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At least 55 records · Page 3

Accurate Thermal Stresses for Beams: Normal Stress

Formulations for a general theory of thermoelasticity to generate accurate thermal stresses for structural members of aeronautical vehicles were developed in 1954 by Boley. The formulation also provides three normal stresses and a shear stress along the entire length of the beam. The Poisson effect of the lateral and transverse normal stresses on a thermally loaded beam is taken into account in this theory by employing an Airy stress function. The Airy stress function enables the reduction of the three-dimensional thermal stress problem to a two-dimensional one. Numerical results from the general theory of thermoelasticity are compared to those obtained from strength of materials. It is concluded that the theory of thermoelasticity for prismatic beams proposed in this paper can be used instead of strength of materials when precise stress results are desired.

Johnson, Theodore F.↗

Transient thermal stress recovery for structural models

A method for computing transient thermal stress vectors from temperature vectors is described. The three step procedure involves the use of NASTRAN to generate an influence coefficient matrix which relates temperatures to stresses in the structural model. The transient thermal stresses are then recovered and sorted for maximum and minimum values. Verification data for the procedure is also provided.

Walls, William↗

Impact of thermal stress on the piezoelectric and dielectric properties of PbTiO{sub 3} thick films on various substrates

The impact of thermal stress on the polarization, as well as dielectric and piezoelectric properties of (001) oriented PbTiO{sub 3} (PTO) thick films deposited on various substrates was investigated based on Landau-Devonshire thermodynamic model. The results showed that dielectric and piezoelectric properties of PTO films depend strongly on the thermal stress in PTO films decided by the deposition temperature T{sub G} and the thermal expansion coefficients' difference between PTO films and substrates. For IC-compatible substrates such as Si, c-sapphire, and a-sapphire that induce tensile in-plane thermal stresses, the dielectric and piezoelectric responses and tunabilities of PTO films were enhanced. Whereas for PTO films on MgO, compressive thermal in-plane stresses can degraded the dielectric and piezoelectric responses and tunabilities of the films.

36 MATERIALS SCIENCE↗

Free vibrations of thermally stressed orthotropic plates with various boundary conditions

An analytical investigation of the vibrations of thermally stressed orthotropic plates in the prebuckled region is presented. The investigation covers the broad class of trapezoidal plates with two opposite sides parallel. Each edge of the plate may be subjected to different uniform boundary conditions. variable thickness and arbitrary temperature distributions (analytical or experimental) for any desired combination of boundary conditions may be prescribed. Results obtained using this analysis are compared to experimental results obtained for isotropic plates with thermal stress, and to results contained in the literature for orthotropic plates without thermal stress. Good agreement exists for both sets of comparisons.

Bailey, C. D.↗

Thermal stress analysis for a wood composite blade

Heat conduction throughout the blade and the distribution of thermal stresses caused by the temperature distribution were determined for a laminated wood wind turbine blade in both the horizontal and vertical positions. Results show that blade cracking is not due to thermal stresses induced by insulation. A method and practical example of thermal stress analysis for an engineering body of orthotropic materials is presented.

Fu, K. C.↗

Reduction of thermal stresses in continuous fiber reinforced metal matrix composites with interface layers

The potential of using interface layer to reduce thermal stresses in the matrix of composites with a mismatch in coefficients of thermal expansion of fiber and matrix has been investigated. It was found that compliant layers, with properties of readily available materials, do not have the potential to reduce thermal stresses significantly. However, interface layers with high coefficient of thermal expansion can compensate for the mismatch and reduce thermal stresses in the matrix significantly.

Jansson, S.↗

On thermal stress failure of the SNAP-19A RTG heat shield

Results of a study on thermal stress problems in an amorphous graphite heat shield that is part of the launch-abort protect system for the SNAP-19A radio-isotope thermoelectric generators (RTG) that will be used on the Viking Mars Lander are presended. The first result is from a thermal stress analysis of a full-scale RTG heat source that failed to survive a suborbital entry flight test, possibly due to thermal stress failure. It was calculated that the maximum stress in the heat shield was only 50 percent of the ultimate strength of the material. To provide information on the stress failure criterion used for this calculation, some heat shield specimens were fractured under abort entry conditions in a plasma arc facility. It was found that in regions free of stress concentrations the POCO graphite heat shield material did fracture when the local stress reached the ultimate uniaxial stress of the material.

Pitts, W. C.↗

The effect of thermal stresses on the integrity of three built-up aircraft structures

A Mach 6 flight was simulated in order to examine heating effects on three frame/skin specimens. The specimens included: a titanium truss frame with a lockalloy skin; a stainless steel z-frame with a lockalloy skin; and a titanium z-frame with a lockalloy skin. Thermal stresses and temperature were measured on these specimens for the purpose of examining their efficiency, performance, and integrity. Measured thermal stresses were examined with respect to material yield strengths, buckling criteria, structural weight, and geometric locations. Principal thermal stresses were studied from the standpoint of uniaxial stress assumptions. Measured thermal stresses were compared to predicted values.

Jenkins, J. M.↗

Effect of element density on the NASTRAN calculated mechanical and thermal stresses of a spar

A NASTRAN model of a spar was examined to determine the sensitivity of calculated axial thermal stresses and bending stresses to changes in element density of the model. The thermal stresses calculated with three different element densities resulted in drastically differing values. The position of the constraint also significantly affected the value of the calculated thermal stresses. Mechanical stresses calculated from an applied loading were insensitive to element density.

Jenkins, J. M.↗

Reduction of thermal stresses in continuous fiber reinforced metal matrix composites with interface layers

The potential of using an interface layer to reduce thermal stresses in the matrix of composites with a mismatch in coefficients of thermal expansion of fiber and matrix was investigated. It was found that compliant layers, with properties of readily available materials, do not have the potential to reduce thermal stresses significantly. However, interface layers with high coefficient of thermal expansion can compensate for the mismatch and reduce thermal stresses in the matrix significantly.

Jansson, S.↗

Thermal-stress analysis for a wood composite blade

A thermal-stress analysis of a wind turbine blade made of wood composite material is reported. First, the governing partial differential equation on heat conduction is derived, then, a finite element procedure using variational approach is developed for the solution of the governing equation. Thus, the temperature distribution throughout the blade is determined. Next, based on the temperature distribution, a finite element procedure using potential energy approach is applied to determine the thermal-stress distribution. A set of results is obtained through the use of a computer, which is considered to be satisfactory. All computer programs are contained in the report.

Fu, K. C.↗

Thermal stress in degraded forests in the Brazilian Amazon Arc of Deforestation

Understanding thermal stress in tropical forests has taken on new urgency in light of accelerating climate change and expansion of deforestation and forest degradation. Degraded tropical forests in particular may be approaching critical temperature thresholds even more rapidly than intact forests, with implications for tree survival and ecosystem recovery. We investigate thermal stress in degraded tropical forests within the Brazilian Amazon Arc of Deforestation. Using land surface temperature data from the ECOsystem Spaceborne Thermal Radiometer Experiment on the international Space Station (ECOSTRESS), we compared canopy temperatures of intact, selectively logged, and burned forests in Feliz Natal, Mato Grosso, Brazil. Upper canopy temperatures in previously burned forests were 4.1% higher (mean = 36.5 °C) and 50.9% more variable compared to intact and logged forests, which showed remarkably similar temperature distributions (means of 34.9 °C and 35.1 °C, respectively). Modeled leaf temperature distributions based on canopy temperature measurements from one of the warmest days in a 2 year dry season record indicated that 87% of leaves in the warmest burned forest patches exceeded the temperature threshold where respiration surpasses photosynthesis, compared to approximately 72%–74% in intact and logged forests, respectively, in the same time period. After controlling for environmental factors, burned forests were predicted to be 2.6 °C warmer on average [1.39 °C–3.96 °C, 95% credible interval] than intact forests across a 5–40 m canopy height range. Burned forests showed modest thermal recovery over time, with temperatures decreasing by approximately 1.2 °C over a 30 year recovery period. In contrast, logged forests showed minimal thermal differences from intact forests (−0.353 on average, [−1.125–0.274, 95% credible interval]) and negligible change (0.15 °C) over the same timeframe. While the absolute probabilities of exceeding damaging thermal thresholds remain low across all forest types under current climate conditions, the probability of leaves exceeding temperatures that cause permanent leaf damage was ten times higher in burned forests, with implications for the future of burned forest regeneration in water-limited regions of the Amazon basin. In particular, the combination of higher mean temperatures, greater temperature variability, and more frequent exposure to damaging thermal thresholds implies that burned tropical forests will experience substantially higher mortality rates and slower biomass recovery compared to intact and selectively logged forests, especially in water-limited regions where trees cannot rely on evaporative cooling to moderate canopy temperatures.

Brazilian Amazon Arc of Deforestation↗

Damage Assessment of Stress-Thermal Cycled high temperature

We report on the characterization of bismaleimide and polyimide carbon fiber composite, microcrack development under stress thermal cycling loading. Such cycles range from cryogenic temperatures associated with cryogenic fuel (LN, LOX) containment to high temperatures of 300 degrees Celsius associated with future hypervelocity aeropropulsion systems. Microcrack development thresholds as a function of temperature range of the thermal cycle; the number of cycles; the applied stress level imposed on the composite are reported. We have conducted stress-thermal cycles on thin bismaleimide-woven carbon fiber foils for three temperature range cycles: 1. Ambient temperature - -196 degrees celsius. 2. Ambient temperature - 150 degrees Celsius; 200 degrees Celsius; 250 degrees Celsius. 3. -196 degrees Celsius - 250 degrees Celsius. The Principle findings are that the full cycles from -196 degrees Celsius to to 250 degrees Celsius cause the most significant microcrack of development. These observations indicate that the high temperature portion of the cycle under load causes fiber-matrix interface failure and subsequent exposure to higher stresses at the cryogenic, low temperature region results in composite matrix microcracking as a result of the additional stresses associate with the fiber-matrix thermal expansion mismatch. Our initial studies for 12 ply PMR-II-50 polyimide/M60JB carbon fabric [0f,90f,90f,0f,0f,90f]ls composites will be presented. The stress-thermal cycle test procedure for these will be described. Moisture absorption characteristics between cycles will be used to monitor interconnected microcrack development. The applied stress level will be 75% of the composite cryogenic (-196 degrees Celsius) ultimate strength.

Ju, Jae-Hyung↗

Transient thermal stress problem for a circumferentially cracked hollow cylinder

The transient thermal stress problem for a hollow elasticity cylinder containing an internal circumferential edge crack is considered. It is assumed that the problem is axisymmetric with regard to the crack geometry and the loading, and that the inertia effects are negligible. The problem is solved for a cylinder which is suddenly cooled from inside. First the transient temperature and stress distributions in an uncracked cylinder are calculated. By using the equal and opposite of this thermal stress as the crack surface traction in the isothermal cylinder the crack problem is then solved and the stress intensity factor is calculated. The numerical results are obtained as a function of the Fourier number tD/b(2) representing the time for various inner-to-outer radius ratios and relative crack depths, where D and b are respectively the coefficient of diffusivity and the outer radius of the cylinder.

Nied, H. F.↗

Damage Assessment of Stress-Thermal Cycled High Temperature

We report on the characterization of bismaleimide and polyimide carbon fiber composite, microcrack development under stress thermal cycling loading. Such cycle range from cryogenic temperatures associated with cryogenic fuel (LN, LOX) containment to high temperatures of 300 degrees associated with future hypervelocity aeropropulsion systems. Microcrack development thresholds as a function of temperature range of the thermal cycle, the number of cycles, and the applied stress level imposed on the composite are reported. We have conducted stress-thermal cycles on thin bismaleimide-woven carbon fiber foils for three temperature range cycles. The principle findings are that the full cycles from -196 degree celsius up to 250 degree celsius cause the most significant microcrack development. These observations indicate that the high temperature portion of the cycle under load causes fiber-matrix interface failure and subsequent exposure to higher stresses at the cryogenic, low temperature region results in composite matrix microcracking as a result of the additional stresses associated with the fiber-matrix thermal expansion mismatch. Our initial studies for 12 ply PMR-II-50 polyimide/M6OJB carbon fabric [0f, 90f, 90f, 0f, 0f, 90f] composites will be presented. The stress-thermal cycle test procedure for these will be described. Moisture absorption characteristics between cycles will be used to monitor interconnected microcrack development. The applied stress level will be 75 percent of the composite cryogenic -196 degree celsius ultimate strength.

Ju, Jach-Yung↗