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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

Ultrafast Annealing Improves SNR and Long-Term Stability of a Highly Multiplexed Line-by-Line FBG Array Inscribed by Femtosecond Laser in a Coreless Fiber for Extreme-Temperature Applications

This study reports the fabrication of a fourth-order line-by-line fiber Bragg grating (FBG) array using femtosecond laser inscription within a highly multimode coreless optical fiber, with a particular focus on achieving substantial multiplexing capabilities. An ultrafast annealing procedure is employed, resulting in an impressive enhancement of the FBG sensor’s fringe visibility by approximately 13 dB, signifying a notable improvement of approximately ~4 dB. This substantial enhancement contributes to the long-term stability and performance of the multiplexed FBG array in extreme-temperature conditions. The systematic fabrication approach employed for the multiplexed FBG array guarantees a high signal-to-noise ratio (SNR) for each individual FBG within the array. This FBG array is intended for extreme-temperature applications, addressing limitations associated with traditional FBGs based on doped optical fibers, including SNR degradation and temperature-induced fringe drift. Testing at temperatures up to 1120 °C demonstrates the FBG array’s stability without fluctuations in readings. Furthermore, it endures seven heat cycles, spanning from 500 °C to 1120 °C, over 60 h, exhibiting outstanding thermal stability. Furthermore, this highly multiplexed FBG array with an ultrafast annealing approach holds promise for extreme-temperature environments, such as steelmaking, where precise and reliable distributed temperature monitoring is imperative.

47 OTHER INSTRUMENTATION↗
NASA NTRS2008

Electronic Components for use in Extreme Temperature Aerospace Applications

Electrical power management and control systems designed for use in planetary exploration missions and deep space probes require electronics that are capable of efficient and reliable operation under extreme temperature conditions. Space-based infra-red satellites, all-electric ships, jet engines, electromagnetic launchers, magnetic levitation transport systems, and power facilities are also typical examples where the electronics are expected to be exposed to harsh temperatures and to operate under severe thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and, therefore, new parts must be developed or the conventional devices need to be modified. For example, spacecraft operating in the cold environment of deep space carry a large number of radioisotope heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. At the other end, built-in radiators and coolers render the operation of electronics possible under hot conditions. These thermal measures lead to design complexity, affect development costs, and increase size and weight. Electronics capable of operation at extreme temperatures, thus, will not only tolerate the hostile operational environment, but also make the overall system efficient, more reliable, and less expensive. The Extreme Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electronics suitable for applications in the aerospace environment and deep space exploration missions. Research is being conducted on devices, including COTS parts, for potential use under extreme temperatures. These components include semiconductor switching devices, passive devices, DC/DC converters, operational amplifiers, and oscillators. An overview of the program will be presented along with some experimental findings.

Patterson, Richard L.↗
DOE OSTI2023

Satellite-Based Ranking of the World’s Hottest and Coldest Cities Reveals Inequitable Distribution of Temperature Extremes

The identification of the world’s hottest and coldest cities fascinates both the public and the scientific community. However, the ranking of city temperatures, especially from the perspective of human discomfort, has been difficult. Here we estimated the monthly mean maximum and minimum 1-km resolution urban temperatures of 13,135 cities worldwide (2003–19) from the thermal discomfort perspective by combining in situ measurements, satellite-based land surface temperatures, fine-resolution intracity data, and reanalysis data. Manama, Bahrain, was identified as the hottest city (48.18° ± 1.31°C) and Yakutsk, Russia (–42.96° ± 0.72°C), as the coldest city. The global city temperatures followed a power-law pattern, characterized by cities with <0.3 million inhabitants covering 80% of the top 20% global cities with extreme temperatures. Our study reveals an inequitable pattern of global city temperature extremes and highlights the urgency of developing appropriate strategies to reduce climate change risks in small- and medium-sized cities with low development levels.

54 ENVIRONMENTAL SCIENCES↗
NASA NTRS2009

Assessment of SOI AND Gate, Type CHT-7408, for Operation in Extreme Temperature Environments

Electronic parts based on silicon-on-insulator (SOI) technology are finding widespread applications due to their ability to operate in harsh environments and the benefits they offer as compared to their silicon counterparts. Due to their construction, they are tailored for high temperature operation and show good tolerance to radiation events. In addition, their inherent design lessens the formation of parasitic junctions, thereby reducing leakage currents, decreasing power consumption, and enhancing speed. These devices are typically rated in temperature capability from -55 C to about +225 C, and their characteristics over this temperature range are documented in data sheets. Since electronics in some of NASA space exploration missions are required to operate under extreme temperature conditions, both cold and hot, their characteristic behavior within the full temperature spectrum must be determined to establish suitability for use in space applications. The effects of extreme temperature exposure on the performance of a new commercial-off-the-shelf (COTS) SOI AND gate device were evaluated in this work. The high temperature, quad 2-inputs AND gate device, which was recently introduced by CISSOID, is fabricated using a CMOS SOI process. Some of the specifications of the CHT-7408 chip are listed in a table. By supplying a constant DC voltage to one gate input and a 10 kHz square wave into the other associated gate input, the chip was evaluated in terms of output response, output rise (t(sub r)) and fall times (tf), and propagation delays (using a 50% level between input and output during low to high (tPLH) and high to low (tPHL) transitions). The supply current of the gate circuit was also obtained. These parameters were recorded at various test temperatures between -195 C and +250 C using a Sun Systems environmental chamber programmed at a temperature rate of change of 10 C/min. In addition, the effects of thermal cycling on this chip were determined by exposing it to a total of 12 cycles between -195 C and +250 C. Following the cycling activity, measurements were performed again at the test temperatures of -195 C, +21 C, and +250 C.

Patterson, Richard↗
NASA NTRS2006

Extreme Temperature Electronics Using a Reconfigurable Analog Array

Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques such as bias cancellation circuitry have also been employed. However, current technology can only ensure very limited lifetime in extreme environments. Previous work presented a novel approach, based on evolvable hardware technology, which allows adaptive in-situ circuit redesign/reconfiguration during operation in extreme environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. This work describes a new reconfigurable analog chip developed by JPL and SPAWAR that is targeted for extreme temperature and evolutionary hardware experiments. Being based on Gm-C technology, this chip can have its functionality tuned and adapted to extreme temperatures through voltage bias adjustment. This tuning process will be controlled by Evolutionary Algorithms. This paper presents details of the reconfigurable analog chip as well as a system level overview. Some early experiments are also described.

evolvable hardware↗
NASA NTRS2004

Fault Tolerant Magnetic Bearing Testing and Conical Magnetic Bearing Development for Extreme Temperature Environments

During the six month tenure of the grant, activities included continued research of hydrostatic bearings as a viable backup-bearing solution for a magnetically levitated shaft system in extreme temperature environments (1000 F), developmental upgrades of the fault-tolerant magnetic bearing rig at the NASA Glenn Research Center, and assisting in the development of a conical magnetic bearing for extreme temperature environments, particularly turbomachinery. It leveraged work from the ongoing Smart Efficient Components (SEC) and the Turbine-Based Combined Cycle (TBCC) program at NASA Glenn Research Center. The effort was useful in providing technology for more efficient and powerful gas turbine engines.

Keith, Theo G., Jr.↗
NASA NTRS2019

Extreme-Temperature Carbon- and Ceramic-Matrix Composite Nozzle Extensions for Liquid Rocket Engines

The United States (US) National Aeronautics and Space Administration (NASA) and its US industry partners are developing extreme-temperature composite nozzle extensions for a variety of cryogenic liquid rocket engine propulsion systems. Applications under consideration at the NASA Marshall Space Flight Center (MSFC) include launch vehicle (upper stage), in-space, and lunar lander descent/ascent propulsion systems. Composite material systems of interest include carbon-carbon (C-C) and carbon/silicon-carbide (C-SiC) composites, as well as modified versions of such composites (coatings, mixed matrices, oxidation inhibitors, etc.). Missions addressed include access to low Earth orbit, the lunar surface, and more distant destinations. Cryogenic upper-stage and in-space liquid rocket engines are optimized for performance through the use of high area ratio nozzles to fully expand combustion gases to low exit pressures, increasing exhaust velocities. As a result of the large size of such nozzles, and the related engine performance requirements, composite nozzle extensions are being considered to reduce mass impacts. Currently, metallic and foreign composite nozzle extensions used on the Atlas V, Delta IV, Falcon 9, and Ariane 5 launch vehicles represent the state-of-the-art. Such extensions are limited to use at or slightly above 2000°F (1093°C). Materials under development by MSFC and its industry partners have the potential to operate at temperatures up to (or above) 4250°F (2343°C). Marshall Space Flight Center efforts are aimed at (a) further developing the technology and databases needed to enable the use of composite nozzle extensions on cryogenic liquid rocket engines, (b) developing and demonstrating low-cost capabilities for testing and qualifying such nozzle extensions, and (c) advancing the US domestic supply chain for nozzle extensions. Through the Small Business Innovation Research (SBIR) and Small Business Technology Transfer (STTR) Programs, low-level internal MSFC research projects, and teaming arrangements with domestic industry partners, composite material design, development, hot-fire test, and evaluation efforts are progressing. Hot- fire engine tests of subscale hardware have been conducted using oxygen/hydrogen (LOX/H2), oxygen/methane (LOX/CH4), and oxygen/kerosene (LOX/RP-1) propellants. These engine tests at MSFC have enabled the evaluation of both heritage and state-of-the-art material systems, demonstrating the initial capabilities of the extreme temperature materials and their fabrication methods. Recent, ongoing, and potential future work supporting cryogenic propulsion systems development will be presented. The composite nozzle extension technology and test capabilities being developed are intended to support both NASA and US Department of Defense requirements, as well as those of the broader Commercial Space industry.

Valentine, Peter G.↗
DOE OSTI2023

Analyzing at-scale distribution grid response to extreme temperatures

Threats against power grids continue to increase, as extreme weather conditions and natural disasters (extreme events) become more frequent. Hence, there is a need for the simulation and modeling of power grids to reflect realistic conditions during extreme events conditions, especially distribution systems. Herein, this paper presents a modeling and simulation platform for electric distribution grids which can estimate overall power demand during extreme weather conditions. The presented platform's efficacy is shown by demonstrating estimation of electrical demand for 1) Electricity Reliability Council of Texas (ERCOT) during winter storm Uri in 2021, and 2) alternative hypothetical scenarios of integrating Distributed Energy Resources (DERs), weatherization, and load electrification. In comparing to the actual demand served by ERCOT during the winter storm Uri of 2021, the proposed platform estimates approximately 34 GW of peak capacity deficit. These numbers are consistent with state-of-the-art prediction results published in the literature. For the case of the future electrification of heating loads, peak capacity of 78 GW (124% increase) is estimated, which would be reduced to 47 GW (38% increase) with the adoption of efficient heating appliances and improved thermal insulation. Integrating distributed solar PV and storage into the grid causes improvement in the local energy utilization and hence reduces the potential unmet energy by 31% and 40%, respectively.

24 POWER TRANSMISSION AND DISTRIBUTION↗
NASA NTRS2010

Operation of a Giant Magnetoresistive (GMR) Digital Isolator, Type IL510, Under Extreme Temperatures

A relatively new type of signal isolation based on Giant Magnetoresistive (GMR) technology was investigated for potential use in harsh temperature environments. Operational characteristics of the 2Mbps single channel, IL510-Series commercial-off-the-shelf (COTS) digital isolator chip was obtained under extreme temperature exposure and thermal cycling in the range of -190 C to +120 C. The isolator was evaluated in terms of its output signal delivery and stability, output rise (t(sub r)) and fall times (t(sub f)), and propagation delays at 50% level between input and output during low to high (t(sub PLH)) and high to low (t(sub PHL)) transitions. The device performed very well throughout the entire test temperature range as no significant changes occurred either in its function or in its output signal timing characteristics. The limited thermal cycling, which comprised of 12 cycles between -190 C and +120 C, also had no influence on its performance. In addition, the device packaging underwent no structural damage due to the extreme temperature exposure. These preliminary results indicate that this semiconductor chip has the potential for use in a temperature range that extends beyond its specified regime. Additional and more comprehensive testing, however, is required to establish its operation and reliability and to determine its suitability for long-term use in space exploration missions.

Patterson, Richard↗
NASA NTRS2010

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗
DOE OSTI2022

Wide Bandgap Semiconductors for Extreme Temperature and Radiation Environments

With their greater voltage breakdowns, higher current limitations, and faster switching speeds, wide bandgap semiconductors are increasing in market application over the traditionally dominant silicon devices. Silicon carbide semiconductors have been increasing the efficiency and reducing the footprint of modern power electronics, and the increased electron mobility of gallium nitride semiconductors have been increasing the switching frequencies of radio frequency circuits. In extreme temperature (>225°C) applications and high radiation environments such as low earth orbit, deep space, and terrestrial nuclear reactors, silicon-based semiconductors degrade rapidly. Wide bandgap semiconductors are poised to disrupt the market for sensing, instrumentation, and communication circuitry in these hazardous environments by increasing the lifetime, safety, and reliability. This report outlines the advantages of using wide bandgap semiconductor materials in extreme temperature and radiation environments.

36 MATERIALS SCIENCE↗
NASA NTRS2009

Performance of the THS4302 and the Class V Radiation-Tolerant THS4304-SP Silicon Germanium Wideband Amplifiers at Extreme Temperatures

This report discusses the performance of silicon germanium, wideband gain amplifiers under extreme temperatures. The investigated devices include Texas Instruments THS4304-SP and THS4302 amplifiers. Both chips are manufactured using the BiCom3 process based on silicon germanium technology along with silicon-on-insulator (SOI) buried oxide layers. The THS4304-SP device was chosen because it is a Class V radiation-tolerant (150 kRad, TID silicon), voltage-feedback operational amplifier designed for use in high-speed analog signal applications and is very desirable for NASA missions. It operates with a single 5 V power supply [1]. It comes in a 10-pin ceramic flatpack package, and it provides balanced inputs, low offset voltage and offset current, and high common mode rejection ratio. The fixed-gain THS4302 chip, which comes in a 16-pin leadless package, offers high bandwidth, high slew rate, low noise, and low distortion [2]. Such features have made the amplifier useful in a number of applications such as wideband signal processing, wireless transceivers, intermediate frequency (IF) amplifier, analog-to-digital converter (ADC) preamplifier, digital-to-analog converter (DAC) output buffer, measurement instrumentation, and medical and industrial imaging.

Patterson, Richard L.↗
DOE OSTI2022

High speed ultraviolet digital image correlation (UV-DIC) for dynamic strains at extreme temperatures

Digital Image Correlation (DIC) is a camera-based method of measuring full-field displacements and strains from the surface of a deforming object. It can be applied at any length scale (determined by the lenses) and any time scale (determined by the camera), and because it is non-contacting, it can also be used at temperatures much higher than can be withstood by bonded strain gauges. At extreme temperatures, materials emit light in the form of blackbody radiation, which can saturate the camera sensor. It has previously been shown that the emitted light can be effectively screened by using ultraviolet (UV) cameras, lenses, and filters; however, commercially available UV cameras are relatively slow, which limits the speed of combined UV-DIC measurements. In this study, a UV intensifier was paired with a high-speed camera, and its ability to perform UV-DIC at high temperature and high speed was investigated. The system was compared over three different experiments: (A) a quasi-static thermal expansion test at high temperature, (B) a vibration test at room temperature, and (C) the same vibration test repeated at high temperature. The system successfully performed DIC up to at least 1600 °C at frame rates of 5000 fps, which is more than 100 times faster than other examples of UV-DIC in the literature. In all cases, measurements made using the UV intensifier were much noisier than those made without the intensifier, but the intensifier enabled measurements at temperatures well above those which an unfiltered high-speed camera otherwise saturates.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

Experimental characterization of extreme temperature granular flows for solar thermal energy transport and storage

High-temperature, dense granular flows along an inclined plane were considered for solar thermal energy transport and storage with sintered bauxite particles. A series of experiments was performed for particle inlet temperatures of ~ 200, 400, 600, and 800 °C to understand the mechanisms of granular flows at extreme temperatures. Mass flow rates were measured using a load cell and free-surface velocities were measured and computed using particle image velocimetry. Surface temperatures were measured using infrared cameras. A significant decrease in steady-state particle mass flow rate was observed with increasing temperature due to changing flow properties. A decrease in bulk particle free-surface velocities was observed at higher temperatures. Free-surface velocity measurement error between experiments were within 20% of the average. The particle surface temperatures decreased from inlet to outlet with larger gradients at higher temperatures observed due to increasing convection and radiative heat losses. Here, a decrease in temperature was observed along the side walls due to a decrease in particle velocities.

14 SOLAR ENERGY↗
DOE OSTI2022

Sealability Qualification of Material Extruded Zytel Gaskets at Extreme Temperatures

In this work, an in-depth qualification of additively manufactured Zytel for gasketing proton exchange membrane fuel cells (PEMFC’s) subject to extreme temperature conditions. The temperature cycling of the PEMFC from 55°C to 100°C accelerates the deterioration of these gaskets compared to that of conventional operation. The additive manufacturing process employed to print these gaskets is material extrusion using Zytel filament. In order to see the effects of the temperature of interest on the printed specimen, each specimen was thermally soaked and then charactered and tested according to ASTM standard F37B. ASTM F37B tests a materials ability to seal and maintain it while bearing both a compressive load and internal pressure load to simulate being in static operation. This process of thermally soaking and sealability testing is shown to show the validity of both this material and additive manufactured components for other applications as well. It is observed that soaking the gaskets at 100°C corrects some of the defects that are present after printing such as missing layers and small voids on the surface of the samples. This allowed for the hot soaked materials to perform better than the samples at room temperature and cold soaked.

Sealability↗
NASA NTRS2021

Novel Lightweight Insulation Protects Fuel Tanks from Extreme Temperatures

Quest Thermal Group developed its integrated multi-layer insulation (IMLI) with funding from the NASA SBIR/STTR program. IMLI is high-performance insulation that protects spacecraft and cryogenic systems from extreme temperatures at a lighter weight than traditional MLI. IMLI performed successful flight demonstrations on NASA’s Robotic Refueling Mission 3 in 2018 and NASA’s Green Propellant Infusion Mission in partnership with large business Ball Aerospace in 2019, opening the door for additional opportunities with NASA and commercial customers.

SBIR/STTR↗