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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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SIRTF requires detector arrays with extremely high sensitivity, limited only by the background irradiance. Especially critical is the near infrared spectral region around 3 mu m, where the detector current due to the zodiacal background is a minimum
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Spacecraft solar cell near-maximum power operation by tracking optimum value with array temperature sensor
Work was done to verify the technological readiness of a select process sequence with respect to satisfying the Low Cost Solar Array Project objectives of meeting the designated goals of $.50 per peak watt in 1986 (1975 dollars). The sequence examined consisted of: (1) 3 inches diameter as-sawn Czochralski grown 1:0:0 silicon, (2) texture etching, (3) ion implanting, (4) laser annealing, (5) screen printing of ohmic contacts and (6) sprayed anti-reflective coatings. High volume production projections were made on the selected process sequence. Automated processing and movement of hardware at high rates were conceptualized to satisfy the PROJECT's 500 MW/yr capability. A production plan was formulated with flow diagrams integrating the various processes in the cell fabrication sequence.
Progress in the development of solar cells and module process steps for low-cost solar arrays is reported. Specific topics covered include: (1) a system to automatically measure solar cell electrical performance parameters; (2) automation of wafer surface preparation, printing, and plating; (3) laser inspection of mechanical defects of solar cells; and (4) a silicon antireflection coating system. Two solar cell process steps, laser trimming and holing automation and spray-on dopant junction formation, are described.
The Mosaic Transistor Array is an extension of the STAR system developed by NASA which has dedicated field cells designed to be specifically used in semicustom microprocessor applications. The Sandia radiation hard bulk CMOS process is utilized in order to satisfy the requirements of space flights. A design philosophy is developed which utilizes the strengths and recognizes the weaknesses of the Sandia process. A style of circuitry is developed which incorporates the low power and high drive capability of CMOS. In addition the density achieved is better than that for classic CMOS, although not as good as for NMOS. The basic logic functions for a data path are designed with compatible interface to the STAR grid system. In this manner either random logic or PLA type structures can be utilized for the control logic.
The performance of a real-time digital combining system for use with array feeds was considered previously. The purpose of the combining operation is to recover signal to noise ratio (SNR) losses due to antenna deformations and atmospheric effects. Previously, arbitrary signal powers and noise variances were assumed, but no attempt was made to match the receiver channels to the available signal powers. It is shown that for any signal power and noise variance distribution, a best channel assignment exists that maximizes the combined SNR in the limit of vanishingly small combining losses. This limit can be approached in practice by observing sufficiently many samples. Specific signal power and noise variance distributions are considered, and it is shown that even relatively noisy channels can be used effectively to recover SNR losses resulting from signals diverted out of a high-quality channel by antenna deformations.
This document reports on the progress in developing hybrid sensors for the simultaneous measurement of pressure and shear stress. The key feature for the success of the proposed hybrid sensor array is the ability to deposit Cu-Ni alloy with proper composition (55 - 45) on a silicon wafer to form a strain gage. This alloy strain gage replaces the normally used Si strain gages in MEMS, which are highly nonlinear and temperature dependent. The copper nickel, with proper composition (55 - 45), was successfully deposited on a silicon wafer with a few trials during this period of the project. Pictures of the Cu-Ni alloy strain gage and the x-ray spectra indicating the composition are shown. The planned tests are also reviewed.
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The activities associated with the fabrication, handling, and testing of 2-mil solar cell modules on a flexible substrate are demonstrated. It is shown that 2-mil solar cells can be reliably handled, welded, and bonded to a Kapton substrate. Flexible Invar interconnects can be used to interconnect individual cells to form modules. These solar cell modules can be temperature cycled, wrapped around a 10-inch diameter drum, and vibrated to the shuttle environment with no significant damage. A bonding technique was developed to physically join adjacent modules that is stronger than the Kapton, itself. Ultraviolet radiation tests were performed on RTV - silicone as a cell cover material - with very encouraging results.
The state of technology readiness for the automated production of solar cells and modules is reviewed. Individual process steps and process sequences for making solar cells and modules were evaluated both technically and economically. High efficiency with a suggested cell goal of 15% was stressed. It is concluded that the technology exists to manufacture solar cells which will meet program goals.
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Silicon tetrachloride and a reductant (sodium) will be injected into an arc heated mixture of hydrogen and argon, yielding silicon and gaseous sodium chloride. Detailed characterization of the Sonicore sodium injection nozzle, using water as the test fluid was completed. Results indicated that flow rates of 45 gph sodium and 50 scfm argon should produce sufficiently small droplet sizes. The design effort was also completed for the test system preparation which was divided into two categories: (1) system components and (2) test system-laboratory integration.
Several modifications instituted in the wafer surface preparation process served to significantly reduce the process cost to 1.55 cents per peak watt in 1975 cents. Performance verification tests of a laser scanning system showed a limited capability to detect hidden cracks or defects, but with potential equipment modifications this cost effective system could be rendered suitable for applications. Installation of electroless nickel plating system was completed along with an optimization of the wafer plating process. The solder coating and flux removal process verification test was completed. An optimum temperature range of 500-550 C was found to produce uniform solder coating with the restriction that a modified dipping procedure is utilized. Finally, the construction of the spray-on dopant equipment was completed.
The results of a study of process variables and solar cell variables are presented. Interactions between variables and their effects upon control ranges of the variables are identified. The results of a cost analysis for manufacturing solar cells are discussed. The cost analysis includes a sensitivity analysis of a number of cost factors.
Various top contact metal systems were studied. Only Ti Pd Cu approaches baseline (Ti Pd Ag) quality, but this system shows a lack of long term stability. Aluminum back surface field structures were fabricated and thicknesses of p superscript + material of up to 7.0 microns were achieved with open circuit voltages of 0.59V. A general purpose ultrasonic welder was purchased and tests using various metal foils are under way. During fabrication of the demonstration module, several cells became cracked. Due to redundancy of interconnections, the module was not open circuited but the efficiency was reduced to 8.8%. The broken cell was interconnected with a strap across the back and the efficiency was increased to 11.5%. A cost analysis was made and the results indicate a selling price of $0.56/watt peak (in 1986 with 1975 dollars).