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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS2006

Space Exploration Supply Chain Modeling, Simulation and Analysis Using the SCOR Model

sustained and affordable human and robotic program to explore the solar system and beyond. Extend human presence across the solar system, starting with a human return to the Moon by the year 2020, in preparation for human exploration of Mars and other destinations. Develop the innovative technologies, knowledge, and infrastructure both to explore and to support decisions about the destinations for human exploration; and promote international and commercial participation in exploration to further U.S. scientific, security, and economic interests

space operations↗
NASA NTRS2006

Haughton-Mars Project Expedition 2005: Interplanetary Supply Chain Management & Logistics Architectures

The 2005 expedition to the Haughton-Mars Project (HMP) research station on Devon Island was part of a NASA-funded project on Space Logistics. A team of nine researchers from MIT went to the Canadian Arctic to participate in the annual HMP field campaign from July 8 to August 12, 2005. We investigated the applicability of the HMP research station as an analogue for planetary macro- and micro-logistics to the Moon and Mars, and began collecting data for modeling purposes. We also tested new technologies and procedures to enhance the ability of humans and robots to jointly explore remote environments. The expedition had four main objectives. We briefly summarize our key findings in each of these areas.

deWeck, Olivier↗
NASA NTRS2011

NASA Goddard Space Flight Center Supply Chain Management Program

This slide presentation reviews the working of the Supplier Assessment Program at NASA Goddard Space Flight Center. The program supports many GSFC projects to ensure suppliers are aware of and are following the contractual requirements, to provide an independent assessment of the suppliers' processes, and provide suppliers' safety and mission assurance organizations information to make the changes within their organization.

Kelly, Michael P.↗
NASA NTRS2018

Supplier Research & Analysis Approach

"The implementation of NASA GSFC's portfolio of mission projects relies upon inter-connected, multi-tiered supply chains of organizations operating under direct and indirect contracts and other agreements throughout the U.S. and around the world. These supply chains are subject to an inter-related array of technical/production, business, market and security risks that are amplified by the ongoing globalization of industry and technology and which can disrupt or threaten the production and delivery of products and services when needed and in conformance with requirements. In recognition of such risks and associated challenges, GSFC's SMA directorate launched an innovative Supplier Research and Analysis (SRA) capability three years ago to gain greater insight into the operating environment, performance, capabilities and viability of current and prospective suppliers for GSFC projects and proposals. The capability uses business intelligence techniques and primarily open source information resources as part of a cost-effective, non-intrusive methodology to produce several types of research and analysis reports. The reports are based on a holistic analytical framework encompassing key technical/production, business enterprise management, market and security factors, and feature in-depth information, summary information profiles, SWOT (Strengths, Weaknesses, Opportunities, Threats) analysis, and candidate risk concerns in order to pro-actively support SMA and project management needs. The SRA capability, which is designed to complement and support ongoing SMA/project management activities and practices, has produced over 95 reports since its start-up in early 2015. This presentation addresses the approach, methodology and performance of the Supplier Research and Analysis (SRA) capability and its value in assuring the success of NASA mission projects. In doing so, the presentation provides lessons-learned, best practices, case examples and address how it fits into the development of an enterprise-level Supply Chain Risk Management capability."

supplier research and analysis↗
NASA NTRSDate not supplied

Contracting Quality Early in the Lifecycle Using AS9145 Data Deliverables

Development schedules and a highly dynamic supply chain are a challenge to developers of complex systems produced at low volume. Flaws in designs, parts and materials availability problems, poor manufacturability, and a lack of knowledge about critical items and key process attributes can be realized well before traditional second-party quality assurance activities begin. Supplier audits and product inspections may have little mitigating effect once these foundational problems have been realized. Their impacts can be significant lifecycle disruption, cost overruns, inability to deliver to plan, and even project cancellation. AS9145, Requirements for Advanced Product Quality Planning and Production Part Approval Process, can be used to drive quality engineering practices into early development lifecycles to significantly reduce this late-cycle risk and to reduce the cost of quality overall. Since its initial publication in 2016, it has had very limited adoption by the DoD, no adoption by NASA, and sparse adoption in the aerospace and defense supply chain. A task group within the Aerospace Industries Association's (AIA) Joint Strategic Quality Council (JSQC) identified that both acquirers and suppliers see as AS9145 as a cost-adder and are hesitant to use it as an alternative to late-stage-heavy quality assurance approaches. A lack of prior use creates large capability gaps in request-for-proposal (RFP) teams, proposal teams, suppliers’ quality management systems (QMS), and in experienced personnel executing the early lifecycle approach. To create a more realizable on-ramp for using AS9145 in the space and defense sectors, the AIA JSQC task team created five deliverable requirements descriptions (DRDs) that can be used in a contract to begin to engage both parties in early lifecycle quality engineering and quality assurance activities, that reduce exposure to late-stage cost and schedule collapse due to unidentified risks in design, supply chain, and manufacturability. These DRDs drive the parties to engage in planning and analysis discussions early on to understand what production risks can be known and how they will focus resources based on safety criticality and the key elements of design and construction. The suppliers and acquirers who will produce the data and information required by the DRD will be able to incrementally evolve their QMS and the acquirer will incrementally be able to track and understand the benefits of cost shifting from late to early development phases. A white paper describing this approach and the five recommended DRDs will be published by the AIA in late 2024 or early 2025.

Jeannette Plante↗
NASA NTRSDate not supplied

Ballistic Lunar Return Trajectories for Sustainable Cargo Return and Entry System Technology Development

As part of the sustained approach for the lunar Gateway and Artemis program as a whole, NASA is extending the logistics supply chain beyond low Earth orbit and to the Moon. This supply chain includes the possibility of lunar sample and cargo return. To enable these future return missions, the possibility for incorporating demonstration payloads including various entry, descent, and landing technologies is examined. Possible implementations include deployable entry vehicles, high speed sample return capsules, aeroassist technologies, and control technologies for guided hypersonic flight. The mission concepts utilize the secondary payload capabilities provided on a relatively low-cost logistic module. The logistic module may perform close Earth flyby, pointing, and release of return systems prior to disposal, with reentry velocities for payloads on the order of 11.5 km/sec. In this paper, we study the various return mission architectures available during the Artemis program to define the range of mission possibilities. Potential options include a reusable logistics module using a hypersonic inflatable aerodynamic decelerator, externally mounted entry system vehicle technologies, and a reusable sample return vehicle using a similar inflatable architecture with a feathered configuration with applied aerodynamic control. In these cases, the use of a ballistic lunar return trajectory is assumed, and a sensitivity analysis of midcourse corrections and the possibility of a lunar gravity assist for refining Earth entry interface points is provided. Furthermore, a novel controller for controlling a vehicle during reentry imposing heating limitations is introduced.

Matthew M. Wittal↗
NASA NTRS2018

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.

non-destructive techniques↗
NASA NTRS2019

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)

PCB quality↗