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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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41 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

Advanced fabrication techniques for hydrogen-cooled engine structures

Described is a program for development of coolant passage geometries, material systems, and joining processes that will produce long-life hydrogen-cooled structures for scramjet applications. Tests were performed to establish basic material properties, and samples constructed and evaluated to substantiate fabrication processes and inspection techniques. Results of the study show that the basic goal of increasing the life of hydrogen-cooled structures two orders of magnitude relative to that of the Hypersonic Research Engine can be reached with available means. Estimated life is 19000 cycles for the channels and 16000 cycles for pin-fin coolant passage configurations using Nickel 201. Additional research is required to establish the fatigue characteristics of dissimilar-metal coolant passages (Nickel 201/Inconel 718) and to investigate the embrittling effects of the hydrogen coolant.

Buchmann, O. A.↗
NASA NTRS2012

Integration Science and Technology of Advanced Ceramics for Energy and Environmental Applications

The discovery of new and innovative materials has been known to culminate in major turning points in human history. The transformative impact and functional manifestation of new materials have been demonstrated in every historical era by their integration into new products, systems, assemblies, and devices. In modern times, the integration of new materials into usable products has a special relevance for the technological development and economic competitiveness of industrial societies. Advanced ceramic technologies dramatically impact the energy and environmental landscape due to potential wide scale applications in all aspects of energy production, storage, distribution, conservation, and efficiency. Examples include gas turbine propulsion systems, fuel cells, thermoelectrics, photovoltaics, distribution and transmission systems based on superconductors, nuclear power generation, and waste disposal. Robust ceramic integration technologies enable hierarchical design and manufacturing of intricate ceramic components starting with geometrically simpler units that are subsequently joined to themselves and/or to metals to create components with progressively higher levels of complexity and functionality. However, for the development of robust and reliable integrated systems with optimum performance under different operating conditions, the detailed understanding of various thermochemical and thermomechanical factors is critical. Different approaches are required for the integration of ceramic-metal and ceramic-ceramic systems across length scales (macro to nano). In this presentation, a few examples of integration of ceramic to metals and ceramic to ceramic systems will be presented. Various challenges and opportunities in design, fabrication, and testing of integrated similar (ceramic-ceramic) and dissimilar (ceramic-metal) material systems will be discussed. Potential opportunities and need for the development of innovative design philosophies, approaches, and integrated system testing under simulated application conditions will also be presented.

Singh, M.↗
NASA NTRS2008

XTCE and XML Database Evolution and Lessons from JWST, LandSat, and Constellation

The database organizations within three different NASA projects have advanced current practices by creating database synergy between the various spacecraft life cycle stakeholders and educating users in the benefits of the Consultative Committee for Space Data Systems (CCSDS) XML Telemetry and Command Exchange (XTCE) format. The combination of XML for managing program data and CCSDS XTCE for exchange is a robust approach that will meet all user requirements using Standards and Non proprietary tools. COTS tools for XTCEKML are very wide and varied. To combine together various low cost and free tools can be more expensive in the long run than choosing a more expensive COTS tool that meets all the needs. This was especially important when deploying in 32 remote sites with no need for licenses. A common mission XTCEKML format between dissimilar systems is possible and is not difficult. Command XMLKTCE is more complex than telemetry and the use of XTCEKML metadata to describe pages and scripts is needed due to the proprietary nature of most current ground systems. Other mission and science products such as spacecraft loads, science image catalogs, and mission operation procedures can all be described with XML as well to increase there flexibility as systems evolve and change. Figure 10 is an example of a spacecraft table load. The word is out and the XTCE community is growing, The f ~ sXt TCE user group was held in October and in addition to ESAESOC, SC02000, and CNES identified several systems based on XTCE. The second XTCE user group is scheduled for March 10, 2008 with LDMC and others joining. As the experience with XTCE grows and the user community receives the promised benefits of using XTCE and XML the interest is growing fast.

Gal-Edd, Jonathan↗
NASA NTRS1972

Friction welding.

Results of an exploratory study of the structure and properties of friction welds in Udimet 700 (U-700) and TD-nickel (TD-Ni) bar materials, as well as dissimilar U-700/TD-Ni friction welds. Butt welds were prepared by friction welding 12.7-mm-diam U-700 bars and TD-Ni bars. Specimens for elevated temperature tensile and stress rupture testing were machined after a postweld heat treatment. Friction welding of U-700 shows great potential because the welds were found to be as strong as the parent metal in stress rupture and tensile tests at 760 and 980 C. In addition, the weld line was not detectable by metallographic examination after postheating. Friction welds in TD-Ni or between U-700 and TD-Ni were extremely weak at elevated temperatures. The TD-Ni friction welds could support only 9% as much stress as the base metal for 10-hour stress rupture life at 1090 C. The U-700/TD-Ni weld could sustain only 15% as much stress as the TD-Ni parent metal for a 10-hour stress rupture life at 930 C. Thus friction welding is not a suitable joining method for obtaining high-strength TD-Ni or U-700/TD-Ni weldments.

Moore, T. J.↗
NASA NTRS2010

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗