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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

A Motor Drive Electronics Assembly for Mars Curiosity Rover: An Example of Assembly Qualification for Extreme Environments

This paper describes the technology development and infusion of a motor drive electronics assembly for Mars Curiosity Rover under space extreme environments. The technology evaluation and qualification as well as space qualification of the assembly are detailed and summarized. Because of the uncertainty of the technologies operating under the extreme space environments and that a high level reliability was required for this assembly application, both component and assembly board level qualifications were performed.

Kolawa, Elizabeth↗
NASA NTRS2008

High Temperature Electronics for Intelligent Harsh Environment Sensors

The development of intelligent instrumentation systems is of high interest in both public and private sectors. In order to obtain this ideal in extreme environments (i.e., high temperature, extreme vibration, harsh chemical media, and high radiation), both sensors and electronics must be developed concurrently in order that the entire system will survive for extended periods of time. The semiconductor silicon carbide (SiC) has been studied for electronic and sensing applications in extreme environment that is beyond the capability of conventional semiconductors such as silicon. The advantages of SiC over conventional materials include its near inert chemistry, superior thermomechanical properties in harsh environments, and electronic properties that include high breakdown voltage and wide bandgap. An overview of SiC sensors and electronics work ongoing at NASA Glenn Research Center (NASA GRC) will be presented. The main focus will be two technologies currently being investigated: 1) harsh environment SiC pressure transducers and 2) high temperature SiC electronics. Work highlighted will include the design, fabrication, and application of SiC sensors and electronics, with recent advancements in state-of-the-art discussed as well. These combined technologies are studied for the goal of developing advanced capabilities for measurement and control of aeropropulsion systems, as well as enhancing tools for exploration systems.

Evans, Laura J.↗
NASA NTRS2007

Silicon Carbide Sensors and Electronics for Harsh Environment Applications

Silicon carbide (SiC) semiconductor has been studied for electronic and sensing applications in extreme environment (high temperature, extreme vibration, harsh chemical media, and high radiation) that is beyond the capability of conventional semiconductors such as silicon. This is due to its near inert chemistry, superior thermomechanical and electronic properties that include high breakdown voltage and wide bandgap. An overview of SiC sensors and electronics work ongoing at NASA Glenn Research Center (NASA GRC) will be presented. The main focus will be two technologies currently being investigated: 1) harsh environment SiC pressure transducers and 2) high temperature SiC electronics. Work highlighted will include the design, fabrication, and application of SiC sensors and electronics, with recent advancements in state-of-the-art discussed as well. These combined technologies are studied for the goal of developing advanced capabilities for measurement and control of aeropropulsion systems, as well as enhancing tools for exploration systems.

Evans, Laura J.↗
DOE OSTI2025

Proton radiation effects in indium oxide using cascade molecular dynamics simulations

Metal oxide (MO) semiconductors, characterized by their wide band gaps and notable charge transport properties, are promising candidates for electronic applications in extreme environments, including near-Earth space. However, atomistic simulations of radiation–matter interactions in MOs remain challenging due to the limitations of existing interatomic potentials, which often fail to capture both the short-range repulsive forces essential for radiation damage modeling and the long-range electrostatic effects governing defect evolution. In this work, we develop a customized interatomic potential tailored for radiation damage simulations in indium oxide (In 2 O 3 ) as a model system, a representative MO material. Our potential integrates the Ziegler-Biersack-Littmark potential to accurately describe short-range interactions with Buckingham and Coulombic potentials to account for long-range forces. We perform molecular dynamics simulations of low-energy proton irradiation using this custom potential. We employ the primary knock-on atom (PKA) cascade method to study atomic displacements and primary defect formation. Simulations were conducted for 1 keV proton irradiation in four randomly chosen directions, and PKA-driven defect analyses at 5, 10, and 15 keV to examine the effects of direction and energy level on damage generation. Our results provide insight into the impact of irradiation direction and energy level on the cascade evolution and defect formation mechanisms.

Atomistic simulations↗
NASA NTRS2007

High-Performance, Radiation-Hardened Electronics for Space Environments

The Radiation Hardened Electronics for Space Environments (RHESE) project endeavors to advance the current state-of-the-art in high-performance, radiation-hardened electronics and processors, ensuring successful performance of space systems required to operate within extreme radiation and temperature environments. Because RHESE is a project within the Exploration Technology Development Program (ETDP), RHESE's primary customers will be the human and robotic missions being developed by NASA's Exploration Systems Mission Directorate (ESMD) in partial fulfillment of the Vision for Space Exploration. Benefits are also anticipated for NASA's science missions to planetary and deep-space destinations. As a technology development effort, RHESE provides a broad-scoped, full spectrum of approaches to environmentally harden space electronics, including new materials, advanced design processes, reconfigurable hardware techniques, and software modeling of the radiation environment. The RHESE sub-project tasks are: SelfReconfigurable Electronics for Extreme Environments, Radiation Effects Predictive Modeling, Radiation Hardened Memory, Single Event Effects (SEE) Immune Reconfigurable Field Programmable Gate Array (FPGA) (SIRF), Radiation Hardening by Software, Radiation Hardened High Performance Processors (HPP), Reconfigurable Computing, Low Temperature Tolerant MEMS by Design, and Silicon-Germanium (SiGe) Integrated Electronics for Extreme Environments. These nine sub-project tasks are managed by technical leads as located across five different NASA field centers, including Ames Research Center, Goddard Space Flight Center, the Jet Propulsion Laboratory, Langley Research Center, and Marshall Space Flight Center. The overall RHESE integrated project management responsibility resides with NASA's Marshall Space Flight Center (MSFC). Initial technology development emphasis within RHESE focuses on the hardening of Field Programmable Gate Arrays (FPGA)s and Field Programmable Analog Arrays (FPAA)s for use in reconfigurable architectures. As these component/chip level technologies mature, the RHESE project emphasis shifts to focus on efforts encompassing total processor hardening techniques and board-level electronic reconfiguration techniques featuring spare and interface modularity. This phased approach to distributing emphasis between technology developments provides hardened FPGA/FPAAs for early mission infusion, then migrates to hardened, board-level, high speed processors with associated memory elements and high density storage for the longer duration missions encountered for Lunar Outpost and Mars Exploration occurring later in the Constellation schedule.

Keys, Andrew S.↗
DOE OSTI2025

Distinctive features of structural evolution and thermodynamic response in wide-bandgap semiconductors driven by intense electronic excitation

Radiation-tolerant material selection requires balancing lattice rigidity, defect dynamics, and electronic stability, as shown by covalent SiC outperforming ionic Ga 2 O 3 and GaN under extreme environments. Responding to intense electronic excitation, irradiation-driven phase segregation (β → δ/κ in Ga 2 O 3 ) and core–shell track (disordered structure in GaN), accompanied by elemental redistribution, contrastingly, exceptional radiation tolerance manifested by comparatively minimal lattice distortion (0.17 % strain variation) was demonstrated in SiC. These differential responses are primarily attributed to two fundamental mechanisms: (i) thermodynamic driving forces governing defect migration and phase separation, and (ii) the synergistic effects of robust covalent bonding composition coupled with efficient defect recombination processes. Here, the stronger electron–phonon (e-ph) coupling in Ga 2 O 3 (4.34 × 1018 W m −3 K −1 ) and GaN (3.55 × 10 18 W m −3 K −1 ) enhances lattice energy deposition, triggering thermal spikes (ΔT ≫ T m ) and structural transition behaviors, whereas weaker e-ph coupling in SiC (3.69 × 10 18 W m −3 K −1 ), relatively high thermodynamic parameters and efficient energy dissipation suppress thermal spikes to maintaining lattice integrity. The photoresponse degradation driven by enhanced radiative recombination is dominant in N-doped SiC, while V-doped systems achieve defect-mediated photoconduction optimization characterized by abrupt current transitions, matching fluorescence yield evolutions, and directly connecting defect engineering to optoelectronic performance.

Intense electronic excitation↗
NASA NTRS2022

Cold Survivable Electronics Motor Control Law Implementation

For the last seven years JPL has been developing motor control electronics for use on future missions to extreme environments such as Europa and Mars. The packaging technology developed will allow the electronics to survive the extremes seen on the surface. This packaging technology allows us to package everything to control a number of motors on a single card including the closed loop control. In order to improve the performance of the motor control we have developed FPGA code to close the position, velocity and current control loops of the motor controller. This code allowed for a significant improvement in loop rate allowing the control of the motors to be more accurate. This allows for more accurate control of descent engines, more precise control of robotic arm motors. In this paper we will present the design of the control algorithm, the performance of the sensors and the test results of the resulting system.

Cheng, Ben↗
NASA NTRSDate not supplied

800 °C Demonstrated kHz SiC IC Electronics and Pressure Sensors as Technical Foundation for Realizing MHz DARPA HOTS Goals

The HOTS program will develop a technology for high-bandwidth, high-dynamic-range sensing at high temperature. Performance will be validated through the development and demonstration of a pressure sensor module (i.e., integrated transducer and signal-conditioning microelectronics) achieving the following performance goals: NASA Glenn has unique technology experience in extreme environment pressure sensors & IC electronics, including at 800 °C in air, providing significant risk reduction in meeting DARPA HOTS goals. Appropriate partnership and tech transfer should accelerate realization of DARPA HOTS hard technical challenges.

SiC pressure sensor electronics high temperature↗
NASA NTRS2008

Evaluation of Silicon-on-Insulator HTOP-01 Operational Amplifier for Wide Temperature Operation

Electronics capable of operation under extreme temperatures are required in many of NASA space exploration missions. Aerospace and military applications, as well as some terrestrial industries constitute environments where electronic systems are anticipated to be exposed to extreme temperatures and wide-range thermal swings. Electronics that are able to withstand and operate efficiently in such harsh environments would simplify, if not eliminate, traditional thermal control elements and their associated structures for proper ambient operation. As a result, overall system mass would be reduced, design would be simplified, and reliability would be improved. Electronic parts that are built utilizing silicon-on-insulator (SOI) technology are known to offer better radiation-tolerance compared to their conventional silicon counterparts, provide faster switching, and consume less power. They also exhibit reduced leakage current and, thus, they are often tailored for high temperature operation. These attributes make SOI-based devices suitable for use in harsh environments where extreme temperatures and wide thermal swings are anticipated. A new operational amplifier, based on silicon-on-insulator technology and geared for high temperature well-logging applications, was recently introduced by Honeywell Corporation. This HTOP-01 dual precision operational amplifier is a low power device, operates on a single supply, and has an internal oscillator and an external clocking option [1]. It is rated for operation from -55 C to +225 C with a maximum output current capability of 50 mA. The amplifier chip is designed as a 14-pin, hermetically-sealed device in a ceramic package. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗
NASA NTRS2017

Automation Rover for Extreme Environments

Almost 2,300 years ago the ancient Greeks built the Antikythera automaton. This purely mechanical computer accurately predicted past and future astronomical events long before electronics existed1. Automata have been credibly used for hundreds of years as computers, art pieces, and clocks. However, in the past several decades automata have become less popular as the capabilities of electronics increased, leaving them an unexplored solution for robotic spacecraft. The Automaton Rover for Extreme Environments (AREE) proposes an exciting paradigm shift from electronics to a fully mechanical system, enabling longitudinal exploration of the most extreme environments within the solar system.

automata↗
NASA NTRS2007

RADECS Short Course Session I: The Space Radiation Environment

The presented slides and accompanying paper focus on radiation in the space environment. Since space exploration has begun it has become evident that the space environment is a highly aggressive medium. Beyond the natural protection provided by the Earth's atmosphere, various types of radiation can be encountered. Their characteristics (energy and nature), origins and distributions in space are extremely variable. This environment degrades electronic systems and on-board equipment in particular and creates radiobiological hazards during manned space flights. Based on several years of space exploration, a detailed analysis of the problems on satellites shows that the part due to the space environment is not negligible. It appears that the malfunctions are due to problems linked to the space environment, electronic problems, design problems, quality problems, other issues, and unexplained reasons. The space environment is largely responsible for about 20% of the anomalies occurring on satellites and a better knowledge of that environment could only increase the average lifetime of space vehicles. This naturally leads to a detailed study of the space environment and of the effects that it induces on space vehicles and astronauts. Sources of radiation in the space environment are discussed here and include the solar activity cycle, galactic cosmic rays, solar particle events, and Earth radiation belts. Future challenges for space radiation environment models are briefly addressed.

Xapsos, Michael↗
NASA NTRSDate not supplied

NASA LSII Lunar Simulant Project

Introduction: America has entered a new era of exploration. NASA’s Artemis program will lead humanity forward to the Moon and prepare us for the next giant leap, the exploration of Mars [1]. To champion technologies needed to live on and explore the Moon, NASA’s Space Technology Mission Directorate (STMD) established the Lunar Surface Innovation Initiative (LSII)[2].LSII's technology development portfolio includes: Utilizing the Moon’s resources; Establishing sustainable surface power; Building machinery and electronics that work in extreme environments, like super-chilly permanently shadowed craters; Mitigating lunar dust; Carrying out surface excavation, manufacturing and construction duties; and Extreme access which includes navigating and exploring the surface/subsurface. To support the development and testing of these technologies, LSII created the lunar simulant project, to create and/or acquire low-, medium-and high-fidelity lunar simulants to match the needs of STMD projects at all levels of technology readiness levels (TRL), as well as other NASA programs. There is not one bulk lunar simulant that will satisfy the needs of all projects. NASA's Approach to Simulants: Just as LSII's activities are being implemented through a combination of unique NASA work and public-private partnerships, NASA will work with commercial simulant providers to acquire simulants that meet NASA's needs. If warranted, NASA will develop simulants using government agencies, as was done with the NASA/USGS Lunar Highlands Type (NU-LHT)series of lunar simulants [3].NASA is also collaborating with the Johns Hopkins University Applied Physics Laboratory(JHUAPL) Lunar Surface Innovation Consortium (LSIC) in the development and characterization of lunar simulants [4]. Within NASA, a small team (< 10 people) is coordinating simulant activities across the agency, with team members located at several NASA centers. The overall objective of the project is to procure lunar simulants in sufficient amounts for earth-based testing of subsystems and systems in a variety of environments (i.e., laboratory, high-bay, thermal-vacuum chambers), required for Artemis missions to the Moon, as well as other missions carrying NASA lunar payloads, such as the Commercial Lunar Payload Services (CLPS)program [5]. Lunar Highlands Simulant: NASA's Artemis Program is targeting the lunar south pole region for initial human missions and the Artemis Base Camp. Hence, the LSII lunar simulant project is currently focusing on the mineralogy and properties of lunar highlands regolith [6 and 7]. Plagioclase-rich rocks (e.g., anorthosite, norite) are the dominant constituent in highlands simulants, with Shawmere, Stillwater, and White Mountain anorthosites being used in commercially available simulants. However, because these feedstocks are terrestrial in nature, they include hydrated minerals, carbon-bearing minerals, and other chemical signatures that are not present on the Moon, and these minor mineral assemblages need to be taken into account when trying to understand test procedures and results. Glass Component: While much attention has been placed on the rock/mineral component of lunar simulants, glass is just as important when creating simulants. The glass component in lunar regoliths is often greater than 50% by volume [8]. This component includes impact melt glass, dark matrix breccias, and agglutinates. However, this component is difficult, time-consuming and expensive to make. Most lunar simulants, past and current, have relied on basaltic cinder as a feedstock for glass. Getting better glass components at a lower cost, particularly agglutinates and glass with an anorthositic composition is a near-term objective that the NASA simulant project is trying to address . Characterization: It is extremely important for lunar simulants to be characterized by several analytical methods. Gruener et al. [9] and JHUAPL LSIC [10] conducted initial assessments of some of the commercially available simulants in 2019 and early 2020, before the global pandemic. Further analyses are needed to better quantify important parameters such as, modal mineralogy and glass content, particle shape, and particle size distribution. These quantified results can then be used in determining figures of merit (FOM) that show how well simulants compare to lunar regolith [11 and 12].

J E Gruener↗
NASA NTRS1999

Low-Temperature Electronic Components Being Developed

In many future NASA missions, such as deep space planetary exploration and the Next Generation Space Telescope, electrical components and systems must operate reliably and efficiently in extremely low temperature environments. Most modern electronic components cannot operate below moderately low operating temperatures (-40 to -55 C). The low-temperature electronics program at the NASA Lewis Research Center is focusing on the development and characterization of low-temperature components and the integration of the developed devices into demonstrable very low-temperature (-200 C) power systems such as dc-dc converters. Such low-temperature electronics will not only tolerate hostile environments but also will reduce system size and weight by eliminating radioisotope heating units, thereby reducing launch cost, improving reliability and lifetime, and increasing energy densities. Low-temperature electronic components will also have a great influence on terrestrial applications such as medical instrumentation, magnetic levitation transportation systems, and arctic and antarctic exploration. Lewis researchers are now performing extensive evaluations of commercially available as well as custom-made devices. These include various types of energy storage and signal capacitors, power switching devices, magnetic and superconducting materials, and primary lithium batteries, to name a few.

Patterson, Richard L.↗
NASA NTRS2008

Silicon-On-Insulator (SOI) Devices and Mixed-Signal Circuits for Extreme Temperature Applications

Electronic systems in planetary exploration missions and in aerospace applications are expected to encounter extreme temperatures and wide thermal swings in their operational environments. Electronics designed for such applications must, therefore, be able to withstand exposure to extreme temperatures and to perform properly for the duration of the missions. Electronic parts based on silicon-on-insulator (SOI) technology are known, based on device structure, to provide faster switching, consume less power, and offer better radiation-tolerance compared to their silicon counterparts. They also exhibit reduced current leakage and are often tailored for high temperature operation. However, little is known about their performance at low temperature. The performance of several SOI devices and mixed-signal circuits was determined under extreme temperatures, cold-restart, and thermal cycling. The investigations were carried out to establish a baseline on the functionality and to determine suitability of these devices for use in space exploration missions under extreme temperatures. The experimental results obtained on selected SOI devices are presented and discussed in this paper.

Patterson, Richard↗
NASA NTRS2008

Electronic Components for use in Extreme Temperature Aerospace Applications

Electrical power management and control systems designed for use in planetary exploration missions and deep space probes require electronics that are capable of efficient and reliable operation under extreme temperature conditions. Space-based infra-red satellites, all-electric ships, jet engines, electromagnetic launchers, magnetic levitation transport systems, and power facilities are also typical examples where the electronics are expected to be exposed to harsh temperatures and to operate under severe thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and, therefore, new parts must be developed or the conventional devices need to be modified. For example, spacecraft operating in the cold environment of deep space carry a large number of radioisotope heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. At the other end, built-in radiators and coolers render the operation of electronics possible under hot conditions. These thermal measures lead to design complexity, affect development costs, and increase size and weight. Electronics capable of operation at extreme temperatures, thus, will not only tolerate the hostile operational environment, but also make the overall system efficient, more reliable, and less expensive. The Extreme Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electronics suitable for applications in the aerospace environment and deep space exploration missions. Research is being conducted on devices, including COTS parts, for potential use under extreme temperatures. These components include semiconductor switching devices, passive devices, DC/DC converters, operational amplifiers, and oscillators. An overview of the program will be presented along with some experimental findings.

Patterson, Richard L.↗
NASA NTRS2013

James Webb Space Telescope Mid Infra-Red Instrument Pulse-Tube Cryocooler Electronics

The latest generation of long life, space pulse-tube cryocoolers require electronics capable of controlling self-induced vibration down to a fraction of a newton and coldhead temperature with high accuracy down to a few kelvin. Other functions include engineering diagnostics, heater and valve control, telemetry and safety protection of the cryocooler subsystem against extreme environments and operational anomalies. The electronics are designed to survive the thermal, vibration, shock and radiation environment of launch and orbit, while providing a design life in excess of 10 years on-orbit. A number of our current generation high reliability radiation-hardened electronics units are in various stages of integration on several space flight payloads. This paper describes the features and performance of our latest flight electronics designed for the pulse-tube cryocooler that is the pre-cooler for a closed cycle Joule-Thomson cooler providing 6K cooling for the James Webb Space Telescope (JWST) Mid Infra-Red Instrument (MIRI). The electronics is capable of highly accurate temperature control over the temperature range from 4K to 15K. Self-induced vibration is controlled to low levels on all harmonics up to the 16th. A unique active power filter controls peak-to-peak reflected ripple current on the primary power bus to a very low level. The 9 kg unit is capable of delivering 360W continuous power to NGAS's 3-stage pulse-tube High-Capacity Cryocooler (HCC).

thermometry↗
NASA NTRS2020

Cold Survivable Current Sense Multi-Chip Module

This paper will present the design of a Current Sense Module (CSM) used to measure motor phase currents that is capable of surviving the harsh ambient environment of ocean worlds, such as Europa and Enceladus. The CSM module is fabricated by i3 Electronics using their Multi-Chip Module (MCM) technology with techniques developed by JPL to allow this module to survive temperatures down to -184°C. This module greatly improves the ability to measure phase and bridge current which can be problematic in extreme environments. In addition, by packaging these electronics at the die level, we achieve significant weight and size savings. This module is one of several modules that employ similar techniques that are integrated into a distributed or centralized motor controller. This paper will discuss the module’s design along with a summary of our test results.

Cheng, Ben↗