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Results for “rapid solidification”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Rapid solidification of metallic particulates

In order to maximize the heat transfer coefficient the most important variable in rapid solidification is the powder particle size. The finer the particle size, the higher the solidification rate. Efforts to decrease the particle size diameter offer the greatest payoff in attained quench rate. The velocity of the liquid droplet in the atmosphere is the second most important variable. Unfortunately the choices of gas atmospheres are sharply limited both because of conductivity and cost. Nitrogen and argon stand out as the preferred gases, nitrogen where reactions are unimportant and argon where reaction with nitrogen may be important. In gas atomization, helium offers up to an order of magnitude increase in solidification rate over argon and nitrogen. By contrast, atomization in vacuum drops the quench rate several orders of magnitude. Previously announced in STAR as N82-26433

Grant, N. J.↗
NASA NTRS1984

Advanced powder metallurgy aluminum alloys via rapid solidification technology

Aluminum alloys containing 10 to 11.5 wt. pct. of iron and 1.5 to 3 wt. pct. of chromium using the technique of rapid solidification powder metallurgy were studied. Alloys were prepared as thin ribbons (.002 inch thick) rapidly solidified at uniform rate of 10(6) C/second by the melt spinning process. The melt spun ribbons were pulverized into powders (-60 to 400 mesh) by a rotating hammer mill. The powders were consolidated by hot extrusion at a high reduction ratio of 50:1. The powder extrusion temperature was varied to determine the range of desirable processing conditions necessary to yield useful properties. Powders and consolidated alloys were characterized by SEM and optical metallography. The consolidated alloys were evaluated for (1) thermal stability, (2) tensile properties in the range, room temperature to 450 F, and (3) notch toughness in the range, room temperature to 450 F.

Ray, R.↗
DOE OSTI2019

Effect of Naturally Deposited Film on the Sub-rapid Solidification of Medium Manganese Steel by Using Droplet Solidification Technique

In this study, the effect of naturally deposited film on the interfacial heat transfer during the sub-rapid solidification of medium manganese steel was studied by means of a droplet solidification technique. The heat transfer rates were calculated by the Inverse Heat Conduction Program (IHCP), through computing the responding temperatures’ gradient inside the cooling mold. The results showed that the contact angle between the mold and solidified droplet becomes lower (from 117.539 to 82.217 deg) with the repeat of the dropping tests, which means the wettability improves after the deposition of the natural film. Meanwhile the liquid time (the time from the start of ejection to the initiation of solidification) decreases from 1.76 to 1.28 seconds during the tests, suggesting that the steel keeps in the liquid state shorter. Therefore, the initiation of solidification is advanced, such that there would be less time for matching the scale of the shell and the mold. Consequently, the maximum heat flux increases from 2.90 to 6.35 MW/m{sup 2} with the deposition of the natural film, as the wettability is getting better leading to the reduction of the interfacial thermal resistance. However, the final maximum heat flux was decreasing to 4.98 MW/m{sup 2} due to the increased thickness of the film and corresponding interfacial thermal resistance. Moreover, it was found that the secondary dendrite arm spacing decreased from 10.84 to 5.01 μm at first, and then it increased to 8.11 μm with the variations of heat flux and cooling rate.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Electromagnetic levitation containerless processing of metallic materials in microgravity: rapid solidification

Space levitation processing allows researchers to conduct benchmark tests in an effort to understand the physical phenomena involved in rapid solidification processing, including alloy thermodynamics, nucleation and growth, heat and mass transfer, solid/liquid interface dynamics, macro- and microstructural evolution, and defect formation. Supported by ground-based investigations, a major thrust is to develop and refine robust computational tools based on theoretical and applied approaches. This work is accomplished in conjunction with experiments designed for precise model validation with application to a broad range of industrial processes.

42 ENGINEERING↗
NASA NTRS1985

Rapid solidification of levitation melted Ni-Sn alloy droplets with high undercooling

Experimental results obtained by high-speed optical temperature sensing for the rapid solidification of highly undercooled, levitation-melted Ni-Sn alloy droplets are presented. These data suggest a solidification model proceeding according to overlapping steps: (1) dendritic growth within the bulk undercooled melt, (2) continued recalescence as supersaturation of the interdendritic liquid dissipates, (3) fine-scale remelting within the dendrites, (4) ripening of the fine structure, and (5) solidification of remaining liquid at the end of recalescence.

Shiohara, Yuh↗
NASA NTRS1986

The mathematical modeling of rapid solidification processing

The detailed formulation of and the results obtained from a continuum mechanics-based mathematical model of the planar flow melt spinning (PFMS) rapid solidification system are presented and discussed. The numerical algorithm proposed is capable of computing the cooling and freezing rates as well as the fluid flow and capillary phenomena which take place inside the molten puddle formed in the PFMS process. The FORTRAN listings of some of the most useful computer programs and a collection of appendices describing the basic equations used for the modeling are included.

Gutierrez-Miravete, E.↗
NASA NTRS1988

Rapid solidification of Nb-base alloys

New Nb-base alloys are of interest for aerospace structural applications at high temperatures, viz, 800 to 1650 C. Fundamental information regarding the effects of rapid solidification in achieving greatly refined microstructures, extended solid solubility, suppression of embrittling equilibrium phases, and formation of new phases is desired in a number of Nb-X alloys. The microstructures and selected properties of Nb-Si and other Nb-base alloys are presented for materials both rapidly quenched from the equilibrium liquidus and rapidly solidified following deep supercooling. Electromagnetic levitation was used to achieve melting and supercooling in a containerless inert gas environment. A variety of solidification conditions were employed including splatting or drop casting of supercooled samples. The morphology and composition of phases formed are discussed in terms of both solidification history and bulk composition.

Gokhale, A. B.↗
DOE OSTI2016

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu 6 Sn 5 phase during solidification. In this study, the number and size of Cu 6 Sn 5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu 6 Sn 5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu 6 Sn 5 phases. Transitions in the Cu 6 Sn 5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 10 3 to 10 4 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu 6 Sn 5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary-β phase in the solidified alloys was noted. As a result, solidification pathways omitting the formation of the ternary-β phase agreed well with observed room temperature microstructures.

36 MATERIALS SCIENCE↗
NASA NTRS1991

Containerless processing and rapid solidification of Nb-Si alloys of hypereutectic composition

A combination of bulk undercooling in an electromagnetic levitation apparatus and splat quenching between two copper plates is used to process Nb-Si alloys in order to maximize rapid solidification conditions and minimize the effects of recalescence, with emphasis on the solidification of characteristics of alloys in the 21 to 27 at. pct Si range of composition. SEM and TEM as well as X-ray diffraction are used to characterize the microstructures of the processed samples. In the range of compositions studied, the splat-quenched drops always formed the tetragonal Nb3Si phase directly from the liquid. Drops solidified in the coil were characterized by the presence of the primary intermetallic Nb5Si3 and the absence of both peritectic Nb3Si and the equilibrium eutectic. In these cases, a metastable alpha-Nb + beta-Nb5Si3 eutectic formed. The results are discussed in terms of possible metastable configurations of the Nb-Si phase diagram as well as concepts of nucleation and growth kinetics applied to the Nb3Si and Nb5Si3 intermetallics.

Hofmeister, W. H.↗
DOE OSTI2025

Rapid Solidification Effects in Additively Manufactured Si and SiGe Compositions

SiGe alloys have a proven track record as robust high-temperature thermoelectric materials, powering NASA missions like SNAP-10A, LES-9, and Voyager 1 and 2. Enhancing thermoelectric efficiency hinges on minimizing thermal conductivity while preserving electrical conductivity. Rapid solidification via LPBF can generate microstructural features such as subgrain cellular boundaries and twinning, which may help reduce thermal conductivity while preserving semiconducting behavior. Here, this study investigates the potential of laser powder bed fusion (LPBF) additive manufacturing to fabricate nanostructured Si and SiGe thermoelectric materials. High cooling rates (10 5 to 10 7 K/s) rates inherent to the LPBF process are conducive to forming such nanostructures. Moreover, this fabrication technique could also be suitable for fabricating complex geometries needed to achieve improved device level performance. Process mapping of commercial Si powder with irregular morphology was first performed to understand the LPBF processing behavior of this semiconductor material. Subsequent studies included in-house synthesized B-doped (p-type) Si7 8 Ge 22 spherical powder that was produced via ultrasonic atomization. Scan strategies involved multiple laser exposures to mitigate solidification cracking: a high density of >98% was achieved, but solidification cracking could not be fully eliminated. Subsequently, a high electrical resistivity (i.e., low conductivity) was observed, but the measured Seebeck coefficient, ∼230 μV/K @ 500 °C, proved that good semiconductor material was being fabricated. A subgrain cellular structure (5–10 μm) was observed as defined by Ge segregation to the intercellular boundaries. The remelting strategies helped lower the cooling rates in processing SiGe, but this still resulted in high residual stresses, which induced a remarkably high density of twins (78–95%) to accommodate the deformation. This unique grain structure offers an avenue for phonon scattering and potential improvements in thermoelectric performance.

figure of merit↗
NASA NTRS1989

Rapid solidification of high-conductivity copper alloys

The main objective was to develop improved copper alloys of high strength and high thermal and electric conductivity. Chill block melt spinning was used to produce binary alloys of Cu-Cr and Cu-Zr, and ternary alloys of Cu-Cr-Ag. By quenching from the liquid state, up to 5 atomic percent of Cr and Zr were retained in metastable extended solid solution during the rapid solidification process. Eutectic solidification was avoided and the full strengthening benefits of the large volume fraction of precipitates were realized by subsequent aging treatment. The very low solid solubility of Cr and Zr in Cu result in a high conductivity Cu matrix strengthened by second phase precipitates. Tensile properties on as-cast and aged ribbons were measured at room and elevated temperatures. Precipitate coarsening of Cr in Cu was studied by changes in electrical resistance during aging. X-ray diffraction was used to measure the lattice parameter and the degree of supersaturation of the matrix. The microstructures were characterized by optical and electron microscopy.

Bloom, Theodore Atlas↗
DOE OSTI2023

Influence of Molybdenum on Rapid Solidification Microstructure and Microsegregation in Primary Ferrite Solidified Stainless Steel

Due to the widespread use and familiarity of austenitic stainless steels in many industries these alloys are often the first materials used when adapting new processing techniques. The rapid cooling and solidification rates that occur during fusion based additive manufacturing processes like powder bed fusion cause a fundamental shift in the solidification behavior of the material. While the effects that Cr and Ni have on the microstructure have been fairly well documented across a range of solidification conditions, the impact of alloying elements like Mo are not as well understood at rapid solidification rates. For this study, four custom stainless steel alloy feedstocks were made with targeted modification of the Cr and Mo concentrations to maintain a constant Cr/Ni eq ratio of ~1.7. Two-piston splat quenching was used to produce rapidly solidified samples and the solidification mode, phase, and cell size were investigated. Solidification rates were estimated to be between 0.4 and 1.5m/s. A comparison of the microsegregation and partitioning behavior of Cr, Ni and Mo in ferrite solidified material was also performed for the different alloy compositions. Variations of the Mo concentration between each feedstock showed no measurable influence on the solidification/cooling rates, solidification morphology, or the partitioning of Mo. Furthermore, higher concentrations of Mo were found to significantly increase the amount of ferrite phase in the microstructure by suppressing the ferrite to austenite massive transformation.

36 MATERIALS SCIENCE↗
DOE OSTI2016

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu 6 Sn 5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu 6 Sn 5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu 6 Sn 5 observed, while in the melt spun alloy, Cu 6 Sn 5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu 6 Sn 5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. As a result, the reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu 6 Sn 5 was maintained for both alloys.

36 MATERIALS SCIENCE↗
NASA NTRS1987

Rapid-Solidification Processing Facility

Microstructural changes enhance properties of alloys. Major feature of process is rapid quenching of alloys or intermetallic compounds from liquid to solid state at cooling rates of 10 to the 6th power C/s.

Glasgow, Thomas K.↗
NASA NTRS1988

Dispersion strengthened NiAl alloys produced by rapid solidification processing

Initial experimental results are presented concerning the relationship between microstructure and properties in rapidly solidified NiAl alloys whose melting point is of the order of 1900 K. When the dispersoid content of NiAl alloys is increased, the dispersoids begin to populate the grain boundaries, rendering them weak, so that failure must propagate intergranularly. It is concluded that NiAl alloys' strength can be significantly increased through dispersoid additions without sacrifice of high temperature ductility.

Jha, S. C.↗
NASA NTRS1988

Dispersion strengthening of precipitation hardened Al-Cu-Mg alloys prepared by rapid solidification and mechanical alloying

Several Al-4Cu-1Mg-1.5Fe-0.75Ce alloys have been processed from either rapidly solidified or mechanically alloyed powder using various vacuum degassing parameters and consolidation techniques. Strengthening by the fine subgrains, grains, and the dispersoids individually or in combination is more effective when the alloys contain shearable precipitates; consequently, the strength of the alloys is higher in the naturally aged rather than the artificially aged condition. The strengths of the mechanically alloyed variants are greater than those produced from prealloyed powder. Properties and microstructural features of these dispersion strengthened alloys are discussed in regards to their processing histories.

Gilman, P. S.↗
DOE OSTI2020

Interface velocity dependent solute trapping and phase selection during rapid solidification of laser melted hypo-eutectic Al-11at.%Cu alloy

Microstructure formation of a hypo-eutectic Al-11Cu (atom percent) alloy during solidification after laser melting has been studied by transmission electron microscopy (TEM). The evolution of the solid-liquid-interface velocity, V SL , during the solidification process has been determined from direct observation by in-situ TEM. This enabled correlating V SL with development of four distinct microstructure zones. Crystal growth mode transitions from planar to cellular, cellular to dendritic, dendritic to cellular, and cellular to planar, have been observed for the accelerating solid-liquid-interface. The transition from coupled two-phase growth to the single-phase growth occurred for V SL = V a = (0.80±0.05) m/s, where V a is the velocity of absolute stability, at the onset of banded morphology grain formation. The in-situ and post-mortem TEM uniquely permitted determination of the non-equilibrium solidus for the rapidly solidifying Al-11Cu alloy. Experimental evidence for solute clustering and chemical ordering tendencies at length scales on the order of ≤ 5nm has been detected in the single-phase regions of the banded grains. The structural features of the single-phase bands have been interpreted as signatures of ‘frozen in’ configurations present in the liquid boundary layer adjacent to the growing crystal, which has a width of about 3nm. Finally, the nano-scale spatiotemporal resolution experimental TEM studies performed here provided quantitative metrics, e.g. the solidification interface velocity dependent solute concentration of the α-Al phase and the near-atomic scale structure in the single-phase bands, that are uniquely suitable for comparison with theory and model predictions for solidification microstructure development in multicomponent alloys after laser melting.

36 MATERIALS SCIENCE↗