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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3

Optical Flow Diagnostics of Counter Fluidization of Gravity-Driven Moving Packed Bed for a CSP Receiver Section Featuring Staggered Array of Cylindrical Pins

Particle fluidized beds have the potential to improve the efficiency of heat transfer in concentrated solar receiver furnace for use in next generation concentrated solar power (CSP) plants. This study presents an experimental investigation on the flow characterization of vertically downward moving packed bed with counter fluidization through an array of jets. To control the bubble size and its distribution in the bubbling fluidized bed, an array of cylindrical pin fins was arranged uniformly across the test article. The flow visualization was performed on the surface of transparent glass coated with electrically conductive materials for electrostatic dissipation purposes. The image acquisition was carried out via high-speed camera at a frequency of ~ 1kHz. The acquired images were analyzed in pairs with the help of a modern optical flow algorithm capable of calculating the movement of dense particle flow in the fluidized bed by tracking the light intensity of each predefined window of the frames. A comparison of fluidized beds with plane and pin-finned channels revealed distinct bubble behavior. Pin-finned channels were found to produce a larger number of small-sized bubbles, while plane channels generated fewer but larger bubbles at any given instant. The presence of pin fins was observed to reduce bubble size by preventing bubble merging and splitting larger bubbles when they encountered a pin.

concentrating solar power

Metal-to-Ceramic Joining Methods to Support Development of Advanced Ceramic-Based CSP Components

The National Renewable Energy Laboratory, Missouri University of Science and Technology (MS&T), Massachusetts Institute of Technology (MIT), and Colorado School of Mines (CSM) collaborated to design, develop, and test a material concept at bench scale which will be used to achieve a ceramic-to-metal (C2M) joint between a selected metal HTF loop material and a selected ceramic material used by the Gen3 CSP technology pathway. The final joint assembly will need to possess sufficient mechanical properties to withstand static high-temperature (650 degrees-700 degrees C) and high-pressure (20 MPa) and thermal cycling (between 650 degrees C and 100 degrees C) conditions. The material concept consists of three key components: (1) a ceramic matrix composite (CMC) that serves as a compliant transition material aiming to mitigate the stresses due to the mismatch of coefficient of thermal expansion (CTE) from a direct ceramic-to-metal joint, (2) a metal-end joint utilizing a multi-principal element alloy (MPEA) with changing percentage of particle loading to bond the candidate metal to the CMC, and (3) a ceramic-end joint utilizing a glass ceramic to bond the candidate ceramic to the CMC.

14 SOLAR ENERGY

Fabrication of ceramic to metal graded structure for high temperature CSP receiver application using solid state additive manufacturing

The overarching goal of this project is to come up with an innovative joining solution for integration of SiC ceramic to structural materials such as stainless steels (SS)/Ni-base alloys, where intimate metallurgical bonding between SiC ceramic and the structural metallic alloy is demonstrated at the interface. Implementation of a simple, yet robust joining method would help in increasing the application space of SiC in a high-temperature CSP (concentrated solar power) plant, especially in the receiver section. This research goal has been achieved by creating a functionally graded material (FGM) interface between SiC and the selected structural material with the help of powder metallurgy (PM) approach and demonstrate intimate metallurgical bonding between monolithic RB-SiC and 316L stainless steel alloy blanks.

36 MATERIALS SCIENCE

Improving the Reliability and Modal Stability of High Power 870 nm AlGaAs CSP Laser Diodes for Applications to Free Space Communication Systems

The operating characteristics (power-current, beam divergence, etc.) and reliability assessment of high-power CSP lasers is discussed. The emission wavelength of these lasers was optimized at 860 to 880 nm. The operational characteristics of a new laser, the inverse channel substrate planar (ICSP) laser, grown by metalorganic chemical vapor deposition (MOCVD), is discussed and the reliability assessment of this laser is reported. The highlights of this study include a reduction in the threshold current value for the laser to 15 mA and a degradation rate of less than 2 kW/hr for the lasers operating at 60 mW of peak output power.

Connolly, J. C.

Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies. Acceleration induced failure mechanisms varied from conventional surface mount (SM) failures for CSPs. Examples of unrealistic life projections for other CSPs are also presented. The cumulative cycles to failure for ceramic BGA assemblies performed under different conditions, including plots of their two Weibull parameters, are presented. The results are for cycles in the range of -30 C to 100 C, -55 C to 100 C, and -55 C to 125 C. Failure mechanisms as well as cycles to failure for thermal shock and thermal cycling conditions in the range of -55 C to 125 C were compared. Projection to other temperature cycling ranges using a modified Coffin-Manson relationship is also presented.

Ghaffarian, Reza

Automata learning algorithms and processes for providing more complete systems requirements specification by scenario generation, CSP-based syntax-oriented model construction, and R2D2C system requirements transformation

Systems, methods and apparatus are provided through which in some embodiments, automata learning algorithms and techniques are implemented to generate a more complete set of scenarios for requirements based programming. More specifically, a CSP-based, syntax-oriented model construction, which requires the support of a theorem prover, is complemented by model extrapolation, via automata learning. This may support the systematic completion of the requirements, the nature of the requirement being partial, which provides focus on the most prominent scenarios. This may generalize requirement skeletons by extrapolation and may indicate by way of automatically generated traces where the requirement specification is too loose and additional information is required.

Hinchey, Michael G.

3D Chip Scale Package (CSP)

Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.

Chip Scale Packaging (CSP) 3D CSP Stack TSOP D2CSP

Design Basis Document / Owner’s Technical Specification for Nitrate Salt Systems in CSP Projects: Volume 1 Specifications for Parabolic Trough Projects, Volume 2 - Specifications for Central Receiver Projects, Volume 3 - Narrative

Design Basis Documents / Owner’s Technical Specifications are developed for parabolic trough and central receiver power plants using nitrate salt as the heat transport fluid and the thermal storage medium. The goals were to 1) distill the successful experience with nitrate salt systems from as many commercial projects as possible, 2) provide technical bases for equipment design/selection that an owner can impose on an EPC contractor, 3) compile this information in one location to provide guidance on salt systems that is as broadly applicable to as many projects as possible, and 4) work toward an industry consensus on a Design Basis Document that reflects the lessons learned from earlier commercial projects. The document allows an owner to provide design guidance, and to impose a minimum set of requirements, above and beyond those in the normal Codes and Standards, on an EPC contractor in an effort to avoid a repeat of past mistakes. If successful, this would allow salt systems to achieve the same levels of reliability and availability as commercial parabolic trough plants using diphenyl oxide / biphenyl (i.e., Dowtherm A, Therminol VP-1) as the heat transfer fluid. The report consists of 3 volumes: • Volume 1 - Specifications for Parabolic Trough Projects • Volume 2 - Specifications for Central Receiver Projects • Volume 3 - Narrative Volumes 1 and 2 include discussions of the following topics: • Plant functional requirements for the salt systems • Plant operating states, and transitions between states, for the salt systems • Risk analysis of the principal salt components • Plant requirements for the salt systems to meet the functional and the operating requirements • Type of specification for the principal salt components: functional; or prescriptive • Current state of the art for salt systems. Volume 3 discusses a number of cases in which the salt equipment at commercial parabolic trough and central receiver projects has not met the projected levels of reliability and availability. Possible reasons for the sources of the problems are discussed, as is a range of possible alternate designs that could avoid the known problems.

14 SOLAR ENERGY

Development of a High-Efficiency Hybrid Dry Cooler System for sCO 2 Power Cycles in CSP Applications

This project addressed a major gap in supercritical CO 2 (sCO 2 ) power cycle research by focusing on the pre-cooler, a component that had received little attention despite its significant impact on cycle efficiency and plant economics. The team developed a compact dry cooler using brazed/diffusion-bonded microchannel passages paired with formed air-side fins, advancing the technology from TRL-2 toward commercial readiness. Compared to conventional fin-tube coolers, the design cuts installation footprint by roughly half for 10+ MWth systems while achieving better heat transfer and lower approach temperatures, translating into a projected LCOE reduction from 6.04 ¢/kWh to between 5.85 and 5.94 ¢/kWh. While fabrication of an aluminum MW-scale prototype revealed brazing and sealing challenges at larger scales, lessons learned informed a subsequent 1 MWth unit that was successfully built and delivered for integration into Sandia's Gen3 Particle Pilot Plant, advancing the technology to TRL-7 with a path toward TRL-8 pending successful testing.

30 DIRECT ENERGY CONVERSION

Development and Validation of Low-Cost, High-Reflectance Composite CSP Facets: SIPS Final Report

This work investigates the various challenges associated with developing heliostat structural composite facets using 1 mm glass mirrors. Such facets are desirable for Concentrating Solar Power because 1 mm glass mirrors provide an absolute increase in reflectivity of 2-3 % over the industry standard of 4 mm glass mirrors. Prototypes of paraboloid composite facets with 1 mm glass mirrors were constructed that have a root mean square slope error on the order of 2 mrad while achieving greater than 96% reflectivity. These facets were constructed using a low-quality aluminum mold and a bill of materials that show potential to achieve cost parity with existing 4 mm glass mirrors supported by structural steel. The facets produced were able to survive up to 50 mm hail ball impacts and were robust against accelerated environmental cycling designed to expose durability concerns. Further work is needed to develop a scalable and cost-effective manufacturing process with a similar bill of materials.

14 SOLAR ENERGY

Effect of thermal cycling ramp rate on CSP assembly reliability

A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.

accelerated thermal cycle chip scale package solde