liquid rocket engine injectors, preburners, turbines, and hot-section components, capable of withstanding temperatures up to 1,100 °C. The objective of this alloy development is to bridge the temperature gap between traditional Nickel-based superalloys and refractory alloys. This paper provides a comprehensive comparison of the GRX-810 alloy with other aerospace alloys, discussing its microstructure, mechanical properties, processing advancements, component development, and hot-fire testing results. The ultimate goal of this development was to elevate the Technology Readiness Level (TRL) of the GRX-810 alloy, enabling its integration into NASA and commercial aerospace applications.

GRX-810↗

PRTs and Their Bonding for Long-Duration, Extreme-Temperature Environments

Research was conducted on the qualification of Honeywell platinum resistance thermometer (PRT) bonding for use in the Mars Science Laboratory (MSL). This is the first time these sensors will be used for Mars-related projects. Different types of PRTs were employed for the Mars Exploration Rover (MER) project, and several reliability issues were experienced, even for a shortduration mission like MER compared to MSL. Therefore, the development of a qualification process for the Honeywell PRT bonding was needed for the MSL project. Reliability of the PRT sensors, and their bonding processes, is a key element to understand the health of the hardware during all stages of the project, and particularly during surface operations on Mars. Three extreme temperature summer season cycles and three winter season cycles (total: 1983 thermal cycles) were completed, and no Honeywell PRT failures associated with the bonding process were found. Seventy-eight PRTs were bonded onto six different substrate materials using four different adhesives during the thermal cycling, which included a planetary protection cycle to +125 C for two hours, three protoflight/qualification cycles (-135 to 70 C), 1,384 summer cycles (-105 to 40 C), and 599 winter cycles (-130 to 15 C). There were no observed changes in PRT resistances, bonding characteristics, or damage identified from the package evaluation as a result of the qualification tests.

Ramesham, Rajeshuni↗

New adhesive withstands temperature extremes

Adhesive, developed for high-temperature components aboard satellites, is useful at both high and low temperatures and exhibits low-vacuum volatility and low shrinkage. System uses polyfunctional epoxy with high aromatic content, low equivalent weight, and more compact polymer than conventional bisphenol A tape.

Park, J. J.↗

Climate Change and Fetal Health: The Impacts of Exposure to Extreme Temperatures in New York City

Background: Climate change is projected to increase the frequency, intensity, and duration of heat waves while reducing cold extremes, yet few studies have examined the relationship between temperature and fetal health. Objectives: We estimate the impacts of extreme temperatures on birth weight and gestational age in Manhattan, a borough in New York City, and explore differences by socioeconomic status (SES). Methods: We combine average daily temperature from 1985 to 2010 with birth certificate data in Manhattan for the same time period. We then generate 33 downscaled climate model time series to project impacts on fetal health. Results: We find exposure to an extra day where average temperature 25 F and 85 F during pregnancy is associated with a 1.8 and 1.7 g (respectively) reduction in birth weight, but the impact varies by SES, particularly for extreme heat, where teen mothers seem most vulnerable. We find no meaningful, significant effect on gestational age. Using projections of temperature from these climate models, we project average net reductions in birth weight in the 2070- 2099 period of 4.6 g in the business-as-usual scenario. Conclusions: Results suggest that increasing heat events from climate change could adversely impact birth weight and vary by SES.

climate change↗