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At least 55 records · Page 3

Accelerated thermal and mechanical testing of CSP assemblies

Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.

Chip Scale Package CSP thermal cycle fatigue solde↗

Miniature Trace Gas Detector Based on Microfabricated Optical Resonators

While a variety of techniques exist to monitor trace gases, methods relying on absorption of laser light are the most commonly used in terrestrial applications. Cavity-enhanced absorption techniques typically use high-reflectivity mirrors to form a resonant cavity, inside of which a sample gas can be analyzed. The effective absorption length is augmented by the cavity's high quality factor, or Q, because the light reflects many times between the mirrors. The sensitivity of such mirror-based sensors scales with size, generally making them somewhat bulky in volume. Also, specialized coatings for the high-reflectivity mirrors have limited bandwidth (typically just a few nanometers), and the delicate mirror surfaces can easily be degraded by dust or chemical films. As a highly sensitive and compact alternative, JPL is developing a novel trace gas sensor based on a monolithic optical resonator structure that has been modified such that a gas sample can be directly injected into the cavity. This device concept combines ultra-high Q optical whispering gallery mode resonators (WGMR) with microfabrication technology used in the semiconductor industry. For direct access to the optical mode inside a resonator, material can be precisely milled from its perimeter, creating an open gap within the WGMR. Within this open notch, the full optical mode of the resonator can be accessed. While this modification may limit the obtainable Q, calculations show that the reduction is not significant enough to outweigh its utility for trace gas detection. The notch can be milled from the high- Q crystalline WGMR with a focused ion beam (FIB) instrument with resolution much finer than an optical wavelength, thereby minimizing scattering losses and preserving the optical quality. Initial experimental demonstrations have shown that these opened cavities still support high-Q whispering gallery modes. This technology could provide ultrasensitive detection of a variety of molecular species in an extremely compact and robust package. With this type of modified WGMR, one can inject a gas sample into the open gap, allowing highly sensitive trace molecule detection within a roughly 1-cm volume. Other critical components of the instrument, such as the detector and a semiconductor laser, could be directly packaged with the resonator so as to not significantly increase the size of the device. Besides its low mass, volume, and power consumption, the monolithic design makes these resonators intrinsically robust devices, capable of handling significant temperature excursions, without moving parts to wear out or delicate coatings that can be easily damaged. A sensor could integrate with microfluidics technology for a chip-scale device. It could be mounted to the end of a deployable arm, or inserted into a borehole. Also, a network of individual sensors could be dispersed to monitor conditions over a wide region

Aveline, David C.↗

68815 revisited

Remeasurement of the particle track density as a function of depth in lunar breccia 68815 has yielded galactic cosmic-ray track densities consistent with a 2 m.y. surface exposure, in good agreement with results by other authors. The empirical track-production spectrum of Walker and Yuhas (1973) is confirmed. The solar-flare track profile is typical and shows no evidence of large-scale chipping. Radionuclide profiles (Mn-53) investigated by the Arnold group should thus be undisturbed and should provide a test of the Reedy-Arnold model and of the constancy of solar and galactic cosmic rays.

Dust, S.↗

Novel approaches to the construction of miniaturized analytical instrumentation

This paper focuses on the design, construction, preliminary testing, and potential applications of three forms of miniaturized analytical instrumentation. The first is an optical fiber instrument for monitoring pH and other cations in aqueous solutions. The instrument couples chemically selective indicators that were immobilized at porous polymeric films with a hardware package that provides the excitation light source, required optical components, and detection and data processing hardware. The second is a new form of a piezoelectric mass sensor. The sensor was fabricated by the deposition of a thin (5.5 micron) film of piezoelectric aluminum nitride (AIN). The completed deposition process yields a thin film resonator (TFR) that is shaped as a 400 micron square and supports a standing bulk acoustic wave in a longitudinal mode at frequencies of approx. 1 GHz. Various deposition and vapor sorption studies indicate that the mass sensitivity of the TFR's rival those of the most sensitive mass sensors currently available, though offering such performance in a markedly smaller device. The third couples a novel form of liquid chromatography with microlithographic miniaturization techniques. The status of the miniaturization effort, the goal of which is to achieve chip-scale separations, is briefly discussed.

Porter, Marc D.↗

Novel approaches to the construction of miniaturized analytical instrumentation

This paper focuses on the design, construction, preliminary testing, and potential applications of three forms of miniaturized analytical instrumentation. The first is an optical fiber instrument for monitoring pH and other cations in aqueous solutions. The instrument couples chemically selective indicators that were immobilized at porous polymeric films with a hardware package that provides the excitation light source, required optical components, and detection and data processing hardware. The second is a new form of a piezoelectric mass sensor. The sensor was fabricated by the deposition of a thin (5.5 micron) film of piezoelectric aluminum nitride (AIN). The completed deposition process yields a thin film resonator (TFR) that is shaped as a 400 micron square and supports a standing bulk acoustic wave in a longitudinal mode at frequencies of approx. 1 GHz. Various deposition and vapor sorption studies indicate that the mass sensitivity of the TFR's rival those of the most sensitive mass sensors currently available, though offering such performance in a markedly smaller device. The third couples a novel form of liquid chromatography with microlithographic miniaturization techniques. The status of the miniaturization effort, the goal of which is to achieve chip-scale separations, is briefly discussed.

Porter, Marc D.↗

Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies. Acceleration induced failure mechanisms varied from conventional surface mount (SM) failures for CSPs. Examples of unrealistic life projections for other CSPs are also presented. The cumulative cycles to failure for ceramic BGA assemblies performed under different conditions, including plots of their two Weibull parameters, are presented. The results are for cycles in the range of -30 C to 100 C, -55 C to 100 C, and -55 C to 125 C. Failure mechanisms as well as cycles to failure for thermal shock and thermal cycling conditions in the range of -55 C to 125 C were compared. Projection to other temperature cycling ranges using a modified Coffin-Manson relationship is also presented.

Ghaffarian, Reza↗

CSP Manufacturing Challenges and Assembly Reliability

Although the expression of CSP is widely used by industry from suppliers to users, its implied definition had evolved as the technology has matured. There are "expert definition"- package that is up to 1.5 time die- or "interim definition". CSPs are miniature new packages that industry is starting to implement and there are many unresolved technical issues associated with their implementation. For example, in early 1997, packages with 1 mm pitch and lower were the dominant CSPs, whereas in early 1998 packages with 0.8 mm and lower became the norm for CSPs. Other changes included the use of flip chip die rather than wire bond in CSP. Nonetheless the emerging CSPs are competing with bare die assemblies and are becoming the package of choice for size reduction applications. These packages provide the benefits of small size and performance of the bare die or flip chip, with the advantage of standard die packages. The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. This talk will cover specifically the experience of our consortium on technology implementation challenges, including design and build of both standard and microvia boards, assembly of two types of test vehicles, and the most current environmental thermal cycling test results.

Ghaffarian, Reza↗

Mechanical Properties and Microstructure Investigation of Lead Free Solder

While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a eutectic region of Sn with moderately dispersed Ag3Sn intermetallic, surrounded by a dendritic Sn-rich phase. The SEM images of the fracture surface indicated the presence of a tough shear surface at the initial cavity break area and a break line in the middle of specimen along the failure direction. A hyperbolic-sine creep model was adopted and used to fit the creep experiment data. The effect on the mechanical properties by adding the quaternary element bismuth to the Sn-3.5Ag-0.8Cu alloy was measured and compared with the mechanical properties of the ternary alloys. The results of this research study provide necessary data for the modeling of solder joint reliability for a range of Sn-Ag-Cu compositions and a baseline for evaluating the effects of subsequent quaternary additions.

Wang, Qing↗

Accelerated Thermal Cycling and Failure Mechanisms

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.

BGA CSP CBGA thermal cycle solder joint reliabilit↗

CSP/BGA Board level Reliability

Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.

package type board material surface finish solder ↗

Visual and x-ray inspection characteristics of eutectic and lead free assemblies

For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).

x-ray↗

A Comparative Study of Inspection Techniques for Array Packages

This viewgraph presentation reviews the inspection techniques for Column Grid Array (CGA) packages. The CGA is a method of chip scale packaging using high temperature solder columns to attach part to board. It is becoming more popular over other techniques (i.e. quad flat pack (QFP) or ball grid array (BGA)). However there are environmental stresses and workmanship challenges that require good inspection techniques for these packages.

Mohammed, Jelila↗

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

plastic ball grid array (PBGA)↗

Biosensors for EVA: Improved Instrumentation for Ground-based Studies

During lunar excursions in the EVA suit, real-time measurement of metabolic rate is required to manage consumables and guide activities to ensure safe return to the base. Metabolic rate, or oxygen consumption (VO2), is normally measured from pulmonary parameters but cannot be determined with standard techniques in the oxygen-rich environment of a spacesuit. Our group has developed novel near infrared spectroscopic (NIRS) methods to calculate muscle oxygen saturation (SmO 2), hematocrit, and pH, and we recently demonstrated that we can use our NIRS sensor to measure VO 2 on the leg during cycling. Our NSBRI project has 4 objectives: (1) increase the accuracy of the metabolic rate calculation through improved prediction of stroke volume; (2) investigate the relative contributions of calf and thigh oxygen consumption to metabolic rate calculation for walking and running; (3) demonstrate that the NIRS-based noninvasive metabolic rate methodology is sensitive enough to detect decrement in VO 2 in a space analog; and (4) improve instrumentation to allow testing within a spacesuit. Over the past year we have made progress on all four objectives, but the most significant progress was made in improving the instrumentation. The NIRS system currently in use at JSC is based on fiber optics technology. Optical fiber bundles are used to deliver light from a light source in the monitor to the patient, and light reflected back from the patient s muscle to the monitor for spectroscopic analysis. The fiber optic cables are large and fragile, and there is no way to get them in and out of the test spacesuit used for ground-based studies. With complimentary funding from the US Army, we undertook a complete redesign of the sensor and control electronics to build a novel system small enough to be used within the spacesuit and portable enough to be used by a combat medic. In the new system the filament lamp used in the fiber optic system was replaced with a novel broadband near infrared LED light source. The compact grating spectrometer was replaced with a chip-scale spectrometer. With this new design, the sensor is 4 in 2 in 0.5 in, weighs 60 g, and no fiber optic cables are needed. The sensor, which contains the light source and the spectrometer, is adhered directly to the skin with medical grade adhesive. The sensor can be powered via the USB port of the laptop computer that controls the sensor operation. Alternatively, for studies in the spacesuit, the sensor can be powered by a small battery pack and operated by an ultra-portable hand-held computer. Both the handheld computer and battery pack will easily fit within the PLSS of the test spacesuit. System automation was significantly improved, to add features suggested by our colleagues in the Cardiovascular Laboratory and the NASA JSC Exercise Physiology and Countermeasures Project. The functionality and portability of this system were demonstrated in our UMass laboratory.

Soller, B.↗

180-GHz Interferometric Imager

A 180-GHz interferometric imager uses compact receiver modules, combined high- and low-gain antennas, and ASIC (application specific integrated circuit) correlator technology, enabling continuous, all-weather observations of water vapor with 25-km resolution and 0.3-K noise in 15 minutes of observation for numerical weather forecasting and tropical storm prediction. The GeoSTAR-II prototype instrument is broken down into four major subsystems: the compact, low-noise receivers; sub-array modules; IF signal distribution; and the digitizer/correlator. Instead of the single row of antennas adopted in GeoSTAR, this version has four rows of antennas on a coarser grid. This dramatically improves the sensitivity in the desired field of view. The GeoSTAR-II instrument is a 48-element, synthetic, thinned aperture radiometer operating at 165-183 GHz. The instrument has compact receivers integrated into tiles of 16 elements in a 4x4 arrangement. These tiles become the building block of larger arrays. The tiles contain signal distribution for bias controls, IF signal, and local oscillator signals. The IF signals are digitized and correlated using an ASIC correlator to minimize power consumption. Previous synthetic aperture imagers have used comparatively large multichip modules, whereas this approach uses chip-scale modules mounted on circuit boards, which are in turn mounted on the distribution manifolds. This minimizes the number of connectors and reduces system mass. The use of ASIC technology in the digitizers and correlators leads to a power reduction close to an order of magnitude.

Kangaslahti, Pekka P.↗

Distributed Timing and Localization (DiGiTaL)

The Distributed Timing and Localization (DiGiTaL) system provides nano satellite formations with unprecedented,centimeter-level navigation accuracy in real time and nanosecond-level time synchronization. This is achieved through the integration of a multi-constellation Global Navigation Satellite System (GNSS) receiver, a Chip-Scale Atomic Clock (CSAC), and a dedicated Inter-Satellite Link (ISL). In comparison, traditional single spacecraft GNSS navigation solutions are accurate only to the meter-level due to the sole usage of coarse pseudo-range measurements. To meet the strict requirements of future miniaturized distributed space systems, DiGiTaL uses powerful error-cancelling combinations of raw carrier-phase measurements which are exchanged between the swarming nano satellites through a decentralized network. A reduced-dynamics estimation architecture on board each individual nano satellite processes the resulting millimeter-level noise measurements to reconstruct the fullformation state with high accuracy.

Small Spacecraft↗

2.5/3D Daisy Chain Reliability Evaluation

The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.

Ghaffarian, Reza↗

CHOMPTT (CubeSat Handling of Multisystem Precision Timing Transfer): From Concept to Launch Pad

Here we present the evolution of a student satellite mission: CHOMPTT (CubeSat Handling of Multisystem Precision Time Transfer), from its original concept as a candidate for the University NanoSatellite Program 8 (UNP8), to a spacecraft ready for launch in Fall of 2017 on ELaNa XIX (Educational Launch of Nanosatellites). The 3U CubeSat houses a 1 kg, 1U OPTI (Optical Precision Timing Instrument) payload, designed and built at the University of Florida, and a 1.5U EDSNNODeS-derived bus from NASA Ames Research Center. The OPTI payload comprises of: 1) a supervisor board that handles payload data, power regulation, and mode settings, 2) an optics assembly of six 1 cm retroreflectors and four laser beacon diodes for ground-tracking; and 3) two fully redundant timing channels, each consisting of: a chip-scale atomic clock, a microprocessor with clock counter, a picosecond event timer, and an avalanche photodetector (APD) with band-pass filter. Several iterations of OPTI have been developed, tested, and designed to achieve its current functionality and design a laboratory breadboard design, a 1.5U high altitude balloon design, engineering unit design, and its current flight unit design. In-lab testing of the current OPTI design indicates a short-term precision of 100 ps, equivalent to a range accuracy of 3 cm necessary to achieve our primary objective of 200 ps time transfer error, and a long-term timing accuracy of 20 ns over one orbit (1.5 hours). After the spacecraft reaches its nominal 500 km orbit at a 85 degree inclination, an experimental laser ranging facility at Kennedy Space Center in Florida, will track and emit 1064 nm nanosecond optical pulses at the CHOMPTT spacecraft. The laser pulses will then reflect off the retroreflector array mounted on the nadir face of CHOMPTT, and return the pulse to the laser ranging facility where the laser ranging facility will record the round-trip duration of the laser pulses. At the same time the pulse arrives at the spacecraft and is reflected by the array, an APD will record the arrival time of the pulses at the nanosatellite. By comparing the arrival of the pulse at the CubeSat and the duration of the round-trip of the laser pulse, the clock discrepancy between the ground and CubeSat atomic clocks can be determined, in addition to the CubeSats range from the facility. The design and verification of the flight version of CHOMPTT will be reviewed and an overview of the lifetime development and progression of CHOMPTT from the inception to launch pad will be presented.

CHOMPTT↗