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At least 55 records · Page 3

Evaluation of 10V Chip Polymer Tantalum Capacitors for Space Applications

Due to low ESR and safe failure mode, new technology chip polymer tantalum capacitors (CPTC) have gained popularity in the electronics design community, first in commercial applications, and now in hi-rel and space systems. The major drawbacks of these parts are high leakage currents, degradation under environmental stresses, and a relatively narrow temperature range of operating and storage conditions. Several studies have shown that a certain amount of moisture in polymer cathodes is necessary for a normal operation of the parts. This might limit applications of CPTCs in space systems and requires analysis of long-term exposure to deep vacuum conditions on their performance and reliability. High leakage currents and limited maximum operational temperature complicate accelerated testing that is necessary to assess long-term reliability and require new screening and qualification procedures for quality assurance. A better understanding of behavior of CPTCs as compared to traditional, MnO2, capacitors is necessary to develop adequate approaches for QA system for space applications. A specific of CPTCs is that different materials and processes might be used for low-voltage (10 V and less) and high-voltage (above 10 V) capacitors, so performance and degradation processes in these groups require separate analysis. In this work, that is a part of the NASA Electronic Parts and Packaging (NEPP) program, degradation of AC and DC characteristics under environmental stresses at different temperatures and voltages have been studied in nine lots of commercial and automotive grade capacitors rated to 10 V. Results of analysis of leakage currents, high temperature storage (HTS) up to 5000 hrs in vacuum and air at different temperatures, and Highly Accelerated Life Testing (HALT) in the range from 85 C to 145 C are presented. Temperature and voltage acceleration factors were calculated based on approximation of distributions of degradation rates with a general log-linear Weibull model. Mechanisms of degradation and failures, and requirements for screening and qualification testing are discussed.

Tantalum Capacitors↗

Performance degradation mechanisms and modes in terrestrial photovoltaic arrays and technology for their diagnosis

Accelerated life-prediction test methodologies have been developed for the validation of a 20-year service life for low-cost photovoltaic arrays. Array failure modes, relevant materials property changes, and primary degradation mechanisms are discussed as a prerequisite to identifying suitable measurement techniques and instruments. Measurements must provide sufficient confidence to permit selection among alternative designs and materials and to stimulate widespread deployment of such arrays. Furthermore, the diversity of candidate materials and designs, and the variety of potential environmental stress combinations, degradation mechanisms and failure modes require that combinations of measurement techniques be identified which are suitable for the characterization of various encapsulation system-cell structure-environment combinations.

Noel, G. T.↗

Engine systems analysis results of the Space Shuttle Main Engine redesigned powerhead initial engine level testing

Engineers regularly analyze SSME ground test and flight data with respect to engine systems performance. Recently, a redesigned SSME powerhead was introduced to engine-level testing in part to increase engine operational margins through optimization of the engine internal environment. This paper presents an overview of the MSFC personnel engine systems analysis results and conclusions reached from initial engine level testing of the redesigned powerhead, and further redesigns incorporated to eliminate accelerated main injector baffle and main combustion chamber hot gas wall degradation. The conclusions are drawn from instrumented engine ground test data and hardware integrity analysis reports and address initial engine test results with respect to the apparent design change effects on engine system and component operation.

Sander, Erik J.↗

Effect of Post-HALT Annealing on Leakage Currents in Solid Tantalum Capacitors

Degradation of leakage currents is often observed during life testing of tantalum capacitors and is sometimes attributed to the field-induced crystallization in amorphous anodic tantalum pentoxide dielectrics. However, degradation of leakage currents and the possibility of annealing of degraded capacitors have not been investigated yet. In this work the effect of annealing after highly accelerated life testing (HALT) on leakage currents in various types of solid tantalum capacitors was analyzed. Variations of leakage currents with time during annealing at temperatures from 125 oC to 180 oC, thermally stimulated depolarization (TSD) currents, and I-V characteristics were measured to understand the conduction mechanism and the reason for current degradation. Annealing resulted in a gradual decrease of leakage currents and restored their initial values. Repeat HALT after annealing resulted in reproducible degradation of leakage currents. The observed results are explained based on ionic charge instability (drift/diffusion of oxygen vacancies) in the tantalum pentoxide dielectrics using a modified Schottky conduction mechanism.

Teverovsky, Alexander↗

Development of an Accelerated Test Design for Predicting the Service Life of the Solar Array at Mead, Nebraska

An accelerated life test is described which was developed to predict the life of the 25 kW photovoltaic array installed near Mead, Nebraska. A quantitative model for accelerating testing using multiple environmental stresses was used to develop the test design. The model accounts for the effects of thermal stress by a relation of the Arrhenius form. This relation was then corrected for the effects of nonthermal environmental stresses, such as relative humidity, atmospheric pollutants, and ultraviolet radiation. The correction factors for the nonthermal stresses included temperature-dependent exponents to account for the effects of interactions between thermal and nonthermal stresses on the rate of degradation of power output. The test conditions, measurements, and data analyses for the accelerated tests are presented. Constant-temperature, cyclic-temperature, and UV types of tests are specified, incorporating selected levels of relative humidity and chemical contamination and an imposed forward-bias current and static electric field.

Gaines, G. B.↗

Scaled CMOS Technology Reliability Users Guide

The desire to assess the reliability of emerging scaled microelectronics technologies through faster reliability trials and more accurate acceleration models is the precursor for further research and experimentation in this relevant field. The effect of semiconductor scaling on microelectronics product reliability is an important aspect to the high reliability application user. From the perspective of a customer or user, who in many cases must deal with very limited, if any, manufacturer's reliability data to assess the product for a highly-reliable application, product-level testing is critical in the characterization and reliability assessment of advanced nanometer semiconductor scaling effects on microelectronics reliability. A methodology on how to accomplish this and techniques for deriving the expected product-level reliability on commercial memory products are provided.Competing mechanism theory and the multiple failure mechanism model are applied to the experimental results of scaled SDRAM products. Accelerated stress testing at multiple conditions is applied at the product level of several scaled memory products to assess the performance degradation and product reliability. Acceleration models are derived for each case. For several scaled SDRAM products, retention time degradation is studied and two distinct soft error populations are observed with each technology generation: early breakdown, characterized by randomly distributed weak bits with Weibull slope (beta)=1, and a main population breakdown with an increasing failure rate. Retention time soft error rates are calculated and a multiple failure mechanism acceleration model with parameters is derived for each technology. Defect densities are calculated and reflect a decreasing trend in the percentage of random defective bits for each successive product generation. A normalized soft error failure rate of the memory data retention time in FIT/Gb and FIT/cm2 for several scaled SDRAM generations is presented revealing a power relationship. General models describing the soft error rates across scaled product generations are presented. The analysis methodology may be applied to other scaled microelectronic products and their key parameters.

Microelectronics Reliability↗

Observed changes in a-Si:H cell characteristics due to long term temperature stress

Determination of thermally induced degradation mechanisms affecting thin film amorphous silicon solar cells through the use of laboratory accelerated stress testing requires acquisition of specially constructed, individually addressable test cells and the development of highly repeatable instrumentation which is not influenced by short-term reversible optical effects. This paper illustrates these considerations by describing accelerated temperature stress procedures and test results for one type of a-Si:H cell. Observed electrical characteristic changes indicate that two types of stress induced mechanisms are operating - one of which is self limiting and can be observed at lower temperatures and one which continues to complete degradation. The self limiting mechanism can result in a dramatic improvement to cells having initially low Voc values.

Lathrop, Jay W.↗

Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs

Degradation of wire bonds (WBs) is one of the major factors limiting reliability of plastic encapsulated microcircuits (PEMs) at high temperatures. Use of PEMs in military and aerospace applications requires extended and thorough evaluation of encapsulating materials and reliability of packages in harsh environments. However, the effect of environmental conditions on characteristics of molding compounds (MCs) and reliability of wire bonds has not been studied sufficiently to date. In this work, two types of PEMs in QFP-style packages have been stored in different environments at temperatures from 130 C to 225 C for up to 4,500 hours in some cases. To assess the effect of oxygen, the parts were aged at 198 C in air and vacuum chambers. The effect of humidity was evaluated during long-term highly accelerated temperature and humidity stress testing (HAST) at temperatures of 130 C and 150 C. Thermo-mechanical and thermo-gravimetrical analyses were used to evaluate the effect of environment on characteristics of molding compound used. Measurements of contact resistances of wire bonds and their mechanical strength were employed to monitor degradation of wire bonds throughout the testing. Correlation between degradation of MC and WB failures has been analyzed. The effect of environmental conditions on accelerating factors of WB failures has been assessed, and the mechanism of wire bond degradation due to the presence of moisture and oxygen is discussed.

Teverosky, Alexander↗

Environmental Exposure Effects on Composite Materials for Commercial Aircraft

The test program concentrates on three major areas: flight exposure; ground based exposure; and accelerated environmental effects and data correlation. Among the parameters investigated were: geographic location, flight profiles, solar heating effects, ultraviolet degradation, retrieval times, and test temperatures. Data from the tests can be used to effectively plan the cost of production and viable alternatives in materials selection.

Hoffman, D. J.↗

An Approach to Reliability Testing of Microcircuits at Cryogenic Conditions

This viewgraph presentation reviews an approach to testing microcircuits at cryogenic temperatures. Standard testing procedures are not adequate to test microcircuits that are to operate at cryogenic temperatures. It is therefore necessary to perform analysis of operation conditions and reliability conditions for planning qualification testing of microcircuits at cryogenic temperatures. The major degradations for microcircuits operating at low temperatures depend on the number of switching cycles rather than on the duration of part operation. Therefore instead of accelerating degradation of the parts by increasing the level of stress, the possibility of which is very limited at cryogenic temperatures, the reliability testing can be based on the number of switching cycles.

Teverovsky, Alexander↗

Towards A Model-Based Prognostics Methodology for Electrolytic Capacitors: A Case Study Based on Electrical Overstress Accelerated Aging

A remaining useful life prediction methodology for electrolytic capacitors is presented. This methodology is based on the Kalman filter framework and an empirical degradation model. Electrolytic capacitors are used in several applications ranging from power supplies on critical avionics equipment to power drivers for electro-mechanical actuators. These devices are known for their comparatively low reliability and given their criticality in electronics subsystems they are a good candidate for component level prognostics and health management. Prognostics provides a way to assess remaining useful life of a capacitor based on its current state of health and its anticipated future usage and operational conditions. We present here also, experimental results of an accelerated aging test under electrical stresses. The data obtained in this test form the basis for a remaining life prediction algorithm where a model of the degradation process is suggested. This preliminary remaining life prediction algorithm serves as a demonstration of how prognostics methodologies could be used for electrolytic capacitors. In addition, the use degradation progression data from accelerated aging, provides an avenue for validation of applications of the Kalman filter based prognostics methods typically used for remaining useful life predictions in other applications.

Celaya, Jose R.↗

A Model-based Prognostics Methodology for Electrolytic Capacitors Based on Electrical Overstress Accelerated Aging

A remaining useful life prediction methodology for electrolytic capacitors is presented. This methodology is based on the Kalman filter framework and an empirical degradation model. Electrolytic capacitors are used in several applications ranging from power supplies on critical avionics equipment to power drivers for electro-mechanical actuators. These devices are known for their comparatively low reliability and given their criticality in electronics subsystems they are a good candidate for component level prognostics and health management. Prognostics provides a way to assess remaining useful life of a capacitor based on its current state of health and its anticipated future usage and operational conditions. We present here also, experimental results of an accelerated aging test under electrical stresses. The data obtained in this test form the basis for a remaining life prediction algorithm where a model of the degradation process is suggested. This preliminary remaining life prediction algorithm serves as a demonstration of how prognostics methodologies could be used for electrolytic capacitors. In addition, the use degradation progression data from accelerated aging, provides an avenue for validation of applications of the Kalman filter based prognostics methods typically used for remaining useful life predictions in other applications.

Electrolytic capacitors↗

Hydrogen evolution in nickel-water heat pipes.

A study was made of the evolution of hydrogen gas in nickel-water heat pipes for the purpose of investigating methods of accelerated life testing. The data were analyzed in terms of a phenomenological corrosion model of heat pipe degradation which incorporates corrosion and oxidation theory and contains parameters which can be determined by experiment. The gas was evolved with a linear time dependence and an exponential temperature dependence with an activation energy of 1.03 x 10 to the minus 19th joules. A flow-rate dependence of the gas evolution was found in the form of a threshold. The results were used to predict usable lifetimes of heat pipes operated at normal operating conditions from results taken under accelerated operating conditions.

Anderson, W. T.↗

Successful completion of a cyclic ground test of a mercury ion auxiliary propulsion system

An engineering model Ion Auxiliary Propulsion System (IAPS) 8-cm thruster (S/N 905) has completed a life test at NASA Lewis Research Center. The mercury ion thruster successfully completed and exceeded the test goals of 2557 on/off cycles and 7057 hr of operation at full thrust. The final 1200 cycles and 3600 hr of the life test were conducted using an engineering model of the IAPS power electronics unit (PEU) and breadboard digital controller and interface unit (DCIU). This portion of the test is described in this paper with a charted history of thruster operating parameters and off-normal events. Performance and operating characteristics were constant throughout the test with only minor variations. The engineering model power electronics unit operated without malfunction; the flight software in the digital controller and interface unit was exercised and verified. Post-test inspection of the thruster revealed facility enhanced accelerator grid erosion but overall the thruster was in good condition. It was concluded that the thruster performance was not drastically degraded by time or cycles. Additional cyclic testing is currently under consideration.

Francisco, David R.↗

Successful completion of a cyclic ground test of a mercury Ion Auxiliary Propulsion System

An engineering model Ion Auxiliary Propulsion System (IAPS) 8-cm thruster (S/N 905) has completed a life test at NASA Lewis Research Center. The mercury ion thruster successfully completed and exceeded the test goals of 2557 on/off cycles and 7057 hr of operation at full thrust. The final 1200 cycles and 3600 hr of the life test were conducted using an engineering model of the IAPS power electronics unit (PEU) and breadboard digital controller and interface unit (DCIU). This portion of the test is described in this paper with a charted history of thruster operating parameters and off-normal events. Performance and operating characteristics were constant throughout the test with only minor variations. The engineering model power electronics unit operated without malfunction; the flight software in the digital controller and interface unit was exercised and verified. Post-test inspection of the thruster revealed facility enhanced accelerator grid erosion but overall the thruster was in good condition. It was concluded that the thruster performance was not drastically degraded by time or cycles. Additional cyclic testing is currently under consideration.

Francisco, David R.↗

An accelerated stress testing program for determining the reliability sensitivity of silicon solar cells to encapsulation and metallization systems

The use of accelerated testing methods in a program to determine the reliability attributes of terrestrial silicon solar cells is discussed. Different failure modes are to be expected when cells with and without encapsulation are subjected to accelerated testing and separate test schedules for each are described. Unencapsulated test cells having slight variations in metallization are used to illustrate how accelerated testing can highlight different diffusion related failure mechanisms. The usefulness of accelerated testing when applied to encapsulated cells is illustrated by results showing that moisture related degradation may be many times worse with some forms of encapsulation than with no encapsulation at all.

Lathrop, J. W.↗

Corrosion of a-Si cells and modules

The authors report on corrosion/erosion phonemena observed in exposing a-Si cells, modules, and specially designed test structures to natural and accelerated test environments. Relevant cell and module I-V curve data used for monitoring degradation are presented. The causes of the observed degradation, methods of mitigation, and consequences for fielded modules are discussed.

Mon, G. R.↗

Evaluation of Case Size 0603 BME Ceramic Capacitors

High volumetric efficiency of commercial base metal electrode (BME) ceramic capacitors allows for a substantial reduction of weight and sizes of the parts compared to currently used military grade precious metal electrode (PME) capacitors. Insertion of BME capacitors in space applications requires a thorough analysis of their performance and reliability. In this work, six types of cases size 0603 BME capacitors from three vendors have been evaluated. Three types of multilayer ceramic capacitors (MLCCs) were designed for automotive industry and three types for general purposes. Leakage currents in the capacitors have been measured in a wide range of voltages and temperatures, and measurements of breakdown voltages (VBR) have been used to assess the proportion and severity of defects in the parts. The effect of soldering-related thermal shock stresses was evaluated by analysis of distributions of VBR for parts in 'as is' condition and after terminal solder dip testing at 350 C. Highly Accelerated Life Testing (HALT) at different temperatures was used to assess the activation energy of degradation of leakage currents and predict behavior of the parts at life test and normal operating conditions. To address issues related to rework and manual soldering, capacitors were soldered onto different substrates at different soldering conditions. The results show that contrary to a common assumption that large-size capacitors are mostly vulnerable to soldering stresses, cracking in small size capacitors does happen unless special measures are taken during assembly processes.

testing↗