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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1993

Control of micromachined deformable mirrors

A micromachined deformable mirror with pixelated electrostatic actuators is proposed. The paper begins with a physical description of the proposed mirror. Then a mathematical model in the form of a nonlinear partial differential equation describing the mirror surface deformations is derived. This model is used to derive the required voltages for the actuators to achieve a specified static deformation of the mirror surface. This is followed by the derivation of a static nonlinear feedback controller for achieving noninteracting actuation. Then the structure for a complete control system for wavefront correction is proposed. The paper concludes with a discussion of the physical implementation of the proposed control system.

Agronin, M. L.↗
NASA NTRS1995

Silicon Micromachining in RF and Photonic Applications

Texas Instruments (TI) has developed membrane and micromirror devices since the late 1970s. An eggcrate space membrane was used as the spatial light modulator in the early years. Discrete micromirrors supported by cantilever beams created a new era for micromirror devices. Torsional micromirror and flexure-beam micromirror devices were promising for mass production because of their stable supports. TI's digital torsional micromirror device is an amplitude modulator (known as the digital micromirror device (DMD) and is in production development, discussed elsewhere. We also use a torsional device for a 4 x 4 fiber-optic crossbar switch in a 2 cm x 2 cm package. The flexure-beam micromirror device is an analog phase modulator and is considered more efficient than amplitude modulators for use in optical processing systems. TI also developed millimeter-sized membranes for integrated optical switches for telecommunication and network applications. Using a member in radio frequency (RF) switch applications is a rapidly growing area because of the micromechanical device performance in microsecond-switching characteristics. Our preliminary membrane RF switch test structure results indicate promising speed and RF switching performance. TI collaborated with MIT for modeling of metal-based micromachining.

Lin, Tsen-Hwang↗
NASA NTRS1996

Integrated Optical Interferometers with Micromachined Diaphragms for Pressure Sensing

Optical pressure sensors have been fabricated which use an integrated optical channel waveguide that is part of an interferometer to measure the pressure-induced strain in a micromachined silicon diaphragm. A silicon substrate is etched from the back of the wafer leaving a rectangular diaphragm. On the opposite side of the wafer, ring resonator and Mach-Zehnder interferometers are formed with optical channel waveguides made from a low pressure chemical vapor deposited film of silicon oxynitride. The interferometer's phase is altered by pressure-induced stress in a channel segment positioned over the long edge of the diaphragm. The phase change in the ring resonator is monitored using a link-insensitive swept frequency laser diode, while in the Mach-Zehnder it is determined using a broad band super luminescent diode with subsequent wavelength separation. The ring resonator was found to be highly temperature sensitive, while the Mach-Zehnder, which had a smaller optical path length difference, was proportionally less so. The quasi-TM mode was more sensitive to pressure, in accord with calculations. Waveguide and sensor theory, sensitivity calculations, a fabrication sequence, and experimental results are presented.

DeBrabander, Gregory N.↗
NASA NTRS1998

Experimental Performance of a Micromachined Heat Flux Sensor

Steady-state and frequency response calibration of a microfabricated heat-flux sensor have been completed. This sensor is batch fabricated using standard, micromachining techniques, allowing both miniaturization and the ability to create arrays of sensors and their corresponding interconnects. Both high-frequency and spatial response is desired, so the sensors are both thin and of small cross-sectional area. Thin-film, temperature-sensitive resistors are used as the active gauge elements. Two sensor configurations are investigated: (1) a Wheatstone-bridge using four resistors; and (2) a simple, two-resistor design. In each design, one resistor (or pair) is covered by a thin layer (5000 A) thermal barrier; the other resistor (or pair) is covered by a thick (5 microns) thermal barrier. The active area of a single resistor is 360 microns by 360 microns; the total gauge area is 1.5 mm square. The resistors are made of 2000 A-thick metal; and the entire gauge is fabricated on a 25 microns-thick flexible, polyimide substrate. Heat flux through the surface changes the temperature of the resistors and produces a corresponding change in resistance. Sensors were calibrated using two radiation heat sources: (1) a furnace for steady-state, and (2) a light and chopper for frequency response.

TEMPERATURE SENSITIVE ELEMENTS↗
NASA NTRS1998

Surface Micromachined Silicon Carbide Accelerometers for Gas Turbine Applications

A finite-element analysis of possible silicon carbide (SIC) folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices Inc., (Norwood, MA) air-bag crash detector, are etched from 2-pm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 gm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.

DeAnna, Russell G.↗
NASA NTRS2000

High-Q X-Band and K-Band Micromachined Spiral Inductors for Use in Si-Based ICs

A micromachined structure with reduced parasitics is proposed to enhance the resonant frequency and the quality factor (Q) of a spiral inductor. Inductors with various etch depths have been fabricated on a high resistivity Si substrate. Two-port S-parameters measurement is taken to characterize the performance of the inductors. With an etch depth of 20 micron, a fabricated 1.8 nH spiral inductor achieves a maximum resonant frequency of 25.6 GHz and a maximum Q of 20.2 at 14.5 GHz. This technology is compatible with SiGe/Si HBT technology, and the spiral inductors are especially suitable for Si-based monolithic microwave integrated circuit (MMIC) applications.

Lu, Liang-Hung↗
NASA NTRS2001

Micromachined TWTs for THz Radiation Sources

The Terahertz (THz) region of the electromagnetic spectrum (about 300 - 3000 GHz in frequency or about 0.1 - 1 mm free space wavelength) has enormous potential for high-data-rate communications, spectroscopy, astronomy, space research, medicine, biology, surveillance, remote sensing, industrial process control, etc. It has been characterized as the most scientifically rich, yet under-utilized, region of the electromagnetic spectrum. The most critical roadblock to full exploitation of the THz band is lack of coherent radiation sources that are powerful (0.001 - 1.0 W continuous wave), efficient (> 1%), frequency agile (instantaneously tunable over 1% bandwidths or more), reliable, and comparatively inexpensive. To develop vacuum electron device (VED) radiation sources satisfying these requirements, fabrication and packaging approaches must be heavily considered to minimize costs, in addition to the basic interaction physics and circuit design. To minimize size of the prime power supply, beam voltage must be minimized, preferably 10 kV. Solid state sources satisfy the low voltage requirement, but are many orders of magnitude below power, efficiency, and bandwidth requirements. On the other hand, typical fast-wave VED sources in this regime (e.g., gyrotrons, FELs) tend to be large, expensive, high voltage and very high power devices unsuitable for most of the applications cited above. VEDs based on grating or inter-digital (ID) circuits have been researched and developed. However, achieving forward-wave amplifier operation with instantaneous fractional bandwidths > 1% is problematic for these devices with low-energy (< 15 kV) electron beams. Moreover, the interaction impedance is quite low unless the beam-circuit spacing is kept particularly narrow, often leading to significant beam interception. One solution to satisfy the THz source requirements mentioned above is to develop micromachined VEDs, or "micro-VEDs". Among other benefits, micro-machining technologies provide superior high frequency wall conductivity as a result of superior surface smoothness compared with conventional mechanical or electric discharge machining approaches. Micro-VED technologies are already being applied to the development of millimeter-wave klystrons at Stanford Linear Accelerator Center and submillimeter-wave klystrons at the University of Leeds. We are investigating the use of micro-machining technologies to develop THz regime TWTs, with emphasis on folded-waveguide TWTs. The folded-waveguide TWT (FW-TWT) has several features that make it attractive for THz-regime micro-VED applications. It is a relatively simple circuit to design and fabricate, it is amenable to precision pattern replication by micro-machining, and it is has been demonstrated capable of forward-wave amplification with appreciable bandwidth. We are conducting experimental and computational studies of micro-VED FW-TWTs to examine their feasibility for applications at frequencies from 200 - 1000 GHz.

Booske, John H.↗
NASA NTRS1999

A Novel Silicon Micromachined Integrated MCM Thermal Management System

This research concerned the development of a novel porous wick, fabricated totally out of silicon, using state-of-the-art MEMS technology. A comprehensive summary of results, as well as additional fabrication details, can be found in the following three documents located in the attached Appendices: A) Selected pages and excerpts from Year 2 progress report of the principal NASA Grant awarded from NASA Lewis Research Center, Grant Number NAG3-1706 entitled "A Novel Silicon Nficromachined Integrated MCM Thermal Management System" submitted to NASA LRC on 4/4/98. B) Selected viewgraphs from the joint NASA, TEES, and UC meeting held at the University of Cincinnati on April 24, 1998. C) Pre-print of the paper entitled "Coherent Macro Porous Silicon as a Wick Structure in an Integrated Nficrofluidic Two-Phase Cooling System" to be presented September 20-25, 1998 at the SPIE conference held in Santa Clara, Ca. To summarize,. nearly all of the proposed work was successfully accomplished (albeit a 3-month time extension was required), proving that micromachining can indeed be used to fabricate porous silicon wick structures with precise hole sizes and patterning control, thus permitting a substantial improvement in future wick designs. In addition, the appropriate range of thermal conductivities of the porous samples were theoretically predicted (see Appendix A). Although not part of the scope of work, the permeability of the test samples were measured (see results sections of Appendices B and C).

Kazmierczak, M. J.↗
NASA NTRS2004

Project: Micromachined High-Frequency Circuits For Sub-mm-wave Sensors

A novel micromachined resonator at 45 GHz based on a defect in a periodic electromagnetic bandgap structure (EBG) and a two-pole Tchebysbev filter with 1.4% 0.15 dB equiripple bandwidth and 2.3 dB loss employing this resonator are presented in this letter. The periodic bandgap structure is realized on a 400 micron thick high-resistivity silicon wafer using deep reactive ion etching techniques. The resonator and filter can be accessed via coplanar waveguide feeds.

Papapolymerou, Ioannis John↗
NASA NTRS1996

Silicon Bulk Micromachined Vibratory Gyroscope

This paper reports on design, modeling, fabrication, and characterization of a novel silicon bulk micromachined vibratory rate gyroscope designed for microspacecraft applications. The new microgyroscope consists of a silicon four leaf cloverstructure with a post attached to the center.

gyroscope microgyroscope↗
NASA NTRS1995

Micromachined Silicon Waveguide Circuits

Rectangular waveguides are commonly used as circuit elements in remote-sensing heterodyne receivers at millimeter wavelengths. The advantages of waveguides are low loss and mechanical tunability. However, conventional machining techniques for waveguide components operating above a few hundred GHz are complicated and costly. Waveguides micromachined from silicon however would have several important advantages including low-cost; small size for very high frequency (submillimeter wave) operation; high dimensional accuracy (important for high-Q circuits); atomically smooth walls, thereby reducing rf losses; and the ability to integrate active and passive devices directly in the waveguide on thin membranes, thereby solving the traditional problem of mounting thin substrates.

Silicon Waveguide↗
NASA NTRS1993

Micromachined Tunneling Displacement Transducers for Physical Sensors

We have designed and constructed a series of tunneling sensors which take advantage of the extreme position sensitivity of electron tunneling. In these sensors, a tunneling displacement transducer, based on scanning tunneling microscopy principles, is used to detect the signal-induced motion of a sensor element. Through the use of high-resonant frequency mechanical elements for the transducer, sensors may be constructed which offer wide bandwidth, and are robust and easily operated. Silicon micromachining may be used to fabricate the transducer elements, allowing integration of sensor and control electronics. Examples of tunneling accelerometers and infrared detectors will be discussed. In each case, the use of the tunneling transducer allows miniaturization of the sensor as well as enhancement of the sensor performance.

Kenny, T. W.↗
NASA NTRS2001

Fabricating and using a micromachined magnetostatic relay or switch

A micromachined magnetostatic relay or switch includes a springing beam on which a magnetic actuation plate is formed. The springing beam also includes an electrically conductive contact. In the presence of a magnetic field, the magnetic material causes the springing beam to bend, moving the electrically conductive contact either toward or away from another contact, and thus creating either an electrical short-circuit or an electrical open-circuit. The switch is fabricated from silicon substrates and is particularly useful in forming a MEMs commutation and control circuit for a miniaturized DC motor.

Tai, Yu-Chong↗
NASA NTRS1999

Micromachined peristaltic pumps

Micromachined pumps including a channel formed between a first membrane and a substrate or between first and second flexible membranes. A series of electrically conductive strips is applied to a surface of the substrate or one of the membranes. Application of a sequential voltage to the series of strips causes a region of closure to progress down the channel to achieve a pumping action.

Hartley, Frank T.↗
NASA NTRS2002

Micromachined double resonator

A micromachined resonator mountable to an external support structure has a proof mass coupled to a base structure by a first spring structure, the base structure having a plurality of electrodes, and a second spring structure coupling the base structure to the external support structure.

Gutierrez, Roman↗
NASA NTRS2008

Micromachined Slits for Imaging Spectrometers

Slits for imaging spectrometers can now be fabricated to a precision much greater than previously attainable. What makes this possible is a micromachining process that involves the use of microlithographic techniques.

Wilson, Daniel↗