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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

R3IT, Rapid Rural Resilient Interconnection Toolkit, Final Technical Report

Utilities nationwide are beginning to experience multiple solar interconnection requests per day. This request volume will soon overwhelm utility engineers, especially at smaller utilities which serve the majority of the landmass of the United States. In this project, we developed open-source software tool that automates the interconnection approval process and removes 80% of the time required to approve an interconnection and hence allow more solar to be quickly and safely integrated with the grid. This software is accompanied by a guidebook detailing interconnection best practices and utility lessons learned. Competing solar interconnection software is extremely expensive at ten times the cost of typical distribution engineering tools, it’s closed source which makes it hard to integrate into utility workflows, and it doesn’t address the hardest power flow modeling challenges of interconnection screening. Our solution was built built with our utility partners who are already experiencing multiple interconnection requests per day and integrates best practices from our past work with DOE and the cooperative community on solar integration. The resulting free and open-source solution has been disseminated through our media channels and conferences that engage over 1,900 utilities nationwide.

14 SOLAR ENERGY↗
DOE OSTI2021

Working With Your Utility Series: Interconnection Basics

This training provided information on interconnection basics for federal agencies developing distributed energy projects. Considerations covered included: Understanding interconnection processes and timelines, interconnection siting considerations, technology-specific interconnection issues, and interconnect agreements. This webinar is the first in a multi-part series on working with electric utilities to develop distributed energy projects on federal sites.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2022

High-Temperature RF Transmission Loss Characteristics of Platinum–Inconel 600 and Platinum–304 Steel Interconnects

Radio frequency (RF) transmission losses that occur at electronic interconnects is currently an important limitation of wireless sensors and other electronic device packages that must operate in high-temperature environments. Herein, in-situ RF transmission losses were measured for two types of interconnects: platinum (Pt) wire bonded to an Inconel 600 coaxial cable; and Pt-wire bonded to a block of 304 steel. Heating the Pt wire/Inconel interconnects at 800 °C for up to 200 hours were found to be very stable with no measurable transmission losses. In contrast, Pt wire/304 steel block interconnects examined over similar test periods at 800 °C exhibited gradual increases in transmission losses leveling off at 10, 38 and 85 mdB at 400 MHz, 700 MHz, and 1 GHz, respectively. Increasing the test temperature to 900 °C caused further elevated transmission losses of 30, 70 and 108 mdB at the same reported frequencies. By comparison, temperature cycling of the Pt wire/304 steel interconnects between room temperature and 900 °C was found to cause more significant degradation. In particular, four thermal cycles from room temperature to 900 °C resulted in losses of 75, 271, and 482 mdB at the same reported frequencies. Parabolic oxidation relative to the RF skin depth in the 304 steel block at the tested frequencies are discussed as possible reasons for the transmission losses during the isothermal soaks, whereas interconnect degradation due to differences in thermal expansion between Pt and 304 steel are primarily responsible for transmission losses caused by high temperature cycling.

304 steel↗
DOE OSTI2022

Graphene-Based Interconnect Exploration for Large SRAM Caches for Ultrascaled Technology Nodes

Graphene-based interconnects are considered promising replacements for traditional copper (Cu) interconnect due to their great electric properties. In this article, an interconnect-memory co- design framework is developed to efficiently optimize various graphene-based interconnect technologies. Four interconnect materials and heterogeneous design schemes are benchmarked against their traditional Cu counterparts to optimize large cache-level SRAM performance in terms of delay and energy per access, energy-delay product (EDP), and energy-delay-area product (EDAP). Here, a large design space exploration is performed based on realistic subarray design and device technology. Various interconnect- and array-level design parameters are studied to quantify the true potential of graphene-based wires for optimal memory performance.

42 ENGINEERING↗
DOE OSTI2023

Characterization of Interconnects

Combined-accelerated stress testing (C-AST) simultaneously combines stress factors of the natural environment (including UV radiation, temperature, humidity, electrical current, and external mechanical force) into a single test that requires fewer modules, fewer chambers, and makes it possible to discover weaknesses in new designs that are not known a-priori. C-AST reduces risk, accelerates time to market, and improves bankability by reducing costly overdesign using test levels not exceeding those seen in the natural environment. This project seeks to evaluate strengths and weaknesses of modern cell interconnect designs with combined-accelerated stress testing (C-AST) to screen multiple climates along with finite element and failure analysis to determine the potential for a 50-year life. Supporting this, we seek to develop methods of characterization to assess the degradation of interconnects, enable predictive rate models with material forensics and FEA and show C-AST's ability to find interconnect failures and benchmark it relative to other accelerated stress test methods like temperature cycling and cyclic dynamic mechanical loading. Examples of modern interconnect designs covered are Canadian Solar Hetero Technology ribbon enabling closer cell interconnections, SmartWire (eg. Meyer-Berger technology), and shingled cells with new interconnect materials.

C-AST↗
DOE OSTI2022

Optimal interconnection of three-terminal tandem solar cells

Three-terminal (3T) tandem solar cells require an adapted module integration scheme in order to explore their full efficiency potential. The three terminals allow to extract the power of the top and bottom cell separately. In a cell string, the wide bandgap top cells are interconnected in parallel to multiple bottom cells resulting in a parallel/series interconnection. This interconnection scheme affects the operation of the subcells, the resulting current path between the subcells, the layout of the cell interconnects, and the system level. Here, we analyze by simulations and experiments the aspects of the module integration of series- and reverse-connected 3T cells with their practical impact on module processes and performance as well as the effect of varying voltage ratios on the string-end losses. If the subcells are connected in series, the module integration requires insulation layers and significantly longer interconnects compared to devices with reverse-connected subcells. Tandem devices with a reverse connection and a voltage ratio between top and bottom cell of 2:1 allow a lean interconnection design and low integration losses. Here, we present an approach for the integration of bypass diodes for the protection against shading effects that allow to minimize string-end and shading losses for a system of modules featuring 3T cells.

14 SOLAR ENERGY↗
DOE OSTI2024

Interconnected Nanoporous Polysulfone by the Self-Assembly of Randomly Linked Copolymer Networks and Linear Multiblocks

Porous materials have attracted considerable attention due to their versatile applications, especially in water purification. Interconnected nanoporous structures are distinguished by their high degree of porosity and resistance to clogging, as well as their insensitivity to nanostructural orientation. Previous works on randomly linked copolymer systems have shown that they can effectively produce disordered cocontinuous nanostructures, which upon removal of one component yield interconnected nanoporous materials. However, the cocontinuous nanomaterials previously developed using polystyrene (PS) and poly(d,l-lactic acid) (PLA) strands, and the resulting interconnected nanoporous PS monoliths, were far too brittle to enable practical use as membranes. Here, we study the self-assembly of randomly linked copolymer networks prepared using blocks of the engineering polymer polysulfone (PSU). A wide cocontinuous regime (spanning 40 wt %) was found for randomly end-linked copolymer networks (RECNs) constructed from PSU and PLA strands, via a combination of mechanical testing, gravimetry, small-angle X-ray scattering, and scanning electron microscopy. The PSU/PLA cocontinuous nanomaterial with symmetric composition showed 2.4 times higher Young’s modulus and ~100 times greater toughness than the corresponding PS/PLA sample. The interconnected nanoporous PSU fabricated after etching of PLA even exhibited 1.6 times greater toughness than PS/PLA prior to PLA removal. To facilitate the production of thin films of cocontinuous nanomaterials, we applied solution-processable randomly linked linear PSU/PLA multiblock polymers onto ultrafiltration membranes. Here, the interconnected nanoporous PSU thin film generated by etching PLA was found to effectively reject 50 nm diameter particles without significantly compromising permeability. This discovery presents a valuable addition to the existing techniques used to fabricate PSU membranes. In contrast to traditional methods, which are sensitive to processing conditions, produce a wide range of pore sizes, and offer limited adjustability of pore size, the current technique is anticipated to enable interconnected PSU membranes with more uniform and tailorable porosity.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Development of Quantum Interconnects (QuICs) for Next-Generation Information Technologies

Just as “classical” information technology rests on a foundation built of interconnected information-processing systems, quantum information technology (QIT) must do the same. A critical component of such systems is the “interconnect,” a device or process that allows transfer of information between disparate physical media, for example, semiconductor electronics, individual atoms, light pulses in optical fiber, or microwave fields. While interconnects have been well engineered for decades in the realm of classical information technology, quantum interconnects (QuICs) present special challenges, as they must allow the transfer of fragile quantum states between different physical parts or degrees of freedom of the system. The diversity of QIT platforms (superconducting, atomic, solid-state color center, optical, etc.) that will form a “quantum internet” poses additional challenges. As quantum systems scale to larger size, the quantum interconnect bottleneck is imminent, and is emerging as a grand challenge for QIT. For these reasons, it is the position of the community represented by participants of the NSF workshop on “Quantum Interconnects” that accelerating QuIC research is crucial for sustained development of a national quantum science and technology program. Given the diversity of QIT platforms, materials used, applications, and infrastructure required, a convergent research program including partnership between academia, industry, and national laboratories is required.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2021

Considerations for Distributed Energy Resource Integration in Puerto Rico: DOE Multi-Lab Grid Modeling Support for Puerto Rico; Analytical Support for Interconnection and IEEE Std 1547-2018 National Renewable Energy Laboratory (Task 3.0)

To ensure the sustainable long-term recovery of Puerto Rico's electric power grid from hurricanes María and Irma and to build capacity to manage future potential natural disasters in the most secure and resilient way, the U.S. Department of Energy (DOE) convened experts from multiple national laboratories to develop a comprehensive set of data, models, analytic tools, and studies, considering inputs from a wide variety of stakeholder groups, to support technically sound recommendations for Puerto Rico's energy investment decisions. A resilient electric grid is vital to Puerto Rico's security, economy, and way of life, and it will provide the foundation for essential services that people and businesses on the island rely on every day. This report shows progress for a grid modeling task under the DOE-sponsored project that is a collaboration among the National Renewable Energy Laboratory (NREL) and other national laboratories. In Phase 1 of the multilab effort to support Puerto Rico's recovery, NREL provided the utility company Puerto Rico Electric Power Authority (PREPA) recommendations for a new framework of interconnection standards to accelerate the integration of utility-scale, transmission-connected renewable electrical generation and energy storage that ensure cross-technology compatibility and enable high deployment levels without compromising grid reliably, safety, or security. This Phase 2 report focuses on the interconnection of distributed energy resources (DERs) to the electric distribution system in Puerto Rico. This report is intended to familiarize the reader with Puerto Rico's distribution infrastructure and operational practices and procedures that are relevant to DER interconnection. The report also provides considerations for streamlining the interconnection process given the expected increase in deployments resulting from Puerto Rico's renewable portfolio standard (RPS) goal of 100% renewables by 2050. Accordingly, the report identifies considerations and concerns associated with the increase in intermittent generation, strategies for DER interconnection best practices, and the potential use of the latest technological solutions identified in the latest revision of the Institute of Electrical and Electronics Engineers (IEEE) 1547-2018 interconnection standard.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2023

Queued Up: Characteristics of Power Plants Seeking Transmission Interconnection As of the End of 2022 [Slides]

Proposed large-scale electric generation and storage projects must apply for interconnection to the bulk power system via interconnection queues. While most projects that apply for interconnection are not subsequently built, data from these queues nonetheless provide a general indicator for mid-term trends in developer interest. Berkeley Lab compiled and analyzed data from all seven ISOs/RTOs in concert with 35 non-ISO utilities, representing an estimated 85% of all U.S. electricity load. We include all "active" projects in these generation interconnection queues through the end of 2022, as well as data on "operational" and "withdrawn" projects where those data are available. We find that the amount of new electric capacity in these queues is growing dramatically, with over 2,000 gigawatts (GW) of total generation and storage capacity now seeking connection to the grid (over 95% of which is for zero-carbon resources like solar, wind, and battery storage). Solar (947 GW) and battery storage (~680 GW) are – by far – the fastest growing resources in the queues; combined they accounted for over 80% of new capacity entering the queues in 2022. Substantial wind (300 GW) capacity is also seeking interconnection, 38% of which is for offshore projects (113 GW). In total, about 1,250 GW of zero-carbon generating capacity is currently seeking transmission access, as is 82 GW of natural gas capacity. Hybrids projects (co-locating multiple generation and/or storage types) comprise a large – and increasing – share of proposed projects, particularly in CAISO and the non-ISO West. 457 GW of solar hybrids (primarily solar+battery) and 24 GW of wind hybrids are currently active in the queues; over half of battery storage in the queues is paired with generation. However, much of this proposed capacity will be withdrawn from the queues and not built. Among a subset of queues for which data are available, only 21% of the projects (and 14% of capacity) seeking connection from 2000 to 2017 have been built as of the end of 2022. Additionally, interconnection wait times are on the rise: The typical duration from connection request to commercial operation increased from <2 years for projects built in 2000-2007 to nearly 4 years for those built in 2018-2022 (with a median of 5 years for projects built in 2022).

24 POWER TRANSMISSION AND DISTRIBUTION↗
NASA NTRS1982

Interconnect fatigue design for terrestrial photovoltaic modules

The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.

Mon, G. R.↗
NASA NTRS1994

Reconfigurable optical interconnections via dynamic computer-generated holograms

A system is proposed for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for largescale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

Liu, Hua-Kuang↗
NASA NTRS1996

Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

Liu, Hua-Kuang↗
NASA NTRS2004

Fabrication of a novel gigabit/second free-space optical interconnect - photodetector characterization and testing and system development

The time when computing power is limited by the copper wire inherent in the computer system and not the speed of the microprocessor is rapidly approaching. With constant advances in computer technology, many researchers believe that in only a few years, optical interconnects will begin to replace copper wires in your Central Processing Unit (CPU). On a more macroscopic scale, the telecommunications industry has already made the switch to optical data transmission as, to date, fiber optic technology is the only reasonable method of reliable, long range data transmission. Within the span of a decade, we will see optical technologies move from the macroscopic world of the telecommunications industry to the microscopic world of the computer chip. Already, the communications industry is marketing commercially available optical links to connect two personal computers, thereby eliminating the need for standard and comparatively slow wired and wireless Ethernet transfers and greatly increasing the distance the computers can be separated. As processing demands continue to increase, the realm of optical communications will continue to move closer to the microprocessor and quite possibly onto the microprocessor itself. A day may come when copper connections are used only to supply power, not transfer data. This summer s work marks some of the beginning stages of a 5 to 10 year, long-term research project to create and study a free-space, 1 Gigabit/sec optical interconnect. The research will result in a novel fabricated, chip-to-chip interconnect consisting of a Vertical Cavity Surface Emitting Laser (VCSEL) Diode linked through free space to a Metal- Semiconductor-Metal (MSM) Photodetector with the possible integration of microlenses for signal focusing and Micro-Electromechanical Systems (MEMS) devices for optical signal steering. The advantages, disadvantages, and practicality of incorporating flip-chip mounting technologies will also be addressed. My work began with the design and construction of a test setup for the experiment and then appropriate characterization of the test system. Specifically, I am involved in the characterization of a commercially available 1550nm wavelength, 5mW diode laser and a study of its modulation bandwidth. Commercially produced photodetectors as well as the incorporation of microwave technology, in the form of RF input and output, are used in the characterization procedure. The next stage involves the use of a probe station and network analyzer to characterize and test a series of photodetectors fabricated on a 2 inch, Indium Gallium Arsenide (InGaAs) wafer in the Branch s microlithography lab. Other project responsibilities include, but are not limited to the incorporation of a transimpedance amplifier to the photodetector circuit; a study of VCSEL technology; bit error rate analysis of an optical interconnect system; and analysis of free space divergence of the VCSEL, optical path length of the interconnect; and any other pertinent optical properties of the one gigabit per second interconnect for fabrication and testing.

Savich, Gregory R.↗
NASA NTRS2001

Zee electrical interconnect

An interconnect, having some length, that reliably connects two conductors separated by the length of the interconnect when the connection is made but in which one length if unstressed would change relative to the other in operation. The interconnect comprises a base element an intermediate element and a top element. Each element is rectangular and formed of a conducting material and has opposed ends. The elements are arranged in a generally Z-shape with the base element having one end adapted to be connected to one conductor. The top element has one end adapted to be connected to another conductor and the intermediate element has its ends disposed against the other end of the base and the top element. Brazes mechanically and electrically interconnect the intermediate element to the base and the top elements proximate the corresponding ends of the elements. When the respective ends of the base and the top elements are connected to the conductors, an electrical connection is formed therebetween, and when the conductors are relatively moved or the interconnect elements change length the elements accommodate the changes and the associated compression and tension forces in such a way that the interconnect does not mechanically fatigue.

Rust, Thomas M.↗
DOE OSTI2022

High-voltage push to mate electrical interconnect

A high-voltage self-aligning push to mate electrical interconnect device is provided. The electrical interconnect device includes a housing with a mating end and a receiving end. The interconnect also includes an insulator bushing configured to be affixed to the receiving end of the housing. The interconnect also includes a center pin disposed within the housing. The center pin extends from the mating end of the housing to the receiving end of the housing. The interconnect also includes a connector socket disposed within the insulator bushing and which is in electrical communication with the center pin. The interconnect also includes an alignment sleeve including a chamfered mating funnel defining a void configured to accept and surround the housing and at least a portion of insulator bushing.

Martinez, David K.↗
DOE OSTI2022

Supervised Learning for Distribution Secondary Systems Modeling: Improving Solar Interconnection Processes

The current interconnection process and hosting capacity analysis for distributed energy resources (DERs), such as photovoltaics (PV) and battery energy storage systems, are based on analyzing grid network constraints (voltage and thermal) using only medium-voltage distribution network models. This is because most utilities do not have secondary low-voltage system models that connect service transformers and residential customers. This is important because in many cases the main impact of interconnecting DERs could occur on the low-voltage distribution systems. This paper proposes a supervised learning method to approximate local secondary models to improve the interconnection process. The proposed supervised learning method includes a decision tree model that predicts the secondary topology and a logistic regression model that predicts conductor types. The case studies demonstrate the benefits of including secondary low-voltage circuits in the interconnection process. We report the proposed modeling methodology is readily scalable and thus can reduce the cost and effort of PV interconnection for the industry and stakeholders.

14 SOLAR ENERGY↗
DOE OSTI2020

Nanometal-Interconnected Carbon Conductors (NICCS) for Advanced Electric Machines (RIT Final Technical Report)

Recent advancements in carbon nanotube (CNT) research have enabled lightweight, conductive wires as a transformative technology. Metal-carbon nanotube (CNT) hybrid conductors aim to combine the high conductivity of traditional metals with the low mass and temperature coefficient of resistance (TCR) of carbon nanotubes. The high conductivity of copper makes it a promising candidate to combine with CNTs in a hybrid structure, but there is limited physical and electrical interaction between copper and CNTs. The use of an interfacial layer offers one method of improving the interconnection of a Cu-CNT hybrid conductor. Over the course of this grant, a joule heating-driven chemical vapor deposition (CVD) technique was developed to deposit nanometal seeds throughout a porous, low-density (0.12 g/cm 3 , ~10 tex or mg/m) CNT roving template. Modification of the applied current to the CNT roving allows for the tuning of depositions towards either hot-spot site-specificity or overall uniformity. The effects of temperature, pressure, precursor mass, and the interval of applied current were investigated, demonstrating nanometal depositions ranging from less than 5 % w/w to over 85 % w/w. The versatility of CVD allows for a wide variety of metals to be deposited including copper, titanium, nickel, silver, tungsten, palladium, platinum, ruthenium, rhodium, and iridium. One preferred demonstration involved using platinum depositions to improve the electrical properties of metal-seeded CNTs across all mass loadings studied. Moreover, when the metal-seeded CNT wires were electroplated with copper, densified, and annealed under hydrogen/argon; the result was a Cu-CNT hybrid conductor with the highest conductivities reported to date. The good interconnection of the metal and CNT portions results in a stable conductor. An electrical conductivity of 16-20 MS/m was achieved for multiple Cu-CNT hybrid conductors at 150 °C, which exceeds the program goal for conductivity of greater than 15 MS/m for a 1 m long CNT wire. Overall, the research outcomes from the project showed improvements in CNT wire fabrication from roll-to-roll CVD grown carbon nanotube wires using nanometal interconnects to bridge CNT-to-CNT junctions, thus mitigating network contact resistances. Advanced nanometal interconnected carbon conductors (NICCs) were developed as a means to achieve novel light-weight wiring appropriate for applications that require the conductivity of metallic (i.e., Cu, Al, etc.) wires at elevated temperatures. High conductivity, low TCR electrical conductors such as the nanometal interconnected Cu-CNT hybrids have numerous future applications towards high efficiency motors, generators, and transformers. Specifically, the advanced wires have the ability to operate at lower resistance during conditions for standard electric motors at 150 °C, which would improve the electrical efficiency while lowering energy needs.

36 MATERIALS SCIENCE↗