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A number of performance-limiting spacecraft problems will be qualitatively discussed: Spacecraft Charging, Deep Dielectric Charging, Solar Cell Arcing, Antenna Sparking, High Voltage Power Shorts, Radiation-induced Defects in Semiconductors, and Degradation of Electronic Devices.
There are few if any clear, visual, and detailed images of carbon fiber strand failures under tension useful for determining mechanisms, sequences of events, different types of failure modes, etc. available to researchers. This makes discussion of physics of failure difficult. It was also desired to find out whether the test article-to-test rig interface (grip) played a part in some failures. These failures have nothing to do with stress rupture failure, thus representing a source of waste for the larger 13-00912 investigation into that specific failure type. Being able to identify or mitigate any competing failure modes would improve the value of the 13-00912 test data. The beginnings of the solution to these problems lay in obtaining images of strand failures useful for understanding physics of failure and the events leading up to failure. Necessary steps include identifying imaging techniques that result in useful data, using those techniques to home in on where in a strand and when in the sequence of events one should obtain imaging data.
Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses.
Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses
High speed automated identification and design of dynamic systems, both linear and nonlinear, are discussed. Special emphasis is placed on developing hardware and techniques which are applicable to practical problems. The basic modeling experiment and new results are described. Using the improvements developed successful identification of several systems, including a physical example as well as simulated systems, was obtained. The advantages of parameter signature analysis over signal signature analysis in go-no go testing of operational systems were demonstrated. The feasibility of using these ideas in failure mode prediction in operating systems was also investigated. An improved digital controlled nonlinear function generator was developed, de-bugged, and completely documented.
This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.
A simulation-based risk assessment approach is presented and is applied to the analysis of abort during the ascent phase of a space exploration mission. The approach utilizes groupings of launch vehicle failures, referred to as failure bins, which are mapped to corresponding failure environments. Physical models are used to characterize the failure environments in terms of the risk due to blast overpressure, resulting debris field, and the thermal radiation due to a fireball. The resulting risk to the crew is dynamically modeled by combining the likelihood of each failure, the severity of the failure environments as a function of initiator and time of the failure, the robustness of the crew module, and the warning time available due to early detection. The approach is shown to support the launch vehicle design process by characterizing the risk drivers and identifying regions where failure detection would significantly reduce the risk to the crew.
The Integrated Health Management (IHM) for the future aerospace systems requires to interface models of multiple subsystems in an efficient and accurate information environment at the earlier stages of system design. The complexity of modern aeronautic and aircraft systems (including e.g. the power distribution, flight control, solid and liquid motors) dictates employment of hybrid models and high-level reasoners for analysing mixed continuous and discrete information flow involving multiple modes of operation in uncertain environments, unknown state variables, heterogeneous software and hardware components. To provide the information link between key design/performance parameters and high-level reasoners we rely on development of multi-physics performance models, distributed sensors networks, and fault diagnostic and prognostic (FD&P) technologies in close collaboration with system designers. The main challenges of our research are related to the in-flight assessment of the structural stability, engine performance, and trajectory control. The main goal is to develop an intelligent IHM that not only enhances components and system reliability, but also provides a post-flight feedback helping to optimize design of the next generation of aerospace systems. Our efforts are concentrated on several directions of the research. One of the key components of our strategy is an innovative approach to the diagnostics/prognostics based on the real time dynamical inference (DI) technologies extended to encompass hybrid systems with hidden state trajectories. The major investments are into the multiphysics performance modelling that provides an access of the FD&P technologies to the main performance parameters of e.g. solid and liquid rocket motors and composite materials of the nozzle and case. Some of the recent results of our research are discussed in this chapter. We begin by introducing the problem of dynamical inference of stochastic nonlinear models and reviewing earlier results. Next, we present our analytical approach to the solution of this problem based on the path integral formulation. The resulting algorithm does not require an extensive global search for the model parameters, provides optimal compensation for the effects of dynamical noise, and is robust for a broad range of dynamical models. In the following Section the strengths of the algorithm are illustrated illustrated by inferring the parameters of the stochastic Lorenz system and comparing the results with those of earlier research. Next, we discuss a number of recent results in application to the development of the IHM for aerospace system. Firstly, we apply dynamical inference approach to a solution of classical three tank problems with mixed unknown continuous and binary parameters. The problem is considered in the context of ground support system for filling fuel tanks of liquid rocket motors. It is shown that the DI algorithm is well suited for successful solution of a hybrid version of this benchmark problem even in the presence of additional periodic and stochastic perturbation of unknown strength. Secondly, we illustrate our approach by its application to an analysis of the nozzle fault in a solid rocket motor (SRM). The internal ballistics of the SRM is modelled as a set of one-dimensional partial differential equations coupled to the dynamics of the propellant regression. In this example we are specifically focussed on the inference of discrete and continuous parameters of the nozzle blocking fault and on the possibility of an application of the DI algorithm to reducing the probability of "misses" of an on-board FD&P for SRM. In the next section re-contact problem caused by first stage/upper stage separation failure is discussed. The reaction forces imposed on the nozzle of the upper stage during the re-contact and their connection to the nozzle damage and to the thrust vector control (TVC) signal are obtained. It is shown that transient impact induced torquean be modelled as a response of an effective damped oscillator. A possible application of the DI algorithm to the inference of damage parameters and predicting fault dynamics ahead of time using the actuator signal is discussed. Finally, we formulate Bayesian inferential framework for development of the IHM system for in-flight structural health monitoring (SHM) of composite materials. We consider the signal generated by piezoelectric actuator mounted on composite structure generating elastic waves in it. The signal received by the sensor is than compared with the baseline signal. The possibility of damage inference is discussed in the context of development of the SHM.
"Qualification" of fiber optic components holds a very different meaning than it did ten years ago. In the past, qualification meant extensive prolonged testing and screening that led to a programmatic method of reliability assurance. For space flight programs today, the combination of using higher performance commercial technology, with shorter development schedules and tighter mission budgets makes long term testing and reliability characterization unfeasible. In many cases space flight missions will be using technology within years of its development and an example of this is fiber laser technology. Although the technology itself is not a new product the components that comprise a fiber laser system change frequently as processes and packaging changes occur. Once a process or the materials for manufacturing a component change, even the data that existed on its predecessor can no longer provide assurance on the newer version. In order to assure reliability during a space flight mission, the component engineer must understand the requirements of the space flight environment as well as the physics of failure of the components themselves. This can be incorporated into an efficient and effective testing plan that "qualifies" a component to specific criteria defined by the program given the mission requirements and the component limitations. This requires interaction at the very initial stages of design between the system design engineer, mechanical engineer, subsystem engineer and the component hardware engineer. Although this is the desired interaction what typically occurs is that the subsystem engineer asks the components or development engineers to meet difficult requirements without knowledge of the current industry situation or the lack of qualification data. This is then passed on to the vendor who can provide little help with such a harsh set of requirements due to high cost of testing for space flight environments. This presentation is designed to guide the engineers of design, development and components, and vendors of commercial components with how to make an efficient and effective qualification test plan with some basic generic information about many space flight requirements. Issues related to the ~ physics of failure, acceptance criteria and lessons learned will also be discussed to assist with understanding how to approach a space flight mission in an ever changing commercial photonics industry.
The Advanced Stirling Convertor, is intended to provide power for an unmanned planetary spacecraft and has an operational life requirement of 17 years. Over this 17 year mission, the ASC must provide power with desired performance and efficiency and require no corrective maintenance. Reliability demonstration testing for the ASC was found to be very limited due to schedule and resource constraints. Reliability demonstration must involve the application of analysis, system and component level testing, and simulation models, taken collectively. Therefore, computer simulation with limited test data verification is a viable approach to assess the reliability of ASC components. This approach is based on physics-of-failure mechanisms and involves the relationship among the design variables based on physics, mechanics, material behavior models, interaction of different components and their respective disciplines such as structures, materials, fluid, thermal, mechanical, electrical, etc. In addition, these models are based on the available test data, which can be updated, and analysis refined as more data and information becomes available. The failure mechanisms and causes of failure are included in the analysis, especially in light of the new information, in order to develop guidelines to improve design reliability and better operating controls to reduce the probability of failure. Quantified reliability assessment based on fundamental physical behavior of components and their relationship with other components has demonstrated itself to be a superior technique to conventional reliability approaches based on utilizing failure rates derived from similar equipment or simply expert judgment.
EUV channels of the AIA instrument have long been used to characterize the temperature of the plasma, particularly through emission measure inversions. During a solar flare, the instrument can suffer several instrumental artifacts that complicates the analysis. We have performed an analysis of the evolution of two X class flares and find regions where the inversion fails that cannot be easily explained by instrumental artifacts. These failures tend to occur at the top of the flare loop arcade where energy is thought to be released and several non-equilibrium processes may be contributing to the emission of the plasma. In this presentation, I will establish the regions of the emission measure failures and discuss the potential instrumental and physical explanations for these failures.
The scanning electron microscope adds a new dimension to the knowledge that can be obtained from a failed microcircuit. When used with conventional techniques, SEM assists and clarifies the analysis, but it does not replace light microscopy. The most advantageous features for microcircuit analysis are long working distances and great depth of field. Manufacturer related failure modes of microcircuits are metallization defects, poor bonding, surface and particle contamination, and design and fabrication faults. User related failure modes are caused by abuse, such as overstress. The Physics of Failure Procedure followed by the Astrionics Laboratory in failure analysis is described, which is designed to obtain maximum information available from each step.
Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.
Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)
Over the years, many analytical and experimental research studies have aimed to improve the state-of-the-art assessment of solder joint integrity from a physics-of-failure perspective. Although much progress has been made, there still exist many inconsistent and even contradictory correlations and conclusions. Before discussing some of the prominent inconsistencies found in the literature, this paper reviews the fundamental physics underlying the nature of solder failure...Using the complex constitutive properties of solder, fundamental mechanical and thermomechanical proccesses can be modeled to demonstrate some of the inconsistencies in the literature.
An attempt is made to provide simple identification and description of techniques that have proved to be most useful either in developing a new product or in improving reliability of an established product. The first reliability task is obtaining and organizing parts failure rate data. Other tasks are parts screening, tabulation of general failure rates, preventive maintenance, prediction of new product reliability, and statistical demonstration of achieved reliability. Five principal tasks for improving reliability involve the physics of failure research, derating of internal stresses, control of external stresses, functional redundancy, and failure effects control. A final task is the training and motivation of reliability specialist engineers.
Physics of failure approaches have gained wide spread acceptance within the electronic reliability community. These methodologies involve identifying root cause failure mechanisms, developing associated models, and utilizing these models to inprove time to market, lower development and build costs and higher reliability. The methodology outlined herein sets forth a process, based on integration of both physics and engineering principles, for achieving the same goals.
The art of flight quality solid-state laser development is still relatively young, and much is still unknown regarding the best procedures, components, and packaging required for achieving the maximum possible lifetime and reliability when deployed in the harsh space environment. One of the most important issues is the limited and unstable supply of quality, high power diode arrays with significant technological heritage and market lifetime. Since Spectra Diode Labs Inc. ended their involvement in the pulsed array business in the late 1990's, there has been a flurry of activity from other manufacturers, but little effort focused on flight quality production. This forces NASA, inevitably, to examine the use of commercial parts to enable space flight laser designs. System-level issues such as power cycling, operational derating, duty cycle, and contamination risks to other laser components are some of the more significant unknown, if unquantifiable, parameters that directly effect transmitter reliability. Designs and processes can be formulated for the system and the components (including thorough modeling) to mitigate risk based on the known failures modes as well as lessons learned that GSFC has collected over the past ten years of space flight operation of lasers. In addition, knowledge of the potential failure modes related to the system and the components themselves can allow the qualification testing to be done in an efficient yet, effective manner. Careful test plan development coupled with physics of failure knowledge will enable cost effect qualification of commercial technology. Presented here will be lessons learned from space flight experience, brief synopsis of known potential failure modes, mitigation techniques, and options for testing from the system level to the component level.