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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1980

High temperature solar thermal technology

Some advanced technology concepts under development for high-temperature solar thermal energy systems to achieve significant energy cost reductions and performance gains and thus promote the application of solar thermal power technology are presented. Consideration is given to the objectives, current efforts and recent test and analysis results in the development of high-temperature (950-1650 C) ceramic receivers, thermal storage module checker stoves, and the use of reversible chemical reactions to transport collected solar energy. It is pointed out that the analysis and testing of such components will accelerate the commercial deployment of solar energy.

Leibowitz, L. P.↗
NASA NTRS2016

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗
DOE OSTI2025

Investigation of heat pump technologies for high-temperature applications above 250 °C

This paper examines heat pump (HP) technologies to achieve heat supply temperatures above 250 °C, referred to as ultra-high-temperature heat pump (UHTHP). UHTHP, as a low-carbon heat delivery and heat augmentation technology, can offer an alternative to traditional combustion heating for decarbonizing high-temperature industrial processes. However, the heat supply temperature of over 250 °C surpasses the temperature range typically covered in the high-temperature HP literature and existing capabilities of commercial HP systems. This paper reviews HP technologies with the potential to evolve into UHTHP. Additionally, UHTHP studies in the literature are analyzed to compare the pros, cons, and technical potentials of various HPs using different thermodynamic cycles and fluids. Furthermore, we then pinpoint the technical gaps and challenges that have hindered widespread adoption of UHTHP in industry, explore potential improvements and solutions, and discuss the feasibility. Current efforts aim to lay the ground for future research, development, and commercial deployment for UHTHP.

32 - ENERGY CONSERVATION, CONSUMPTION, AND UTILIZA↗
NASA NTRS2003

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗
NASA NTRS1998

Affordable, Robust Ceramic Joining Technology (ARCJoinT) for High Temperature Applications

Ceramic joining is recognized as one of the enabling technologies for the successful utilization of silicon carbide-based monolithic ceramic and fiber reinforced composite components in a number of demanding and high temperature applications in aerospace and ground-based systems. An affordable, robust ceramic joining technology (ARCJoinT) for joining of silicon carbide-based ceramics and fiber reinforced composites has been developed. This technique is capable of producing joints with tailorable thickness and composition. A wide variety of silicon carbide-based ceramics and composites, in different shapes and sizes, have been joined using this technique. The room and high temperature mechanical properties and fractography of ceramic joints have been reported. In monolithic silicon carbide ceramics, these joints maintain their mechanical strength up to 1350 C in air. There is no change in the mechanical strength of joints in silicon carbide matrix composites up to 1200 C in air. In composites, simple butt joints yield only about 20% of the ultimate strength of the parent materials. This technology is suitable for the joining of large and complex shaped ceramic and composite components, and with certain modifications, can be applied to repair of ceramic components damaged in service.

Singh, M.↗
NASA NTRS1984

High-Temperature Lubricants

In the early 1980's, Lewis Research Center began a program to develop high-temperature lubricants for use on future aircraft flying at three or more times the speed of sound, which can result in vehicle skin temperatures as high as 1,600 degrees Fahrenheit. A material that emerged from this research is a plasma-sprayed, self-lubricating metal- glass-fluoride coating able to reduce oxidation at very high temperatures. Technology is now in commercial use under the trade name Surf-Kote C-800, marketed by Hohman Plating and Manufacturing Inc. and manufactured under a patent license from NASA. Among its uses are lubrication for sliding contact bearings, shaft seals for turbopumps, piston rings for high performance compressors and hot glass processing machinery; it is also widely used in missile and space applications.

Source record↗
NASA NTRS1995

Integrated Cryogenic Satellite Communications Cross-Link Receiver Experiment

An experiment has been devised which will validate, in space, a miniature, high-performance receiver. The receiver blends three complementary technologies; high temperature superconductivity (HTS), pseudomorphic high electron mobility transistor (PHEMT) monolithic microwave integrated circuits (MMIC), and a miniature pulse tube cryogenic cooler. Specifically, an HTS band pass filter, InP MMIC low noise amplifier, HTS-sapphire resonator stabilized local oscillator (LO), and a miniature pulse tube cooler will be integrated into a complete 20 GHz receiver downconverter. This cooled downconverter will be interfaced with customized signal processing electronics and integrated onto the space shuttle's 'HitchHiker' carrier. A pseudorandom data sequence will be transmitted to the receiver, which is in low Earth orbit (LEO), via the Advanced Communication Technology Satellite (ACTS) on a 20 GHz carrier. The modulation format is QPSK and the data rate is 2.048 Mbps. The bit error rate (BER) will be measured in situ. The receiver is also equipped with a radiometer mode so that experiment success is not totally contingent upon the BER measurement. In this mode, the receiver uses the Earth and deep space as a hot and cold calibration source, respectively. The experiment closely simulates an actual cross-link scenario. Since the receiver performance depends on channel conditions, its true characteristics would be masked in a terrestrial measurement by atmospheric absorption and background radiation. Furthermore, the receiver's performance depends on its physical temperature, which is a sensitive function of platform environment, thermal design, and cryocooler performance. This empirical data is important for building confidence in the technology.

Romanofsky, R. R.↗
NASA NTRS1988

Dynamic thermophysical measurements in space

The objective is to develop an accurate dynamic technique which, in a microgravity environment, would enable performance of thermophysical measurements on high-melting-point electrically conducting substances in their liquid state. In spite of the critical need in high temperature technologies related to spacecraft, nuclear reactors, effects of power laser radiation, and in validating theoretical models in related areas, no accurate data on thermophysical properties exist. This is primarily due to the limitation of the reliable steady-state techniques to temperatures below about 2000 K, and the accurate millisecond-resolution pulse heating techniques to the solid state of the specimen. The limitation of the millisecond-resolution techniques to temperatures below the melting point stems from the fact that the specimen collapses due to the gravitational force once it starts to melt. The rationale for the use of the microgravity is that by performing the dynamic experiments in a microgravity environment the specimen will retain its geometry, and thus it will be possible to extend the accurate thermophysical measurements to temperatures above the melting point of high-melting-point substances.

Cezairliyan, Ared↗
DOE OSTI2026

Oxygen Effects and Selective Oxidation of Group IV Alloying Additions in Group V-Based Refractory Multi-principal Element Alloys

Refractory multi-principal element alloys (RMPEAs) hold significant potential for advancing ultra-high-temperature technologies due to their remarkable strength retention under these conditions. However, the beneficial effects of alloying on microstructural evolution and mechanical properties are often obscured by the presence of interstitial alloying elements. The intricate interactions between substitutional alloying elements of Groups IV, V, and VI and interstitial content, whether intentional or incidental, remain poorly understood. In this study, we investigate the impact of dissolved oxygen on the microstructural evolution and stability of RMPEAs primarily composed of Group V elements, Nb and V, along with Group IV elements Ti, Zr, and Hf. We show that the strong affinity of oxygen for Group IV elements Zr and Hf leads to the internal precipitation of oxides during heat treatment, which competes with the homogenization of the as-cast dendritic microstructure. Here, we demonstrate that careful control and design of oxygen content and Group IV alloying additions are essential to minimize micro-segregation and prevent the detrimental precipitation of internal oxides. To address these challenges, we propose employing non-equilibrium solidification calculations to predict and optimize as-cast solidification structures, thereby reducing the reliance on homogenization processes.

Alloy design↗
DOE OSTI2024

Heterogeneous Integration Technologies for High-temperature, High-density, Low-profile Power Modules of Wide Bandgap Devices in Electric Drive Applications (Final Technical Report)

The goal of this project is to develop packaging technologies for making high-temperature, high-density, and low-profile wide-bandgap (WBG) power electronics modules for electric drives. These modules are aimed at enabling the DOE’s University Consortium to reach its 2025 inverter targets of ≥ 100 kW/L and ≤ 2.7 $/kW. The specific objectives are to: design and fabricate SiC half-bridge power modules with double-sided cooling and parasitic inductances < 5 nH, heat flux density > 400 W/cm 2 , and working junction temperature of 200 o C; design, fabricate, and deliver a gate driver with double-sided cooled modules for the construction of a 100 kW/L inverter at Oak Ridge National Lab; and design and prototype intelligent gate drivers with integrated current sensor and a low-profile DC-DC power supply with air-core transformer for testing power modules at 200 o C junction temperature. We followed an iterative technical approach of design, simulation, fabrication, and testing of various versions of modules, current sensors, and power supply. The state-of-the-art silicon carbide devices rated at 1.2 kV and 149 A were packaged by sintered-silver bonding on an aluminum nitride direct-bond-copper substrate for high thermal conductivity, high working temperature, and high joint reliability. Porous silver posts were used to interconnect the device’s source pads to the other direct-bond-copper substrate for low mechanical stresses, ease of manufacturing, and double-sided cooling. A current sensor based on package parasitic inductance was developed to measure switching current. A dynamic feedback scheme was developed to compensate the effect of parasitic resistance and temperature variation. A constant-current class-E dc-dc converter with air-core transformer was developed. Air-core transformer was used due to the unavailability of magnetic core at high temperatures. Gate driver and power supply were integrated with the double-side cooled, high temperature SiC power modules for testing the modules at 200 o C junction temperature. Double-pulse and continuous testing of the integrated technologies validated the design and fabrication of the three component technologies. Throughout the project, we overcame the challenge for design verification caused by low prototyping yield, which then helped train the graduate students, the future workforce, to learn the engineering know-how for low-cost manufacturing of reliable products. Below is a summary of the major accomplishments of this project: development of a prototyping process for fabricating double-side cooled (1200 V, 149 A) SiC phase-leg modules capable of working to 200 o C Tj; simulation and experimental verification of the improvement of thermo-mechanical reliability of the double-side cooled SiC phase-leg module by using rigid encapsulant; design and experimental validation of a current sensor based on package parasitic inductance and a compensation solution for eliminating the effect of parasitic resistance; design and experimental validation of a low-profile power supply with six-output air-core transformer for gate driver; functional demonstration of a SiC phase-leg module integrated with its gate driver, current sensor, and an air-core power supply at 200 o C Tj in a double-pulse switching test setup and Buck converter continuous test setup; successful completion of six PhD and two MS students who are or will work at Apple Inc., Tesla Inc., Wolfspeed Inc., Microchip Inc., Monolithic Power Systems Inc., and LG Magna Inc.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
NASA NTRS1966

Modified thermocouple is effective from minus 250 deg to 5000 deg F

Modified, commercially available thermocouple which measures the temperature of a spacecraft heat shield, is capable of continuous measurement in the range of minus 250 deg to 5000 deg F. The modified thermocouples may be used inside metal treating furnaces in high temperature technology, and in certain corrosive environments.

Moen, W. K.↗
NASA NTRS1983

Burden for manufacture of ceramic material

A Soviet invention is discussed. The invention refers to ceramic materials which can be obtained by methods of powder metallurgy and can be used in high temperature technology.

Chechenya, T. V.↗
NASA NTRS1983

High-temperature optically activated GaAs power switching for aircraft digital electronic control

Gallium arsenide high-temperature devices were fabricated and assembled into an optically activated pulse-width-modulated power control for a torque motor typical of the kinds used in jet engine actuators. A bipolar heterojunction phototransistor with gallium aluminum arsenide emitter/window, a gallium arsenide junction field-effect power transistor and a gallium arsenide transient protection diode were designed and fabricated. A high-temperature fiber optic/phototransistor coupling scheme was implemented. The devices assembled into the demonstrator were successfully tested at 250 C, proving the feasibility of actuator-located switching of control power using optical signals transmitted by fibers. Assessments of the efficiency and technical merits were made for extension of this high-temperature technology to local conversion of optical power to electrical power and its control at levels useful for driving actuators. Optical power sources included in the comparisons were an infrared light-emitting diode, an injection laser diode, tungsten-halogen lamps and arc lamps. Optical-to-electrical power conversion was limited to photovoltaics located at the actuator. Impedance matching of the photovoltaic array to the load was considered over the full temperature range, -55 C to 260 C. Loss of photovoltaic efficiency at higher temperatures was taken into account. Serious losses in efficiency are: (1) in the optical source and the cooling which they may require in the assumed 125 C ambient, (2) in the decreased conversion efficiency of the gallium arsenide photovoltaic at 260 C, and (3) in impedance matching. Practical systems require improvements in these areas.

Berak, J. M.↗
NASA NTRS1985

Polyimide composites: Application histories

Advanced composite hardware exposed to thermal environments above 127 C (260 F) must be fabricated from materials having resin matrices whose thermal/moisture resistance is superior to that of conventional epoxy-matrix systems. A family of polyimide resins has evolved in the last 10 years that exhibits the thermal-oxidative stability required for high-temperature technology applications. The weight and structural benefits for organic-matrix composites can now be extended by designers and materials engineers to include structures exposed to 316 F (600 F). Polyimide composite materials are now commercially available that can replace metallic or epoxy composite structures in a wide range of aerospace applications.

Poveromo, L. M.↗
NASA NTRS1994

High-Temperature Rocket Engine

Two rocket engines that operate at temperature of 2,500 K designed to provide thrust for station-keeping adjustments of geosynchronous satellites, for raising and lowering orbits, and for changing orbital planes. Also useful as final propulsion stages of launch vehicles delivering small satellites to low orbits around Earth. With further development, engines used on planetary exploration missions for orbital maneuvers. High-temperature technology of engines adaptable to gas-turbine combustors, ramjets, scramjets, and hot components of many energy-conversion systems.

Schneider, Steven J.↗
NASA NTRSDate not supplied

An Overview of High Temperature Venus Surface Lander and Smart Systems Technologies

The extreme surface conditions of Venus, including high temperature/pressure and reactive chemistry, have previously limited the lifetime of surface missions to ~2 hours. Recent advances in high temperature technologies suggest the possibility of extended duration missions on the Venus surface. This presentation gives a brief overview of a range of high temperature technologies to enable a possible extended duration Venus surface mission, as well as an overview of the motivation and challenges of Venus surface exploration. The technology development under the Long-Lived In Situ Solar System Explorer (LLISSE) project is aimed towards developing a full lander system operational for 60 days on the Venus surface and included a power source, electronics, communications, sensors, and the structure, each at a different level of maturity. This presentation briefly describes these and other lander system technologies, their relative level of maturity, and planned future development for Venus surface exploration. Relevance to Aeronautic applications is briefly discussed.

Venus high temperature technologies vehicle health↗
NASA NTRS1992

Overview of NASA's advanced high temperature engine materials technology program

NASA's 'HITEMP' program has been charged with development of propulsion systems technologies for next-generation civil and military aircraft, stressing high-temperature/low-density composites. These encompass polymer-matrix composites for fans, ducts, and compressor cases, and intermetallic and metallic alloy matrix composites for applications in turbine disks, blades, and vanes, and ceramic matrix composites for combustors and turbines. An overview is presented of program concerns and achievements to date.

Ginty, Carol A.↗