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All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗
NASA NTRS2008

A Compact, Modular Package for Superconducting Bolometer Arrays

As bolometer arrays grow to ever-larger formats, packaging becomes a more critical engineering issue. We have designed a detector package to house a superconducting bolometer array, SQUID multiplexers, bias and filtering circuitry, and electrical connectors. The package includes an optical filter, magnetic shielding, and has well-defined thermal and mechanical interfaces. An early version of this package has been used successfully in the GISMO 2mm camera, a 128-pixel camera operating at a base temperature of 270mK. A more advanced package permits operation at lower temperatures by providing direct heat sinking to the SQUIDS and bias resistors, which generate the bulk of the dissipation in the package. Standard electrical connectors provide reliable contact while enabling quick installation and removal of the package. We describe how the design compensates for differing thermal expansions, allows heat sinking of the bolometer array, and features magnetic shielding in critical areas. We highlight the performance of this detector package and describe its scalability to 1280-pixel arrays in the near future.

Benford, D.↗
NASA NTRS2010

The Assurance Challenges of Advanced Packaging Technologies for Electronics

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Sampson, Michael J.↗
NASA NTRS2010

Ultra Low Temperature Ultra Low Power Instrument Packages for Planetary Surfaces

Achievement of solar system exploration roadmap goals will involve robotic or human deployment and longterm operation of surface science packages remote from human presence, thus requiring autonomous, self-powered operation. The major challenge such packages face will be operating during long periods of darkness in extreme cold potentially without the Pu238 based power and thermal systems available to Apollo era packages (ALSEP). Development of such science payloads will thus require considerable optimization of instrument and subsystem design, packaging and integration for a variety of planetary surface environments in order to support solar system exploration fully. Our work supports this process through the incorporation of low temperature operational components and design strategies which radically minimize power, mass, and cost while maximizing the performance under extreme surface conditions that are in many cases more demanding than those routinely experienced by spacecraft in deep space. Chief instruments/instrument package candidates include those which could provide long-term monitoring of the surface and subsurface environments for fundamental science and human crew safety. The initial attempt to design a 10 instrument environmental monitoring package with a solar/battery based power system led to a package with a unacceptably large mass (500 kg) of which over half was battery mass. In phase 1, a factor of 5 reduction in mass was achieved, first through the introduction of high performance electronics capable of operating at far lower temperature and then through the use of innovative thermal balance strategies involving the use of multi-layer thin materials and gravity-assisted heat pipes. In phase 2, reported here, involves strategies such as universal incorporation of ULT/ULP digital and analog electronics, and distributed or non-conventionally packaged power systems. These strategies will be required to meet the far more challenging thermal requirements of operating through a normal 28 day diurnal cycle. The limited temperature range of efficient battery operation remains the largest obstacle.

Clark, P. E.↗
NASA NTRS2004

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗
NASA NTRSDate not supplied

A Notional Artemis Lunar Surface Exploration Package (ArLSEP) based on the Gandalf Staff Platform

Introduction: The Artemis program is planning to deliver crew and cargo to the lunar surface, but there is no current package for supporting lunar in-struments and experiments similar to the Apollo Lunar Surface Exploration Package (ALSEP). This abstract provides a possible concept for such a package using the Gandalf Staff Platform as a common core. Gandalf Staff: The Gandalf Staff is an early prototype system developed over FY’21/FY’22 using NASA Science Technology Mission Directorate (STMD) Center Information Fund (CIF) grants to de-sign, build and test “proof-of-concept” components. These components include a 24v battery powered monopole that powers a suite of subsystems, including a Graphical User Interface (GUI) for crew, surface voice and data communications, Lunar Search and Rescue (LunaSAR) navigation and communications, LiDAR, field site external lighting, 360-degree camera, and a geothermal instrument for measuring sub-surface temperature gradient. The staff can be carried independently by an Extra-Vehicular Activity (EVA) astronaut, or can be mounted into a tripod for “hands free” support at a surface site being investigated. The staff can be attached to an external solar array and power storage system for long-duration operations. [1,2] ALSEP: An ASLEP flew on each mission Apollo 12 to Apollo 17. For Apollo 11, a simplified packaged called the Early Apollo Scientific Experiments Pack-age (EASEP) was flown. Each package included a “Central Station” that provided the power and communications connected to a variety of instruments and sensors. The power was provided by a Radioisotope Thermoelectric Generator (RTG) fueled by Plutoni-um-238 generating 70 watts of power (initially, decayed over time) [3]. The communications system provide for direct to Earth data transfer from the lunar surface. Each pack-age was stowed externally in the Lunar Module (LM) Scientific Equipment (SEQ) bay with a mass up to 163 kg (Apollo 17). The crew unloaded the ALSEP from the LM and deployed the instruments on the lunar surface. Although designed to operate for only 1 year, many sites operated for up to 8 years successfully [4]. The Active Seismic Experiment (ASE) included 3 geophones for detecting seismic waves created by mortars and thumpers deployed by the crew. Other active experiments measured the lunar atmosphere, the heat flow in the subsurface, the lunar gravity and potential gravity waves, the lunar magnetic field, the solar wind and plasma interactions in cislunar space. Passive experiments included collectors for dust and cosmic rays, and retroreflectors for precise measurements of distance using a laser from Earth. The ALSEP program continues to generate insights into lunar formation and evolution. ArLSEP Concepts: The lunar surface science package for the Artemis program will hopefully exceed the capability of the ALSEP. There are multiple issues for discussion leading to the design of a new ArLSEP, needing requirements definition from the science community, NASA mission architecture, and NASA budget planners. 1. Delivery Mechanism Two possible projects currently provide capability to deliver scientific cargo to the lunar surface: 1) the Commercial Lunar Payload Services (CLPS) [5] and the Human Landing System (HLS) [6, 7]. Each project is controlled by a different organization within NASA and budgeted with different criteria although both support lunar exploration. The HLS system delivers crew (and potentially cargo) to human landing sites. If an ArLSEP is “predeployed” to such a site, the design must include power (either from the vehicle or independently) to keep the electronics functioning until deployed by the crew. If an ArLSEP is delivered on a vehicle after the crew is present on the lunar surface, safety protocols require adequate distance from the humans for impact from descent propelled sur-face regolith ejecta. This distance can not exceed the capability of the crew to walk (if no rover) to the vehicle for ArLSEP deployment. 2. Overall Guidelines The general design of ArLSEP will likely follow the ALSEP with a common system for communications and power; however, significant architecture differences between Apollo and Artemis exist. Power: The RTG will not be available for early Artemis missions nor likely follow-on Lunar Exploration Transportation Services (LETS) missions [8]. Thus, ArLSEP power must be supplied by solar arrays with sufficient battery capability to “keep alive” necessary electronics during any lunar surface eclipse period. Communication: The Artemis program is developing a series of communications satellites for lunar orbit to provide surface transmission of data and voice to Earth. Called “LunaNET”, this network is component useful for ArLSEP since south polar locations may not always have direct “line-of-sight” to Earth [9]. 3. Concept of Operations (ConOps) The general ConOps for ArLSEP is to deliver the package to lunar surface before the crew arrives, and then have the crew deploy the package after some period of time. This requires coordinated design (for power systems) and launch window (for schedule) on both the cargo and crew missions. Once the ArLSEP is deployed, it will operate autonomously for a number of years. It should be designed to be EVA compatible for crew maintenance and upgrade. 4. Notional Design (for discussion purpose only) The landing site near the South Pole is expected to have no eclipse cycle exceeding 5 days, so the “keep alive” power is 144 hours (6 days to include margin). A 12v ArLSEP will use rechargeable LiFePO4 cells, which are common in the Electric Vehicle (EV) industry. With a current of 5 amps and a 125 watt system, the mass is about 90kg. The comm. system and structure adds another 10kg, thus the “Central Station” is approximately 100kg. The solar power is collected on four arrays (each 2m above the surface), and the entire ArLSEP is designed to stow in a 2m x 1m x 1m volume. The experiment and instrument design will vary for each installation and add mass to the total (although they are expected to fit within the 2m3 volume). Seismic wave generation will likely not be provided with mortars, thus an electric “thumper” will be required. Active instruments such as imaging systems and sensing instruments will benefit from the additional power and communication capability provided by ArLSEP. Passive systems such as retroreflectors, witness plates, and cosmic dust collectors can be added to either the landing vehicle and/or the ArLSEP. With repeated HLS missions to the same human site, the ArLSEP can be expanded and easily maintained for long duration science collection on the lunar surface.

ALSEP↗
DOE OSTI2025

ORNL Package Testing Program Overview

Radioactive materials are widespread in our everyday activities which are used in many different types of industries: Consumer products, Medicine, Industry, Energy, and Defense. In the United States there is about 3 million shipments of radioactive materials per year. With radioactive material being very widespread the number of new applications to ship these quantities increases daily. As such, ensuring the safe and secure transport of these materials is paramount, necessitating stringent packaging, transportation, and certification requirements. Shipments of radioactive materials have been made from Oak Ridge National Laboratory (ORNL) for the past 65 years. Since the 1940s ORNL has been at the forefront of the early development of regulations pertaining to the transport of radioactive shipments and associated regulatory testing. The early involvement resulted in ORNL being one of the leaders in the development of regulations and testing standards pertaining to the testing and design of packages. Today all package testing activities are conducted under the Package Testing Program (PTP) at ORNL at the Package Evaluation Facility (PEF). The PTP develops and evaluates testing solutions – ensuring that they are safe, efficient, and meet regulatory requirements ORNL PTP has extensive experience in the regulatory testing of radioactive material packages, supporting certification of Type A, Type, B, Type AF, and special form packages. The PEF serves as a one-stop-shop for design, testing, and certification of a wide variety of packages needed for shipment of radioactive materials. The facility provides the space, expertise, and equipment necessary to conduct rigorous performance testing under both normal and accident conditions or transport environments including free drop, dynamic crush, puncture, penetration, compression, vibration, water spray, water immersion, and thermal test. The PTP remains a key contributor to the safety and compliance of radioactive material transportation. This presentation will provide an overview of the program’s history, capabilities, and its ongoing role in advancing regulatory standards and transportation safety.

Martinez, Oscar [ORNL] (ORCID:0000000181814046)↗
NASA NTRS2016

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

dielectric performance↗
NASA NTRSDate not supplied

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.

High Temperature, Packaging, Alumina, Thick Film↗
NASA NTRSDate not supplied

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500oC are reviewed.

high temperature↗
DOE OSTI2026

RC-SFA Data Management Templates and Guidance for Standardized, Reusable AI-Ready Data Packages

This data package provides templates and supporting documentation developed by the River Corridor Science Focus Area (RC-SFA; https://www.pnnl.gov/projects/river-corridor) to communicate its approach to managing and publishing AI-ready data. The package is intended to help data users and data producers understand the structures, metadata practices, and quality-control approaches that support consistent, reusable, and machine-actionable data products across RC-SFA studies. Rather than focusing on a single experimental dataset, this package documents the data management framework used to make RC-SFA data easier to find, ingest, navigate, and interpret. The materials in this package reflect RC-SFA practices for standardized data package organization, including the use of a human- and machine-readable README, file-level metadata, data dictionaries, descriptive file naming, method identifiers, and automated and review-based quality assurance procedures. Together, these components illustrate how RC-SFA extends FAIR data principles toward AI-readiness by prioritizing deep metadata, consistency across data packages, and support for informed downstream reuse by both humans and computational tools. This dataset is comprised of (1) readme; (2) presentation slides with an overview of RC-SFA approach and guidance; (3) document of RC-SFA best practices; (4) data dictionary (dd); (5) file level metadata (flmd); and a subfolder containing templates for dd and flmd. All files are .csv and .pdf. For details on how to navigate data packages generated by this project, see https://data.ess-dive.lbl.gov/portals/PNNLRiverCorridorSFA/About.

AI-readiness↗
NASA NTRS1978

Food packages for Space Shuttle

The paper reviews food packaging techniques used in space flight missions and describes the system developed for the Space Shuttle. Attention is directed to bite-size food cubes used in Gemini, Gemini rehydratable food packages, Apollo spoon-bowl rehydratable packages, thermostabilized flex pouch for Apollo, tear-top commercial food cans used in Skylab, polyethylene beverage containers, Skylab rehydratable food package, Space Shuttle food package configuration, duck-bill septum rehydration device, and a drinking/dispensing nozzle for Space Shuttle liquids. Constraints and testing of packaging is considered, a comparison of food package materials is presented, and typical Shuttle foods and beverages are listed.

Fohey, M. F.↗
NASA NTRS1992

ASpect: A new spectrum and line analysis package for IRAF

We examined several publicly available spectral analysis software packages looking for one with enough functionality and versatility to meet the analysis needs of astronomers during the next decade. None of those examined can satisfactorily support the wide variety of panchromatic science programs that are now becoming possible. Furthermore, we concluded that none of these packages can be simply modified to include critical functions because of their original (limited) designs. During the next two years we will write a new spectral analysis package, ASpect, that will incorporate the latest analysis techniques for astronomical spectra in all wavelength domains. The ASpect package has several functional requirements. It must operate on spectra from a wide variety of ground-based and space-based instruments spanning wavelengths from radio to gamma rays. It must accommodate non-linear dispersion relations. It must provide a variety of functions, individually or in combination, with which to fit spectral features and the continuum. It is vitally important that known bad data be masked and that, uncertainties be propagated throughout the calculations in order for astronomers to evaluate the reliability of results. Finally, this new package must provide a powerful, intuitive graphical user interface to handle the burden of data input/output (I/O), on-line 'help,' selection of relevant features for analysis, plotting and graphical interaction, and data base management--all in a comprehensible environment. We anticipate that ASpect will take the form of an external package in IRAF (such as the NOAO and STSDAS packages) and will be layered upon the IRAF virtual Operating System to make it available on as many platforms as possible, while making it resistant to changes in operating systems and compilers. Our choice of IRAF is motivated by its portability, its wide use within the astronomical community, and its rich set of existing user applications.

Hulbert, S. J.↗
NASA NTRS1995

Advanced packaging for Integrated Micro-Instruments

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

Lyke, James L.↗
NASA NTRS2000

Laser Welding in Electronic Packaging

The laser has proven its worth in numerous high reliability electronic packaging applications ranging from medical to missile electronics. In particular, the pulsed YAG laser is an extremely flexible and versatile too] capable of hermetically sealing microelectronics packages containing sensitive components without damaging them. This paper presents an overview of details that must be considered for successful use of laser welding when addressing electronic package sealing. These include; metallurgical considerations such as alloy and plating selection, weld joint configuration, design of optics, use of protective gases and control of thermal distortions. The primary limitations on use of laser welding electronic for packaging applications are economic ones. The laser itself is a relatively costly device when compared to competing welding equipment. Further, the cost of consumables and repairs can be significant. These facts have relegated laser welding to use only where it presents a distinct quality or reliability advantages over other techniques of electronic package sealing. Because of the unique noncontact and low heat inputs characteristics of laser welding, it is an ideal candidate for sealing electronic packages containing MEMS devices (microelectromechanical systems). This paper addresses how the unique advantages of the pulsed YAG laser can be used to simplify MEMS packaging and deliver a product of improved quality.

Source record↗
NASA NTRS2000

Packaging Technology Developed for High-Temperature SiC Sensors and Electronics

A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.

Chen, Liang-Yu↗
NASA NTRS2006

Advanced Space Suit Portable Life Support Subsystem Packaging Design

This paper discusses the Portable Life Support Subsystem (PLSS) packaging design work done by the NASA and Hamilton Sundstrand in support of the 3 future space missions; Lunar, Mars and zero-g. The goal is to seek ways to reduce the weight of PLSS packaging, and at the same time, develop a packaging scheme that would make PLSS technology changes less costly than the current packaging methods. This study builds on the results of NASA s in-house 1998 study, which resulted in the "Flex PLSS" concept. For this study the present EMU schematic (low earth orbit) was used so that the work team could concentrate on the packaging. The Flex PLSS packaging is required to: protect, connect, and hold the PLSS and its components together internally and externally while providing access to PLSS components internally for maintenance and for technology change without extensive redesign impact. The goal of this study was two fold: 1. Bring the advanced space suit integrated Flex PLSS concept from its current state of development to a preliminary design level and build a proof of concept mockup of the proposed design, and; 2. "Design" a Design Process, which accommodates both the initial Flex PLSS design and the package modifications, required to accommodate new technology.

Howe, Robert↗
NASA NTRS1978

Food Packaging Materials

The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

Source record↗