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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1993

Transverse flexural tests as a tool for assessing damage to PMR-15 composites from isothermal aging in air at elevated temperatures

To date, the effect of thermo-oxidative aging on unidirectional composite mechanical properties has been monitored by the measurement of interlaminar shear strength (ILSS) and either three or four point longitudinal flexural strength (LFS) of the composites being tested. Both results are affected by the fiber-to-matrix bonding, the former being dependent on the shear resistance of the interface and the latter on the degree of load sharing by the fibers through the fiber/matrix interface. Recently, fiber/matrix interfacial bond strengths have been monitored using a transverse flexural strength (TFS) test method. This test method was used to evaluate the effect of fiber surface treatment on the fiber/matrix.

Bowles, Kenneth J.↗
NASA NTRS2007

Indium Hybridization of Large Format TES Bolometer Arrays to Readout Multiplexers for Far-Infrared Astronomy

The advance of new detector technologies combined with enhanced fabrication methods has resulted in an increase in development of large format arrays. The next generation of scientific instruments will utilize detectors containing hundreds to thousands of elements providing a more efficient means to conduct large area sky surveys. Some notable detectors include a 32x32 x-ray microcalorimeter for Constellation-X, an infrared bolometer called SAFIRE to fly on the airborne observatory SOFIA, and the sub-millimeter bolometer SCUBA-2 to be deployed at the JCMT which will use more than 10,000 elements for two colors, each color using four 32x40 arrays. Of these detectors, SCUBA-2 is farthest along in development and uses indium hybridization to multiplexers for readout of the large number of elements, a technology that will be required to enable the next generation of large format arrays. Our current efforts in working toward large format arrays have produced GISMO, the Goddard IRAM Superconducting 2-Millimeter observer. GISMO is a far infrared instrument to be field tested later this year at the IRAM 30 meter telescope in Spain. GISMO utilizes transition edge sensor (TES) technology in an 8x16 filled array format that allows for typical fan-out wiring and wire-bonding to four 1x32 NIST multiplexers. GISMO'S electrical wiring is routed along the tops of 30 micron walls which also serve as the mechanical framework for the array. This architecture works well for the 128 element array, but is approaching the limit for routing the necessary wires along the surface while maintaining a high fill factor. Larger format arrays will benefit greatly from making electrical connections through the wafer to the backside, where they can be hybridized to a read-out substrate tailored to handling the wiring scheme. The next generation array we are developing is a 32x40 element array on a pitch of 1135 microns that conforms to the NIST multiplexer, already developed for the SCUBA-2 instrument This architecture will utilize electrical connections that route from the TES to the support frame and through the wafer. The detector chip will then be hybridized to the NIST multiplexer via indium bump bonding. In our development scheme we are using substrates that allow for diagnostic testing of electrical continuity across the entire array and we are testing our process to minimize or eliminate any contact resistance at metal interfaces. Our goal is hybridizing a fully functional 32x40 array of TES bolometers to a NIST multiplexer. The following work presents our current progress toward enabling this technology.

Miller, Timothy M.↗
NASA NTRS2021

Thermoelectric System Economics - The Apex: New Paradigms in Manufacturing and Interface Performance Relationships Driving System Cost Optimizations

Thermoelectric energy recovery systems require cost-optimized designs with high thermal and thermoelectric (TE) performance to surmount common commercialization barriers controlling the acceptance of thermoelectric generator (TEG) systems. Recent work has addressed this requirement with new analytic tools and paradigms that allow integrated TEG cost-performance analysis and optimization. New work herein has identified the existence of optimized TE element design (i.e., TE element length) for minimizing TEG cost and provides design guidelines associated with critical thermal and electrical contact resistance effects and TE manufacturing sensitivities. Once optimum hot-side heat flux criteria are satisfied, this work highlights the tradeoffs between interface resistance effects and manufacturing cost effects in determining optimum-cost TE element lengths, and then quantifies the increase in optimum-cost TE lengths as manufacturing costs become more sensitive to TE element lengths. Optimized TE element design criteria and key non-dimensional design parameters (i.e., [𝐶′′′LTE/𝐶′′], [TE/con], [con/(TE,aveLTE)]) driving the design are presented and explained showing the interdependencies between manufacturing cost parameters and thermal and electrical interface impacts on integrated TE cost-performance analysis and design. Comprehensive TEG system cost-performance relationships clearly demonstrate the two parameters that most greatly impact the TEG system cost are heat exchanger costs ($/(W/K)) and TE hot side heat flux. Reducing heat exhanger cost from $1/(W/K) to $0.5/(W/K) can decrease TEG system cost by $2/W to $4/W depending on TE hot side heat fluxes from 4-10 W/cm2. The impact of TE hot side heat flux on TEG system cost is larger; reducing TE system cost by factors of 2-4 as TE hot side heat flux increases from 4 W/cm2 to high levels around 18 W/cm2. The levels of thermal contact resistance and electrical contact resistance required to even approach the critical TEG system cost level of $1/W are characterized by con = 1.0 x 10-10 -m2 and r = 0.1, respectively. This not only lowers TEG costs, but it also makes the TEG system costs less sensitive to TE manufacturing dependences on TE element length. New design paradigms and relationships create holistic, integrated TE performance-cost models that enhance understanding of crucial interrelationships between component costs, TE design parameters and material properties, heat exchanger design parameters, interfacial heat flux, and now thermal and electrical interface effects in minimizing TEG system costs.

Hendricks, Terry J.↗
NASA NTRS1994

Measurement of resistance to solute transport across surfactant-laden interfaces using a Fluorescence Recovery After Photobleaching (FRAP) technique

A noninvasive fluorescence recovery after photobleaching (FRAP) technique is under development to measure interfacial transport in two phase systems without disturbing the interface. The concentration profiles of a probe solute are measured in both sides of the interface by argon-ion laser, and the system relaxation is then monitored by a microscope-mounted CCD camera.

Browne, Edward P.↗
NASA NTRS2015

Thermal Interface Materials Selection and Application Guidelines: In Perspective of Xilinx Virtex-5QV Thermal Management

The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.

Suh, Jong-ook↗
NASA NTRS2015

Thermal interface materials selection and application guidelines: in perspective of Xilinx Virtex-5QV thermal management

The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device.

Tseng, Stephen↗
NASA NTRS1976

The metal to metal interface and its effect on adhesion and friction

The paper considers the interface between two bulk metals and the effect of this interface on adhesive bonding, resistance to tangential displacements, friction and the interfacial transport from one surface to another. Using Auger emission spectroscopy, field ion microscopy, and low energy electron diffraction techniques, the influence of surface orientation, lattice registry, crystal lattice structure and defects, metal surface chemistry and alloying on the characteristics of the interface was studied for noble, platinum, transition, and Group 4B metals. With dissimilar metals in contact, epitaxial transfer of the cohesively weaker to the cohesively stronger metal has been observed. Surface chemical activity of the noble and platinum metals is shown to affect interfacial behavior as does a valence bonding in the transition metals, and the degree of metallic nature in the Group 4B elements. Alloying elements, e.g., Si and Fe, can alter interfacial behavior by segregation to the surface of metals or by altering bulk properties such as crystal transformation kinetics.

Buckley, D. H.↗
NASA NTRS1992

The achievement of low contact resistance to indium phosphide: The roles of Ni, Au, Ge, and combinations thereof

We have investigated the electrical and metallurgical behavior of Ni, Au-Ni, and Au-Ge-Ni contacts on n-InP. We have found that very low values of contact resistivity rho(sub c) in the E-7 omega-sq cm range are obtained with Ni-only contacts. We show that the addition of Au to Ni contact metallization effects an additional order of magnitude reduction in rho(sub c). Ultra-low contact resistivities in the E-8 omega-sq cm range are obtained with both the Au-Ni and the Au-Ge-Ni systems, effectively eliminating the need for the presence of Ge in the Au-Ge-Ni system. The formation of various nickel phosphides at the metal-InP interface is shown to be responsible for the observed rho(sub c) values in the Ni and Au-Ni systems. We show, finally, that the order in which the constituents of Au-Ni and Au-Ge-Ni contacts are deposited has a significant bearing on the composition of the reaction products formed at the metal-InP interface and therefore on the contact resistivity at that interface.

Fatemi, Navid S.↗
NASA NTRS2002

Folded Coplanar Waveguide Slot Antenna on Silicon Substrates With a Polyimide Interface Layer

A novel mm-wave Coplanar Waveguide (CPW) folded slot antenna is characterized on low-resistivity Si substrate (1 omega-cm) and a high resistivity Si substrate with a polyimide interface layer for the first time. The antenna resonates around 30 GHz with a return loss greater than 14.6 dB. Measured radiation patterns indicate the existence of a main lobe, but the radiation pattern is affected by a strong surface wave mode, which is greater in the high resistivity Si wafer.

Bacon, Andrew↗
NASA NTRS1977

Susceptibility to hot corrosion of four nickel-base superalloys, NASA-TRW VIA, B-1900, 713C and IN-738

The susceptibility to hot corrosion of four nickel-base, cast superalloys has been studied at 900 and 1000 C. The test consisted of coating alloy samples with known amounts of Na2SO4 and oxidizing the coated samples isothermally in 1 atmosphere of slowly flowing oxygen, the weight-gain being monitored on a sensitive recording microbalance. Susceptibility to hot corrosion decreased in the order of decreasing molybdenum content of the alloys. Preoxidation of samples before hot-corrosion testing markedly increased the induction period observed prior to the inception of hot corrosion for all alloys tested. X-ray diffraction analyses of the oxide scales were made. All samples that underwent hot corrosion showed the presence of a (Ni,Co)MoO4 layer near the alloy-oxide interface. Several specimens displayed resistance to hot corrosion and these showed NaTaO3 as a prominent feature in their oxide scale. Our results may be interpreted as indicating that molybdenum in an alloy is detrimental, with respect to hot corrosion, while tantalum is beneficial.

Stearns, C. A.↗
NASA NTRS1988

Recent advances in Alkali Metal Thermoelectric Converter (AMTEC) electrode performance and modeling

The Alkali Metal Thermoelectric Converter (AMTEC) is a direct energy conversion device, utilizing a high sodium vapor pressure or activity ratio across a beta-double prime-alumina solid electrolyte (BASE). This paper describes progress on the remaining scientific issue which must be resolved to demonstrate AMTEC feasibility for space power systems: a stable, high power density electrode. Two electrode systems have recently been discovered at JPL that now have the potential to meet space power requirements. One of these is a very thin sputtered molybdenum film, less than 0.5 micron thick, with overlying current collection grids. This electrode has experimentally demonstrated stable performance at 0.4-0.5 W/sq cm for hundreds of hours. Recent modeling results show that at least 0.7 W/sq cm can be achieved. The model of electrode performance now includes all loss mechanisms, including charge transfer resistances at the electrode/electrolyte interface. A second electrode composition, cosputtered platinum/tungsten, has demonstrated 0.8 W/sq cm for 160 hours. Systems studies show that a stable electrode performance of 0.6 W/sq cm will enable high efficiency space power systems.

Bankston, C. P.↗
NASA NTRS1989

Fatigue crack growth study of SCS6/Ti-15-3 composite

A study was performed to determine the fatigue crack growth (FCG) behavior and the associated fatigue damage processes in a (0)(8) and (90)(8) oriented SCS(6)/Ti-15-3 composite. Companion testing (CT) was also done on identically processed Ti-15-3 unreinforced material. The active fatigue crack growth failure processes were very similar for both composite orientations tested. For both orientations, fatigue crack growth was along the fiber direction. It was found that the composite constituent most susceptible to fatigue damage was the interface region and in particular the carbon coating surrounding the fiber. The failure of the interface region lead to crack initiation and also strongly influenced the FCG behavior in this composite. The failure of the interface region was apparently driven by normal stresses perpendicular to the fiber direction. The FCG rates were considerably higher for the (90)(8) oriented CT specimens in comparison to the unreinforced material. This is consistent with the scenario in which the interface has lower fatigue resistance than the matrix, causing lower composite fatigue resistance. The FCG rates of the (0)(8) composite could not be directly compared to the (90)(8) composite but were shown to increase with an increase in the crack length.

Kantzos, Peter↗
NASA NTRS2002

Galvanic Liquid Applied Coating System For Protection of Embedded Steel Surfaces from Corrosion

Corrosion of reinforcing steel in concrete is an insidious problem facing Kennedy Space Center (KSC), other Government Agencies, and the general public. These problems include KSC launch support structures, highway bridge infrastructure, and building structures such as condominium balconies. Due to these problems, the development of a Galvanic Liquid Applied Coating System would be a breakthrough technology having great commercial value for the following industries: Transportation, Infrastructure, Marine Infrastructure, Civil Engineering, and the Construction Industry. This sacrificial coating system consists of a paint matrix that may include metallic components, conducting agents, and moisture attractors. Similar systems have been used in the past with varying degrees of success. These systems have no proven history of effectiveness over the long term. In addition, these types of systems have had limited success overcoming the initial resistance between the concrete/coating interface. The coating developed at KSC incorporates methods proven to overcome the barriers that previous systems could not achieve. Successful development and continued optimization of this breakthrough system would produce great interest in NASA/KSC for corrosion engineering technology and problem solutions. Commercial patents on this technology would enhance KSC's ability to attract industry partners for similar corrosion control applications.

Curran, Joseph↗
NASA NTRS2019

Quick-Replacement High-Temperature Superconducting Current Leads for Use in a Research Cryostat

We report the use of a series of high-temperature superconducting leads in a cryostat that require no soldering to replace in the event of a failed lead. The temperature range spanned by the leads is 50 to 3 degrees Kelvin and they typically carry currents up to 4 amperes although they have a much higher capacity in this temperature range. The leads are integrated into the cryostat by clamping both ends to gold-plated copper pads. Support of the leads over the 25-centimeter length is provided by a simple G10 strong back. Details of the clamping interface, measurements of joint resistances, and other interesting observations will be discussed.

Superconductivity↗
NASA NTRS2004

Multiwalled Carbon Nanotube/nanofiber Arrays as Conductive and Dry Adhesive Interface Materials

We demonstrate the possibility of making conductive and dry adhesive interfaces between multiwalled carbon nanotube (MWNT) and nanofiber (MWNF) arrays grown by chemical vapor deposition with transition-metal as catalyst on highly Boron doped silicon substrates. The maximum observed adhesion force between MWNT and MWNF surfaces is 3.5 mN for an apparent contact area of 2 mm by 4 mm. The minimum contact resistance measured at the same time is approx.20 Omega. Contact resistances of MWNT-MWNT and MWNT-gold interfaces were also measured as pressure forces around several mN were applied at the interface. The resulting minimum contact resistances are on the same order but with considerable variation from sample to sample. For MWNT-MWNT contacts, a minimum contact resistance of approx.1 Omega is observed for a contact area of 2 mm by 1 mm. The relatively high contact resistances, considering the area density of the nanotubes, might be explained by the high cross-tube resistances at the contact interfaces.

Tong, Tao↗
NASA NTRSDate not supplied

Thermal Management Challenges and Technology Options for Lunar Regenerative Fuel Cells

Regenerative Fuel Cells (RFCs) enable lunar surface hardware, from pressurized rovers to surface habitats, to survive the lunar night by providing the required energy storage with a lower mass than state of the art battery systems. RFCs consist of fuel cell and electrolyzer electrochemical stack(s), a fluidic balance of plant, and electrical balance of plant. Fuel cells operate by converting the stored chemical energy of reactants into DC electrical power, heat, and water. When supplied DC power from an available external source, electrolyzers regenerate the reactants through electrolysis. The balance of plant is a critical part of the integrated system consisting of many individual components and provides fluid pressure management and conditioning, fluid storage, and thermal management. Component technology development is required to create an RFC system that will be capable of surviving the harsh lunar environment and maximize specific energy (W-hr/kg). One critical component requiring development includes a kW-scale high flux thermal switch. The primary requirement for the thermal switch is the ability to maintain low thermal resistance with the RFC heat rejection interface during the lunar day to maximize heat rejection while switching to a high thermal resistance during the lunar night such that the RFC can conserve as much thermal energy as possible. Different technology including freeze tolerant pumped loop, passive louvers, and variable conductance heat pipes were assessed as potential solutions. NASA is exploring development options through internal and external partnerships to develop this technology critical for a spaceflight RFC system.

Energy Storage↗
NASA NTRS1994

PV Technology for Low Intensity, Low Temperature (LILT) Applications

As a result of the recent NASA emphasis on smaller, lower cost space missions, PV is now being considered for a number of missions operating at solar distances of 3 AU or greater. In the past, many of these missions would utilize an RTG (radioisotope thermoelectric generator). Historically, silicon solar cell behavior at these distances has been compromised by a number of mechanisms including shunting, nonohmic back contacts, and the 'broken knee' curve shape. The former two can usually be neglected for modern silicon cells, but the latter has not been eliminated. This problem has been identified with localized diffusion at the top contact/silicon interface which leads to structural changes at the local junction. This is believed to create a resistive metal-semiconductor-like (MSL) interface in parallel with the junction which results in the characteristic forms of the LILT (low intensity, low temperature) 'broken knee'. This paper discusses a TaSiN contact barrier that will prevent the MSL structure in the junction.

spacecraft power LILT low temperature low intensit↗
NASA NTRS1994

(abstract) PV Technology for Low Intensity, Low Temperature (LILT) Applications

As a result of the recent NASA emphasis on smaller, lower cost space missions, PV is now being considered for a number of missions operating at solar distances of 3 AU or greater. In the past, many of these missions would utilize an RTG (radioisotope thermoelectric generator). Historically, silicon solar cell behavior at these distances has been compromised by a number of mechanisms including shunting, nonohmic back contacts, and the 'broken knee' curve shape. The former two can usually be neglected for modern silicon cells, but the latter has not been eliminated. This problem has been identified with localized diffusion at the top contact/silicon interface which leads to structural changes at the local junction. This is believed to create a resistive metal-semiconductor-like (MSL) interface in parallel with the junction which results in the characteristic forms of the LILT (low intensity, low temperature) 'broken knee'. This paper discusses a TaSiN contact barrier that will prevent the MSL structure in the junction.

spacecraft power LILT low temperature low intensit↗