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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Development of Electronics for Low Temperature Space Missions

The operation of electronic systems at cryogenic temperatures is anticipated for many future NASA space missions such as deep space probes and planetary surface exploration. For example, an unheated interplanetary probe launched to explore the rings of Saturn would reach an average temperature near Saturn of about -183 C. In addition to surviving the deep space harsh environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing payload development and launch costs. Terrestrial applications where components and systems must operate in low temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. An on-going research and development program on low temperature electronics at the NASA Glenn Research Center focuses on the development of efficient power systems capable of surviving and exploiting the advantages of low temperature environments. Inhouse efforts include the design, fabrication, and characterization of low temperature power systems and the development of supporting technologies for low temperature operations, such as dielectric and insulating materials, semiconductor devices, passive power components, opto-electronic devices, as well as packaging and integration of the developed components into prototype flight hardware.

Patterson, Richard L.↗
NASA NTRS2013

PhoneSat - The Smartphone Nanosatellite

PhoneSat 2.4, carried into space on November 19, 2013 aboard a Minotaur I rocket from the Mid-Atlantic Regional Spaceport at NASAs Wallops Flight Facility in Virginia, is the first of the PhoneSat family to use a two-way S-band radio to allow engineers to command the satellite from Earth. This mission also serves as a technology demonstration for a novel attitude determination and control system (ADCS) that establishes and stabilizes the satellites attitude relative to Earth. Unlike the earlier PhoneSats that used a Nexus One, PhoneSat 2.4 uses the Nexus S smartphone, which runs Googles Android operating system, and is made by Samsung Electronics Co., Suwon, So. Korea. The smartphone provides many of the functions needed by the satellite such as a central computer, data memory, ready-made interfaces for communications, navigation and power all pre-assembled in a rugged electronics package.

PhoneSat↗
NASA NTRS2011

Instrument Packages for the Cold, Dark, High Radiation Environments

We are developing a small cold temperature instrument package concept that integrates a cold temperature power system and radhard ultra low temperature ultra low power electronics components and power supplies now under development into a cold temperature surface operational version of a planetary surface instrument package. We are already in the process of developing a lower power lower tem-perature version for an instrument of mutual interest to SMD and ESMD to support the search for volatiles (the mass spectrometer VAPoR, Volatile Analysis by Pyrolysis of Regolith) both as a stand alone instrument and as part of an environmental monitoring package.

Clark, P. E.↗
NASA NTRS1990

Custom electronic subsystems for the laboratory telerobotic manipulator

The National Aeronautics and Space Administration (NASA) Space Station Program presents new opportunities for the application of telerobotic and robotic systems. The Laboratory Telerobotic Manipulator (LTM) is a highly advanced 7 degrees-of-freedom (DOF) telerobotic/robotic manipulator. It was developed and built for the Automation Technology Branch at NASA's Langley Research Center (LaRC) for work in research and to demonstrate ground-based telerobotic manipulator system hardware and software systems for future NASA applications in the hazardous environment of space. The LTM manipulator uses an embedded wiring design with all electronics, motor power, and control and communication cables passing through the pitch-yaw differential joints. This design requires the number of cables passing through the pitch/yaw joint to be kept to a minimum. To eliminate the cables needed to carry each pitch-yaw joint's sensor data to the VME control computers, a custom-embedded electronics package for each manipulator joint was developed. The electronics package collects and sends the joint's sensor data to the VME control computers over a fiber optic cable. The electronics package consist of five individual subsystems: the VME Link Processor, the Joint Processor and the Joint Processor power supply in the joint module, the fiber optics communications system, and the electronics and motor power cabling.

Glassell, R. L.↗
NASA NTRS1977

Advanced combined iodine dispenser and detector

A total weight of 1.23 kg (2.7 lb), a total volume of 1213 cu m (74 cu in), and an average power consumption of 5.5W was achieved in the advanced combined iodine dispenser/detector by integrating the detector with the iodine source, arranging all iodinator components within a compact package and lowering the parasitic power to the detector and electronics circuits. These achievements surpassed the design goals of 1.36 kg (3.0 lb), 1671 cu m (102 cu in) and 8W. The reliability and maintainability were improved by reducing the detector lamp power, using an interchangeable lamp concept, making the electronic circuit boards easily accessible, providing redundant water seals and improving the accessibility to the iodine accumulator for refilling. The system was designed to iodinate (to 5 ppm iodine) the fuel cell water generated during 27 seven-day orbiter missions (equivalent to 18,500 kg (40,700 lb) of water) before the unit must be recharged with iodine crystals.

Lantz, J. B.↗
NASA NTRS2010

Development of a Fan for Future Space Suit Applications

NASA's next generation space suit system will place new demands on the fan used to circulate breathing gas through the ventilation loop of the portable life support system. Long duration missions with frequent extravehicular activities (EVAs), the requirement for significant increases in reliability and durability, and a mission profile that imposes strict limits on weight, volume and power create the basis for a set of requirements that demand more performance than is available from existing fan designs. This paper describes the development of a new fan to meet these needs. A centrifugal fan was designed with a normal operating speed of approximately 39,400 rpm to meet the ventilation flow requirements while also meeting the aggressive minimal packaging, weight and power requirements. The prototype fan also operates at 56,000 rpm to satisfy a second operating condition associated with a single fan providing ventilation flow to two spacesuits connected in series. This fan incorporates a novel nonmetallic "can" to keep the oxygen flow separate from the motor electronics, thus eliminating ignition potential. The nonmetallic can enables a small package size and low power consumption. To keep cost and schedule within project bounds a commercial motor controller was used. The fan design has been detailed and implemented using materials and approaches selected to address anticipated mission needs. Test data is presented to show how this fan performs relative to anticipated ventilation requirements for the EVA portable life support system. Additionally, data is presented to show tolerance to anticipated environmental factors such as acoustics, shock, and vibration. Recommendations for forward work to progress the technology readiness level and prepare the fan for the next EVA space suit system are also discussed.

Paul. Heather L.↗
NASA NTRS1993

A low-mass faraday cup experiment for the solar wind

Faraday cups have proven to be very reliable and accurate instruments capable of making 3-D velocity distribution measurements on spinning or 3-axis stabilized spacecraft. Faraday cup instrumentation continues to be appropriate for heliospheric missions. As an example, the reductions in mass possible relative to the solar wind detection system about to be flown on the WIND spacecraft were estimated. Through the use of technology developed or used at the MIT Center for Space Research but were not able to utilize for WIND: surface-mount packaging, field-programmable gate arrays, an optically-switched high voltage supply, and an integrated-circuit power converter, it was estimated that the mass of the Faraday Cup system could be reduced from 5 kg to 1.8 kg. Further redesign of the electronics incorporating hybrid integrated circuits as well as a decrease in the sensor size, with a corresponding increase in measurement cycle time, could lead to a significantly lower mass for other mission applications. Reduction in mass of the entire spacecraft-experiment system is critically dependent on early and continual collaborative efforts between the spacecraft engineers and the experimenters. Those efforts concern a range of issues from spacecraft structure to data systems to the spacecraft power voltage levels. Requirements for flight qualification affect use of newer, lighter electronics packaging and its implementation; the issue of quality assurance needs to be specifically addressed. Lower cost and reduced mass can best be achieved through the efforts of a relatively small group dedicated to the success of the mission. Such a group needs a fixed budget and greater control over quality assurance requirements, together with a reasonable oversight mechanism.

Lazarus, A. J.↗
NASA NTRS2015

High-Temperature, Wirebondless, Ultracompact Wide Bandgap Power Semiconductor Modules

Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.

Elmes, John↗
NASA NTRS1992

System Testing and Performance Characterization of the LITE Laser Transmitter Module at NASA

The Laser Transmitter Module (LTM) is a three-color Q-switched flashlamp pumped Nd:YAG laser. The original design concept was to package commercially available optics and flashlamp electronics for spaceflight with a power consumption goal of 2200 W and a weight goal of 600 lbs. The optical output was to exceed 200 mJ of IR, 400 mJ of green, and 150 mJ of UV per pulse at 10 Hz. The new space qualified laser exceeds the optical output requirements by 188 percent, 50 percent, and 13 percent in the UR, green, and UV respectively. This output needs only 1500 W at a weight of only 500 lbs. The LTM was delivered to the NASA Langley Research Center in December 1991. Optical characterization is now being completed.

Cimolino, Marc C.↗
NASA NTRS1999

Nondestructive Detection of Cracks in Ceramics Using Vicinal Illumination

Cracks and other defects in ceramic materials can be difficult or impossible to examine and photograph due to the extreme lack of contrast. A method for inspecting translucent ceramics using scattered light, also known as vicinal illumination, will be described. This method has been known in the ceramics industry for quite some time, but is not well known in the testing and failure analysis community. Electronics applications include substrates, packages, multilayer capacitors, and thin film resistors. Ceramic materials are used in electronic applications as microcircuit packages and substrates which carry signals and power between microcircuits. Fine cracks in ceramic materials can result in mechanical failures, electrical failures, and loss of hermeticity. Often, fine cracks are difficult or impossible to detect using standard nondestructive inspection techniques such as visual inspection, ultrasonic inspection, or vapor crack detection. Dye penetrant inspection is usually effective, but contaminates the part, which is unacceptable for space flight hardware. One effective nondestructive inspection method of detecting cracks involves examining the way in which light scatters through the ceramic material when viewed with a standard bright field reflected light microscope. This method, termed vicinal illumination, has been used for detecting cracks during failure analyses of several part types, and screening of space flight hardware. The technique has proven effective on several different types of ceramic materials as well. A related method for use with dark field equipment has also been used to successfully locate otherwise invisible cracks.

Hull, Scott M.↗
NASA NTRS1999

Physically separating printed circuit boards with a resilient, conductive contact

A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Baker, John D.↗
DOE OSTI2024

An Organic, Direct Bonded Copper, Multi-Layered, Ultra-Low Inductance Package for High-Power UWBG MOSFETs

The most common metalized substrates used in high-power switching packages consist of a ceramic layer such as Aluminum Nitride (AlN) sandwiched between two copper layers. Ceramic substrates are used because it has the key characteristic of having high dielectric strength while being thermally conductive. A large drawback to ceramic substrates is that they do not allow for a multi-layered circuit design. By replacing the traditional ceramic substrate with organic direct bonded copper (ODBC) we can open a wide range of possibilities when it comes to power module layout such as multi-layered circuits and double-sided cooling. Both benefits are critical while packaging high-performance Gallium Oxide (Ga2O3) MOSFETs. Because of Ga2O3's relatively poor thermal conductivity, a double-sided cooled package becomes necessary. Therefore, the use of ODBC provides the flexibility to fabricate copper traces carrying much higher currents, and by creating a multi-layered package, we can drastically reduce the parasitic inductance inside the power module. Achieving lower parasitic inductance is critical for an ultra-fast Ga2O3 package to avoid excessive voltage overshoot and ringing. Using ODBC, we have designed novel packages capable of handling the challenges presented by fast Ga2O3 switching. Using multi-physics modeling software, we can validate our design before building the prototype. Due to the simple process parameters needed to work with ODBC, we can rapidly create prototypes without using external vendors. This flexibility allows us to quickly design, build, and validate highly complex switching power modules to accommodate next generation, Ga2O3 switching devices.

ADVANCED PROPULSION SYSTEMS,ENGINEERING↗
NASA NTRS2015

CarbAl Heat Transfer Material

The increasing use of power electronics, such as high-current semiconductor devices and modules, within space vehicles is driving the need to develop specialty thermal management materials in both the packaging of these discrete devices and the packaging of modules consisting of these device arrays. Developed by Applied Nanotech, Inc. (ANI), CarbAl heat transfer material is uniquely characterized by its low density, high thermal diffusivity, and high thermal conductivity. Its coefficient of thermal expansion (CTE) is similar to most power electronic materials, making it an effective base plate substrate for state-of-the-art silicon carbide (SiC) super junction transistors. The material currently is being used to optimize hybrid vehicle inverter packaging. Adapting CarbAl-based substrates to space applications was a major focus of the SBIR project work. In Phase I, ANI completed modeling and experimentation to validate its deployment in a space environment. Key parameters related to cryogenic temperature scaling of CTE, thermal conductivity, and mechanical strength. In Phase II, the company concentrated on improving heat sinks and thermally conductive circuit boards for power electronic applications.

Fink, Richard↗
NASA NTRS2008

SiC vs. Si for High Radiation Environments: NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance

Commercial silicon carbide and silicon Schottky barrier power diodes have been subjected to 203 MeV proton irradiation and the effects of the resultant displacement damage on the I-V characteristics have been observed. Changes in forward bias I-V characteristics are reported for fluences up to 4 x 10(exp 14) p/cm2. For devices of both material types, the series resistance is observed to increase as the fluence increases. The changes in series resistance result from changes in the free carrier concentration due to carrier removal by the defects produced. A simple model is presented that allows calculation of the series resistance of the device and then relates the carrier removal rate to the changes in series resistance. Using this model to calculate the carrier removal rate in both materials reveals that the carrier removal rate in silicon is less than that in silicon carbide, indicating that silicon is the more radiation tolerant material.

Schottky barrier power diodes↗
NASA NTRS2011

Carbon Nanotube-Based Structural Health Monitoring Sensors

Carbon nanotube (CNT)-based sensors for structural health monitoring (SHM) can be embedded in structures of all geometries to monitor conditions both inside and at the surface of the structure to continuously sense changes. These CNTs can be manipulated into specific orientations to create small, powerful, and flexible sensors. One of the sensors is a highly flexible sensor for crack growth detection and strain field mapping that features a very dense and highly ordered array of single-walled CNTs. CNT structural health sensors can be mass-produced, are inexpensive, can be packaged in small sizes (0.5 micron(sup 2)), require less power than electronic or piezoelectric transducers, and produce less waste heat per square centimeter than electronic or piezoelectric transducers. Chemically functionalized lithographic patterns are used to deposit and align the CNTs onto metallic electrodes. This method consistently produces aligned CNTs in the defined locations. Using photo- and electron-beam lithography, simple Cr/Au thin-film circuits are patterned onto oxidized silicon substrates. The samples are then re-patterned with a CNT-attracting, self-assembled monolayer of 3-aminopropyltriethoxysilane (APTES) to delineate the desired CNT locations between electrodes. During the deposition of the solution-suspended single- wall CNTs, the application of an electric field to the metallic contacts causes alignment of the CNTs along the field direction. This innovation is a prime candidate for smart skin technologies with applications ranging from military, to aerospace, to private industry.

Wincheski, Russell↗
NASA NTRS2014

Flight Avionics Hardware Roadmap

The Avionics Technology Roadmap takes an 80% approach to technology investment in spacecraft avionics. It delineates a suite of technologies covering foundational, component, and subsystem-levels, which directly support 80% of future NASA space mission needs. The roadmap eschews high cost, limited utility technologies in favor of lower cost, and broadly applicable technologies with high return on investment. The roadmap is also phased to support future NASA mission needs and desires, with a view towards creating an optimized investment portfolio that matures specific, high impact technologies on a schedule that matches optimum insertion points of these technologies into NASA missions. The roadmap looks out over 15+ years and covers some 114 technologies, 58 of which are targeted for TRL6 within 5 years, with 23 additional technologies to be at TRL6 by 2020. Of that number, only a few are recommended for near term investment: 1. Rad Hard High Performance Computing 2. Extreme temperature capable electronics and packaging 3. RFID/SAW-based spacecraft sensors and instruments 4. Lightweight, low power 2D displays suitable for crewed missions 5. Radiation tolerant Graphics Processing Unit to drive crew displays 6. Distributed/reconfigurable, extreme temperature and radiation tolerant, spacecraft sensor controller and sensor modules 7. Spacecraft to spacecraft, long link data communication protocols 8. High performance and extreme temperature capable C&DH subsystem In addition, the roadmap team recommends several other activities that it believes are necessary to advance avionics technology across NASA: center dot Engage the OCT roadmap teams to coordinate avionics technology advances and infusion into these roadmaps and their mission set center dot Charter a team to develop a set of use cases for future avionics capabilities in order to decouple this roadmap from specific missions center dot Partner with the Software Steering Committee to coordinate computing hardware and software technology roadmaps and investment recommendations center dot Continue monitoring foundational technologies upon which future avionics technologies will be dependent, e.g., RHBD and COTS semiconductor technologies

Some, Raphael↗